DATASHEET

X1226
®
4K (512 x 8), 2-Wire™ RTC
Data Sheet
May 8, 2006
FN8098.3
APPLICATIONS
Real Time Clock/Calendar with EEPROM
FEATURES
• Real Time Clock/Calendar
—Tracks Time in Hours, Minutes, and Seconds
—Day of the Week, Day, Month, and Year
• 2 Polled Alarms (Non-volatile)
—Settable on the Second, Minute, Hour, Day of
the Week, Day, or Month
—Repeat Mode (periodic interrupts)
• Oscillator Compensation On Chip
—Internal Feedback Resistor and Compensation
Capacitors
—64 Position Digitally Controlled Trim Capacitor
—6 Digital Frequency Adjustment Settings to
±30ppm
• Battery Switch or Super Cap Input
• 512 x 8 Bits of EEPROM
—64-Byte Page Write Mode
—8 Modes of Block Lock™ Protection
—Single Byte Write Capability
• High Reliability
—Data Retention: 100 Years
—Endurance: 100,000 Cycles Per Byte
• 2-Wire™ Interface Interoperable with I2C
—400kHz Data Transfer Rate
• Frequency Output (SW Selectable: Off, 1Hz,
4096Hz or 32.768kHz)
• Low Power CMOS
—1.25µA Operating Current (Typical)
• Small Package Options
—8 Ld SOIC and 8 Ld TSSOP
• Repetitive Alarms
• Temperature Compensation
• Pb-Free Plus Anneal Available (RoHS Compliant)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Utility Meters
HVAC Equipment
Audio/Video Components
Set Top Box/Television
Modems
Network Routers, Hubs, Switches, Bridges
Cellular Infrastructure Equipment
Fixed Broadband Wireless Equipment
Pagers/PDA
POS Equipment
Test Meters/Fixtures
Office Automation (Copiers, Fax)
Home Appliances
Computer Products
Other Industrial/Medical/Automotive
DESCRIPTION
The X1226 device is a Real Time Clock with
clock/calendar, two polled alarms with integrated
512x8 EEPROM, oscillator compensation, and battery
backup switch.
The oscillator uses an external, low-cost 32.768kHz
crystal. All compensation and trim components are
integrated on the chip. This eliminates several external
discrete components and a trim capacitor, saving
board area and component cost.
BLOCK DIAGRAM
OSC
Compensation
32.768kHz
X1
Oscillator
X2
SCL
SDA
1Hz
Timer
Calendar
Logic
Time
Keeping
Registers
(SRAM)
Battery
Switch
Circuitry
VCC
VBACK
Select
Serial
Interface
Decoder
Control
Decode
Logic
Control/
Registers
(EEPROM)
Status
Registers
Compare
Alarm
(SRAM)
Mask
PHZ/IRQ
Frequency
Divider
8
Alarm Regs
(EEPROM)
4K
EEPROM
ARRAY
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
X1226
Ordering Information
PART NUMBER
VDD (V)
TEMP
RANGE (°C)
2.7 to 5.5
0 to 70
8 Ld SOIC (150 mil)
MDP0027
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
PART MARKING
PACKAGE
PKG. DWG. #
X1226S8*
X1226
X1226S8Z* (Note)
X1226Z
0 to 70
X1226S8I*
X1226I
-40 to 85
8 Ld SOIC (150 mil)
MDP0027
X1226S8IZ* (Note)
X1226ZI
-40 to 85
8 Ld SOIC (150 mil) (Pb-free)
MDP0027
X1226V8*
1226
0 to 70
8 Ld TSSOP (4.4mm)
M8.173
X1226V8Z* (Note)
1226Z
0 to 70
8 Ld TSSOP (4.4mm) (Pb-free)
M8.173
X1226V8I*
1226I
-40 to 85
8 Ld TSSOP (4.4mm)
M8.173
X1226V8IZ* (Note)
1226IZ
-40 to 85
8 Ld TSSOP (4.4mm) (Pb-free)
M8.173
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PIN CONFIGURATION
8 LD SOIC
8 LD TSSOP
1
8
VCC
X2
2
7
VBACK
PHZ/IRQ
3
6
SCL
VSS
4
5
SDA
X1
2
VBACK
VCC
1
2
8
7
SCL
SDA
X1
X2
3
4
6
VSS
PHZ/IRQ
5
FN8098.3
May 8, 2006
X1226
PIN ASSIGNMENTS
Pin Number
SOIC
TSSOP
Symbol
Brief Description
1
3
X1
X1. The X1pin is the input of an inverting amplifier. An external 32.768kHz quartz
crystal is used with the X1226 to supply a timebase for the real time clock. The
recommended crystal is a Citizen CFS206-32.768KDZF. Internal compensation circuitry is
included to form a complete oscillator circuit. Care should be taken in the placement of the
crystal and the layout of the circuit. Plenty of ground plane around the device and short
traces to X1 are highly recommended. See Application section for more recommendations.
2
4
X2
X2. The X2 pin is the output of an inverting amplifier. An external 32.768kHz quartz
crystal is used with the X1226 to supply a timebase for the real time clock. The
recommended crystal is a Citizen CFS206-32.768KDZF. Internal compensation circuitry is
included to form a complete oscillator circuit. Care should be taken in the placement of the
crystal and the layout of the circuit. Plenty of ground plane around the device and short
traces to X2 are highly recommended. See Application section for more recommendations.
3
5
PHZ/IRQ
Programmable Frequency/Interrupt Output – PHZ/IRQ. This is either an output from
the internal oscillator or an interrupt signal output. It is an open drain output.
When used as frequency output, this signal has a frequency of 32.768kHz, 4096Hz,
1Hz or inactive.
When used as interrupt output, this signal notifies a host processor that an alarm has
occurred and an action is required. It is an active LOW output.
The control bits for this function are FO1 and FO0 and are found in address 0011h of
the Clock Control Memory map. See “Programmable Frequency Output Bits—FO1,
FO0” on page 9.
4
6
VSS
VSS.
5
7
SDA
Serial Data (SDA). SDA is a bidirectional pin used to transfer data into and out of the
device. It has an open drain output and may be wire ORed with other open drain or
open collector outputs. The input buffer is always active (not gated).
An open drain output requires the use of a pull-up resistor. The output circuitry controls
the fall time of the output signal with the use of a slope controlled pull-down. The circuit
is designed for 400kHz 2-wire interface speed.
6
8
SCL
Serial Clock (SCL). The SCL input is used to clock all data into and out of the device.
The input buffer on this pin is always active (not gated).
7
1
VBACK
VBACK. This input provides a backup supply voltage to the device. VBACK supplies
power to the device in the event the VCC supply fails. This pin can be connected to a
battery, a Supercap or tied to ground if not used.
8
2
VCC
3
VCC.
FN8098.3
May 8, 2006
X1226
DESCRIPTION (continued)
Serial Data (SDA)
The Real-Time Clock keeps track of time with
separate registers for Hours, Minutes, Seconds. The
Calendar has separate registers for Date, Month, Year
and Day-of-week. The calendar is correct through
2099, with automatic leap year correction.
SDA is a bidirectional pin used to transfer data into and
out of the device. It has an open drain output and may
be wire ORed with other open drain or open collector
outputs. The input buffer is always active (not gated).
The powerful Dual Alarms can be set to any
Clock/Calendar value for a match. For instance, every
minute, every Tuesday, or 5:23 AM on March 21. The
alarms can be polled in the Status Register or provide
a hardware interrupt (IRQ Pin). There is a repeat
mode for the alarms allowing a periodic interrupt.
The PHZ/IRQ pin may be software selected to provide
a frequency output of 1 Hz, 4096 Hz, or 32,768 Hz.
The device offers a backup power input pin. This
VBACK pin allows the device to be backed up by
battery or SuperCap. The entire X1226 device is fully
operational from 2.7 to 5.5 volts and the
clock/calendar portion of the X1226 device remains
fully operational down to 1.8 volts (Standby Mode).
