Data Sheet

PEMIxCSP family
Integrated 4-, 6- and 8-channel passive filter network with
ESD protection
Rev. 2 — 27 January 2012
Product data sheet
1. Product profile
1.1 General description
The devices are a family of 4-, 6- and 8-channel RC low pass filters which are designed to
provide filtering of undesired RF signals on the I/O ports of portable communication or
computing devices. In addition the devices incorporate diodes to provide protection to
downstream components from ElectroStatic Discharge (ESD) voltages up to 20 kV.
The PEMIxCSP family is fabricated using monolithic silicon technology and integrates
up to eight resistors and 16 protection diodes in a single Wafer Level Chip-Size
Package (WLCSP).
These features make the devices ideal for use in applications requiring the utmost in
miniaturization such as mobile phone handsets, cordless telephones and personal digital
devices.
1.2 Features and benefits
 Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
 Integrated 4-, 6- and 8-channel -type RC filter network
 Channel series resistance Rs(ch) = 100 
 Channel capacitance Cch = 23 or 30 pF at Vbias(DC) = 2.5 V
 Channel capacitance Cch = 41 or 54 pF at Vbias(DC) = 0 V
 Available in 10, 15 and 20-ball WLCSP
 ESD protection up to 20 kV contact discharge according to IEC 61000-4-2,
far exceeding level 4
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
 Cellular phone and Personal Communication Systems (PCS) mobile handsets
 Cordless telephones
 Wireless data (WAN/LAN) systems
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
2. Pinning information
2.1 Pinning
bump A1
index area
bump A1
index area
1
3
2
4
1
A
2
3
4
5
A
B2
B1
B
B2
B1
B
C
B3
C
001aak062
001aak063
transparent top view,
solder balls facing down
Fig 1.
6
transparent top view,
solder balls facing down
PEMI4CSP: pin configuration
Fig 2.
PEMI6CSP: pin configuration
bump A1
index area
1
3
2
4
5
6
7
8
A
B2
B1
B
B3
B4
C
001aak064
transparent top view,
solder balls facing down
Fig 3.
PEMI8CSP: pin configuration
2.2 Pin description
Table 1.
Pinning
Pin
PEMIXCSP_FAM
Product data sheet
Description
PEMI4CSP
PEMI6CSP
PEMI8CSP
A1 and C1
A1 and C1
A1 and C1
filter channel 1
A2 and C2
A2 and C2
A2 and C2
filter channel 2
A3 and C3
A3 and C3
A3 and C3
filter channel 3
A4 and C4
A4 and C4
A4 and C4
filter channel 4
-
A5 and C5
A5 and C5
filter channel 5
-
A6 and C6
A6 and C6
filter channel 6
-
-
A7 and C7
filter channel 7
-
-
A8 and C8
filter channel 8
B1 and B2
B1, B2 and B3
B1, B2, B3 and B4
ground (GND)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
2 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
PEMI4CSP/RT
WLCSP10 wafer level chip-size package; 10 bumps; 1.56  1.05  0.61 mm
PEMI4CSP/RT
PEMI4CSP/RW
WLCSP10 wafer level chip-size package; 10 bumps; 1.56  1.05  0.61 mm
PEMI4CSP/RW
PEMI6CSP/RT
WLCSP15 wafer level chip-size package; 15 bumps; 2.36  1.05  0.61 mm
PEMI6CSP/RT
PEMI6CSP/RW
WLCSP15 wafer level chip-size package; 15 bumps; 2.36  1.05  0.61 mm
PEMI6CSP/RW
PEMI8CSP/RT/P
WLCSP20 wafer level chip-size package; 20 bumps; 3.16  1.05  0.61 mm
PEMI8CSP/RT/P
PEMI8CSP/RW/P WLCSP20 wafer level chip-size package; 20 bumps; 3.16  1.05  0.61 mm
PEMI8CSP/RW/P
4. Functional diagram
Rs(ch)
Rs(ch)
A1 to A4
C1 to C4
A1 to A6
Cch
2
Cch
2
GND
Cch
2
GND
018aaa077
Fig 4.
C1 to C6
Cch
2
018aaa078
PEMI4CSP: schematic diagram
Fig 5.
PEMI6CSP: schematic diagram
Rs(ch)
A1 to A8
C1 to C8
Cch
2
Cch
2
GND
018aaa079
Fig 6.
