datasheet

SKET 800/14G H4
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
Tc = 85 °C
808
A
Tc = 100 °C
597
A
Tj = 25 °C
37000
A
Tj = 130 °C
32000
A
Tj = 25 °C
6845000
A²s
Tj = 130 °C
5120000
A²s
VRSM
1500
V
VRRM
1400
V
Chip
IT(AV)
ITSM
i2t
SEMIPACK® 6
Thyristor Modules
SKET 800/14G H4
sinus 180°
10 ms
10 ms
VDRM
(di/dt)cr
Tj = 130 °C
(dv/dt)cr
Tj = 130 °C
Tj
Visol
• Precious metal pressure contacts for
high reliability
• Thyristor with amplifying gate
• UL recognized, file no. E 63 532
Typical Applications*
• DC motor control (e. g. for machine
tools)
• Temperature control (e. g. for ovens,
chemical processes)
• Softstart application
V
200
A/µs
2000
V/µs
-40 ... 130
°C
Module
Tstg
Features
1400
a.c.; 50 Hz; r.m.s.
-40 ... 125
°C
1 min
4000
V
1s
4800
V
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
V
Chip
VT
Tj = 25 °C, IT = 3000 A
1.45
1.55
VT(TO)
Tj = 130 °C
0.78
0.83
V
rT
Tj = 130 °C
0.22
0.25
m
IDD;IRD
Tj = 130 °C, VDD = VDRM; VRD = VRRM
150
mA
tgd
Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs
1
µs
tgr
VD = 0.67 * VDRM
2
µs
tq
Tj = 130 °C
200
IH
Tj = 25 °C
1000
2000
mA
IL
Tj = 25 °C, RG = 33 
1500
2500
mA
VGT
Tj = 25 °C, d.c.
3
V
IGT
Tj = 25 °C, d.c.
300
mA
VGD
Tj = 130 °C, d.c.
IGD
Tj = 130 °C, d.c.
Rth(j-c)
Rth(j-c)
Rth(j-c)
continuous DC
sin. 180°
rec. 120°
µs
0.25
V
10
mA
per chip
0.0405
K/W
per module
0.0405
K/W
per chip
0.042
K/W
per module
0.042
K/W
per chip
0.043
K/W
per module
0.043
K/W
Module
Rth(c-s)
chip
0.01
K/W
module
0.01
K/W
Nm
Ms
to heatsink M6
5.1
6.9
Mt
to terminal M12
15.3
20.7
Nm
5 * 9,81
m/s²
a
w
2150
g
SKET
© by SEMIKRON
Rev. 0 – 08.03.2012
1
SKET 800/14G H4
Fig. 1L: Power dissipation per thyristor vs. on-state
current
Fig. 1R: Power dissipation per thyristor vs. ambient
temperature
Fig. 5: Recovered charge vs. current decrease
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
2
Rev. 0 – 08.03.2012
© by SEMIKRON
SKET 800/14G H4
Fig. 9: Gate trigger characteristics
SKET
SEMIPACK 6
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 0 – 08.03.2012
3
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