The X1226 device provides 4K bits of EEPROM with 8
modes of BlockLock™ control. The BlockLock allows a
safe, secure memory for critical user and configuration
data, while allowing a large user storage area.
X1226
8 LD SOIC
X2
PHZ/IRQ
VSS
8 LD TSSOP
1
2
8
VCC
7
VBACK
3
6
SCL
4
5
SDA
VBACK
This input provides a backup supply voltage to the
device. VBACK supplies power to the device in the
event the VCC supply fails. This pin can be connected
to a battery, a Supercap or tied to ground if not used.
Programmable Frequency/Interrupt Output – PHZ/IRQ
This is either an output from the internal oscillator or an
interrupt signal output. It is an open drain output.
When used as frequency output, this signal has a
frequency of 32.768kHz, 4096Hz, 1Hz or inactive.
When used as interrupt output, this signal notifies a
host processor that an alarm has occurred and an
action is required. It is an active LOW output.
The control bits for this function are FO1 and FO0 and
are found in address 0011h of the Clock Control Memory map. See “Programmable Frequency Output
Bits—FO1, FO0” on page 9.
PIN DESCRIPTIONS
X1
An open drain output requires the use of a pull-up
resistor. The output circuitry controls the fall time of
the output signal with the use of a slope controlled
pull-down. The circuit is designed for 400kHz 2-wire
interface speed.
VBACK
VCC
X1
X2
1
2
3
4
8
7
6
5
SCL
SDA
VSS
PHZ/IRQ
NC = No internal connection
Serial Clock (SCL)
The SCL input is used to clock all data into and out of
the device. The input buffer on this pin is always active
(not gated).
X1, X2
The X1 and X2 pins are the input and output,
respectively, of an inverting amplifier. An external
32.768kHz quartz crystal is used with the X1226 to
supply a timebase for the real time clock. The
recommended crystal is a Citizen CFS206-32.768KDZF.
Internal compensation circuitry is included to form a
complete oscillator circuit. Care should be taken in the
placement of the crystal and the layout of the circuit.
Plenty of ground plane around the device and short
traces to X1 and X2 are highly recommended. See
Application section for more recommendations.
Figure 1. Recommended Crystal Connection
X1
X2
4
FN8098.3
May 8, 2006
X1226
POWER CONTROL OPERATION
The power control circuit accepts a VCC and a VBACK
input. The power control circuit powers the clock from
VBACK when VCC < VBACK – 0.2V. It will switch back to
power the device from VCC when VCC exceeds VBACK.
the stop bit is written. The RTC continues to update
the time while an RTC register write is in progress and
the RTC continues to run during any nonvolatile write
sequences. A single byte may be written to the RTC
without affecting the other bytes.
Accuracy of the Real Time Clock
Figure 2. Power Control
VCC
Voltage
On
VBACK
In
Off
REAL TIME CLOCK OPERATION
The Real Time Clock (RTC) uses an external
32.768kHz quartz crystal to maintain an accurate internal representation of the second, minute, hour, day,
date, month, and year. The RTC has leap-year correction. The clock also corrects for months having fewer
than 31 days and has a bit that controls 24 hour or
AM/PM format. When the X1226 powers up after the
loss of both VCC and VBACK, the clock will not operate
until at least one byte is written to the clock register.
Reading the Real Time Clock
The RTC is read by initiating a Read command and
specifying the address corresponding to the register of
the Real Time Clock. The RTC Registers can then be
read in a Sequential Read Mode. Since the clock runs
continuously and a read takes a finite amount of time,
there is the possibility that the clock could change during
the course of a read operation. In this device, the time is
latched by the read command (falling edge of the clock
on the ACK bit prior to RTC data output) into a separate
latch to avoid time changes during the read operation.
The clock continues to run. Alarms occurring during a
read are unaffected by the read operation.
Writing to the Real Time Clock
The time and date may be set by writing to the RTC
registers. To avoid changing the current time by an
uncompleted write operation, the current time value is
loaded into a separate buffer at the falling edge of the
clock on the ACK bit before the RTC data input bytes,
the clock continues to run. The new serial input data
replaces the values in the buffer. This new RTC value
is loaded back into the RTC Register by a stop bit at
the end of a valid write sequence. An invalid write
operation aborts the time update procedure and the
contents of the buffer are discarded. After a valid write
operation the RTC will reflect the newly loaded data
beginning with the next “one second” clock cycle after
5
The accuracy of the Real Time Clock depends on the
frequency of the quartz crystal that is used as the time
base for the RTC. Since the resonant frequency of a
crystal is temperature dependent, the RTC performance will also be dependent upon temperature. The
frequency deviation of the crystal is a fuction of the
turnover temperature of the crystal from the crystal’s
nominal frequency. For example, a >20ppm frequency
deviation translates into an accuracy of >1 minute per
month. These parameters are available from the crystal
manufacturer. Intersil’s RTC family provides on-chip
crystal compensation networks to adjust loadcapacitance to tune oscillator frequency from +116 ppm
to -37 ppm when using a 12.5 pF load crystal. For more
detail information see the Application section.
CLOCK/CONTROL REGISTERS (CCR)
The Control/Clock Registers are located in an area
separate from the EEPROM array and are only
accessible following a slave byte of “1101111x” and
reads or writes to addresses [0000h:003Fh]. The
clock/control memory map has memory addresses
from 0000h to 003Fh. The defined addresses are
described in the Table 1. Writing to and reading from
the undefined addresses are not recommended.
CCR Access
The contents of the CCR can be modified by performing a byte or a page write operation directly to any
address in the CCR. Prior to writing to the CCR
(except the status register), however, the WEL and
RWEL bits must be set using a two step process (See
section “Writing to the Clock/Control Registers.”)
The CCR is divided into 5 sections. These are:
1.
2.
3.
4.
5.
Alarm 0 (8 bytes; non-volatile)
Alarm 1 (8 bytes; non-volatile)
Control (4 bytes; non-volatile)
Real Time Clock (8 bytes; volatile)
Status (1 byte; volatile)
Each register is read and written through buffers. The
non-volatile portion (or the counter portion of the RTC) is
updated only if RWEL is set and only after a valid write
operation and stop bit. A sequential read or page write
operation provides access to the contents of only one
section of the CCR per operation. Access to another section requires a new operation. Continued reads or writes,
FN8098.3
May 8, 2006
X1226
registers are read by performing a sequential read.
The read instruction latches all Clock registers into a
buffer, so an update of the clock does not change the
time being read. A sequential read of the CCR will not
result in the output of data from the memory array. At
the end of a read, the master supplies a stop condition
to end the operation and free the bus. After a read of
the CCR, the address remains at the previous address
+1 so the user can execute a current address read of
the CCR and continue reading the next Register.
once reaching the end of a section, will wrap around to
the start of the section. A read or write can begin at any
address in the CCR.
It is not necessary to set the RWEL bit prior to writing
the status register. Section 5 (status register) supports
a single byte read or write only. Continued reads or
writes from this section terminates the operation.
The state of the CCR can be read by performing a random read at any address in the CCR at any time. This
returns the contents of that register location. Additional
Bit
Default
Table 1. Clock/Control Memory Map
Addr.
