Data Sheet

IP3337CX18
7-channel integrated LC-filter network with ESD input
protection to IEC 61000-4-2 level 4
Rev. 02 — 10 March 2009
Product data sheet
1. Product profile
1.1 General description
The IP3337CX18 is a 7-channel1 LC low-pass filter network designed to filter undesired
RF signals in the 800 MHz to 3000 MHz frequency band. In addition, the IP3337CX18
incorporates diodes which protect downstream components from ElectroStatic Discharge
(ESD) voltages as high as 15 kV.
The IP3337CX18 is fabricated using monolithic silicon technology and integrates
7 inductors, 14 back-to-back diodes in a single Wafer-Level Chip-Scale Package
(WLCSP) measuring 2.06 mm by 1.66 mm (typical). These features make the
IP3337CX18 ideal for use in applications requiring the utmost in miniaturization such as
mobile phone handsets, cordless telephones and personal digital devices.
1.2 Features
n
n
n
n
Pb-free, RoHS compliant and halogen free package; Dark Green compliant
Integrated 7-channel π-type LC-filter network with 60 nH channel inductance
125 Ω series resistance, 25 pF (typical) capacitance per line
Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding
IEC 61000-4-2, level 4
n WLCSP with 0.4 mm pitch
1.3 Applications
n Cellular and PCS mobile handsets
n Cordless telephones
n Wireless data (WAN/LAN) systems and PDAs
1.
Available as a 10-channel device (IP3338CX24).
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
2. Pinning information
2.1 Pinning
ball A1
index
IP3337CX18/LF
1
2
3
4
5
A
B
C
D
001aai833
Transparent top view
Fig 1.
Pin configuration IP3337CX18
Table 1.
Pinning
Pin
Description
A2 and A5
filter channel 1
A1 and A4
filter channel 2
B1 and B5
filter channel 3
C2 and C5
filter channel 4
C1 and C4
filter channel 5
D2 and D5
filter channel 6
D1 and D4
filter channel 7
A3, B3, C3, D3
ground
B2 and B4
no balls
3. Ordering information
Table 2.
Ordering information
Type number
IP3337CX18/LF
Package
Name
Description
Version
WLCSP18
wafer level chip-size package; 18 bumps; 2.06 × 1.66 × 0.61 mm
IP3337CX18/LF
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
2 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
4. Functional diagram
A1, A2, B1, C1,
C2, D1, D2
Ls(ch)
Rs(ch)
A4, A5, B5, C4,
C5, D4, D5
A3, B3, C3, D3
001aai748
Fig 2.
Schematic diagram IP3337CX18
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge voltage
Min
Max
Unit
−4.0
+4.0
V
all pins to ground
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−15
+15
kV
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
IEC 61000-4-2, level 4; all
pins to ground
Ich
channel current (DC)
Tamb = 70 °C
-
10
mA
Ich(M)
peak channel current
Tamb = 70 °C; 60 s
-
50
mA
Pch
channel power dissipation
continuous power;
Tamb = 70 °C
-
10
mW
Ptot
total power dissipation
Tamb = 70 °C
-
70
mW
Tstg
storage temperature
−55
+150 °C
-
260
°C
−35
+85
°C
Treflow(peak) peak reflow temperature
Tamb
[1]
10 s maximum
ambient temperature
Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model, which
far exceeds IEC 61000-4-2, level 4 (8 kV contact discharge).
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
3 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
6. Characteristics
Table 4.
Channel characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Rs(ch)
channel series resistance
Cch
channel capacitance
Ls(ch)
channel series inductance
VBR
breakdown voltage
[1]
Min
Typ
Max Unit
f = 0 Hz (DC)
100
125
150
Ω
-
25
30[1]
pF
-
60
-
nH
Itest = 1 mA
6
-
10
V
Itest = −1 mA
−10
-
−6
V
per channel; VI = 3.0 V
-
-
100
nA
Min
Typ
Max Unit
800 MHz < f < 1 GHz
38
40
-
dB
1 GHz < f < 3 GHz
35
40
-
dB
at 0 Hz; Rgen = 50 Ω;
RL = 50 Ω; Vbias(DC) = 0 V
6
7
10
dB
Vbias(DC) = 0 V; f = 1 MHz
[1]
reverse leakage current
ILR
Conditions
Guaranteed by design.
Table 5.