PEMI8CSP: schematic diagram
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
3 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC
supply voltage
VESD
Conditions
electrostatic discharge
voltage
Min
Max
Unit
0.5
+5.6
V
contact discharge
-
20
kV
air discharge
-
30
kV
contact discharge
-
8
kV
air discharge
-
15
kV
-
33
mA
[1]
all pins to ground
IEC 61000-4-2, level 4
all pins to ground
Tamb = 70 C
Ich
channel current (DC)
Pch
channel power dissipation continuous power;
Tamb = 70 C
-
60
mW
Ptot
total power dissipation
-
250
mW
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
40
+85
C
[1]
continuous power;
Tamb = 70 C
Device is qualified with 1000 pulses of 15 kV contact discharges each, according to the IEC 61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
6. Characteristics
Table 4.
Channel characteristics
Tamb = 25 C; unless otherwise specified.
Symbol Parameter
Rs(ch)
Conditions
PEMIxCSP/RT
PEMIxCSP/RW
PEMIXCSP_FAM
Product data sheet
Typ
Max
Unit
80
100
120

Vbias(DC) = 0 V
33
41
49
pF
Vbias(DC) = 2.5 V
-
23
-
pF
Vbias(DC) = 0 V
43
54
65
pF
Vbias(DC) = 2.5 V
-
30
-
pF
channel series resistance
channel capacitance
Cch
Min
for the total channel;
f = 100 kHz
[1]
VBR
breakdown voltage
positive clamp; II = 1 mA
5.8
-
9
V
VF
forward voltage
negative clamp; IF = 1 mA
1.5
-
0.4
V
ILR
reverse leakage current
per channel; VI = 3.5 V
-
-
0.1
A
Rdyn
dynamic resistance
I=1A
positive transient
-
0.3
-

negative transient
-
0.85
-

[1]
Guaranteed by design.
[2]
According to IEC 61000-4-5 and IEC 61000-4-9.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
[2]
© NXP B.V. 2012. All rights reserved.
4 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
Table 5.
Frequency characteristics
Tamb = 25 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
il
Rsource = 50 ; RL = 50 
800 MHz < fi < 3 GHz
25
30
-
dB
fi = 1.7 GHz
-
35
-
dB
PEMIxCSP/RW
800 MHz < fi < 3 GHz
27
32
-
dB
fi = 1.7 GHz
-
37
-
dB
ct
crosstalk attenuation
Rsource = 50 ; RL = 50 ;
800 MHz < fi < 3 GHz
-
30
-
dB
f3dB
cut-off frequency
Rsource = 50 ; RL = 50 
PEMIxCSP/RT
-
128
-
MHz
PEMIxCSP/RW
-
98
-
MHz
insertion loss
PEMIxCSP/RT
7. Application information
7.1 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
All measurements were performed in a typical 50  NetWork Analyzer (NWA) setup as
shown in Figure 7. The measured insertion loss in a 50  system is depicted in Figure 8.
DUT
IN
OUT
50 Ω
50 Ω
Vgen
018aaa074
Fig 7.
PEMIXCSP_FAM
Product data sheet
Frequency response setup
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
5 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
018aaa080
0
S21
(dB)
(1)
−20
(2)
−40
−60
10−1
1
10
102
103
104
f (MHz)
(1) PEMIxCSP/RT
(2) PEMIxCSP/RW
Fig 8.
Frequency response curves
7.2 Use cases
The selection of one of the filter device has to be performed in dependence of the
maximum clock frequency, the driver strength, the capacitive load of the sink and the
maximum applicable rise and fall times.
7.3 LCD interfaces, medium-speed interfaces
For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock
speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of
the sink load, the clock speed, the driver strength and the rise and fall time requirements.
The minimum EMI filter requirements may be an important factor, too.
7.4 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and
low-speed control signals, the PEMIxCSP family offers a very robust ESD protection and
strong suppression of unwanted frequencies (EMI filtering). Due to their small size the
devices can easily be spread on a Printed-Circuit Board (PCB) in order to move the
ESD and EMI protection close to the part of the design which shall be protected.
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
6 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
8. Marking
All dies are laser-marked with the following information (see Figure 9 and 10):
• A marker indicating the pin A1 position.
• Two lines of characters or numbers:
– The first line (placeholder <marking code>) indicates the marking code.
Mapping of product type numbers to marking codes is given in Table 6.
– The second line (placeholder <lot ID>) indicates the production lot.
This information enable to track a device down to a particular production date.
pin A1 marker
<marking code>
<lot ID>
018aaa081
Fig 9.
PEMI4CSP and PEMI6CSP: outline of the marking
pin A1 marker
<marking code>
<lot ID>
018aaa082
Fig 10. PEMI8CSP: outline of the marking
Table 6.