Type
Reg
Name
7
6
5
4
3
2
1
0 (optional)
003F
Status
SR
BAT
AL1
AL0
0
0
RWEL
WEL
RTCF
0037
RTC
(SRAM)
Y2K
0
0
Y2K21
Y2K20
Y2K13
0
0
Y2K10
19/20
20h
DW
0
0
0
0
0
DY2
DY1
DY0
0-6
00h
0035
YR
Y23
Y22
Y21
Y20
Y13
Y12
Y11
Y10
0-99
00h
0034
MO
0
0
0
G20
G13
G12
G11
G10
1-12
00h
0036
Range
01h
0033
DT
0
0
D21
D20
D13
D12
D11
D10
1-31
00h
0032
HR
MIL
0
H21
H20
H13
H12
H11
H10
0-23
00h
0031
MN
0
M22
M21
M20
M13
M12
M11
M10
0-59
00h
0030
SC
0
S22
S21
S20
S13
S12
S11
S10
0-59
00h
0013
0012
Control
(EEPROM)
DTR
0
0
0
0
0
DTR2
DTR1
DTR0
00h
ATR
0
0
ATR5
ATR4
ATR3
ATR2
ATR1
ATR0
00h
0011
INT
IM
AL1E
AL0E
FO1
FO0
X
X
X
00h
0010
BL
BP2
BP1
BP0
0
0
0
0
0
00h
Y2K1
0
0
A1Y2K21
A1Y2K20
A1Y2K13
0
0
A1Y2K10
19/20
20h
DWA1
EDW1
0
0
0
0
DY2
DY1
DY0
0-6
00h
A1G10
1-12
00h
000F
000E
Alarm1
(EEPROM)
000D
YRA1
000C
MOA1
Unused - Default = RTC Year value (No EEPROM) - Future expansion
EMO1
0
0
A1G20
A1G13
A1G12
A1G11
000B
DTA1
EDT1
0
A1D21
A1D20
A1D13
A1D12
A1D11
A1D10
1-31
00h
000A
HRA1
EHR1
0
A1H21
A1H20
A1H13
A1H12
A1H11
A1H10
0-23
00h
0009
MNA1
EMN1
A1M22
A1M21
A1M20
A1M13
A1M12
A1M11
A1M10
0-59
00h
0008
SCA1
ESC1
A1S22
A1S21
A1S20
A1S13
A1S12
A1S11
A1S10
0-59
00h
Y2K0
0
0
A0Y2K21
A0Y2K20
A0Y2K13
0
0
A0Y2K10
19/20
20h
DWA0
EDW0
0
0
0
0
DY2
DY1
DY0
0-6
00h
A0G10
1-12
00h
0007
0006
Alarm0
(EEPROM)
0005
YRA0
0004
MOA0
Unused - Default = RTC Year value (No EEPROM) - Future expansion
EMO0
0
0
A0G20
A0G13
A0G12
A0G11
0003
DTA0
EDT0
0
A0D21
A0D20
A0D13
A0D12
A0D11
A0D10
1-31
00h
0002
HRA0
EHR0
0
A0H21
A0H20
A0H13
A0H12
A0H11
A0H10
0-23
00h
0001
MNA0
EMN0
A0M22
A0M21
A0M20
A0M13
A0M12
A0M11
A0M10
0-59
00h
0000
SCA0
ESC0
A0S22
A0S21
A0S20
A0S13
A0S12
A0S11
A0S10
0-59
00h
6
FN8098.3
May 8, 2006
X1226
ALARM REGISTERS
There are two alarm registers whose contents mimic the
contents of the RTC register, but add enable bits and
exclude the 24 hour time selection bit. The enable bits
specify which registers to use in the comparison between
the Alarm and Real Time Registers. For example:
– Setting the Enable Month bit (EMOn*) bit in combination with other enable bits and a specific alarm
time, the user can establish an alarm that triggers at
the same time once a year.
*n = 0 for Alarm 0: N = 1 for Alarm 1
When there is a match, an alarm flag is set. The occurrence of an alarm can be determined by polling the
AL0 and AL1 bits or by enabling the IRQ output, using
it as hardware flag.
The alarm enable bits are located in the MSB of the
particular register. When all enable bits are set to ‘0’,
there are no alarms.
– The user can set the X1226 to alarm every Wednesday at 8:00 AM by setting the EDWn*, the EHRn*
and EMNn* enable bits to ‘1’ and setting the DWAn*,
HRAn* and MNAn* Alarm registers to 8:00 AM
Wednesday.
– A daily alarm for 9:30PM results when the EHRn*
and EMNn* enable bits are set to ‘1’ and the HRAn*
and MNAn* registers are set to 9:30 PM.
*n = 0 for Alarm 0: N = 1 for Alarm 1
REAL TIME CLOCK REGISTERS
Clock/Calendar Registers (SC, MN, HR, DT, MO, YR)
These registers depict BCD representations of the
time. As such, SC (Seconds) and MN (Minutes) range
from 00 to 59, HR (Hour) is 1 to 12 with an AM or PM
indicator (H21 bit) or 0 to 23 (with MIL = 1), DT (Date)
is 1 to 31, MO (Month) is 1 to 12, YR (Year) is 0 to 99.
Date of the Week Register (DW)
This register provides a Day of the Week status and
uses three bits DY2 to DY0 to represent the seven
days of the week. The counter advances in the cycle
0-1-2-3-4-5-6-0-1-2-… The assignment of a numerical
value to a specific day of the week is arbitrary and may
be decided by the system software designer. The
default value is defined as ‘0’.
24 Hour Time
If the MIL bit of the HR register is 1, the RTC uses a
24-hour format. If the MIL bit is 0, the RTC uses a 12hour format and H21 bit functions as an AM/PM
indicator with a ‘1’ representing PM. The clock defaults
to standard time with H21 = 0.
7
Leap Years
Leap years add the day February 29 and are defined
as those years that are divisible by 4. Years divisible
by 100 are not leap years, unless they are also divisible by 400. This means that the year 2000 is a leap
year, the year 2100 is not. The X1226 does not correct
for the leap year in the year 2100.
STATUS REGISTER (SR)
The Status Register is located in the CCR memory
map at address 003Fh. This is a volatile register only
and is used to control the WEL and RWEL write
enable latches, read power status and two alarm bits.
This register is separate from both the array and the
Clock/Control Registers (CCR).
Table 2. Status Register (SR)
Addr
7
6
5
4
3
2
1
0
003Fh
BAT
AL1
AL0
0
0
RWEL
WEL
RTCF
Default
0
0
0
0
0
0
0
1
BAT: Battery Supply—Volatile
This bit set to “1” indicates that the device is operating
from VBACK, not VCC. It is a read-only bit and is
set/reset by hardware (X1226 internally). Once the
device begins operating from VCC, the device sets this
bit to “0”.
AL1, AL0: Alarm bits—Volatile
These bits announce if either alarm 0 or alarm 1 match
the real time clock. If there is a match, the respective
bit is set to ‘1’. The falling edge of the last data bit in a
SR Read operation resets the flags. Note: Only the AL
bits that are set when an SR read starts will be reset.
An alarm bit that is set by an alarm occurring during an
SR read operation will remain set after the read operation is complete.
RWEL: Register Write Enable Latch—Volatile
This bit is a volatile latch that powers up in the LOW
(disabled) state. The RWEL bit must be set to “1” prior
to any writes to the Clock/Control Registers. Writes to
RWEL bit do not cause a nonvolatile write cycle, so
the device is ready for the next operation immediately
after the stop condition. A write to the CCR requires
both the RWEL and WEL bits to be set in a specific
sequence.
FN8098.3
May 8, 2006
X1226
This bit is set to a “1” after a total power failure. This is
a read only bit that is set by hardware (X1226 internally) when the device powers up after having lost all
power to the device (both VCC and VBACK go to 0V).
The bit is set regardless of whether VCC or VBACK is
applied first. The loss of only one of the supplies does
not set the RTCF bit to “1”. On power-up after a total
power failure, all registers are set to their default
states and the clock will not increment until at least
one byte is written to the clock register. The first valid
write to the RTC section after a complete power failure
resets the RTCF bit to “0” (writing one byte is sufficient).
Unused Bits:
This device does not use bits 3 or 4 in the SR, but
must have a zero in these bit positions. The Data Byte
output during a SR read will contain zeros in these bit
locations.
