Data Sheet

IP4365CX11
Integrated (U)SIM card passive filter array and USB full speed
ESD protection to IEC 61000-4-2 level 4
Rev. 01 — 26 March 2010
Product data sheet
1. Product profile
1.1 General description
The IP4365CX11 is a fully integrated smart card interface device according
ISO/IEC 7816-3 for the Subscriber Identity Module (SIM) card interface and according
ISO/IEC 7816-12 for the Universal Subscriber Identity Module (USIM) Universal Serial
Bus (USB) interface. It is designed to provide ElectroMagnetic Interference (EMI) filtering
and ElectroStatic Discharge (ESD) protection for the conventional digital interface and
also for the USB interface.
The 3-channel EMI filter is identical to the filter available as ESD protection and EMI filter
IP4366CX8 (which does not contain the additional USB full speed ESD protection). It also
provides RC low-pass filtering of undesired Radio Frequency (RF) signals in the 800 MHz
to 3 000 MHz frequency band. The IP4365CX11 is designed to provide protection to
downstream components from ESD voltages as high as ±15 kV contact discharge and
> ±15 kV air discharge according the IEC 61000-4-2 model, far exceeding standard
level 4.
The device is fabricated using monolithic silicon technology and integrate three resistors
and several high-level ESD-protection diodes in a single Wafer-Level Chip-Scale Package
(WLCSP). These features make the IP4365CX11 ideal for use in applications requiring
the utmost in miniaturization such as mobile phone handsets, cordless telephones and
personal digital devices.
1.2 Features and benefits
„
„
„
„
„
„
„
„
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
3-channel SIM card interface integrated RC filter array
Integrated 100 Ω/100 Ω/47 Ω series channel resistors
2-channel USB full speed compliant ESD protection for USIM
1-channel ESD protection for card supply
10 pF channel capacitance
EMI filter compatible with IP4366CX8
Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air
discharge, far exceeding IEC 61000-4-2 level 4
„ WLCSP with 0.4 mm pitch
1.3 Applications
„ USIM, SIM and similar smart card interfaces in e.g. cellular and Personal
Communication System (PCS) mobile handsets and wireless modems
IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
2. Pinning information
2.1 Pinning
3
2
1
bump A1
index area
A
B
C
D
008aaa218
transparent top view,
solder balls facing down
Fig 1.
Pin configuration
2.2 Pin description
Table 1.
Pinning
Pin
Description
A1
internal pin RST or I/O channel
A2
ground
A3
external pin RST or I/O channel
B1
internal pin CLK channel
B2
not connected (missing ball)
B3
external pin CLK channel
C1
internal pin I/O or RST channel
C2
ground
C3
external pin I/O or RST channel
D1
external ESD protection (USB data or supply)
D2
external ESD protection (USB data or supply)
D3
external ESD protection (USB data or supply)
3. Ordering information
Table 2.
Ordering information
Type number
IP4365CX11/P
IP4365CX11_1
Product data sheet
Package
Name
Description
Version
WLCSP11
wafer level chip-size package; 11 bumps (3 × 4 - B2)
IP4365CX11/P
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
4. Functional diagram
IEC61000-4-2
level 1
protection pins
IEC61000-4-2
level 4
protection pins
R1
A1
100 Ω
A3
R2
B1
47 Ω
B3
R3
C1
100 Ω
C3
D1
D2
D3
A2, C2
008aaa216
Fig 2.
Schematic diagram
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VI
input voltage
VESD
electrostatic discharge
voltage
Min
Max
Unit
−0.5
+5.5
V
pins A3, B3, C3, D1, D2 and D3
to ground (A2, C2)
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−15
+15
kV
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
contact discharge
−2
+2
kV
air discharge
−2
+2
kV
IEC 61000-4-2 level 4; pins A3,
B3, C3, D1, D2 and D3 to
ground (A2, C2)
IEC 61000-4-2 level 1; pins A1,
B1 and C1 to ground (A2, C2)
Pch
channel power dissipation continuous power; Tamb = 70 °C
-
60
mW
Ptot
total power dissipation
continuous power; Tamb = 70 °C
-
180
mW
Tstg
storage temperature
−55
+150 °C
-
260
°C
−35
+85
°C
Treflow(peak) peak reflow temperature
Tamb
[1]
IP4365CX11_1
Product data sheet
10 s maximum
ambient temperature
Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
6. Characteristics
Table 4.
Electrical characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
75
100
125
Ω
35.2
47.0
58.8
Ω
8
10
12
pF
Rs(ch)
channel series resistance R1 and R3
Cch
channel capacitance
channel A1 to A3,
channel B1 to B3,
channel C1 to C3,
pins D1, D2 and D3;
Vbias(DC) = 0 V; f = 1 MHz
VBR
breakdown voltage
Itest = 1 mA
6
-
10
V
ILR
reverse leakage current
VI = 3 V
-
-
50
nA
R2
[1]
[1]
Guaranteed by design.
7. Application information
7.1 Application diagram
A typical application diagram showing IP4365CX11 in a SIM card interface using the
standard digital and the USB full speed interface is depicted in Figure 3. The 2 kV ESD
compliant pins (A1, B1 and C1) are connected to the baseband interface side while the six
15 kV ESD compliant pins (pins A3, B3, C3, D1, D2 and D3) are connected to the USIM
card. Pins D1, D2 and D3 are identical and can be used as required. Also the channel
A1 to A3 and the channel C1 to C3 can be exchanged in case this is required for an
easier routing.
