Application guide; Portable devices and mobile handsets

Application guide
Portable devices and mobile handsets
Enhancing the user experience, simplifying the design
Introduction
Your partner for portable devices and mobile handsets
NXP Semiconductors is a recognized leader in portable and mobile
applications. We offer a comprehensive portfolio of best-in-class solutions
and have long-standing partnerships with every major handset maker in the
industry.
We consistently introduce new technologies that set the standard for
performance, efficiency, and size. Our new chip-scale package (CSP) devices,
for example, have an exceptionally compact footprint yet achieve a new
benchmark in mechanical robustness.
Our customers rely on us for innovation, whether it’s application-specific
solutions for peripheral functions that enhance the user experience − like
advanced audio, secure services (NFC), or tailored software − or simply the
most extensive portfolio of standard products.
We also offer security and reliability, with a cost-efficient supply chain and an
enterprise-wide commitment to the highest standards of quality. In short, our
customers have the confidence that comes from working with a world-class
partner.
We use next-generation packaging to save space in compact designs,
and we extend battery life with low-power technologies that dramatically
increase efficiency. We design for ruggedness, supplying devices that stand
up to intensive use, and we deliver the high integration needed to simplify
development, lower BOM and production costs, and reduce time-to-market.
There’s more.
This application guide provides an introduction to our portfolio for portable
devices. It highlights many of the forward-thinking solutions we have available,
but it’s only the beginning. To learn more, please visit our dedicated
application page at www.nxp.com/applications/portable/cellular_phone_mms
2
Introduction
System diagram for generic portable application
NXP offers a wide range of
application-specific peripheral
solutions for portable devices and
mobile handsets. These solutions
serve to support the move toward :
} Enhanced user experiences
AC/DC
Charger
Battery
Charger
Interface
PMU
FM, GPS,
WLAN, BT
Cellular &
connectivity
radio
} Connectivity everywhere
} Secure transactions
} Enhanced services
SIM Card
Interface
Memory Card
Interface
Blinker
Back light
Processor
LED Flash
driver
Cellular
} Mobilized multimedia
} Enhanced audio quality
} Standardized technology interfaces
NFC/au10tic
Audio
Interface
Security
MCU, special
Function μC
I2C, MIPI,
SPI UART
Camera
Interface
Display
Interface
HDMI
Interface
Distributed Power
LDO, DCDC
www.nxp.com/applications/portable/cellular_phone_mms
USB
Interface
Keypad
Interface
Discretes &
EMI Filtering
Processing
Interface
RF
Sensor and Actuator
Power
Standard Products
Sensor
Logic
Level
Translators
Analog
Switches
3
Contents
1. Audio solutions
1.1 Digital-in Class-D amplifiers
1.2 Class-G headphone amplifier
1.3 Low-ohmic switches
1.4 Audio-specific EMI filters and ESD protection
1.5 LifeVibesTM for Mobile
2. Distributed power
2.1 Low Drop Out (LDO) regulators
2.2 Load switches with logic control
2.3 Standard load switches
2.4 Charger interfaces
5
7
10
11
13
16
17
18
19
19
20
3. Display and camera interfaces
22
4. Lighting and blinking
25
5. Memory card interfaces
29
6. High-speed data interfaces
35
4.1 Camera flash products
4.2 LED blinkers and dimmers
5.1 SIM card interfaces
5.2 SD card and T-Flash interfaces
6.1 HDMI 6.2 High-Speed USB 26
28
7. Level translators
40
8. Keypad and joystick interfaces
43
9. RF interfaces
45
10. NFC and RFID
46
11. Logic for portable applications
48
7.1 I2C level translators
7.2 Level shifters for voltage translation 11.1 Ultra-low-power CMOS logic
11.2 Configurable logic gates
11.3 Logic-controlled analog switches
41
42
48
49
50
12. Discretes for portable applications 51
Additional resources
53
29
32
35
39
4
1.
Audio solutions
NXP is committed to higher performance, shorter design cycles, and
lower overall cost.
NXP audio advantages
} NXP’s power-efficient audio amplifier
techniques extend battery life and
are compatible with upcoming digital
audio interfaces
} Low-power CoolFlux DSP is optimized
for audio with an extensive range of
audio algorithms
} Our LifeVibes audio software
enhances the user experience with
functions such as VoiceClarity,
ConcertSound, and Horn Removal
Our application knowledge builds on decades of technical leadership
to deliver pure, uncolored sound performance. Our power-efficient
amplifier techniques extend battery life, are compatible with digital audio
interfaces, and support our speaker portfolio with maximum loudness
in a minimum form factor. Our advanced EMI filters and ESD protection
solutions enable undistorted audio signals and robust audio interfaces.
To extend performance even further, we offer LifeVibesTM for Mobile,
a suite of tailored audio software solutions that let designers
optimize the end-user’s audio experience.
Advanced Class-D audio amplifier
Basic DSP structure
Program
Memory
32
ASIC
SPK
16
Program
Control
ESD protection solutions enable
undistorted audio signals in
combination with very robust audio
interfaces
} NXP’s analog switch portfolio
supports multiple sources sharing the
limited number of analog interfaces in
mobile devices
LifeVibes MxMedia catalog index
X Data Memory
24
} Our advanced EMI filter and
Y Data Memory
16
24
‘‘X’’ Address
Generation
Capture
Edit
DSP
16
NoiseVoid
1.8 V
ALU X
Smart DCDC
Vbatt
MediaManager
ALU Y
VideoStudio
MediaConverter
MusicManager
Data, Computation
AudioRecorder
JTAG
DMA
TvPlayer
QuickStart
ConcertSound
Rounding, Saturation
Interrupts
HandsFree
AmbiVolume
Camcorder
Accumulator Registers A, B
Vboost
ClearCall
MediaPlayer
VideoArtist
Multiplier y
ALU 0
Multiplier x
Experience
VoiceClarity
Operand Registers x, y
AMP
Play
‘‘Y’’ Address
Generation
VideoTelephony
I/O
Manage
AudioStudio
MixDJFX
JinglePlayer
LoudnessMaximizer
I/O
5
1.
Audio solutions
Highlights of the NXP audio portfolio
Analog input
Digital input
Headphone
SA58670ABS
2 x 2.1 W @ 5 V, 4 Ω
Stereo audio amplifier
TFA9879
2.5 W @ 5 V, 4 Ω
I2S, PCM input/equalizer/DRC
TDA1308AUK
Class-AB headphone driver
SA58671UK
2 x 1.2 W @ 5 V, 8 Ω
Stereo audio amplifier
TFA9881
2.7 W @ 5 V, 4 Ω (1% THD)
PDM bus, simple control
SA5863UK
Class-G headphone driver
SA58672UK and TK
3 W @ 5.5 V, 4 Ω
Mono audio amplifier
TFA9882
2.7 W @ 5 V, 4 Ω (1% THD)
I2S bus, simple control
6
1.
Audio solutions
1.1 Digital-in Class-D amplifiers
By using a digital interface, our audio amplifiers simplify the audio architecture, enable easy interfacing, and lower system cost. They eliminate the need
for a digital-to-analog converter (DAC) in the host processor, and the PDM/I2S format guarantees an ultra-small IC footprint. The digital interface reduces
RF susceptibility, in the device and the system overall, and lowers sensitivity to input-clock jitter. Also, because the digital interface eliminates the
problems that can arise from DC offsets due to leakage currents in analog designs, there’s no need for couple capacitors or safeguard speakers.
I2S-input Class-D
} 1-direction data (+ control tokens) via 3 wires
} 2 channels
} Sample based, no complex modulation
} Stable up to 0 dB full scale, with no artifacts at clipping
} Signal at 1 Fs can be easily signal processed
Volume control, EQ, DRC, etc
PDM-input Class-D
} 1-direction data (+ control tokens) via 2 wires
} 2 channels
} Less distortion from “wrong” bits
} Simple digital-to-analog conversion (saves power)
} L/R by means of clock phase
Benefits of digital interface
} Highly immune to RF interference
- No pick-up of GSM or other disturbing signals
} No need for digital-to-analog converter in host processor
- For dual audio channels, digital interface requires fewer pins
- Achieving good analog performance is difficult with host processors
built using advanced CMOS technology
} No DC offset at the output due to input leakage currents
} Easy layout
- Digital interface traces are less sensitive to noise pick-up on
the PCB
- Amplifier can be placed close to speaker
- Fewer components required (no input couple capacitors)
7
1.
Audio solutions
2.7 W PDM input Class-D amplifiers TFA9881 & TFA9882
These compact amplifiers include either a PDM input (TFA9881) or
an I2S input (TFA9882) as the interface for audio and control settings.
Audio starts automatically when the clock associated with the data
stream is on. For maximum power saving, the amplifier enters a
power-down mode as soon as the clock for the data stream is stopped.