CONTROL REGISTERS
The Control Bits and Registers, described under this
section, are nonvolatile.
Block Protect Bits—BP2, BP1, BP0
The Block Protect Bits, BP2, BP1 and BP0, determine
which blocks of the array are write protected. A write to a
protected block of memory is ignored. The block protect
bits will prevent write operations to one of eight segments
of the array. The partitions are described in Table 3.
Table 3. Block Protect Bits
Protected
Addresses
BP0
RTCF: Real Time Clock Fail Bit—Volatile
Interrupt Control and Status Bits (IM, AL1E, AL0E)
There are two Interrupt Control bits, Alarm 1 Interrupt
Enable (AL1E) and Alarm 0 Interrupt Enable (AL0E) to
specifically enable or disable the alarm interrupt signal
output (IRQ). The interrupts are enabled when either the
AL1E and AL0E bits are set to ‘1’, respectively.
BP1
The WEL bit controls the access to the CCR and memory array during a write operation. This bit is a volatile
latch that powers up in the LOW (disabled) state. While
the WEL bit is LOW, writes to the CCR or any array
address will be ignored (no acknowledge will be issued
after the Data Byte). The WEL bit is set by writing a “1”
to the WEL bit and zeroes to the other bits of the Status
Register. Once set, WEL remains set until either reset
to 0 (by writing a “0” to the WEL bit and zeroes to the
other bits of the Status Register) or until the part powers
up again. Writes to WEL bit do not cause a nonvolatile
write cycle, so the device is ready for the next operation
immediately after the stop condition.
INTERRUPT CONTROL AND FREQUENCY
OUTPUT REGISTER (INT)
BP2
WEL: Write Enable Latch—Volatile
0
0
0
None
None
0
0
1
6000h – 7FFFh
Upper 1/4
0
1
0
4000h – 7FFFh
Upper 1/2
0
1
1
0000h – 7FFFh
Full Array
1
0
0
0000h – 007Fh
First Page
1
0
1
0000h – 00FFh
First 2 pgs
X1226
Array Lock
1
1
0
0000h – 01FFh
First 4 pgs
1
1
1
0000h – 03FFh
First 8 Pgs
Two volatile bits (AL1 and AL0), associated with the two
alarms respectively, indicate if an alarm has happened.
These bits are set on an alarm condition regardless of
whether the IRQ interrupt is enabled. The AL1 and AL0
bits in the status register are reset by the falling edge of
the eighth clock of a read of the register containing the
bits.
Pulse Interrupt Mode
The pulsed interrrupt mode allows for repetitive or
recurring alarm functionality. Hence an repetitive or
recurring alarm can be set for every nth second, or nth
minute, or nth hour, or nth date, or for the same day of
the week. The pulsed interrupt mode can be considered a repetitive interrupt mode, with the repetition
rate set by the time setting fo the alarm.
The Pulse Interrupt Mode is enabled when the IM bit is
set.
IM Bit
Interrupt/Alarm Frequency
0
Single Time Event Set By Alarm
1
Repetitive/Recurring Time Event Set By
Alarm
The Alarm IRQ output will output a single pulse of
short duration (approximately 10-40ms) once the
alarm condition is met. If the interrupt mode bit (IM bit)
is set, then this pulse will be periodic.
8
FN8098.3
May 8, 2006
X1226
Programmable Frequency Output Bits—FO1, FO0
These are two output control bits. They select one of
three divisions of the internal oscillator, that is applied
to the PHZ output pin. Table 4 shows the selection bits
for this output. When using the PHZ output function,
the Alarm IRQ output function is disabled.
with different ATR bit combinations provides an estimated ppm range from +116ppm to -37ppm to the
nominal frequency compensation. The combination of
digital and analog trimming can give up to +146ppm
adjustment.
Table 4. Programmable Frequency Output Bits
CATR = [(ATR value, decimal) x 0.25pF] + 11.0pF
FO1
FO0
Output Frequency
(average of 100 samples)
0
0
Alarm IRQ output
0
1
32.768kHz
1
0
4096Hz
1
1
1Hz
Digital Trimming Register (DTR) — DTR2, DTR1
and DTR0 (Non-Volatile)
The digital trimming Bits DTR2, DTR1 and DTR0
adjust the number of counts per second and average
the ppm error to achieve better accuracy.
DTR2 is a sign bit. DTR2 = 0 means frequency
compensation is > 0. DTR2 = 1 means frequency
compensation is < 0.
DTR1 and DTR0 are scale bits. DTR1 gives 10 ppm
adjustment and DTR0 gives 20 ppm adjustment.
A range from -30ppm to +30ppm can be represented
by using three bits above.
Table 5. Digital Trimming Registers
DTR2
DTR1
DTR0
Estimated frequency
PPM
0
0
0
0
0
1
0
+10
0
0
1
+20
0
1
1
+30
1
0
0
0
1
1
0
-10
1
0
1
-20
1
1
1
-30
Analog Trimming Register (ATR) (Non-volatile)
Six analog trimming Bits from ATR5 to ATR0 are provided to adjust the on-chip loading capacitance range.
The on-chip load capacitance ranges from 3.25pF to
18.75pF. Each bit has a different weight for capacitance adjustment. Using a Citizen CFS-206 crystal
9
Note that the ATR values are in two’s complement,
with ATR(000000) = 11.0pF, so the entire range runs
from 3.25pF to 18.75pF in 0.25pF steps.
The values calculated above are typical, and total load
capacitance seen by the crystal will include approximately 2pF of package and board capacitance in addition to the ATR value.
ON-CHIP OSCILLATOR COMPENSATION
DTR Register
The on-chip capacitance can be calculated as follows:
See Application Section and Intersil’s Application Note
AN154 for more information.
WRITING TO THE CLOCK/CONTROL REGISTERS
Changing any of the nonvolatile bits of the
clock/control register requires the following steps:
– Write a 02h to the Status Register to set the Write
Enable Latch (WEL). This is a volatile operation, so
there is no delay after the write. (Operation preceeded by a start and ended with a stop).
– Write a 06h to the Status Register to set both the
Register Write Enable Latch (RWEL) and the WEL
bit. This is also a volatile cycle. The zeros in the data
byte are required. (Operation preceeded by a start
and ended with a stop).
– Write one to 8 bytes to the Clock/Control Registers
with the desired clock, alarm, or control data. This
sequence starts with a start bit, requires a slave byte
of “11011110” and an address within the CCR and is
terminated by a stop bit. A write to the CCR changes
EEPROM values so these initiate a nonvolatile write
cycle and will take up to 10ms to complete. Writes to
undefined areas have no effect. The RWEL bit is
reset by the completion of a nonvolatile write cycle,
so the sequence must be repeated to again initiate
another change to the CCR contents. If the
sequence is not completed for any reason (by sending an incorrect number of bits or sending a start
instead of a stop, for example) the RWEL bit is not
reset and the device remains in an active mode.
– Writing all zeros to the status register resets both the
WEL and RWEL bits.
– A read operation occurring between any of the previous operations will not interrupt the register write
operation.
FN8098.3
May 8, 2006
X1226
Acknowledge
SERIAL COMMUNICATION
Interface Conventions
The device supports a bidirectional bus oriented protocol. The protocol defines any device that sends data
onto the bus as a transmitter, and the receiving device
as the receiver. The device controlling the transfer is
called the master and the device being controlled is
called the slave. The master always initiates data
transfers, and provides the clock for both transmit and
receive operations. Therefore, the devices in this family operate as slaves in all applications.
Clock and Data
Data states on the SDA line can change only during
SCL LOW. SDA state changes during SCL HIGH are
reserved for indicating start and stop conditions. See
Figure 3.
Acknowledge is a software convention used to indicate successful data transfer. The transmitting device,
either master or slave, will release the bus after transmitting eight bits. During the ninth clock cycle, the
receiver will pull the SDA line LOW to acknowledge
that it received the eight bits of data. Refer to Figure 5.
