PSC www.vishay.com Vishay Electro-Films High Frequency RF Spiral Inductor for Wire Bonded Assemblies FEATURES • Wire bond assembly • Small size: 45 mils x 45 mils x 10 mils • Low DCR, high Q • Low parasitic capacitance, high SRF APPLICATIONS • RF choking for DC biasing • RF tuning circuits • Lumped element filters PSC series RF spiral inductors are designed for RF circuits that require wire bondable components. High precision equivalent circuit modeling enables accurate computer simulation of component performance. Additional values and form factors available upon request. STANDARD ELECTRICAL SPECIFICATIONS PARAMETER Inductance Range Tolerance (1) VALUE UNIT 0.001 to 0.1 μH ± 20 % 250 mW Max. Power Handling Operating Temperature - 55 to + 125 °C Storage Temperature - 55 to + 125 °C Note (1) Main source of value tolerance is due to variation in wire bonds. See “text fixture” section below. RF CHARACTERISTICS - TYPICAL VALUES PART NUMBER INDUCTANCE (nH) Q (UNITLESS) DCR () IN-CIRCUIT INDUCTANCE (1) (nH) IN-CIRCUIT DCR (1) () 250 MHz 1000 MHz SRF (GHz) 250 MHz 1000 MHz PSC3500C 3.5 3.5 0.26 6 0.36 8 14 10.2 PSC1050B 10.5 10.5 0.9 12 1 10 16 5.5 PSC1250B 12.5 12.5 0.9 15 1 12 18 5.0 PSC1800B 18 18 1.25 20.5 1.35 13 15 4.2 PSC4500B 45 50 3.4 47.5 3.5 13 8 2.4 Note (1) Including the added inductance and resistance of typical bond wires. See equivalent circuit section. DIMENSIONS in inches (millimeters) 0.045 0.006 LENGTH 0.045 ± 0.002 (1.143 ± 0.051) Revision: 27-Sep-11 WIDTH 0.045 ± 0.002 (1.143 ± 0.051) THICKNESS 0.010 ± 0.001 (0.254 ± 0.0254) BOND PAD DIAMETER 0.006 (0.152) Document Number: 61050 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PSC www.vishay.com Vishay Electro-Films MECHANICAL SPECIFICATIONS Chip Substrate Material Alumina 99.6 % Conductor Material Gold Conductor Tthickness 5 μm ± 10 % Bond Pad Diameter (1) 6 mil Note (1) Bond pad geometry can be modified upon request. GLOBAL PART NUMBER INFORMATION Global Part Number: PSC4000CL4A1GNHW1 Global Part Number Description: PSC 4 nH 25 % 45 x 45 x 10 Au None H W1 P S MODEL PSC C INDUCTANCE (nH) The first 4 digits are significant figures of inductance 4 0 0 0 C INDUCTANCE TOLERANCE MULTIPLIER CODE CODE C = 0.001 B = 0.01 A = 0.1 M = 20 % L = 25 % SIZE L 4 SUBSTRATE 4 = 45 x 45 A = Alumina A 1 G N THICKNESS TERMINATION (mil) 1 = 10 G = Au H BACK METAL W TEST CLASS 1 PACKAGING CODE G = Au H = Class H W1 = N = None K = Class K Waffle pack, 1 min, 1 mult TS = tape and reel 100 min, 1 mult EQUIVALENT CIRCUIT The inductor’s spiral trace presents a substantial amount of series resistance, and the close spacing of the spiral turns presents measurable amounts of stray capacitance that interact with the inductive characteristics. A useful tool commonly used to model the behavior of electronic components at high frequency is the equivalent circuit model. While the equivalent circuit model accurately predicts the reactive part of the total impedance, it fails to determine the real part of the response at high frequency. This is due to the fact that the model does not include skin and proximity effects that significantly increase the real part of the impedance as the frequency rises. Bond Wire Rbw Spiral Inductor Lbw L R C L: Desired inductance R: Parasitic self resistance C: Parasitic shunt capacitance Rbw: Bond wire self resistance Fig. 1 - Equivalent Circuit Revision: 27-Sep-11 The equivalent circuit values are presented in the table below: EQUIVALENT CIRCUIT MODEL 2 INDUCTANCE VALUE L (nH) DCR R () SHUNT CAP. C (fF) TYP. Rbw (1) () 3.5 0.26 71 0.1 2.5 10.5 0.9 80 0.1 2.5 TYP. Lbw (1) (nH) 12.5 0.9 81 0.1 2.5 18 1.25 84 0.1 2.5 45 3.4 92 0.1 2.5 Note (1) Typical bond wires are approximated as being 1.25 mil in diameter gold, totaling a length of 3 mm. The resistance listed above includes the added effect of the bond wire adhesion to the substrate and component. Document Number: 61050 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PSC www.vishay.com Vishay Electro-Films Abs (Z)/Z0 TYPICAL COMPONENT PERFORMANCE 2.1 18 nH 12.5 nH 2.0 1.9 1.8 1.7 45 nH 1.6 10.5 nH 1.5 1.4 1.3 1.2 1.1 3.5 nH 1.0 0.9 10 100 1000 10 000 Frequency (MHz) Fig. 2 - Relative Impedance vs. Frequency LAYOUT CONSIDERATIONS The RF spiral inductor is electrically connected to the circuit by wire bonds. All wire bonds add parasitic inductance and resistance, as shown in Figure 1. It is important to note that setup variations might affect the performance of the component. Special care must be given to minimize these effects by careful design of the component host circuit board. The following aspects should be considered: • Bond wire length should be minimized. The bond wire added inductance can be roughly estimated at 0.75 nH per mm of 1.25 mil diameter gold wire. • Any ground plane directly under the component will increase the parasitic shunt capacitance. This will cause self-resonance at lower frequencies. • The epoxy used to attach the component is the limiting factor in power handling. For applications that require high power handling it is recommended to use high temperature epoxy and to ensure adequate heat sinking. Revision: 27-Sep-11 Document Number: 61050 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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