Features
} Single power supply: 2.3 to 5.5 V
} Output power
- 1.4 W into 4 Ω at 1% THD; 3.6 V
- 2.7 W into 4 Ω at 1% THD; 5 V
} Dynamic Power Stage Activation (DPSA) technology for very low
quiescent power (6.5 mW)
} Fully automatic power-down mode for maximum power savings
} PDM stream for audio and IC control
- PDM clock range 2 to 6.144 MHz
- Standby and mute by PDM signal
- 4 gain settings and slope control by PDM
- Standby, mute, and on
} ESD on output pins to support HV flash ESD discharge
(IEC 61000-4-2 10 kV )
} Left/right selection by control pin
} Low RDSon (~0.1 Ω) for high efficiency
} WLCSP9 package (1.3 x 1.3 mm) with 0.4 mm pitch
Benefits
} Simple architecture with small size and minimized number of connections
} Smallest solution available with benchmark performance for THD,
noise, and idle current
} Less distortion with ‘wrong’ bits
} Simple D/A conversion (power saving)
Read more on the links below
} TFA9881 product page
} TFA9881 leaflet
Application video
8
1.
Audio solutions
2.5 W I2S input mono Class-D amplifier TFA9879HN
Equipped with sound-processing features like a DRC and an equalizer,
this Class-D audio amplifier comes with two digital audio inputs,
so the audio amplifier can be connected to the baseband and the
multimedia IC.
Features
} Single power supply : 2.5 to 5.5 V
} Output power (THD=10%)
- 2.5 W @ 4 Ω, 5 V supply
- 1.29 W @ 8 Ω, 5 V supply
- 0.7 W @ 8 Ω, 3.7 V supply
} 2x I2S audio inputs
} Integrated micro DSP with 5-band equalizer, dynamic range control,
bass and treble control (-18 to +18 dB), and digital volume control
} PLL for automatic clock regeneration
} No output filter required
} Diagnostic features (by I2C readout)
} Compact HVQFN24 (4.0 x 4.0 x 0.85 mm) package
Benefits
} Full digital Class-D with feedback for high PSRR and good audio
performance
} Fixed gain for high PSRR
} High RF immunity suppression, easier application combined with
lower noise levels
} Reduced BOM costs due to high level of integration
} Integrated parametric equalizer for speaker curve compensation
(software calculation tool to optimize the EQ parameters)
Read more on the link below
} TFA9879HN product page
Application video
9
1.
Audio solutions
1.2 Class-G headphone amplifier
2 x 25 mW Class-G stereo headphone amplifier SA58635
This power-efficient Class-G headphone amplifier delivers excellent S/N
performance in an ultra-small package.
Features
} Easy mechanical integration due to rectangular shape
} 80% efficiency employing Class-G dynamic power management
design
} Operating voltage: 0.9 to 1.7 V
} S/N performance: 100 dB
} Thermal and short-circuit protection circuitry
} Pop & click suppression circuitry
} I2C-bus interface and control for volume control (32 steps), mute,
and operation selection mode
} Available in WLCSP16 (2 x 2 mm) or HVQFN20 (4 x 4 mm) package
Benefits
} Long battery life
} Excellent audio quality
} Low EMI to enable combinations with FM radio
} No need for headphone coupling capacitors
10
1.
Audio solutions
1.3 Low-ohmic switches
Low-ohmic switches NX3 series
These best-in-class low-ohmic switches are an excellent choice for
audio and mixed-signal applications in small, portable devices. They
feature low switching threshold levels, so they’re ideal for interfacing
with audio ICs, ASICs, and other circuits requiring switching level
translation. The combination of low ON resistance and low RON flatness
greatly reduces switched signal attenuation and distortion. Low power
consumption makes the NX3 family especially well suited for portable
applications. The ultra-compact MicroPak™ packages greatly improve
placement and routing, so the switches are easier to place in applications
where board space and headroom are at a premium.
Benefits
} Reduced signal attenuation and distortion
} Longer battery life
} Lower chip count
} Easier placement in tight layouts
Read more on the links below
} Low-ohmic switch leaflet
} Low-ohmic switch products
Features
} Low RON (L series = 0.75 Ω, V series = 0.45 Ω)
} RON flatness (0.1 Ω typ)
} Wide supply range (1.4 to 4.3 V)
} High current handling (up to 350 mA continuous)
} Low leakage (<50 nA at 85 °C)
} Break-before-make switching
} Overvoltage-tolerant control inputs
} Low-threshold input variants
} Excellent ESD performance (7.5 kV HBM)
} Fully specified (-40 to +85 and -40 to +125 °C)
} Pb-free, RoHS, and Dark Green compliant
} PicoGate and MicroPak packages
11
1.
Audio solutions
Dual low-ohmic SPDT analog switches NX3L4684 & NX3L2267
These advanced switches provide two low-ohmic single-pole, doublethrow (SPDT) analog switches suitable for use as an analog or digital
multiplexer/demultiplexer. The two devices provide similar functionality,
but with different pinouts.
Application examples
Features
} Wide supply voltage range: 1.4 to 4.3 V
} Very low ON resistance (0.3 Ω at Vcc = 2.3 V)
} Break-before-make switching
} High noise immunity
} Low switching threshold at control input
} -3 dB frequency of 20 MHz
} Very small, 10-pin leadless packages
Benefits
} Superior performance
} Smaller layouts
Read more on the links below
} NX3L4684 data sheet
} NX3L2267 data sheet
12
1.
Audio solutions
1.4 Audio-specific EMI filters and ESD
protection
These highly integrated, optimized devices use coil-based EMI filters
for speaker and receiver interfaces and are designed for use with 2G,
2.5G, and 3G frequencies. They use NXP’s high-K technology to
integrate coupling capacitors, deliver excellent EMI suppression with
a broad filter response, and offer robust ESD protection with very low
clamping voltage.
Filter response: discrete (solid line) versus integrated EMI filter (dotted line)
brb461
13
1.
Audio solutions
EMI filters for analog audio interfaces
The analog audio interfaces in most portable devices use differential
signals. The filtering requirements for these signals can vary according
to maximum allowed series resistance, maximum capacitance, and
maximum operating voltage. NXP’s EMI filters include high R-channel
C-R-C filters for microphones, multi-ohm R-channel C-R-C filters
for receivers and headphones, and sub-one-ohm R-channel C-L-C
filters for handsfree and speakerphone applications. All have predefined filter performance (independent of component resonance
frequencies), and, compared to discrete solutions, depend very little
on PCB layout.
Features
} Integrated dual-channel LC or RC filter
} Predefined filter performance simplifies design-in
} ESD protection of ±15 kV IEC 61000-4-2
} Wafer-level chip-scale package (0.4 or 0.5 mm pitch)
} Pb-free and RoHS-compliant
Benefits
} Support for all three use cases (microphone, receiver/headphone,
handsfree/speakerphone)
} Robust ESD protection with very low clampling voltage
} No demodulated RF noise in the audio channel
} Small footprint yields optimized designs
Read more on the links below
} NXP Mobile Usage brochure
} IP3047CX6 product page
} IP3048CX5 product page
IP3047CX6
IP3048CX5
IP4047CX6
Selection guide for audio EMI filters
Type name
[+ /LF]
Channel small signal
equivalents
Loudspeaker Microphone
Integrated
biasing
resistors
Rchannel (Lchannel)
Cchannel
IP4027CX20/LF
10 Ω, 100 Ω
225 pF, 75 pF
IP4047CX6/LF
0.95 Ω
2x 140 pF
IP4048CX5/LF
10 Ω
2x 100 pF
IP4049CX5/LF
68 Ω
2x 47 pF
x
x
-
IP4055CX6/LF
470 Ω
35 pF
x
x
-
IP4355CX6/LF
470 Ω
<20 pF
x
x
IP4363CX10/LF
15 Ω, 95 Ω
≤8 Ω
≥8 Ω
Single-ended
x
Differential
x
x
x
65 pF, 33 pF
1.1 kΩ
pull-up/down
x
-
-
x
2 kΩ
pull-up/down
Single-ended to
quasi-differential
-
IP5002CX8/LF
2.2 Ω, 4.4 Ω
65 nF, + 1 nF
IP3047CX6
0.25 Ω (3 nH)
280 pF
x
-
IP3048CX5
0.25 Ω (3 nH)
280 pF
x
-
14
1.
Audio solutions
Audio-specific ESD solutions
NXP’s standalone ESD solutions are robust, flexible devices with low
clamping voltages. They’re available in a number of space-saving
package formats.
Single-channel ESD solutions
Type
Cline (pF)
BV
Package
Size (L x B x H) mm
PESD5V0S1BL
Channels
1
35
5
SOD882
1.06 x 0.6 x 0.5
PESD5V0U1BL
1
2.9
5
SOD882
1.06 x 0.6 x 0.5
IP4302CX2/LF
1
10
16
CSP
0.76 x 0.76 x 0.61
PESD5V0V1BL/BLD
1
11
5
PESD5V0S1BSF
1
35
PESD5V0L1BSF
1
12
PESD5V0V1BSF
1
3.5
SOD882
1.0 x 0.6 x 0.5
SOD882D
1.0 x 0.6 x 0.37
5.5
SOD962
0.6 x 0.3 x 0.3
5.5
SOD962
0.6 x 0.3 x 0.3
5.5
SOD962
0.6 x 0.3 x 0.3
Dual-channel ESD solutions
Type
Cline (pF)
BV
Package
Size (L x B x H) mm
IP4303CX4/LF
Channels
2
10
16
CSP
0.76 x 0.76 x 0.61
PESD5V0U2BM
2
2.9
5
SOT883
1. 0 x 0.6 x 0.5
15
1.