The device will respond with an acknowledge after
recognition of a start condition and if the correct
Device Identifier and Select bits are contained in the
Slave Address Byte. If a write operation is selected,
the device will respond with an acknowledge after the
receipt of each subsequent eight bit word. The device
will acknowledge all incoming data and address bytes,
except for:
– The Slave Address Byte when the Device Identifier
and/or Select bits are incorrect
– All Data Bytes of a write when the WEL in the Write
Protect Register is LOW
Start Condition
All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL
is HIGH. The device continuously monitors the SDA
and SCL lines for the start condition and will not
respond to any command until this condition has been
met. See Figure 4.
Stop Condition
All communications must be terminated by a stop
condition, which is a LOW to HIGH transition of SDA
when SCL is HIGH. The stop condition is also used to
place the device into the Standby power mode after a
read sequence. A stop condition can only be issued
after the transmitting device has released the bus. See
Figure 4.
– The 2nd Data Byte of a Status Register Write Operation (only 1 data byte is allowed)
In the read mode, the device will transmit eight bits of
data, release the SDA line, then monitor the line for an
acknowledge. If an acknowledge is detected and no
stop condition is generated by the master, the device
will continue to transmit data. The device will terminate
further data transmissions if an acknowledge is not
detected. The master must then issue a stop condition
to return the device to Standby mode and place the
device into a known state.
Figure 3. Valid Data Changes on the SDA Bus
SCL
SDA
Data Stable
10
Data Change
Data Stable
FN8098.3
May 8, 2006
X1226
Figure 4. Valid Start and Stop Conditions
SCL
SDA
Start
Stop
Figure 5. Acknowledge Response From Receiver
SCL from
Master
1
8
9
Data Output
from Transmitter
Data Output
from Receiver
Start
Acknowledge
DEVICE ADDRESSING
Following a start condition, the master must output a
Slave Address Byte. The first four bits of the Slave
Address Byte specify access to either the EEPROM
array or to the CCR. Slave bits ‘1010’ access the
EEPROM array. Slave bits ‘1101’ access the CCR.
When shipped from the factory, EEPROM array is
UNDEFINED, and should be programmed by the customer to a known state.
Bit 3 through Bit 1 of the slave byte specify the device
select bits. These are set to ‘111’.
The last bit of the Slave Address Byte defines the
operation to be performed. When this R/W bit is a one,
then a read operation is selected. A zero selects a
write operation. Refer to Figure 6.
Following the Slave Byte is a two byte word address.
The word address is either supplied by the master
device or obtained from an internal counter. On powerup the internal address counter is set to address 0h,
so a current address read of the EEPROM array starts
at address 0. When required, as part of a random
read, the master must supply the 2 Word Address
Bytes as shown in Figure 6.
In a random read operation, the slave byte in the
“dummy write” portion must match the slave byte in
the “read” section. That is if the random read is from
the array the slave byte must be 1010111x in both
instances. Similarly, for a random read of the
Clock/Control Registers, the slave byte must be
1101111x in both places.
After loading the entire Slave Address Byte from the
SDA bus, the X1226 compares the device identifier
and device select bits with ‘1010111’ or ‘1101111’.
Upon a correct compare, the device outputs an
acknowledge on the SDA line.
11
FN8098.3
May 8, 2006
X1226
Figure 6. Slave Address, Word Address, and Data Bytes (64 Byte pages)
Device Identifier
Array
1
0
1
0
CCR
1
1
0
1
0
0
0
A7
A6
D7
D6
1
1
1
R/W
0
0
0
0
A8
A5
A4
A3
A2
A1
A0
D5
D4
D3
D2
D1
D0
Slave Address Byte
Byte 0
Word Address 1
Byte 1
Word Address 0
Write Operations
Byte Write
For a write operation, the device requires the Slave
Address Byte and the Word Address Bytes. This gives
the master access to any one of the words in the array
or CCR. (Note: Prior to writing to the CCR, the master
must write a 02h, then 06h to the status register in two
preceding operations to enable the write operation.
See “Writing to the Clock/Control Registers.” Upon
receipt of each address byte, the X1226 responds with
Byte 2
Data Byte
Byte 3
an acknowledge. After receiving both address bytes
the X1226 awaits the eight bits of data. After receiving
the 8 data bits, the X1226 again responds with an
acknowledge. The master then terminates the transfer
by generating a stop condition. The X1226 then
begins an internal write cycle of the data to the nonvolatile memory. During the internal write cycle, the
device inputs are disabled, so the device will not
respond to any requests from the master. The SDA output is at high impedance. See Figure 7.
Figure 7. Byte Write Sequence
Signals from
the Master
SDA Bus
S
t
a
r
t
Word
Address 1
Slave
Address
1
1 110
S
t
o
p
Data
0000000
A
C
K
Signals From
The Slave
Word
Address 0
A
C
K
A
C
K
A
C
K
Figure 8. Writing 30 bytes to a 64-byte memory page starting at address 40.
7 Bytes
23 Bytes
Address
=6
12
Address Pointer
Ends Here
Addr = 7
Address
40
Address
63
FN8098.3
May 8, 2006
X1226
page. For example, if the master begins writing at
location 60 of the memory and loads 30 bytes, then
the first 23 bytes are written to addresses 40 through
63, and the last 7 bytes are written to columns 0
through 6. Afterwards, the address counter would
point to location 7 on the page that was just written. If
the master supplies more than the maximum bytes in
a page, then the previously loaded data is over written
by the new data, one byte at a time. Refer to Figure 8.
The master terminates the Data Byte loading by issuing a stop condition, which causes the X1226 to begin
the nonvolatile write cycle. As with the byte write operation, all inputs are disabled until completion of the
internal write cycle. Refer to Figure 9 for the address,
acknowledge, and data transfer sequence.
A write to a protected block of memory is ignored, but
will still receive an acknowledge. At the end of the
write command, the X1226 will not initiate an internal
write cycle, and will continue to ACK commands.
Page Write
The X1226 has a page write operation. It is initiated in
the same manner as the byte write operation; but
instead of terminating the write cycle after the first data
byte is transferred, the master can transmit up to 63
more bytes to the memory array and up to 7 more
bytes to the clock/control registers. (Note: Prior to writing to the CCR, the master must write a 02h, then 06h
to the status register in two preceding operations to
enable the write operation. See “Writing to the
Clock/Control Registers.”
Stops and Write Modes
After the receipt of each byte, the X1226 responds
with an acknowledge, and the address is internally
incremented by one. When the counter reaches the
end of the page, it “rolls over” and goes back to the
first address on the same page. This means that the
master can write 64 bytes to a memory array page or 8
bytes to a CCR section starting at any location on that
Stop conditions that terminate write operations must be
sent by the master after sending at least 1 full data byte
and it’s associated ACK signal. If a stop is issued in the
middle of a data byte, or before 1 full data byte + ACK is
sent, then the X1226 resets itself without performing the
write. The contents of the array are not affected.
Figure 9. Page Write Sequence
Signals from
the Master
SDA Bus
1 ≤ n ≤ 64 for EEPROM array
1 ≤ n ≤ 8 for CCR
S
t
a
r
t
Word
Address 1
Slave
Address
1
1 1 10
13
Data
(1)
S
t
o
p
Data
(n)
0 0 0 00 0 0
A
C
K
Signals from
the Slave
Word
Address 0
A
C
K
A
C
K
A
C
K
FN8098.3
May 8, 2006
X1226
Figure 11. Acknowledge Polling Sequence
Acknowledge Polling
Disabling of the inputs during nonvolatile write cycles
can be used to take advantage of the typical 5mS write
cycle time. Once the stop condition is issued to indicate the end of the master’s byte load operation, the
X1226 initiates the internal nonvolatile write cycle.
