Data Sheet

IP3253/IP3254-TTL
Integrated 4-, 6- and 8-channel passive EMI-filter network with
high-level ESD protection
Rev. 1 — 5 May 2011
Product data sheet
1. Product profile
1.1 General description
The IP3253/IP3254-TTL family consists of 4-, 6- and 8-channel LC low-pass filter arrays
designed to filter unwanted RF signals on the I/O ports of portable communication and
computing devices. In addition, the IP3253/IP3254-TTL family incorporates diodes which
protect downstream components from ElectroStatic Discharge (ESD) voltages
up to ±15 kV.
These devices are fabricated using monolithic silicon technology integrating up to
8 inductors and 16 diodes in a 0.4 mm pitch 8-, 12- or 16-pin ultra-thin leadless
Quad Flat No-leads (QFN) plastic package.
1.2 Features and benefits
„ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
„ 4-, 6- and 8-channel integrated π-type LC filter network
„ ESD protection to ±15 kV contact discharge according to IEC 61000-4-2, level 4
„ ESD protection to ±30 kV contact discharge according to MIL-STD-883 (method 3015)
Human Body Model (HBM)
„ QFN plastic package with 0.4 mm pitch and 0.5 mm height
1.3 Applications
„ General-purpose ElectroMagnetic Interference (EMI), Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
‹ Cellular phone and Personal Communication System (PCS) mobile handsets
‹ Cordless telephones
‹ Wireless data (WAN/LAN) systems
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
2. Pinning information
Table 1.
Pin
Pinning
Description
Simplified outline
Graphic symbol
IP3253CZ8-4-TTL; IP3254CZ8-4-TTL (SOT1166-1)
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
filter channel 4
ground pad
ground
8
5
Ls(ch)
1, 2, 3, 4
1
4
Transparent
top view
5, 6, 7, 8
GND
001aaj745
IP3253CZ12-6-TTL; IP3254CZ12-6-TTL (SOT1167-1)
1 and 12
filter channel 1
2 and 11
filter channel 2
3 and 10
filter channel 3
4 and 9
filter channel 4
5 and 8
filter channel 5
6 and 7
filter channel 6
ground pad
ground
12
7
Ls(ch)
1, 2, 3,
4, 5, 6
1
7, 8, 9,
10, 11, 12
6
Transparent
top view
GND
001aaj746
IP3253CZ16-8-TTL; IP3254CZ16-8-TTL (SOT1168-1)
IP3253_IP3254-TTL
Product data sheet
1 and 16
filter channel 1
2 and 15
filter channel 2
3 and 14
filter channel 3
4 and 13
filter channel 4
5 and 12
filter channel 5
6 and 11
filter channel 6
7 and 10
filter channel 7
8 and 9
filter channel 8
ground pad
ground
16
9
Ls(ch)
1, 2, 3, 4,
5, 6, 7, 8
1
9, 10, 11, 12,
13, 14, 15, 16
8
Transparent
top view
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
GND
001aaj747
© NXP B.V. 2011. All rights reserved.
2 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
HUSON8
plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP3253CZ12-6-TTL HUSON12
plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP3253CZ16-8-TTL HUSON16
plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP3254CZ8-4-TTL
plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.55 mm
SOT1166-1
IP3254CZ12-6-TTL HUSON12
plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.55 mm
SOT1167-1
IP3254CZ16-8-TTL HUSON16
plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.55 mm
SOT1168-1
IP3253CZ8-4-TTL
HUSON8
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
VESD
electrostatic discharge
voltage
IEC 61000-4-2, level 4
Unit
−0.5
+5.6
V
-
±30
kV
Tamb = 85 °C
[1]
-
±15
kV
-
30
mA
-
10
mW
-
500
mW
Ich
channel current (DC)
Pch
channel power dissipation
Ptot/pack
total power dissipation
per package
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
[1]
Product data sheet
Max
all pins to ground;
contact discharge
HBM; MIL-STD-883,
method 3015
IP3253_IP3254-TTL
Min
Tamb = 85 °C
Device tested with 1000 pulses of ±15 kV contact discharges, according to the IEC 61000-4-2 model,
far exceeding IEC 61000-4-2 level 4 (8 kV contact discharge).
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
3 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
5. Characteristics
Table 4.
Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Ls(ch)
Conditions
Typ
Max
Unit
-
18
-
nH
Vbias(DC) = 2.5 V
20
25
28.2
pF
Vbias(DC) = 0 V
34
43
48
pF
Vbias(DC) = 2.5 V
25
33
40
pF
Vbias(DC) = 0 V
38
50
60
pF
channel series inductance
channel capacitance
Cch
Min
IP3253CZx-y-TTL
IP3254CZx-y-TTL
for the total channel;
fi = 100 kHz
[1]
ILR
reverse leakage current
per channel; VI = 3.5 V
-
-
0.1
μA
VBR
breakdown voltage
positive clamp; II = 1 mA
5.8
-
10
V
VF
forward voltage
negative clamp;
IF = −1 mA
−1.5
-
−0.4
V
R(ch-ch)
resistance between
channels
VI = 3.5 V
10
-
-
MΩ
Rs(ch)
channel series resistance
-
8
-
Ω
[1]
Guaranteed by design.
Table 5.
Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
αil
insertion loss
Rsource = 50 Ω; RL = 50 Ω;
1 GHz < fi < 4 GHz
-
30
-
dB
f−3dB
cut-off frequency
Rsource = 50 Ω; RL = 50 Ω;
VI = 0 V
IP3253CZx-y-TTL
-
175
-
MHz
IP3254CZx-y-TTL
-
145
-
MHz
IP3253CZx-y-TTL
-
350
-
MHz
IP3254CZx-y-TTL
-
315
-
MHz
frolloff
[1]
IP3253_IP3254-TTL
Product data sheet
Rsource = 50 Ω; RL = 50 Ω;
VI = 0 V
roll-off frequency
[1]
Measured at 6 dB attenuation.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
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IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
6. Application information
6.1 Insertion loss
The devices are specifically designed as EMI/RFI filters for multichannel interfaces.
The block schematic for measuring insertion loss in a 50 Ω system is shown in Figure 1.
An example of the measurement curves for all channels is shown in Figure 2.
DUT
IN
50 Ω
OUT
TEST BOARD
50 Ω
Vgen
018aaa016
Test Printed-Circuit Board (PCB) utilizes laser-drilled micro-via holes which connect the ground
plane to the device ground pins.
Fig 1.
Frequency response setup
001aak301
0
001aak302
0
s21
(dB)
s21
(dB)
−10
−10
−20
−20
(1)
−30
(2)
−40
−50
(1)
−30
1
10
102
103
(2)
−40
−50
104
1
10
102
f (MHz)
104
f (MHz)
(1) Channel 1 (pin 1 to pin 8)
(1) Channel 3 (pin 3 to pin 6)
(2) Channel 4 (pin 4 to pin 5)
(2) Channel 2 (pin 2 to pin 7)
Fig 2.
103
IP3253CZ8-4-TTL measured insertion loss magnitudes
IP3253_IP3254-TTL
Product data sheet
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Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
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IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
001aal112
0
001aal389
0
s21
(dB)
s21
(dB)
−10
−10
−20
−20
−30
(2)
−30
(1)
−40
(1)
−40
(2)
−50
1
10
102
103
−50
104
1
10
102
f (MHz)
104
f (MHz)
(1) Channel 1 (pin 1 to pin 8)
(1) Channel 3 (pin 3 to pin 6)
(2) Channel 4 (pin 4 to pin 5)
(2) Channel 2 (pin 2 to pin 7)
Fig 3.
103
IP3254CZ8-4-TTL measured insertion loss magnitudes
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
6 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
7. Package outline
HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.55 mm
SOT1166-1
X
A
B
D
A
E
A1
c
terminal 1
index area
detail X
e1
terminal 1
index area
e
1
4
C
C A B
C
v
w
b
y1 C
y
L
k
Eh
8
5
Dh
tiebars are indicated on
arbitrary location and size
0
1
scale
Dimensions
Unit(1)
mm
2 mm
A
A1
b
c
D
max 0.55 0.05 0.25
1.8
nom
0.20 0.127 1.7
min
0.00 0.15
1.6
Dh
1.3
1.2
1.1
E
Eh
1.45 0.45
1.35 0.40
1.25 0.35
e
e1
0.4
k
L
v
0.1
0.2
0.30
0.25
0.20
1.2
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Fig 4.
References
Outline
version
IEC
JEDEC
JEITA
SOT1166-1
---
---
---
sot1166-1_po
European
projection
Issue date
10-03-18
10-03-22
Package outline SOT1166-1 (HUSON8)
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
7 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads;
12 terminals; body 1.35 x 2.5 x 0.55 mm
SOT1167-1
X
A
B
D
A
E
A1
c
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
6
C
C A B
C
y1 C
y
L
k
Eh
12
7
Dh
tiebars are indicated on
arbitrary location and size
0
1
scale
Dimensions
Unit(1)
mm
2 mm
A
A1
b
c
D
max 0.55 0.05 0.25
2.6
nom
0.20 0.127 2.5
min
0.00 0.15
2.4
Dh
2.1
2.0
1.9
E
Eh
1.45 0.45
1.35 0.40
1.25 0.35
e
e1
0.4
k
L
v
0.1
0.2
0.30
0.25
0.20
2.0
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Fig 5.
References
Outline
version
IEC
JEDEC
JEITA
SOT1167-1
---
---
---
sot1167-1_po
European
projection
Issue date
10-03-18
10-03-22
Package outline SOT1167-1 (HUSON12)
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
8 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads;
16 terminals; body 1.35 x 3.3 x 0.55 mm
SOT1168-1
X
A
B
D
A
E
A1
c
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
8
C
C A B
C
y1 C
y
L
k
Eh
16
9
Dh
tiebars are indicated on
arbitrary location and size
0
1
Dimensions
Unit(1)
mm
2 mm
scale
A
A1
b
c
D
max 0.55 0.05 0.25
3.4
nom
0.20 0.127 3.3
min
0.00 0.15
3.2
Dh
2.9
2.8
2.7
E
Eh
1.45 0.45
1.35 0.40
1.25 0.35
e
e1
0.4
2.8
k
L
v
0.1
0.2
0.30
0.25
0.20
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Fig 6.
References
Outline
version
IEC
JEDEC
JEITA
SOT1168-1
---
---
---
sot1168-1_po
European
projection
Issue date
10-03-18
10-03-22
Package outline SOT1168-1 (HUSON16)
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
9 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
8. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP3253_IP3254-TTL v.1
20110505
Product data sheet
-
-
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
10 of 13
IP3253/IP3254-TTL
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
9.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
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NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP3253_IP3254-TTL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 May 2011
© NXP B.V. 2011. All rights reserved.
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NXP Semiconductors
Integrated 4-, 6- and 8-channel passive EMI-filter network
11. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
7
8
9
9.1
9.2
9.3
9.4
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 5 May 2011
Document identifier: IP3253_IP3254-TTL