Audio solutions
1.5 LifeVibes for Mobile software
LifeVibes for Mobile software
NXP’s LifeVibes software solutions for mobile devices deliver a vibrant,
easy-to-enjoy multimedia experience. Available in tailored packages
for audio and voice applications, they help developers create portable
products that offer more fun, more features, and considerably more
quality and clarity of music, video, and voice. Optimized for different
mobile device segments and platforms, LifeVibes software is used in
over 700 million mobile devices, making it the market leader in mobile
multimedia software. The list below includes just a few examples. For our
complete portfolio, which includes NoiseVoid, VoiceClarity, ClearCall,
VideoTelephony, and more, go to www.software.nxp.com
AmbiVolume 1.0
} Automatically adjusts ringtone volume to environment noise
} Adaptation is continuous
} Loudness maximizer (optional)
Read more
} www.software.nxp.com
Sound Expedience 3.0
} Best-in-class rich and natural audio experience for headphone
and speakers
} Full multi-channel surround sound
} Plug-and-Play extension of the Android Audio Effects
Voice Experience
} Crystal-clear speech, with support for HD Voice
} Echo cancellation & noise reduction
} Voice enhancements on application processor
} Pre-integrated on common Android processor
} VoiceClarity for maximum speaker volume
16
2.
Distributed power
In portable devices, the supply voltage can vary depending on the
battery’s charge level. For mobile phones, the typical range is from
about 2.7 to around 4.7 volts. However, the system’s ICs need to
have a stable (and often lower) supply voltage. Even though most
appliances have a central Power Management Unit (PMU), the PMU
may not be able to offer all the required voltages or currents at once,
so additional devices are needed to expand the available source
nodes. Various boundary conditions, such as required voltage drop,
average and peak current, noise, PSRR, thermal budget, and cost, can
influence the choice of support device.
If, for example, the required voltage source has enough current
delivery capabilities, a load switch may be sufficient for controlling
the supply. On the other hand, with functions that consume a lower
current or have a short active cycle time, a Low Drop Out (LDO)
function may offer a more cost-efficient solution.
Typical use cases of DC/DC converters, LDOs, and load switches
Load switch
PMU
LDO
Load switch
SW
ref
Load switch
DC/DC
LDO
Load switch
SW
ref
LDO
SW
ref
Load switch
High-current and low-voltage supplies typically use DC/DC converters
to maximize efficiency and minimize heat generation. For very lownoise applications, an LDO is often used to regulate the DC/DC
converter output voltage and reduce ripple on the supply.
Also, some charger inputs use a load switch rated with a higher
voltage to isolate the charger input from the battery and protect the
charging circuit from overvoltage conditions.
17
2.
Distributed power
2.1 Low Drop Out (LDO) regulators
In the portable market, especially in the area of smartphones and
tablets, the pressure to innovate quickly means designers often have
to add new features to an existing platform. LDOs are a simple way
to provide newly added devices with power from the battery or a
pre-regulated voltage. Our LDOs offer the lowest dropout in a CSP or
leadless package that measures only 0.76 x 0.76 mm. Our high PSRR
device family is also available in a tiny leadless package, measuring
just 1 x 1 mm.
Features
} Operating input voltage from 2.3 to 5.5 V
} Output voltage from 1.2 to 3.6 V
} 2% accuracy
} Low quiescent current in shut-down mode
} Turn-on time ≤ 200 μs
} Available low- and high-ohmic output states when disabled
} Integrated high-level ESD protection
Type (package)
VIN
(V)
VOUT
(V)
∆V0
Read more on the link below
} Low dropout regulators product page
[email protected]
1 kHz,
1 mA
Vdo
drop out
voltage
IOUT DC
(mA)
LD6806CX4/xxP (or H)
(WLCSP4)
2.3 to 5.5
LD6805K/xxP (or H)
(HUSON4)
Output
noise
(μVrms)
650
LD6806F/xxP (or H)
(SOT886/XSON)
LD6806TD/xxP (or H)
(SOT753)
PD
(mW)
1.2, 1.3
1.4, 1.6
1.8, 2.0
2.2, 2.3
2.5, 2.8
2.9, 3.0
3.3, 3.6
55 dB
2%
60 mV
@
200 mA
200
450
30
700
75 dB
250 mV
@
150 mA
150
160
40
18
2.
Distributed power
2.2 Load switches with logic control
2.3 Standard load switches
Load switches are a cost-effective way to control individual supplies
in designs that use a power supply with sufficient current budget
available. Unlike LDOs, these load switches have no noticeable
quiescent current. The high-side load switches in chipscale (CSP)
packaging offer integrated level translators and can be ordered with
a floating or discharge switch output for off time. The CSP package
measures 0.76 x 0.76 mm and has a footprint compatible with the NXP
LD6806CX4 LDO, for easy upgrades to the power supply scheme.
For supplies working with higher currents and/or higher voltages, we
offer various P- and N-channel FETs, as well as bipolar devices, that
can be used to control the charge current and to protect the charger
interface from overvoltage and overcurrent conditions. These devices
support voltage ranges above 30 V, and can handle currents in the
range of several Amperes.
Features
} Operating input voltage from 1.1 to 3.6 V
} RDSon 95 mΩ at 1.8 V only
} High current capability ImaxDC 500 mA
} 1.2 logic control level at 3.6 V supply
} Low quiescent current in shut-down mode
} Floating output when disabled (NX3P191)
} Integrated 280 Ω discharge resistor (NX3P190)
} Integrated higher-level ESD protection
Read more on the links below
} NX3P190 product page
} NX3P191 product page
} Load switches application page
Read more on the link below
} Load switches application page
19
2.
Distributed power
2.4 Charger interfaces
We make charging more reliable and more efficient, with advanced
ESD protection solutions and TVS diodes that protect the charging
ICs, and low VCEsat (BISS) transistors that guard against power losses.
All these options are optimized for portable performance, and are
available in small, space-saving packages.
Read more on the links below
} IP4085CX4, IP4385CX4, IP4386CX4 and IP4387CX4 product page
} IP4389CX4 data sheet
} Charging interface application page
Charger input protection
ESD/TVS diodes for power line protection IP4085CX4/LF,
IP4385CX4/LF, IP4386CX4/LF, IP4387CX4/LF
These robust ESD/TVS diodes, housed in CSP packages, protect the
charger interface of a PMU from transients. They also protect against
wrong polarity connections. IP4085CX4/LF offers surge immunity
according IEC 61000-4-5 (8/20 μs) up to 60 A. Its reverse clamping
voltage is less than 20 V at a current of 1 A.
ESD/TVS and integrated melting fuse IP4389CX4
This novel device, designed specially for charger inputs, is a TVS
diode with an integrated melting fuse. It protects against overvoltage,
reverse-polarity, and overcurrent conditions. The fuse is rated 2 A DC
with just 35 mΩ of series resistance. The component measures only
0.76 x 0.76 x 0.61 mm.
IP4085CX4/LF
VBR
C JO
Pitch (mm)
16 V
160 pF
0.5
IP4385CX4/LF
7V
450 pF
0.4
IP4386CX4/LF
16 V
160 pF
0.4
IP4387CX4/LF
10 V
290 pF
0.4
IP4389CX4/LF
14 V
220 pF
0.4
20
2.
Distributed power
BISS transistors for the charger interface
With lower saturation voltages than any previous generation, NXP’s
ultra-low VCEsat (BISS) transistors are a perfect fit for the charging
interface.
Features
} Reduced saturation voltage VCEsat
} Improved collector current capabilities
} High current gain HFE
} Small package
Benefits
} Safer charging
} Small footprint
TVS diodes in CSP
Product
BV
ESD protection
Channel small signal equivalents
PD-tot
C channel
Package
B x L x H (mm)
Package
IP4085CX4
14 V
15 KV
1.1 W
240 pF
0.91 x 0.91 x 0.65
CSP 0.5 mm
IP4385CX4
7V
15 KV
0.75 W
240 pF
0.76 x 0.76 x 0.65
CSP 0.4 mm
IP4386CX4
14 V
15 KV
0.75 W
240 pF
0.76 x 0.76 x 0.65
CSP 0.4 mm
IP4387CX4
10 V
15 KV
0.75 W
240 pF
0.76 x 0.76 x 0.65
CSP 0.4 mm
IP4389CX4
14 V
30 kV,
+2 A fuse
0.75 W
160 pF
0.76 x 0.76 x 0.50
CSP 0.4 mm
Protection diodes
Product
BV
ESD protection
C line
Package
PESD12VS1UL
12 V
30 KV
38 PF
SOD882
PESD15VS1UL
15 V
30 KV
32 PF
SOD882
PESD24VS1UL
24 V
30 KV
23 PF
SOD882
Load switches
Product
Description
PMTD
Read more on the links below
Package
Dual N-channel series MOSFET
SOT666
PMZ
Single N-channel series MOSFET
SOT883
PMV65XP
Single P-channel series MOSFET
SOT23
BISS
} Low VCEsat (BISS) transistors brochure
} Application note
Over voltage and back-drive protection
iSense
Product
Description
Package
PBSS304PX
BISS
SOT89
PBSS4520
BISS
SOT1061
PBSS5630PA
BISS
SOT1061
PBSS4520
BISS
SOT1061
Over voltage and back-drive protection
iSense
Linear charging
iSense
brb664
21
3.