Frequency characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
αil
Rgen = 50 Ω; RL = 50 Ω
insertion loss
f−3dB
cut-off frequency
measured relative to
insertion loss at DC;
Rgen = 50 Ω; RL = 50 Ω
150
180
-
MHz
αct
crosstalk attenuation
800 MHz < f < 3 GHz;
Rgen = 50 Ω; RL = 50 Ω
35
40
-
dB
7. Application information
7.1 Insertion loss
The setup for measuring insertion loss in a 50 Ω system is shown in Figure 3.
IN
DUT
OUT
50 Ω
50 Ω
TEST BOARD
Vgen
001aai755
Fig 3.
Frequency response measurement configuration
The measured frequency response curves for all channels are shown in Figure 4.
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
4 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
001aai749
0
αil
(dB)
−10
−20
−30
−40
(1)
(2)
(3)
−50
−60
−70
10−1
1
102
10
103
104
f (MHz)
(1) Channel 2 (pins A1 and A4).
(2) Channel 5 (pins C1 and C4).
(3) Channel 7 (pins D1 and D4).
Fig 4.
Measured frequency response curves
7.2 Crosstalk
The setup for measuring crosstalk in a 50 Ω system is shown in Figure 5.
IN_1
50 Ω
DUT
IN_2
50 Ω
OUT_2
OUT_1
TEST BOARD
50 Ω
50 Ω
Vgen
001aai756
Fig 5.
Crosstalk measurement configuration
The crosstalk between adjacent channels within the IP3337CX18 for different channel
pairs measured in a 50 Ω NetWork Analyzer (NWA) system, is shown in Figure 6. In all
cases, all unused connections are terminated with 50 Ω to ground.
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
5 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
αct
001aai750
0
−10
−20
−30
−40
(1)
(2)
(3)
(4)
−50
−60
−70
−80
−90
10−1
1
10
102
103
104
f (MHz)
(1) Channels 2 and 5 (pins A1 and C4).
(2) Channels 3 and 4 (pins B1 and C5).
(3) Channels 3 and 6 (pins B1 and D5).
(4) Channels 2 and 1 (pins A1 and A5).
Fig 6.
Measured crosstalk between adjacent channels
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
6 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
8. Package outline
WLCSP18: wafer level chip-size package; 18 bumps; 2.06 x 1.66 x 0.61 mm
A
B
D
IP3337CX18/LF
bump A1
index
A2
E
A
A1
detail X
e1
e
b
D
e
C
e2
B
A
1
2
3
4
5
X
0
1
Dimensions
Unit
mm
2 mm
scale
A
A1
A2
b
D
E
max 0.66 0.22
0.31 2.11 1.71
nom 0.61 0.20 0.41 0.26 2.06 1.66
min 0.56 0.18
0.21 2.01 1.61
e
e1
e2
0.4
1.6
1.2
ip3337cx18_lf_po
Outline
version
References
IEC
JEDEC
JEITA
Issue date
08-08-08
08-09-09
IP3337CX18/LF
Fig 7.
European
projection
Package outline IP3337CX18/LF (WLCSP18)
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
7 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
9. Soldering of WLCSP packages
9.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
9.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
9.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 6.
Table 6.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
8 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
9.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
9.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
9.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
9 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
9.3.4 Cleaning
Cleaning can be done after reflow soldering.
10. Abbreviations
Table 7.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
NSMD
Non-Solder Mask Design
OSP
Organic Solderability Preservative
PCB
Printed-Circuit Board
PCS
Personal Communication System
PSU
Power Supply Unit
RoHS
Restriction of Hazardous Substances
WLCSP
Wafer-Level Chip-Scale Package
11. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP3337CX18_2
20090310
Product data sheet
-
IP3337CX18_1
Modifications:
IP3337CX18_1
•
•
•
•
Figure 7 “Package outline IP3337CX18/LF (WLCSP18)” updated
Section 9 “Soldering of WLCSP packages” added
“Packing information” section removed
“Design and assembly recommendations” section removed
20081112
Product data sheet
IP3337CX18_2
Product data sheet
-
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
10 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP3337CX18_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 10 March 2009
11 of 12
IP3337CX18
NXP Semiconductors
7-channel integrated LC-filter network with ESD input protection
14. Contents
1
1.1
1.2
1.3
2
2.1
3
4
5
6
7
7.1
7.2
8
9
9.1
9.2
9.3
9.3.1
9.3.2
9.3.3
9.3.4
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Soldering of WLCSP packages. . . . . . . . . . . . . 8
Introduction to soldering WLCSP packages . . . 8
Board mounting . . . . . . . . . . . . . . . . . . . . . . . . 8
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quality of solder joint . . . . . . . . . . . . . . . . . . . . 9
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 March 2009
Document identifier: IP3337CX18_2
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