Data Sheet

IP3253/54CZ8/CZ12/CZ16
Integrated 4-, 6- and 8-channel passive EMI-filter network with
high level ESD protection to IEC 61000-4-2 level 4
Rev. 03 — 23 March 2010
Objective data sheet
1. Product profile
1.1 General description
The IP3253/54CZ8/CZ12/CZ16 family consists of 4-, 6- and 8-channel LC low-pass filter
arrays designed to filter unwanted RF signals on the I/O ports of portable communication
and computing devices. In addition, the IP3253/54CZ8/CZ12/CZ16 family incorporates
diodes which protect downstream components from ElectroStatic Discharge (ESD)
voltages up to ±15 kV.
These devices are fabricated using monolithic silicon technology integrating up to
8 inductors and 16 diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless plastic
package, compatible with QFN.
1.2 Features
n
n
n
n
Pb-free and Restriction of Hazardous Substances (RoHS) compliant
4-, 6- and 8-channel integrated π-type LC filter network
ESD protection to ±15 kV contact discharge according to IEC 61000-4-2, level 4
ESD protection to ±30 kV contact discharge according to MIL-STD-883 (Method 3015)
Human Body Model
n UTLP (QFN compatible) plastic package with 0.4 mm pitch and 0.5 mm height
1.3 Applications
n General purpose ElectroMagnetic Interference (EMI), Radio-Frequency Interference
(RFI) filtering and downstream ESD protection for:
u Cellular phone and Personal Communication System (PCS) mobile handsets
u Cordless telephones
u Wireless data (WAN/LAN) systems
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
2. Pinning information
Table 1.
Pin
Pinning IP3253/54CZ8/CZ12/CZ16
Description
Simplified outline
Symbol
CZ8
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
filter channel 4
ground pad
ground
8
Ls(ch)
5
1, 2, 3, 4
1
4
Transparent
top view
5, 6, 7, 8
GND
001aaj745
CZ12
1 and 12
filter channel 1
2 and 11
filter channel 2
3 and 10
filter channel 3
4 and 9
filter channel 4
5 and 8
filter channel 5
6 and 7
filter channel 6
ground pad
ground
12
Ls(ch)
7
1, 2, 3,
4, 5, 6
1
7, 8, 9,
10, 11, 12
6
Transparent
top view
GND
001aaj746
CZ16
1 and 16
filter channel 1
2 and 15
filter channel 2
3 and 14
filter channel 3
4 and 13
filter channel 4
5 and 12
filter channel 5
6 and 11
filter channel 6
7 and 10
filter channel 7
8 and 9
filter channel 8
ground pad
ground
16
1, 2, 3, 4,
5, 6, 7, 8
1
9, 10, 11, 12,
13, 14, 15, 16
8
Transparent
top view
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
Ls(ch)
9
GND
001aaj747
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
2 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
HXSON8U
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm
SOT983-1
IP3253CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm
SOT984-1
IP3253CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm
SOT985-1
IP3254CZ8-4
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; UTLP based; body 1.35 × 1.7 × 0.5 mm
SOT983-1
IP3254CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; UTLP based; body 1.35 × 2.5 × 0.5 mm
SOT984-1
IP3254CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; UTLP based; body 1.35 × 3.3 × 0.5 mm
SOT985-1
IP3253CZ8-4
HXSON8U
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VESD
electrostatic discharge voltage
Conditions
Min
Max
Unit
−0.5
+5.6
V
−30
+30
kV
−15
+15
kV
IP3253CZ8/CZ12/CZ16
-
30
mA
IP3254CZ8/CZ12/CZ16
-
30
mA
all pins to ground; contact discharge
Human Body Model; MIL-STD-883,
Method 3015
IEC 61000-4-2, level 4
channel current (DC)
Ich
channel power dissipation
Pch
Ptot/pack total power dissipation per
package
[1]
Tamb = 85 °C
IP3253CZ8/CZ12/CZ16
-
10
mW
IP3254CZ8/CZ12/CZ16
-
10
mW
Tamb = 85 °C
-
500
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
[1]
Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model, which far exceed IEC 61000-4-2
level 4 (8 kV contact discharge).
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
3 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
5. Characteristics
Table 4.
Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Ls(ch)
channel series inductance
Cch
channel capacitance
Conditions
Min
Typ
Max
Unit
IP3253CZ8/CZ12/CZ16
-
18
-
nH
IP3254CZ8/CZ12/CZ16
-
18
-
nH
for the total channel; fi = 100 kHz
IP3253CZ8/CZ12/CZ16
Vbias(DC) = 2.5 V
[1]
20
25
30
pF
Vbias(DC) = 0 V
[1]
34
43
52
pF
Vbias(DC) = 2.5 V
[1]
25
33
40
pF
Vbias(DC) = 0 V
[1]
38
50
60
pF
IP3254CZ8/CZ12/CZ16
ILR
reverse leakage current
per channel; VI = 3.5 V
-
-
0.1
µA
VBR
breakdown voltage
positive clamp; II = 1 mA
5.8
-
10
V
VF
forward voltage
negative clamp; IF = −1 mA
−1.5
-
−0.4
V
R(ch-ch)
resistance between channels VI = 3.5 V
10
-
-
MΩ
Rs(ch)
channel series resistance
-
8
-
Ω
[1]
Guaranteed by design.