Display and camera interfaces
Our next-generation EMI filters and ESD protection devices support a
broad range of user interfaces and protect all the relevant frequencies
for 2G, 3G, LTE, WLAN, and Bluetooth. Available as cost-efficient
RC filters or optimized LC filters for interfaces with high clock rates,
these products deliver superior filter performance and robust ESD
protection at the lowest clamping voltages, and are housed in spacesaving leadless and CSP packages.
EMI filter and ESD protection devices PEMI series
This RC filter family offers 35 RC combinations based on five resistor
and seven capacitor values. Each combination is available in six different
packages with one, two, four, six, or eight channels. The HXSON
packages have a reduced width (only 1.2 mm typ) and a maximum height
of 0.5 mm, and are available with four, six, or eight channels.
Available values:
Channel resistance: 20, 45, 65, 100 and 200 Ω
Channel capacitance: 15, 19, 23, 28, 32, 36, 40 pF (@ 0VDC)
1
Rs(ch)
Cch
2
2
Cch
2
3
018aaa042
Features
} Up to 30 dB insertion loss at mobile-phone frequencies of 800 MHz
to 3 GHz
} High ESD protection up to ± 25 kV, far exceeding IEC 61000-4-2, level 4
} Low ESD clamping voltage
} Available in 1-, 2-, 4-, 6-, or 8-channel formats
} 35 different RC filters per package for easy performance optimization
} Ultra-thin dark green leadless package in 0.4 mm pitch
Benefits
} Solutions for all use cases
} Robust ESD protection with very low clamping voltage
} No demodulated RF noise in the audio channel
} Optimized designs due to small footprint
Read more on the links below
} PEMI EMI filter and ESD protection family
} NXP Mobile Usage brochure
22
3.
Display and camera interfaces
RC-based EMI filters IP433x family in WLCSP packages
Ideal for use in applications requiring the utmost in miniaturization,
these RC low-pass filter arrays are housed in WLCSP packages that
measure only 1.96 x 1.61 mm (typ). They provide filtering of undesired
RF signals in the 800 to 3,000 MHz frequency band.
Features
} Integrated 7- or 10-channel RC filter network
} 70 Ω series resistance; 25 pF (typ) capacitance per line
} High ESD protection exceeding IEC 61000-4-2, level 4
} WLCSP package with 0.4 mm pitch
Benefits
} Significantly reduced board space
} Easy routing
Read more on the links below
} IP4337CX18LF product page
} IP4338CX24LF product page
LC-based EMI filters IP32xx family for use with high clock rates
In designs that use high data-rate interfaces, a broad pass band and
a very steep roll are required to achieve the maximum attenuation at
unwanted frequencies in the RF transmitter transceiver range. These
EMI filters, optimized for use with high-resolution images and color
LCD applications in wireless handsets, are 4-, 6-, and 8-channel LC
low-pass filter arrays that filter unwanted RF signals in the range of
800 MHz to 6 GHz. They integrate up to eight inductors and 16 diodes
in a 0.4 mm pitch 8-, 12-, or 16-pin MicroPak lead-free plastic package.
The package is QFN-compatible and has a height of only 0.5 mm.
Features
} Integrated 4-, 6-, or 8-channel LC filter network
} High ESD protection exceeding IEC 61000-4-2, level 4 and in
accordance with MIL-STD-883
} QFN-type plastic package with 0.4 mm pitch
Benefits
} Faster roll-off
} Low ESD clamping voltages
} Small form factors
1, 2, 3, 4
Read more on the link below
} IP3253/54CZ8/CZ12/CZ16 product page
Ls(ch)
GND
5, 6, 7, 8
001aaj745
23
3.
Display and camera interfaces
LC-based EMI filters IP333x family in WLCSP packages
Similar to the IP4337x family of RC-based EMI filters, these LC-based
filters provide filtering of undesired RF signals in the 800 to
3,000 MHz frequency band. They are housed in WLCSP packages that
measure only 2.06 x 1.66 mm (typ).
Features
} Integrated 7- or 10-channel LC filter network
} 125 Ω series resistance; 25 pF (typ) capacitance per line
} High ESD protection exceeding IEC 61000-4-2, level 4
} WLCSP package with 0.4 mm pitch
Benefits
} Significantly reduced board space
} Easy routing
Features
} Integrated 2-, 4-, 6-, and 8-channel LC filter network
} High ESD protection exceeding IEC 61000-4-2, level 4
} WLCSP package
Benefits
} Optimized for serial MIPI interfaces
} Suppression of disturbances in mobile TV frequencies
Read more on the link below
} IP425xCZ8-4/CZ12-6/CZ16-8 IP4256CZ3-M/CZ5-W/CZ6-F leaflet
Measurement example of fast roll-off and superior filtering
Read more on the links below
} IP3337CX18 product page
} IP3338CX24 product page
LC-based EMI filters IP3348 family for MIPI interface
Similar to the IP32xx family, these LC-based EMI filters integrate a
2-, 4-, 6-, or 8-channel LC filter network and are designed for use
with the Mobile Industry Processor Interface (MIPI). They require low
serial channel resistance in combination with a matching pass band
bandwidth and a maximum attenuation of unwanted frequencies
between 470 MHz (Mobile TV) and 6 GHz.
Channel small signal
equivalents
Type name
-3 dB
frequency
(insertion loss)
Remark
Lchannel
Rchannel
(Lchannel)
Cchannel
IP3053CXyy
35 nH
100 Ω
30 pF
150 MHz
2-, 4-, 6-, or 8-channel CLC-type EMI filter/ESD protection, 0.4 mm pitch
same footprint as IP3088Cxyy
IP3088CXyy
40 nH
18 Ω
42 pF
175 MHz
2-, 4-, 6-, or 8-channel CLC-type EMI filter/ESD protection, 0.4 mm pitch
same footprint as IP3053Cxyy
IP3348CXyy
15 nH
10 Ω
30 pF
350 MHz
2-, 4-, 6-, or 8-channel CLC-type EMI filter/ESD protection, 0.4 mm pitch
IP3337CX18/LF
60 nH
125 Ω
25 pF
180 MHz
7-channel CLC-type EMI filter/ESD protection, 0.4 mm pitch same footprint
as IP4337CX18/LF
IP3338CX24/LF
60 nH
125 Ω
25 pF
180 MHz
10-channel CLC-type EMI filter/ESD protection, 0.4 mm pitch same footprint
as IP4338CX24/LF and IP3328CX24/LF and IP3328CX24
24
4.
Lighting and blinking
Enhance the user experience with high-performance camera flash
products and small, energy-efficient controllers for LED lighting and
blinking.
LED power efficiency (PLED/PIN) vs VBAT and ILED
90%
85%
Our camera flash products use current-mode DC/DC conversion and
can drive one or two LEDs in series. In flash mode, they drive up to
500 mA, and in torch mode, which is used with movies or videos, they
drive up to 200 mA. Driving two LEDs in series ensures the boost
converter operates in boost mode, for 30% higher efficiency than with
a single LED.
For LED lighting and blinking, our solutions offer energy-efficient ways
to control power, message, and status indicators, or just add some fun.
80%
75%
70%
LED powe
w r
we
efficiency, [%]
%
%]
65%
50
125
200
ILED, [mA]
60%
55%
275
350
425
50%
5
4.85.1 V.4 V
4
.
3. 4.2 V5 V V
3 . 3 3 .6 V 9 V
500
2 . 7 3 .0 V V
VBAT
V
V]
A , [V]
AT
V
25
4.
Lighting and blinking
4.1 Camera flash products
Asynchronous boost converter for single/dual high-power LED
SSL3250A
Ideal for driving up to two high-brightness LEDs, the efficient
SSL3252A is an I2C-programmable high-side asynchronous boost
converter that uses a minimum of external components and delivers
efficiency above 85%. The device supports Flash mode, Assist light
mode, Torch mode, and Indicator mode.
Benefits
} Dual LED mode enables high efficiency
} Robust due to built-in protection
} Torch mode for videos
Vbat
L
battery
Cin
10 F
PGND
PGND
2.2 H
VIN
} Wide input voltage ranging from 2.5 to 5.5 V
} High efficiency of over 85% at optimum output current
} Switching frequency of 2 MHz
VO
control
signals
TORCH
STRB/2LED
SDA/EN2
SCL/EN1
IF_SEL(1)
} Strobe signal to avoid I2C latency for the flash
GND
PGND
LED
flash LEDs
PGND
I_IND
indicator LED
} Internally timed flash operation up to 850 ms
} I2C-programmable up to 400 kHz
Cout
10 F
SSL3252
Features
} High-side current source for main and indicator LEDs
LX
PGND
PGND
002aaf152
} Direct enable signals for standalone operation
} Forward voltage sensing to allow single/dual LED detection
} Separate indicator LED output of 2.5 to 10 mA
} Integrated protection circuits for enhanced system reliability (OTP,
Read more on the links below
UVLO, OVP, short, broken coil)
} Low device shut-down current of less than 1 μA
} Small WLCSP12 package with 500 μm bump pitch
} SSL3250A/SSL3252 leaflet
} Photo flash LED driver application note
} SSL3252 product page
26
4.