PEMIXCSP_FAM
Product data sheet
Marking codes
Type number
Marking code
Type number
Marking code
PEMI4CSP/RT
RT
PEMI6CSP/RW
RW
PEMI4CSP/RW
RW
PEMI8CSP/RT/P
RT
PEMI6CSP/RT
RT
PEMI8CSP/RW/P
RW
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
7 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
9. Package outline
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
D
bump A1
index area
A2
E
A
A1
detail X
e
b
C
e1
B1
B
B2
e2
A
1
3
2
4
e3
X
1/2 e
European
projection
wlcsp10_4-2-4_po
Fig 11. Package outline PEMI4CSP (WLCSP10)
Table 7.
Package outline dimensions of PEMI4CSP
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
1.51
1.56
1.61
mm
E
1.00
1.05
1.10
mm
e
-
0.4
-
mm
e1
-
0.346
-
mm
e2
-
0.692
-
mm
e3
-
0.8
-
mm
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
8 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
D
bump A1
index area
A2
E
A
A1
detail X
e
1/2 e
b
C
e1
B2
B1
B
B3
e2
A
1
2
3
4
5
6
e3
X
European
projection
wlcsp15_6-3-6_po
Fig 12. Package outline PEMI6CSP (WLCSP15)
Table 8.
Package outline dimensions of PEMI6CSP
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
2.31
2.36
2.41
mm
E
1.00
1.05
1.10
mm
e
-
0.4
-
mm
e1
-
0.346
-
mm
e2
-
0.692
-
mm
e3
-
0.8
-
mm
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
9 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
WLCSP20: wafer level chip-size package; 20 bumps (8-4-8)
D
bump A1
index area
A2
E
A
A1
detail X
e
1/2 e
b
C
e1
B1
B
B2
B3
B4
e2
A
1
2
3
4
5
6
7
8
e3
X
European
projection
wlcsp20_8-4-8_po
Fig 13. Package outline PEMI8CSP (WLCSP20)
Table 9.
Package outline dimensions of PEMI8CSP
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
3.11
3.16
3.21
mm
E
1.00
1.05
1.10
mm
e
-
0.4
-
mm
e1
-
0.346
-
mm
e2
-
0.692
-
mm
e3
-
0.8
-
mm
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
10 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
10. Design and assembly recommendations
10.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask
Defined (NSMD), also known as a copper-defined design, incorporating laser-drilled
micro-vias connecting the ground pads to a buried ground-plane layer. This results in the
lowest possible ground inductance and provides the best high frequency and
ESD performance. Refer to Table 10 for the recommended Printed-Circuit Board (PCB)
design parameters.
Table 10.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
250 m
Micro-via diameter
100 m (0.004 inch)
Solder mask aperture diameter
325 m
Copper thickness
20 m to 40 m
Copper finish
AuNi
PCB material
FR4
10.2 PCB assembly guidelines for Pb-free soldering
Table 11.
PEMIXCSP_FAM
Product data sheet
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
290 m
Solder screen thickness
100 m (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
Solder to flux ratio
50 : 50
Solder reflow profile
see Figure 14
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
11 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
T
(°C)
Treflow(peak)
250
230
cooling rate
217
preheat
t1
t (s)
t2
t3
t4
t5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 14. Pb-free solder reflow profile
Table 12.
Symbol
Characteristics
Parameter
Conditions
Treflow(peak) peak reflow temperature
Product data sheet
Typ
Max
Unit
230
-
260
C
60
-
180
s
t1
time 1
soak time
t2
time 2
time during T  250 C
-
-
30
s
t3
time 3
time during T  230 C
10
-
50
s
t4
time 4
time during T > 217 C
30
-
150
s
t5
time 5
-
-
540
s
dT/dt
rate of change of temperature cooling rate
-
-
6
C/s
2.5
-
4.0
C/s
pre-heat
PEMIXCSP_FAM
Min
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
12 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
11. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PEMIXCSP_FAM v.2
20120127
Product data sheet
-
PEMIXCSP_FAM v.1
PEMIXCSP_FAM v.1
20110203
Product data sheet
-
-
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
13 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PEMIXCSP_FAM
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
14 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PEMIXCSP_FAM
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 January 2012
© NXP B.V. 2012. All rights reserved.
15 of 16
PEMIxCSP family
NXP Semiconductors
4-, 6- and 8-channel passive filter network with ESD protection
14. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
7.1
7.2
7.3
7.4
8
9
10
10.1
10.2
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Use cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LCD interfaces, medium-speed interfaces . . . . 6
Keypad, low-speed interfaces. . . . . . . . . . . . . . 6
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Design and assembly recommendations . . . 11
PCB design guidelines . . . . . . . . . . . . . . . . . . 11
PCB assembly guidelines for Pb-free
soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 27 January 2012
Document identifier: PEMIXCSP_FAM
Similar pages