Table 5.
Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
αil
insertion loss
Rsource = 50 Ω; RL = 50 Ω;
1 GHz < fi < 4 GHz
-
30
-
dB
f−3dB
cut-off frequency
Rsource = 50 Ω; RL = 50 Ω; VI = 0 V
IP3253CZ8/CZ12/CZ16
-
175
-
MHz
IP3254CZ8/CZ12/CZ16
-
145
-
MHz
IP3253CZ8/CZ12/CZ16
-
350
-
MHz
IP3254CZ8/CZ12/CZ16
-
315
-
MHz
frolloff
roll-off frequency
measured at 6 dB attenuation; Rsource =
50 Ω; RL = 50 Ω; VI = 0 V
6. Application information
6.1 Insertion loss
The devices are specifically designed as EMI/RFI filters for multichannel interfaces.
The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1.
An example of the measurement curves for all channels is shown in Figure 2.
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
4 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
IN
DUT
OUT
50 Ω
50 Ω
TEST BOARD
Vgen
001aaj236
Test board PCB utilizes laser drilled micro-via holes which connect the ground plane to the device
ground pins.
Fig 1.
Frequency response setup
001aak301
0
s21
(dB)
001aak302
0
s21
(dB)
−10
−10
−20
−20
(1)
−30
(2)
−40
−50
1
10
102
(1)
−30
103
(2)
−40
104
−50
1
10
102
f (MHz)
104
f (MHz)
(1) Channel 1 (pin 1 to pin 8)
(1) Channel 3 (pin 3 to pin 6)
(2) Channel 4 (pin 4 to pin 5)
(2) Channel 2 (pin 2 to pin 7)
Fig 2.
103
IP3253CZ8 measured insertion loss magnitudes
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
5 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
001aal112
0
s21
(dB)
001aal389
0
s21
(dB)
−10
−10
−20
−20
−30
(2)
−30
(1)
−40
(1)
−40
(2)
−50
1
10
102
103
104
−50
1
10
102
f (MHz)
104
f (MHz)
(1) Channel 1 (pin 1 to pin 8)
(1) Channel 3 (pin 3 to pin 6)
(2) Channel 4 (pin 4 to pin 5)
(2) Channel 2 (pin 2 to pin 7)
Fig 3.
103
IP3254CZ8 measured insertion loss magnitudes
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
6 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
7. Package outline
HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
SOT983-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
1/2 e
terminal 1
index area
v
w
b
e
1
L1
M
M
C
C A B
C
y
y1 C
4
L
Eh
8
5
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
1.75
1.65
1.5
1.3
1.4
1.3
0.5
0.3
0.4
1.2
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
Fig 4.
REFERENCES
OUTLINE
VERSION
IEC
SOT983-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-12
07-11-14
Package outline SOT983-1 (HXSON8U)
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
7 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm
SOT984-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1/2 e
1
L1
M
M
C
C A B
C
y
y1 C
6
L
Eh
12
7
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
2.55
2.45
2.3
2.1
1.4
1.3
0.5
0.3
0.4
2
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
Fig 5.
REFERENCES
OUTLINE
VERSION
IEC
SOT984-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-12
07-11-14
Package outline SOT984-1 (HXSON12U)
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
8 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm
SOT985-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1/2 e
1
L1
M
M
C
C A B
C
y
y1 C
8
L
Eh
16
9
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
3.35
3.25
3.1
2.9
1.4
1.3
0.5
0.3
0.4
2.8
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
Fig 6.
REFERENCES
OUTLINE
VERSION
IEC
SOT985-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-12
07-11-14
Package outline SOT985-1 (HXSON16U)
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
9 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
8. Abbreviations
Table 6.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
LAN
Local Area Network
PCB
Printed-Circuit Board
PCS
Personal Communication System
QFN
Quad Flat No leads
RFI
Radio Frequency Interference
RoHS
Restriction of Hazardous Substances
UTLP
Ultra-Thin Leadless Package
WAN
Wide Area Network
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP3253_54CZ8_CZ12_CZ16_3
20100323
Objective data sheet
-
IP3253CZ8_CZ12_CZ16_2
Modifications:
•
Added type numbers IP3254CZ8, IP3254CZ12 and IP3254CZ16
IP3253CZ8_CZ12_CZ16_2
20091016
Objective data sheet
-
IP3253CZ8_CZ12_CZ16_1
IP3253CZ8_CZ12_CZ16_1
20090514
Objective data sheet
-
-
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
10 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
11 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use of
the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP3253_54CZ8_CZ12_CZ16_3
Objective data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 03 — 23 March 2010
12 of 13
IP3253/54CZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 23 March 2010
Document identifier: IP3253_54CZ8_CZ12_CZ16_3
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