Lighting and blinking
Ultra-low VCEsat (BISS) transistors PBSS 4220V PBSS2515M
Housed in medium-power SOT666 and SOT883 packages, these new
BISS (Breakthrough In Small Signal) transistors feature lower saturation
voltages than any previous BISS transistor generation.
Features
} Reduced saturation voltage, VCEsat
} Improved collector current capabilities
} High current gain HFE
} Low turn-on voltage compared to MOSFET
} Ultra-small SOT883 package (1.0 x 0.6 x 0.5 mm)
} Samll SOT666 package (1.6 x 1.2, 0.55 mm)
Benefits
} High circuit efficiency
} Low energy consumption
} Reduced heat generation
} Enables smaller products
Read more on the link below
} High voltage low VCEsat (BISS) transistors product page
27
4.
Lighting and blinking
4.2 LED blinkers and dimmers
LED controller PCA9632
The PCA9632 is a 4-bit LED driver, controlled by the I2C-bus,
that is optimized for red/green/blue/amber (RGBA) color-mixing
applications.
Features
} Multifunction: LED on, off, bright, dim, or blinking
} Blink rate: 40 ms to 10.73 s
} Four 8-bit PWMs for individual LED brightness control
} One 6-bit PWM for group dimming
} Fixed I2C-bus address (C4h), no pins
} Programmable via I2C-bus, 400 kHz
} Low standby current (<1 μA)
} Push-pull output current: 25 mA sink, 10 mA source
} Voltage range: 2.3 to 5.5 V
Benefits
} Single-chip solution to drive up to 4 LEDs for superior color-mixing
effect (RGBA)
} Extended battery life with low power consumption
} Offloads CPU from blinking operation
One-wire single LED driver PCA9901
The PCA9901 is a 20 mA current source for a single LED that allows
standalone blinking of a predefined pattern, so it offloads the
microcontroller and saves battery power.
Features
} 1-bit constant current LED control
} Standalone blinking capability after “learning” the sequence
} Simple one-wire interface
} Wake-up, standby, and reset modes
} VCC = 2.1 to 5.5 V
} Imax = 2.0 mA (current in the LED set by external resistor)
} Ideal for low-power applications: Icc <250 µA, Istandby <1 µA
} XSON8 (3 x 2 x 0.5 mm) and WLCSP6 (1 x 1.2 x 0.6 mm) packages
Benefits
} Frees up CPU for other tasks
} Very low power consumption compared to microcontroller solution
} Minimal PCB routing with single-wire control
Read more on the link below
} PCA9901 product page
Read more on the link below
} PCA9632 product page
28
5.
Memory card interfaces
Covering all the most popular interface formats, including SIM cards,
SD cards, and T-Flash, our highly integrated memory card interfaces
are best-in-class conditioning solutions that reduce board space,
shorten design cycles, and lower the bill of materials. They deliver
advanced ESD protection and EMI filtering while adding extra
features that increase design flexibility.
5.1 SIM card interfaces
ESD protection family PESD5V0x4Ux
These unidirectional quadruple ESD protection diode arrays are
housed in small surface-mounted device (SMD) plastic packages
and are designed to protect up to four signal lines from the damage
caused by ESD and other transients.
Interface protection and EMI filtering ICs, IP4064CX8/LF,
IP4364CX8/LF, IP4264CX8-20, IP4264CZ8-40
With three digital lines and additional protection for the supply rail,
these devices provide all the necessary components for complete EMI
filtering and ESD protection in SIM cards.
Features
} 3-channel SIM card interface integrated RC-filter array
} Integrated 100 Ω/100 Ω/47 Ω series channel resistors
} Downstream ESD protection up to ±15 kV (contact), exceeding
IEC 61000-4-2, level 4
} Available in leadless and wafer-level chip-scale packages with 0.5 or
0.4 mm pitch
Benefits
} Ultra-robust ESD protection with low clamping voltage
} Suppression of all 2G and 3G mobile phone frequencies
} Simplified design due to ultra-small footprint
Read more on the links below
} SIM card interface application page
} SIM card EMI filtering and ESD protection using integrated discretes application note
} SD(HC)-memory card and MMC interface conditioning application note
Read more on the link below
} PESD5V0S4UF product page
29
5.
Memory card interfaces
SIM card protection with three USB connection pins IP4365CX11
Similar to the IP4044CX8 and its related product types, the
IP4365CX11 offers exceptional EMI filtering and ESD protection while
adding three connector pins for use with USB.
Features
} 3-channel SIM card interface integrated RC-filter array
} Three additional protection diodes for internal USB connection
protection
} Integrated 100 Ω/100 Ω/47 Ω series channel resistors integrated
} Downstream ESD protection up to ±15 kV (contact), exceeding
IEC 61000-4-2, level 4
} Wafer-level chip-scale package with 0.4 mm pitch
Benefits
} Ultra-robust ESD protection with low clamping voltage
} Suppression of all 2G and 3G mobile phone frequencies
} Simplified design due to ultra-small footprint
Product
Cline
Pitch
Package
Size
IP4044CX8
35 pF
0.5 mm
CSP
1.41 x 1.41
IP4064CX8
<20 pF
0.5 mm
CSP
1.41 x 1.41
IP4364CX8
<20 pF
0.4 mm
CSP
1.16 x 1.16
IP4365CX11
<10 pF
0.4 mm
CSP
1.16 x 1.56
IP4366CX8
<10 pF
0.4 mm
CSP
1.16 x 1.16
10 pF / 40 pF
0.4 mm
Plastic
1.35 x 1.75
Read more on the links below
IP4264CZ8
} SIM card interface application page
} SIM card EMI filtering and ESD protection using integrated discretes application note
} SD(HC)-memory card and MMC interface conditioning application note
30
5.
Memory card interfaces
3 + 1 pole DT switch NX3DV2567 with analog supply switch path
The NX3DV2567 is a four-pole double-throw analog switch (4PDT)
with one channel optimized to switch supplies in dual-SIM and other
applications.
Dual DPDT switch NX3L2467 for SIM Card switching applications
This is a dual, low-ohmic double-pole, double throw (DPDT)
analog switch suitable for use as an analog or digital multiplexer/
demultiplexer.
Features
} Wide supply voltage range: 1.4 to 4.3 V
} Very low ON resistance (peak)
} Break-before-make switching
} High noise immunity
} CMOS low-power consumption
} Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
} 1.8 V control logic at VCC is 3.6 V
} Control input accepts voltages above supply voltage
} Very low supply current, even when input is below VCC
} High current handling capability
} Tiny leadless XQFN16 package (1.8 x 2.6 x 0.5 mm)
Benefits
} Small form factor
} Compatible with 1.8 V chipsets
Read more on the links below
} NX3DV2567 product page
} NX3L2467 data sheet
} SIM card EMI filtering and ESD protection using integrated discretes application note
} SD(HC)-memory card and MMC interface conditioning application note
31
5.
Memory card interfaces
5.2 SD card and T-Flash interfaces
Integrated level shifter IP4853CX24 with PSU, EMI filter, and
ESD protection
Optimized for the SD Card and T-Flash interfaces, this device contains
bidirectional push-pull drivers for clock speeds up to 50 or 60 MHz.
It is ideal of use with a low-voltage processor that interfaces to a
memory card requiring voltages of 2.9 V and above. An integrated
LDO delivers 2.9 V for the memory card from a battery voltage of up
to 5 V. The low-voltage side can operate between 1.62 and 1.9 V while
the high-voltage side works at between 2.5 and 3.5 V.
Features
} High-speed, active level shifter between 1.8 and 2.9 V
} EMI-filter
} IEC 61000-4-2, level 4 compliant ESD-protection
} Memory card supply (2.9 V LDO) from battery
} 0.4 mm pitch device with a package size of just 2.01 x 2.01 mm
Benefits
} Design flexibility due to very small footprint
} Lower BOM, greater cost efficiency
Read more on the links below
} IP4853CX24 product page
} SD(HC)-memory card and MMC interface conditioning application note
} SIM card EMI filtering and ESD protection using integrated
discretes application note
32
5.
Memory card interfaces
SDIO ESD protection and EMI filter IP4357CX17
This small (1.1 x 2.4 mm) EMI filter and ESD protection device supports
all SD, MicroSD, and TransFlash (T-Flash) cards with clock speeds up
to 50 MHz (including UHS-I, DDR50 mode). It integrates a high-ohmic
pull-up resistor for card detect switches and protects against ESD
discharges up to 15 kV contact (IEC 61000-4-2) by using a superior
dual stage clamping structure.
Features
} 5 channels with integrated EMI/RF-filter and pull-up resistors
} 1 channel with integrated EMI/RF-filter (CLK) only
} IEC 61000-4-2, level 4 compliant , 15 kV contact & air discharge
input protection
} WLCSP package (1.1 x 2.4 mm with 0.4 mm pitch)
} Pb-free and RoHS-compliant
Benefits
} Smaller board size due to high integration
} Reduced BOM, higher cost efficiency
Read more on the links below
} Memory card interface application page
} Ultra low capacitance ESD protection diodes leaflet
ESD protection and EMI filter ICs IP4350CX24/LF & IP4352CX24/
LF with 9 channels
Similar to the IP4052CX20/LF, these ICs contain nine channels
protected by rail-to-rail diodes at the card holder interface side and
are housed in wafer-level chip-scale packages with a 0.4 mm pitch.