VSIM
D3
RST
CLK
I/O
USB
A1
R1
A3
100 Ω
B1
R2
B3
47 Ω
C1
R3
C3
100 Ω
VCC
GND
RST
SPU
CLK
I/O
AUX1 AUX2
D1
D+
D2
D−
SIM/smart card
baseband
A2, C2
008aaa217
Fig 3.
Typical application diagram
IP4365CX11_1
Product data sheet
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Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
7.2 Insertion loss
The IP4365CX11 is mainly designed as an EMI/RFI filter for SIM card interfaces.
The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA)
system for evaluation of the IP4365CX11 is shown in Figure 4.
The insertion loss in a 50 Ω NWA system for all three resistor equipped channels of
IP4365CX11 is depicted in Figure 5. The insertion loss is measured with a test
Printed-Circuit Board (PCB) utilizing laser drilled micro-via holes that connect the PCB
ground plane to the ground pins.
IN
OUT
DUT
50 Ω
50 Ω
TEST BOARD
Vgen
001aai755
Fig 4.
Frequency response measurement configuration
008aaa214
0
s21
(dB)
(1)
−10
−20
(2)
−30
(3)
−40
10−1
1
10
102
103
104
f (MHz)
(1) Channel B1 to B3.
(2) Channel C1 to C3.
(3) Channel A1 to A3.
Fig 5.
IP4365CX11_1
Product data sheet
Measured insertion loss magnitudes
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
7.3 Crosstalk
The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of
the IP4365CX11 is shown in Figure 6.
Six typical examples of crosstalk measurement results of IP4365CX11 are depicted in
Figure 7. Unused channels are terminated with 50 Ω to ground.
IN_1
50 Ω
OUT_2
DUT
IN_2
50 Ω
OUT_1
TEST BOARD
50 Ω
50 Ω
Vgen
001aai756
Fig 6.
Crosstalk measurement configuration
008aaa215
0
αct
(dB)
−20
(1)
(2)
(3)
−40
−60
−80
−100
1
10
102
103
104
f (MHz)
(1) Pin B1 to pin C3.
(2) Pin B1 to pin A3.
(3) Pin A1 to pin B3.
Fig 7.
IP4365CX11_1
Product data sheet
Measured crosstalk between different channels
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
6 of 12
IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
8. Package outline
WLCSP11: wafer level chip-size package; 11 bumps (3 x 4 - B2)
bump A1
index area
D
A2
E
A
A1
detail X
e1
b
e
D
e
C
e2
B
A
3
2
X
1
European
projection
wlcsp11_3x4-b2_po
Fig 8.
Table 5.
Package outline IP4365CX11 (WLCSP11)
Dimensions for Figure 8
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
1.11
1.16
1.21
mm
E
1.51
1.56
1.61
mm
e
-
0.4
-
mm
e1
-
0.8
-
mm
e2
-
1.2
-
mm
IP4365CX11_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to Table 6 for the recommended PCB design parameters.
Table 6.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
200 μm
Micro-via diameter
100 μm (0.004 inch)
Solder mask aperture diameter
370 μm
Copper thickness
20 μm to 40 μm
Copper finish
AuNi
PCB material
FR4
9.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
330 μm
Solder screen thickness
100 μm (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
Solder / flux ratio
50 / 50
Solder reflow profile
see Figure 9
T
(°C)
Treflow(peak)
250
230
cooling rate
217
pre-heat
t1
t2
t3
t4
t (s)
t5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 9.
IP4365CX11_1
Product data sheet
Pb-free solder reflow profile
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
Table 8.
Characteristics
Symbol
Parameter
Treflow(peak)
peak reflow temperature
t1
time 1
t2
time 2
t3
Conditions
Min
Typ
Max
Unit
230
-
260
°C
soak time
60
-
180
s
time during T ≥ 250 °C
-
-
30
s
time 3
time during T ≥ 230 °C
10
-
50
s
t4
time 4
time during T > 217 °C
30
-
150
s
t5
time 5
dT/dt
rate of change of temperature
-
-
540
s
cooling rate
-
-
−6
°C/s
pre-heat
2.5
-
4.0
°C/s
10. Abbreviations
Table 9.
Abbreviations
Acronym
Description
DUT
Device Under Test
EMI
ElectroMagnetic Interference
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
IEC
International Electrotechnical Commission
ISO
International Organization for Standardization
NSMD
Non-Solder Mask Defined
NWA
NetWork Analyzer
PCB
Printed-Circuit Board
PCS
Personal Communication System
RF
Radio Frequency
RFI
Radio Frequency Interference
RoHS
Restriction of Hazardous Substances
SIM
Subscriber Identity Module
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
WLCSP
Wafer-Level Chip-Scale Package
11. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4365CX11_1
20100326
Product data sheet
-
-
IP4365CX11_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
IP4365CX11_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
10 of 12
IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4365CX11_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 26 March 2010
© NXP B.V. 2010. All rights reserved.
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IP4365CX11
NXP Semiconductors
Integrated SIM card passive filter array and USB ESD protection
14. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
7.1
7.2
7.3
8
9
9.1
9.2
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Application diagram . . . . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Design and assembly recommendations . . . . 8
PCB design guidelines . . . . . . . . . . . . . . . . . . . 8
PCB assembly guidelines for Pb-free soldering 8
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 March 2010
Document identifier: IP4365CX11_1
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