Acknowledge polling can begin immediately. To do
this, the master issues a start condition followed by the
Memory Array Slave Address Byte for a write or read
operation (AEh or AFh). If the X1226 is still busy with
the nonvolatile write cycle then no ACK will be
returned. When the X1226 has completed the write
operation, an ACK is returned and the host can proceed with the read or write operation. Refer to the flow
chart in Figure 11. Note: Do not use the CCR Salve
byte (DEh or DFh) for Acknowledge Polling.
Byte load completed
by issuing STOP.
Enter ACK Polling
Issue START
Issue Memory Array Slave
Address Byte
AFh (Read) or AEh (Write)
ACK
returned?
Issue STOP
NO
YES
Read Operations
There are three basic read operations: Current
Address Read, Random Read, and Sequential Read.
nonvolatile write
Cycle complete. Continue
command sequence?
Current Address Read
NO
Issue STOP
YES
Internally the X1226 contains an address counter that
maintains the address of the last word read incremented by one. Therefore, if the last read was to
address n, the next read operation would access data
from address n+1. On power-up, the sixteen bit
address is initialized to 0h. In this way, a current
address read immediately after the power-on reset
can download the entire contents of memory starting
at the first location.Upon receipt of the Slave Address
Byte with the R/W bit set to one, the X1226 issues an
acknowledge, then transmits eight data bits. The master terminates the read operation by not responding
with an acknowledge during the ninth clock and issuing a stop condition. Refer to Figure 10 for the
address, acknowledge, and data transfer sequence.
Continue normal
Read or Write
command
sequence
PROCEED
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care.” To terminate a read
operation, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during
the ninth clock cycle and then issue a stop condition.
Figure 10. Current Address Read Sequence
Signals from
the Master
SDA Bus
Signals from
the Slave
14
S
t
a
r
t
S
t
o
p
Slave
Address
1
1 1 11
A
C
K
Data
FN8098.3
May 8, 2006
X1226
read from the newly loaded address. This operation
could be useful if the master knows the next address it
needs to read, but is not ready for the data.
Random Read
Random read operations allow the master to access
any location in the X1226. Prior to issuing the Slave
Address Byte with the R/W bit set to zero, the master
must first perform a “dummy” write operation.
Sequential Read
Sequential reads can be initiated as either a current
address read or random address read. The first data
byte is transmitted as with the other modes; however,
the master now responds with an acknowledge, indicating it requires additional data. The device continues
to output data for each acknowledge received. The
master terminates the read operation by not responding
with an acknowledge and then issuing a stop condition.
The master issues the start condition and the slave
address byte, receives an acknowledge, then issues
the word address bytes. After acknowledging receipt
of each word address byte, the master immediately
issues another start condition and the slave address
byte with the R/W bit set to one. This is followed by an
acknowledge from the device and then by the eight bit
data word. The master terminates the read operation
by not responding with an acknowledge and then issuing a stop condition. Refer to Figure 12 for the
address, acknowledge, and data transfer sequence.
The data output is sequential, with the data from
address n followed by the data from address n + 1.
The address counter for read operations increments
through all page and column addresses, allowing the
entire memory contents to be serially read during one
operation. At the end of the address space the counter
“rolls over” to the start of the address space and the
X1226 continues to output data for each acknowledge
received. Refer to Figure 13 for the acknowledge and
data transfer sequence.
In a similar operation called “Set Current Address,” the
device sets the address if a stop is issued instead of
the second start shown in Figure 12. The X1226 then
goes into standby mode after the stop and all bus
activity will be ignored until a start is detected. This
operation loads the new address into the address
counter. The next Current Address Read operation will
Figure 12. Random Address Read Sequence
Signals from
the Master
S
t
a
r
t
SDA Bus
Slave
Address
1
1 1 11
A
C
K
A
C
K
S
t
o
p
Slave
Address
1
00 00000
A
C
K
Signals from
the Slave
Word
Address 0
Word
Address 1
1 110
S
t
a
r
t
A
C
K
Data
Figure 13. Sequential Read Sequence
A
C
K
Slave
Address
Signals from
the Master
SDA Bus
A
C
K
S
t
o
p
A
C
K
1
A
C
K
Signals from
the Slave
Data
(1)
Data
(2)
Data
(n-1)
Data
(n)
(n is any integer greater than 1)
15
FN8098.3
May 8, 2006
X1226
ABSOLUTE MAXIMUM RATINGS
COMMENT
Temperature Under Bias ................... -65°C to +135°C
Storage Temperature ........................ -65°C to +150°C
Voltage on VCC, VBACK and PHZ/IRQ
pin (respect to ground) ............................-0.5V to 7.0V
Voltage on SCL, SDA, X1 and X2
pin (respect to ground) ............... -0.5V to 7.0V or 0.5V
above VCC or VBACK (whichever is higher)
DC Output Current .............................................. 5 mA
Lead Temperature (Soldering, 10s)................... 300°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation
of the device at these or any other conditions above
those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
DC OPERATING CHARACTERISTICS (Temperature = -40°C to +85°C, unless otherwise stated.)
Symbol
VCC
VBACK
Max
Unit
Main Power Supply
Parameter
2.7
5.5
V
Backup Power Supply
1.8
5.5
V
VBACK -0.2
VBACK -0.1
V
VBACK
VBACK +0.2
V
Max
Unit
VCB
Switch to Backup Supply
VBC
Switch to Main Supply
Conditions
Min
Typ
Notes
OPERATING CHARACTERISTICS
Symbol
Parameter
Conditions
Min
Typ
ICC1
Read Active Supply Current
VCC = 2.7V
400
µA
VCC = 5.0V
800
µA
ICC2
Program Supply Current
(nonvolatile)
VCC = 2.7V
2.5
mA
VCC = 5.0V
3.0
mA
ICC3
Main Timekeeping
Current
VCC = 2.7V
10
µA
VCC = 5.0V
20
µA
IBACK
Timekeeping Current
Notes
1, 5, 7, 14
2, 5, 7, 14
3, 7, 8, 14, 15
VBACK = 1.8V
1.25
µA
3, 6, 9, 14, 15
VBACK = 3.3V
1.5
µA
“See Performance Data”
ILI
Input Leakage Current
10
µA
10
ILO
Output Leakage Current
10
µA
10
VIL
Input LOW Voltage
-0.5
VCC x 0.2 or
VBACK x 0.2
V
13
VIH
Input HIGH Voltage
VCC x 0.7 or
VBACK x 0.7
VCC + 0.5 or
VBACK + 0.5
V
13
V
13
V
11
V
11
V
12
.05 x VCC or
.05 x VBACK
VHYS
Schmitt Trigger Input
Hysteresis
VOL1
Output LOW Voltage for
SDA
VCC = 2.7V
0.4
VCC = 5.5V
0.4
VOL2
Output LOW Voltage for
PHZ/IRQ
VCC = 2.7V
VCC x 0.3
VCC = 5.5V
VCC x 0.3
VOH2
Output HIGH Voltage for
PHZ/IRQ
16
VCC related level
VCC = 2.7V
VCC x 0.7
VCC = 5.5V
VCC x 0.7
FN8098.3
May 8, 2006
X1226
Notes: (1) The device enters the Active state after any start, and remains active: for 9 clock cycles if the Device Select Bits in the Slave Address
Byte are incorrect or until 200nS after a stop ending a read or write operation.
(2) The device enters the Program state 200nS after a stop ending a write operation and continues for tWC.
(3) The device goes into the Timekeeping state 200nS after any stop, except those that initiate a nonvolatile write cycle; tWC after a stop
that initiates a nonvolatile write cycle; or 9 clock cycles after any start that is not followed by the correct Device Select Bits in the Slave
Address Byte.
(4) For reference only and not tested.