The IP4350CX24/LF can be used with MultiMediaCards and integrates
all the required pull-up and pull-down resistors. It is optimized for use
with the SD-Card level shifter IP4852CX25/LF.
Read more on the link below
} Ultra low capacitance ESD protection diodes leaflet
IP4357CX17
IP4350CX24/LF
IP4352CX24/LF
IP4252CZxx-TTL
No of lines
6
6+3
6+3
6 or 8
Rline
40 Ω
15 Ω
40 Ω
25 Ω
Rpull
12.5 kΩ, 50 kΩ
4.7 kΩ, 50 kΩ
15 kΩ, 50 kΩ
-
Cline (V bias = 0 V)
<20
<9
<20
-
Package size
1.1 x 2.4 mm
1.95 x 2.11 mm
2.01 x 2.02 mm
1.35 x 2.5 (6ch)
ESD protection and EMI filter ICs IP4252CZxx
These C-R-C EMI filters and ESD protection devices are available in 4-,
6-, and 8-pin leadless packages with 0.4 mm pitch. The Rline is 40 Ω
and the Cline, at Vbias equals 2.5 V, is 12 pF.
Read more on the links below
} SD(HC)-memory card and MMC interface conditioning application note
} SIM card EMI filtering and ESD protection using integrated discretes application note
} Ultra low capacitance ESD protection diodes leaflet
} IP4251_52_53_54-TTL product page
33
5.
Memory card interfaces
Product name
Device type
Additional features
No. of filter channels
Package type [+ size]
Memory card interface, ESD protection & EMI filter devices with integrated biasing (pull-up/down) resistors, ESD protection level of
>15 kV contact, far exceeding the IEC 61000-4-2, level 4 (8 kV contact, 15 kV air)
IP4051CX11/LF
Passive, ESD protection & EMI filter
4
CSP, 0.5 mm pitch [1.96 x 2.54 mm]
IP4351CX11/LF
Passive, ESD protection & EMI filter
4
CSP, 0.4 mm pitch [2.01 x 2.02 mm]
IP4357CX17
Passive, ESD protection & EMI filter
6 (+1)
CSP, 0.4 mm pitch [1.1 x 2.4 mm]
IP4060CX16/LF
Passive, ESD protection & EMI filter
6
CSP, 0.5 mm pitch [2.01 x 2.02 mm]
IP4350CX24/LF
Passive, ESD protection & EMI filter
Includes WP&CD
6 (+5)
CSP, 0.4 mm pitch [2.01 x 2.02 mm]
IP4352CX24/LF
Passive, ESD protection & EMI filter
Includes WP&CD
6 (+5)
CSP, 0.4 mm pitch [2.01 x 2.02 mm]
Includes CD
Memory card interface, ESD protection & EMI filter devices, ESD protection level according IEC 61000-4-2, level 4 (8 KV contact,
15 kV air discharge)
IP4252CZ8-4
Passive, ESD protection & EMI filter
4
DFN, 0.4 mm pitch [1.35 x 1.7 mm]
IP4252CZ12-6
Passive, ESD protection & EMI filter
6
DFN, 0.4 mm pitch [1.35 x 2.5 mm]
IP4252CZ12-8
Passive, ESD protection & EMI filter
8
DFN, 0.4 mm pitch [1.35 x 3.3 mm]
Bi-directional memory card interface voltage translator device, IC level ESD protection according IEC 61340-3-1, HBM, 2 kV
15 kV air discharge)
IP4852CX25/LF
Active, 1.8 ↔ 2.9 V voltage translator
Voltage translators
6
CSP, 0.4 mm pitch [2.01 x 2.01 mm]
LDO, voltage translators, ESD protection & EMI filter & biasing resistors including WP&CD, integrated ESD protection level according
IEC 61000-4-2, level 4
IP4853CX24/LF
Active, 1.8 ↔ 2.9 V voltage translator
LDO
6 (+3)
CSP, 0.4 mm pitch [2.01 x 2.01 mm]
34
6.
High-speed data interfaces
6.1 HDMI
} High maximum resolution
NXP is a founding member of the HDMI consortium and actively
supports the use of HDMI in mobile applications. Our portfolio
includes a full range of HDMI transceivers, HDMI interface
conditioning components, and advanced ESD protection diodes.
- 1080p/60 Hz for TV
- 1600x1200/60 Hz for computer UXGA60
- 720p/1080i in ITU656
} Low power consumption
- 720p: 55 mW
Our Authorized Test Center in Caen, France offers HDMI compliance
measurements, and our development teams can assist with the more
challenging aspects of HDMI design, including HDCP keys.
HDMI transmitter TDA19989
This compact, low-power HDMI 1.4 transmitter has 3 x 8-bit RGB
or YCbCr video inputs and offers support for CEC. It is backward
compatible with DVI 1.0 and can be connected to any DVI 1.0 or HDMI
sink.
Features
} Complies with industry standards
- HDMI1.4
- DVI1.0
- EIA/CEA-861B
- HDCP 1.3 (optional)
} Supports CEC with embedded clock generation
} Advanced video interface
- Up to 150 MHz pixel clock
- RGB4:4:4 or YCbCr4:4:4 (24 bits)
- YCbCr4:2:2 semi-planar (12 bits)
- YCbCr4:2:2 ITU656 (up to 12 bits)
- Embedded or separate syncs
- Configurable pin mapping
- 1080p: 120 mW
- Standby with I2C on: 130 µW
} Video processing capabilities
} Audio interface: I2S /SPDIF audio input
} Control interfaces
- I2C
- Interrupt pin for HDMI core and CEC
- Receiver detection: Hot Plug Detect, RxSense
- Small BGA package (4.5 x 4.5 mm)
Benefits
} Simpler design
} Proven solution
Read more on the links below
} HDMI transmitters product page
} HDMI interface application page
35
6.
High-speed data interfaces
Advanced ESD protection and interface conditioning ICs
IP4285CZ9-TBB and IP4221CZ6
These devices include high-level ESD protection diodes for the TMDS
signal lines. All TMDS intra-pairs are protected by a special diode
configuration offering a low line capacitance of only 0.8 pF.
Features
} ESD protection of ±12 kV according to IEC 61000-4-2, level 4 for all
TMDS lines
} Design-friendly "flow-through" signal routing
} Matched 0.4 mm trace spacing
} TMDS lines with ≤0.05 pF matching capacitance between TMDS
pairs
} Line capacitance of only 0.8 pF for each channel - IP4285CZ9
} 4-channel, Ultra-Thin Leadless Package
Benefits
} System ESD protection for USB 2.0, HDMI 1.3 and 1.4, DisplayPort,
eSATA, and LVDS
} Optimized layout and routing
Read more on the links below
} IP4221CZ6-S product page
} HDMI interface application page
Optimized layout for HDMI C connector
36
6.
High-speed data interfaces
Advanced ESD protection ICs IP4309CX9 and IP4310CX8 in
WLCSP packages
These devices, housed in WLCSP packages with 0.4 mm pitch, cover
the full HDMI interface with ESD protection on all pins, biasing of
DDC lines, and hotplug. The IP4309CX9 has low-capacitance ESD
protection diodes in a 4 x 2 configuration, while the IP4310CX8 covers
the lower-speed communication interface.
Features
} ESD protection of ±15 kV according to IEC 61000-4-2, level 4 for all
TMDS lines
} TMDS lines with ≤0.05 pF matching capacitance between TMDS
pairs
} Line capacitance of only 1.3 pF for each channel
} Chip-scale package (1.16 x 1.16 x 0.61 mm)
Benefits
} HDMI 1.3a compliant
} Small footprint
Read more on the links below
} NXP Mobile Usage brochure
} HDMI interface application page
37
6.
High-speed data interfaces
ESD protection, DDC/CEC buffering, and Hot Plug module
IP4791CZ12
The IP4791CZ12 is an optimized and highly integrated HDMI interface
protection and conditioning solution in a small leadless package.
It supports HDMI type C and D connectors and contains DDC
buffering, CEC buffered level shifting and pull-up current soruces,
Hot Plus detect, and ±8 kV ESD protection for all signals.
Features
} ESD protection of ±12 kV according to IEC 61000-4-2 for all TMDS lines
} ESD protection of +/-8 kV according to IEC 61000-4-2 for all control lines
} CEC buffered level shifting
} DDC buffer
} CEC pull up resistors
} Hot Plug detect
} Ultra-small leadless packages with 0.4 mm pitch enable simple,
straight PCB routing
Benefits
} HDMI 1.4 compliant
} No need for separate level shifter
} Small footprint
} Compatible with HDMI type C and D connectors
Read more on the links below
} IP4791CZ12 product page
} HDMI interface application page
38
6.
High-speed data interfaces
6.2 High-Speed USB
We support the USB 2.0 High Speed (HS) standard, which requires
very low line capacitance, especially for protection devices, and
allows no series resistors in the data lines. Available in CSP, leadless,
or plastic packages, these highly integrated solutions deliver high
robustness with 8 kV IEC 61000-4-2 ESD protection, and are easy to
route.
Portfolio overview
PRTR5V0U2F SOT886
USB 2.0
1.45 x 1.0 x 0.5 mm/0.5 mm pitch
USB
Connector
VBUS
VBUS
1
VBus
Dat+
DatID
Hi-Speed USB
Transceiver
1
6
to GND 2
5
3
4
D-
D-
to VBUS
2
D+
GND
GND
PESD5V0U1BL
PESD5V0U1BB
2.9 pF (10 KV)
SOD882
1.0 × 0.6 mm
USB controller
D+
A1
0.9 pF (8 KV)
SOD523
1.2 × 0.8 mm
SOT886
1.5 × 1 mm
VBus
D+
D-
D2
2
IP4358CX6/LF
C2
B2
brb453
USB layout optimazed solution
IP4282CZ6 (SOT886)
Click here for pre-selection
V BUS
GND
C1
B1
protected IC/device
common mode
D+ choke
A2
IP4282CZ6
2.9 pF (10 KV)
DD+
GND
1
1
IP4282CZ6
brb660
Read more on the link below
} USB and (e)SATA ESD products
39
7.
Level translators
Next-generation process technologies usually offer smaller
geometries and, along with the smaller footprint, lower maximum
supply and I/O voltages. But legacy products, such as external
interfaces and memory cards, are often slower to change and, as a
result, can use a higher specified voltage. Level translators provide a
convenient way to bridge the gap.
NXP offers a comprehensive portfolio of level translators optimized
for the various interfaces used in portable applications. These range
from 1-wire protocol to a 50 Mbyte/s SD memory card interface.
Standard level translators
Level shifter
I2C
Level shifter
SPI
Level shifter
UART
3.3 V
1.8 V
Level shifter
(w/ ESD+EMI, LDO)
MMC/SDIO
3.3 V
1.8 V
Level shifter
(w/ ESD+EMI, LDO)
SIM
(ISO/IEC7816)
0.8 V - 3.6 V
Level shifter
GPIO
0.8 V - 3.6 V
Level shifter
1-wire
Level shifter
(w/ ESD+EMI, LDO)
VGA
Level shifter
w/ ESD+EMI
HDMI/DDC
Level shifter
DP/DDC
5.0 V
3.3 V
1.8 V
1.2 V
1.0 V
SD, MMC
Devices with externally accessible interface contacts often require
additional, high-level ESD protection and EMI filtering. For these
devices, level translators with uni- or bidirectional drivers with
direction control or auto sensing are recommended. The device
interface will dictate the specific features required.
Read more on the link below
} Voltage translators application page
5V
VGA
HDMI
5V
DVI
DisplayPort
RF
Power
Sensor and actuator
Processing
Interface
Standard products
brb695
40
7.
Level translators
7.1 I2C level translators
NXP offers one of the most comprehensive portfolios of I2C, UART,
and SPI-related products. Functions include the following:
} 1/2/4-bit level translators
} 4/8/16-bit GPIO expanders
} LED blinker
} High-speed UARTs (with IR driver capabilities)
Depending on the requirements of the I²C bus load, different
implementations of I²C level translators (NVT or NTS type) with
automatic direction sensing are available in very small leadless
packages. The PCA9509 is an auto direction sensing repeater
(buffered) I2C translator.
Read more on the links below
} NTS0102 product page
} NTS0104 product page
} PCA9509 product page
1.8 V
3.3 V
0.1 μF
1.8 V
SYSTEM
CONTROLLER
VCC(A)
3.3 V
SYSTEM
VCC(B)
0.1 μF
1 μF
OE
NTS0102
DATA
A1
B1
A2
B2
DATA
001aam491
VCC(A)
VCC(B)
T1
Read more on the link below
} NVT2001/02 product page
ONE
SHOT
ONE
SHOT
T2
10 kΩ
10 kΩ
GATE BIAS
T3
A
B
001aal965
VCC(A)
PCA9509
VCC(B)
VCC(A)
1 mA
A1
B1
VCC(A)
1 mA
A2
B2
EN
GND
002aac125
41
7.
Level translators
7.2 Level shifters for voltage translation
We offer an extensive range of level shifters for use as voltage translators.
All are optimized for low power consumption and small footprint.
Features
} Wide operating voltage (0.8 to 3.6 V)
} High speed (2 ns typical)
} High current capability (up to 50 mA)
} Overvoltage (>VCC) tolerant inputs and outputs
} Lowest power consumption
} Live insertion
} Bus hold
} Standby/suspend mode
} TTL-compatible inputs
} Configurable logic functions
} Pb-free, RoHS- and Dark Green-compliant
} PicoGate and MicroPak packages
Benefits
} Reduced power consumption
} Smaller designs
Read more on the link below
} Level shifters/translators product page
Standard level translators
Width
1-bit
2-bit
4-bit
8-bit
Suffix
Device type
VCC(A)
(V)
VCC(B)
(V)
tPD
(ns)
Rate
(Mb/s)
74AUP1T45
1.1-3.6
1.1-3.6
4.3
250
74AVC(H)1T45
0.8-3.6
0.8-3.6
2.1
500
74LVC(H)1T45
1.2-5.5
1.2-5.5
2.5
420
74AVC(H)2T45
0.8-3.6
0.8-3.6
2.1
500
74LVC(H)2T4
1.2-5.5
1.2-5.5
2.5
420
NTB0102
1.2-3.6
1.65-5.5
3.8
80
NTS0102
1.65-3.6
2.3-5.5
4.4
50
74AVC(H)4T45
0.8-3.6
0.8-3.6
2.1
500
NTB0104
1.2-3.6
1.65-5.5
3.8
80
NTS0104
1.65-3.6
2.3-5.5
4.4
50
74AVC(H)8T245
0.8-3.6
0.8-3.6
2.1
500
74LVC(H)8T245
1.2-5.5
1.2-5.5
3.5
420
74LVC4245
1.5-5.5
1.5-3.6
3.4
300
GW
GM
GF
GT
GM
GD
BQ
BQ
SOT353
SOT886
SOT891
SOT833
SOT902
SOT996
SOT763
SOT815
5-pin
6-pin
6-pin
8-pin
8-pin
8-pin
16-pin
24-pin
Width (mm)
2.10
1.00
1.00
1.00
1.60
3.00
2.50
3.50
Length (mm)
2.00
1.45
1.00
1.95
1.60
2.00
3.50
5.50
Pitch (mm)
0.65
0.50
0.35
0.50
0.50
0.50
0.50
0.50
42
8.
Keypad and joystick interfaces
We have all the ingredients for best-in-class keypad and joystick
interfaces, from GPIO expanders and tailored ESD/EMI filters to one
of the widest portfolios of microcontrollers on the market.
GPIO expanders
These expanders provide a simple way of adding extra GPIO while
keeping interconnections to a minimum.
Features
} 8/16 inputs/outputs
- True bidirectional I/O
- Push-pull outputs/open drain
- Bus keeper feature for inputs
- Programmable pull-up/pull-down
} Input voltage range: 1.1 to 3.6 V
} I/O voltage range: 1.1 to 3.6 V
} Up to 16 different slave addresses
} Bit mask-able input interrupts
} Hardware/softwarerReset
} Low standby current <1 uA
} 16- and 24-pin HVQFN packages
Other GPIO expanders
Type
Bits
PCA9574
8
interrupt
x
1.1 V – 3.6 V
Vcc
8-bit I2C-bus and SMBus, level translating, low-voltage GPIO with reset and interrupt
Description
PCA9575
16
x
1.1 V – 3.6 V
8-bit I2C-bus and SMBus, level translating, low-voltage GPIO with reset and interrupt
PCA9535
16
x
2.3 V – 5.5 V
16-bit I2C-bus and SMBus, low-power I/O port with interrupt
PCA9536
4
-
2.3 V – 5.5 V
4-bit I2C-bus and SMBus, low-power I/O port
PCA9537
4
x
2.3 V – 5.5 V
4-bit I2C-bus and SMBus, low-power I/O port with interrupt
PCA9553
4
-
2.3 V – 5.5 V
4-bit LED driver with programmable blink rates
Benefits
} Fast, easy expansion of GPIO
} Minimize interconnections
Read more on the links below
} PCA9574 product page
} PCA9575 product page
} GPIO for mobile:
NXP web pre-selection
43
8.
Keypad and joystick interfaces
8/16/32-bit microcontrollers
From the smallest 8-bit 80C51 to the highest performing 32-bit
ARM microcontrollers, we drive the industry as an innovation leader
with our highly-integrated and cost-effective products. Our options
include enhanced 80C51, ARM7, ARM9, and even ARM Cortex-M
architectures.
Read more on the links below
} Web page
} Selection guide
ESD protection and EMI filters for keypads and joysticks
These highly integrated devices provide broad suppression of
unwanted 2G and 3G RF signals, offer extremely low ESD clamping
voltage, and deliver ESD protection exceeding EC 61000-4-2 level 4,
with 15 kV contact and at least 15 kV air discharge input protection.