(5) VIL = VCC x 0.1, VIH = VCC x 0.9, fSCL = 400KHz
(6) VCC = 0V
(7) VBACK = 0V
(8) VSDA = VSCL=VCC, Others = GND or VCC
(9) VSDA =VSCL=VBACK, Others = GND or VBACK
(10) VSDA = GND or VCC, VSCL = GND or VCC
(11) IOL = 3.0mA at 5.5V, 1.5mA at 2.7V
(12) IOH = -1.0mA at 5.5V, -0.4mA at 2.7V
(13) Threshold voltages based on the higher of Vcc or Vback.
(14) Using recommended crystal and oscillator network applied to X1 and X2 (25°C).
(15) Typical values are for TA = 25°C
Capacitance TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol
COUT
(1)
CIN(1)
Parameter
Max.
Units
Test Conditions
Output Capacitance (SDA, PHZ/IRQ)
10
pF
VOUT = 0V
Input Capacitance (SCL)
10
pF
VIN = 0V
Notes: (1) This parameter is not 100% tested.
(2) The input capacitance between x1 and x2 pins can be varied between 5pF and 19.75pF by using analog trimming registers
AC CHARACTERISTICS
AC Test Conditions
Input Pulse Levels
VCC x 0.1 to VCC x 0.9
Input Rise and Fall Times
10ns
Input and Output Timing
Levels
VCC x 0.5
Output Load
Standard Output Load
Figure 14. Standard Output Load for testing the device with VCC = 5.0V
Equivalent AC Output Load Circuit for VCC = 5V
5.0V
5.0V
1533Ω
For VOL= 0.4V
1316Ω
and IOL = 3 mA
PHZ/IRQ
SDA
100pF
17
806Ω
100pF
FN8098.3
May 8, 2006
X1226
AC Specifications (TA = -40°C to +85°C, VCC = +2.7V to +5.5V, unless otherwise specified.)
Symbol
Parameter
Min.
tIN
Pulse width Suppression Time at inputs
50(1)
tAA
SCL LOW to SDA Data Out Valid
0.1
tBUF
Time the bus must be free before a new transmission can start
1.3
μs
tLOW
Clock LOW Time
1.3
μs
tHIGH
Clock HIGH Time
0.6
μs
tSU:STA
Start Condition Setup Time
0.6
μs
tHD:STA
Start Condition Hold Time
0.6
μs
fSCL
SCL Clock Frequency
Max.
Units
400
kHz
ns
0.9
μs
tSU:DAT
Data In Setup Time
100
ns
tHD:DAT
Data In Hold Time
0
μs
tSU:STO
Stop Condition Setup Time
0.6
μs
Data Output Hold Time
50
ns
tDH
tR
SDA and SCL Rise Time
tF
SDA and SCL Fall Time
Cb
Capacitive load for each bus line
20
+.1Cb(2)
300
ns
20
+.1Cb(2)
300
ns
400
pF
Notes: (1) This parameter is not 100% tested.
(2) Cb = total capacitance of one bus line in pF.
TIMING DIAGRAMS
Bus Timing
tHIGH
tF
SCL
tLOW
tR
tSU:DAT
tSU:STA
SDA IN
tHD:STA
tHD:DAT
tSU:STO
tAA
tDH
tBUF
SDA OUT
18
FN8098.3
May 8, 2006
X1226
Write Cycle Timing
SCL
SDA
8th Bit of Last Byte
ACK
tWC
Stop
Condition
Start
Condition
Power-up Timing
Symbol
Parameter
Min.
Typ.(2)
Max.
Units
tPUR(1)
Time from Power-up to Read
1
ms
(1)
Time from Power-up to Write
5
ms
tPUW
Notes: (1) Delays are measured from the time VCC is stable until the specified operation can be initiated. These parameters are not 100% tested.
VCC slew rate should be between 0.2mV/µsec and 50mV/µsec.
(2) Typical values are for TA = 25°C and VCC = 5.0V
Nonvolatile Write Cycle Timing
Symbol
tWC
Note:
(1)
Parameter
Write Cycle Time
Min.
Typ.(1)
Max.
Units
5
10
ms
(1) tWC is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It is
the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.
19
FN8098.3
May 8, 2006
X1226
APPLICATION SECTION
CRYSTAL OSCILLATOR AND TEMPERATURE
COMPENSATION
Intersil has now integrated the oscillator compensation
circuity on-chip, to eliminate the need for external
components and adjust for crystal drift over temperature and enable very high accuracy time keeping
(<5ppm drift).
The Intersil RTC family uses an oscillator circuit with
on-chip crystal compensation network, including
adjustable load-capacitance. The only external component required is the crystal. The compensation network is optimized for operation with certain crystal
parameters which are common in many of the surface
mount or tuning-fork crystals available today. Table 6
summarizes these parameters.
Table 7 contains some crystal manufacturers and part
numbers that meet the requirements for the Intersil
RTC products.
The turnover temperature in Table 6 describes the
temperature where the apex of the of the drift vs. temperature curve occurs. This curve is parabolic with the
drift increasing as (T-T0)2. For an Epson MC-405
device, for example, the turnover temperature is typically 25 deg C, and a peak drift of >110ppm occurs at
the temperature extremes of -40 and +85 deg C. It is
possible to address this variable drift by adjusting the
load capacitance of the crystal, which will result in predictable change to the crystal frequency. The Intersil
RTC family allows this adjustment over temperature
since the devices include on-chip load capacitor trimming. This control is handled by the Analog Trimming
Register, or ATR, which has 6 bits of control. The load
capacitance range covered by the ATR circuit is
approximately 3.25pF to 18.75pF, in 0.25pf increments. Note that actual capacitance would also
include about 2pF of package related capacitance. Incircuit tests with commercially available crystals demonstrate that this range of capacitance allows frequency control from +116ppm to -37ppm, using a
12.5pF load crystal.
In addition to the analog compensation afforded by the
adjustable load capacitance, a digital compensation
feature is available for the Intersil RTC family. There
are three bits known as the Digital Trimming Register
or DTR, and they operate by adding or skipping pulses
in the clock signal. The range provided is ±30ppm in
increments of 10ppm. The default setting is 0ppm. The
DTR control can be used for coarse adjustments of
frequency drift over temperature or for crystal initial
accuracy correction.
Table 6. Crystal Parameters Required for Intersil RTC’s
Parameter
Min
Frequency
Typ
Max
32.768
Freq. Tolerance
Turnover Temperature
20
Operating Temperature Range
-40
Parallel Load Capacitance
25
Notes
kHz
±100
ppm
30
°C
85
°C
12.5
Equivalent Series Resistance
Units
Down to 20ppm if desired
Typically the value used for most
crystals
pF
50
kΩ
For best oscillator performance
Table 7. Crystal Manufacturers
Manufacturer
Part Number
Temp Range
+25°C Freq Toler.
Citizen
CM201, CM202, CM200S
-40 to +85°C
±20ppm
Epson
MC-405, MC-406
-40 to +85°C
±20ppm
Raltron
RSM-200S-A or B
-40 to +85°C
±20ppm
SaRonix
32S12A or B
-40 to +85°C
±20ppm
Ecliptek
ECPSM29T-32.768K
-10 to +60°C
±20ppm
ECS
ECX-306/ECX-306I
-10 to +60°C
±20ppm
Fox
FSM-327
-40 to +85°C
±20ppm
20
FN8098.3
May 8, 2006
X1226
A final application for the ATR control is in-circuit calibration for high accuracy applications, along with a
temperature sensor chip. Once the RTC circuit is
powered up with battery backup, the PHZ output is
set at 32.768kHz and frequency drift is measured.
The ATR control is then adjusted to a setting which
minimizes drift. Once adjusted at a particular temperature, it is possible to adjust at other discrete temperatures for minimal overall drift, and store the resulting
settings in the EEPROM. Extremely low overall temperature drift is possible with this method. The Intersil
evaluation board contains the circuitry necessary to
implement this control.
The X1226 product has a special consideration. The
PHZ/IRQ- pin on the 8 Ld SOIC package is located
next to the X2 pin. When this pin is used as a frequency output (PHZ) and is set to 32.768kHz output
frequency, noise can couple to the X1 or X2 pins and
cause double-clocking. The layout in figure 15 can
help minimize this by running the PHZ output away
from the X1 and X2 pins. Also, minimizing the switching current at this pin by careful selection of the pullup
resistor value will reduce noise. Intersil suggests a
minimum value of 5.1kΩ for 32.768kHz, and higher
values (up to 20kΩ) for lower frequency PHZ outputs.
For more detailed operation see Intersil’s application
note AN154 on Intersil’s website at www.intersil.com.
For other RTC products, the same rules stated above
should be observed, but adjusted slightly since the
packages and pinouts are slightly different.
Layout Considerations
Assembly
The crystal input at X1 has a very high impedance and
will pick up high frequency signals from other circuits on
the board. Since the X2 pin is tied to the other side of
the crystal, it is also a sensitive node. These signals can
couple into the oscillator circuit and produce double
clocking or mis-clocking, seriously affecting the accuracy of the RTC. Care needs to be taken in layout of the
RTC circuit to avoid noise pickup. Below in Figure 15 is
a suggested layout for the X1226 or X1227 devices.
Most electronic circuits do not have to deal with
assembly issues, but with the RTC devices assembly
includes insertion or soldering of a live battery into an
unpowered circuit. If a socket is soldered to the board,
and a battery is inserted in final assembly, then there
are no issues with operation of the RTC. If the battery
is soldered to the board directly, then the RTC device
Vback pin will see some transient upset from either
soldering tools or intermittent battery connections
which can stop the circuit from oscillating. Once the
battery is soldered to the board, the only way to assure
the circuit will start up is to momentarily (very short
period of time!) short the Vback pin to ground and the
circuit will begin to oscillate.
Figure 15. Suggested Layout for Intersil RTC in SO-8
Oscillator Measurements
The X1 and X2 connections to the crystal are to be
kept as short as possible. A thick ground trace around
the crystal is advised to minimize noise intrusion, but
ground near the X1 and X2 pins should be avoided as
it will add to the load capacitance at those pins. Keep
in mind these guidelines for other PCB layers in the
vicinity of the RTC device. A small decoupling capacitor at the Vcc pin of the chip is mandatory, with a solid
connection to ground.
21
When a proper crystal is selected and the layout guidelines above are observed, the oscillator should start up
in most circuits in less than one second. Some circuits
may take slightly longer, but startup should definitely
occur in less than 5 seconds. When testing RTC circuits, the most common impulse is to apply a scope
probe to the circuit at the X2 pin (oscillator output) and
observe the waveform. DO NOT DO THIS! Although in
some cases you may see a useable waveform, due to
the parasitics (usually 10pF to ground) applied with the
scope probe, there will be no useful information in that
waveform other than the fact that the circuit is oscillating. The X2 output is sensitive to capacitive impedance
so the voltage levels and the frequency will be affected
by the parasitic elements in the scope probe. Applying a
scope probe can possibly cause a faulty oscillator to
start up, hiding other issues (although in the Intersil
RTC’s, the internal circuitry assures startup when using
the proper crystal and layout).
FN8098.3
May 8, 2006
X1226
The best way to analyze the RTC circuit is to power it
up and read the real time clock as time advances, or if
the chip has the PHZ output, look at the output of that
pin on an oscilloscope (after enabling it with the control register, and using a pullup resistor for an opendrain output). Alternaltively, the X1226 device has an
IRQ- output which can be checked by setting an alarm
for each minute. Using the pulse interrupt mode setting, the once-per-minute interrupt functions as an
indication of proper oscillation.
pacitor, which is connected to the Vback pin. Do not
use the diode to charge a battery (especially lithium
batteries!).
Figure 16. Supercapactor charging circuit
2.7-5.5V
VCC
Vback
Supercapacitor
Backup Battery Operation
VSS
Many types of batteries can be used with the Intersil
RTC products. 3.0V or 3.6V Lithium batteries are
appropriate, and sizes are available that can power a
Intersil RTC device for up to 10 years. Another option
is to use a supercapacitor for applications where Vcc
may disappear intermittently for short periods of time.
Depending on the value of supercapacitor used,
backup time can last from a few days to two weeks
(with >1F). A simple silicon or Schottky barrier diode
can be used in series with Vcc to charge the superca-
Since the battery switchover occurs at Vcc = Vback0.1V (see Figure 16), the battery voltage must always
be lower than the Vcc voltage during normal operation
or the battery will be drained.
The summary of conditions for backup battery operation is given in Table 8:
Table 8. Battery Backup Operation
1. Example Application, Vcc=5V, Vback=3.0V
Condition
a. Normal Operation
Vcc
Vback
Vtrip
Iback
5.00
3.00
4.38
<<1µA
Notes
b. Vcc on with no battery
5.00
0
4.38
0
c. Backup Mode
0–1.8
1.8-3.0
4.38
<2µA
Vcc
Vback
Vtrip
Iback
a. Normal Operation
3.30
3.00
2.65
<<1µA
b. Vcc on with no battery
3.30
0
2.65
0
c. Backup Mode
0–1.8
1.8–3.0*
2.65
<2µA*
Timekeeping only
2.65 - 3.30
> Vcc
2.65
up to 3mA
Internal
Vcc = Vback
Timekeeping only
2. Example Application, Vcc=3.3V,Vback=3.0V
Condition
d. UNWANTED - Vcc ON, Vback
powering
*since Vback>2.65V is higher than Vtrip, the battery is powering the entire device
22
FN8098.3
May 8, 2006
X1226
One way to prevent operation in battery backup mode
above the Vtrip level is to add a diode drop (silicon
diode preferred) to the battery to insure it is below
Vtrip. This will also provide reverse leakage protection
which may be needed to get safety agency approval.
PERFORMANCE DATA
IBACK Performance
IBACK vs. Temperature
Multi-Lot Process Variation Data
1.4
3.3V
1.2
1.8V
1.0
IBACK (µA)
Referring to Figure 16, Vtrip applies to the “Internal
Vcc” node which powers the entire device. This means
that if Vcc is powered down and the battery voltage at
Vback is higher than the Vtrip voltage, then the entire
chip will be running from the battery. If Vback falls to
lower than Vtrip, then the chip shuts down and all outputs are disabled except for the oscillator and timekeeping circuitry. The fact that the chip can be
powered from Vback is not necessarily an issue since
standby current for the RTC devices is <2µA for this
mode (called “main timekeeping current” in the data
sheet). Only when the serial interface is active is there
an increase in supply current, and with Vcc powered
down, the serial interface will most likely be inactive.
0.8
0.6
0.4
0.2
0
-40
25
60
Temperature °C
85
One mode that should always be avoided is the operation of the RTC device with Vback greater than both
Vcc and Vtrip (Condition 2d in Table 8). This will
cause the battery to drain quickly as serial bus communication and non-volatile writes will require higher
supplier current.
23
FN8098.3
May 8, 2006
X1226
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL
SO-8
SO-14
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
N
8
14
16
Rev. L 2/01
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
24
FN8098.3
May 8, 2006
X1226
Thin Shrink Small Outline Plastic Packages (TSSOP)
M8.173
N
INDEX
AREA
E
0.25(0.010) M
E1
2
SYMBOL
3
0.05(0.002)
-A-
INCHES
GAUGE
PLANE
-B1
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
B M
0.25
0.010
SEATING PLANE
L
A
D
-C-
α
e
A1
b
A2
c
0.10(0.004)
0.10(0.004) M
C A M
B S
MIN
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
MILLIMETERS
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
8o
0o
N
NOTES:
MAX
α
8
0o
8
7
8o
Rev. 1 12/00
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
25
FN8098.3
May 8, 2006