Read more on the link below
} NXP Mobile Usage brochure
Type
Pitch
Number of lines
C typ (0 V)
R channel
IP4032CX25/LF
Package
CSP
0.5
10
40 pF
80 Ω
IP4033CX25/LF
CSP
0.5
10
40 pF
80 Ω
IP4035CX24/LF
CSP
0.5
10
50 pF
1 kΩ
IP4337CX18/LF
CSP
0.4
7
25 pF
70 Ω
IP4338CX24/LF
CSP
0.4
10
25 pF
70 Ω
IP4041CX25/LF
CSP
0.5
10
50 pF
200 Ω
IP4053CX15/LF
CSP
0.5
6
60 pF
100 Ω
IP4153CX15/LF
CSP
0.5
6
30 pF
100 Ω
IP4353CX15/LF
CSP
0.4
6
60 pF
100 Ω
IP4054CX15/LF
CSP
0.5
4+4
60 pF
100 Ω
IP4088CX20/LF
CSP
0.5
8
50 pF
100 Ω
IP4253CZ8
plastic
0.4
4
45 pF
200 Ω
IP4253CZ12
plastic
0.4
6
45 pF
200 Ω
IP4253CZ16
plastic
0.4
8
45 pF
200 Ω
IP4256CZ3-M
plastic
0.65
1
45 pF
100 Ω
IP4256CZ5-W
plastic
0.5
2
45 pF
100 Ω
IP4256CZ6-F
plastic
0.5
2
45 pF
100 Ω
IP4055CX6
CSP
0.5
2
35 pF
470 Ω
IP4355CX6
CSP
0.4
2
25 pF
470 Ω
Read more on the links below
} IP4035CX24 product page
} IP4337CX18 product page
} IP4338CX24 product page
} IP4041CX25 product page
} IP4251CZyy product page
} IP4252CZyy product page
} IP4253CZyy product page
} IP4254CZyy product page
} IP4256CZ3-(X) product page
44
9.
RF interfaces
GPS LNA BGU7005
Housed in an extremely small SOT886 package, this Low Noise
Amplifier (LNA) requires only one external matching inductor and
one external decoupling capacitor. It adapts itself to the changing
environment in response to the presence of different radio systems in
the cellular handset. At low jamming power levels, it delivers
16.5 dB gain at a noise figure of 0.9 dB. During high jamming power
levels, resulting, for example, from a cellular transmit burst,
it temporarily increases its bias current to improve sensitivity.
resulting from impedance mismatches. Housed in extremely small
packages (SOT891 or SOT886), both deliver a gain of 23 dB with a noise
figure of just 0.6 dB. They require only one external matching inductor and
one external decoupling capacitor.
Benefits
} Family of products offers flexibility in gain and linearity
} Lowest external component count
} Broad voltage range: 1.5 to 5.0 V
Application video
Features
} Low-noise, high-gain MMIC
} Input and output DC decoupled
} Noise figure (NF) = 0.9 dB at 1.575 GHz
} High 1 dB compression point of -11 dBm
} Supply voltage: 1.5 to 2.85 V
Benefits
} Fully integrated solution with the lowest external BOM
} Simplified design (only 2 external components needed)
} Supports 1.8 V operation with long battery life
} Very high compression point, with excellent handling of mobile Tx jammers
} Unrivalled immunity to jammers due to Adaptive Bias™
} 40% size and 10% cost reduction on PCB due to highest level of
integration
} 20% faster time to first fix in urban canyons / indoor environments
FM radio LNA BGU7003(/W)
FM radios that integrate the antenna into the mobile device can use
one of these LNAs to compensate for losses in antenna sensitivity
Read more on the links below
} BGU7003 product page
} BGU7005 product page
Varicap diodes for TV-on-mobile
These small devices play a big role in tuning mechanisms. They deliver
excellent linearity and matching, offer very low series resistance, have
high capacitance ratios, and meet the requirements of tight capacitance
specifications.
Read more on the link below
} Varicap diodes product page
45
10.
NFC and RFID
NFC, which stands for Near-Field Communication, is the critical
technology needed to realize the promise of connecting physical
and virtual environments. NFC provides a secure wireless two-way
communication between a mobile phone and reception devices
such as other mobile phones, payment terminals, and identification
readers. The smartphone market will soon adopt NFC as a new
connectivity option, similar to the way GPS, Bluetooth, and WiFi
were added to smartphones in the past. However, unlike the prior
applications, NFC is much richer and not simply yet another new
connectivity solution.
Solutions for end-to-end mobile transactions and device authentication
Secure transactions
Payment, ticketing,
access, transit,
loyalty, etc.
Contactless cards
Peer-to-peer
Easy device
association, profile
exchange, gaming,
etc.
Contactless
readers
Content distribution,
smart advertising,
coupons, etc.
Secure cloud
computing, anticounterfeiting,
software protection,
etc.
Service discovery
Device authentication
Contactless
tags & labels
NFC radio IC
NFC software
Secure element IC
Mobile solutions
Over 100 products
to enable a rich & secure
experience
46
10.
NFC and RFID
NFC and secure element PN65N
The PN65N combines the well-known PN544 NFC controller with
a secure element. The higher level of integration saves board
space, shortens development time, and lowers manufacturing cost.
Furthermore, the device is footprint-compatible with the PN544, for
seamless upgrades and component reduction without having to
redesign an existing system.
} Simultaneous multi cards management (ISO14443-A,B,B’, MIFARE)
Second-generation NFC controller PN544
This high-quality, high-performance NFC controller enables a new
range of contactless applications for improved on-the-go experiences.
It complies with all released NFC and ETSI/SCP SWP and HCI
standards, guarantees interoperability with the existing infrastructure,
and provides a flexible, full-featured platform for meeting GSMA
requirements in next-generation NFC-enabled devices and services.
It offers fully host-controllable power states, delivers a small footprint,
and supports multiple secure elements.
Benefits
} Support for all released NFC standards
} Guaranteed interoperability with existing infrastructure
} PN544 Single Wire Protocol (SWP) interface interoperability with
major UICC/SIM suppliers
} Small footprint
} Shorter integration time due to qualified design-in support for
antenna design & software
} Easy access to NFC technology
} Leverages NXP expertise and experience with major device
manufacturers
Features
} Smallest package TFBGA64 (4.5 x 4.5 x 0.8 mm)
} High level of integration for greater flexibility
} Support for variety of RF protocols
} Integrated power management unit
} Battery Low mode and Power by the Field enabled to comply with
deployed infrastructure when handset is off
} Integrated Frac-N PLL to save XTAL quartz
} Compliancy with Paypass and EMVCo polling loop
} Integrated self test to verify antenna matching circuit during
production
} Up to 10 cm operating distance
} Optimized 80C51 core processor with embedded firmware
} RoHS-2006 compliant
Read more on the links below
} PN544 leaflet
} NXP NFC website
47
Logic for portable applications
We are deeply committed to the logic market. To ensure that our
portfolio remains leading-edge, we continually invest in new process
and package technologies, as well as packaging facilities.
We offer advanced, ultra-low-power CMOS logic that’s specially
designed for portable applications. Our configurable logic gates
simplify type approval and shorten design cycles, and our voltage
translators make it easy to convert signal levels.
} Extremely low power consumption for extended battery life
} Wide range of single-, dual-, and triple-gate functions and
configurable logic gates for board layout optimization, especially in
advanced, low-power system designs
Read more on the link below
} 74AUP1G/2G/3Gxxx leaflet
11.1 Ultra-low-power CMOS logic
Low-voltage, Si-gate CMOS AUP family for portable
These products offer the industry’s lowest dynamic power
consumption in a logic device and are designed for use in
high-performance, low-power applications.
Features
} 4 ns performance
} -4/4 mA static drive
} 0.9 μA standby current
} Optimized for 1.8 V
} 3.6 V tolerant I/O
} PicoGate and MicroPak packages
} Multiple sources
Benefits
} Low propagation delay for advanced applications
} Wide operating voltage for mixed-voltage applications
} Schmitt-trigger action on all inputs for high noise immunity
AUP
ULP
AUC
1200
Battery life (minutes)
11.
900
600
300
0
1.8
2.0
2.2
2.4
2.6
Operating VCC (V)
2.8
3.0
3.2
48
11.
Logic for portable applications
11.2 Configurable logic gates
Multi-function AUP family for portable applications
For greater design flexibility and simpler inventory management, we
offer configurable logic functions that let a single device perform
many different operations. The 74AUP1T58, for example, provides
low-power, low-voltage configurable logic gate functions. Its output
state is determined by eight patterns of 3-bit input. The user can
choose the logic functions AND, OR, NAND, NOR, XOR, inverter, or
buffer. All inputs can be connected to VCC or GND.
Features
} Very low dynamic power dissipation (CPD)
} Wide VCC from 0.8 to 3.6 V
} Schmitt-trigger inputs provide high noise immunity
} Superior ESD protection
} Wide operating temperature of -40 to +125 °C
} TPD of 3.2 ns and IOL of 2.2 mA at 1.8 V VCC
} Available in single/dual gate functions
} PicoGate and MicroPak packaging
Benefits
} Greater design flexibility
} Simpler inventory management
Four of nine possible 74LVC1G57 configurations
VCC
A
C
A
C
Y
A
Y
1
6
2
5
3
4
C
Y
Y
A
C
Y
A
1
6
2
5
3
4
001aab586
Fig 7. 2-input NAND gate with input C inverted or
2-input OR gate with inverted A input
C
Y
001aab587
Fig 7. 2-input NOR gate or 2-input AND gate with
both inputs inverted
VCC
VCC
B
C
B
Y
1
6
2
5
3
4
C
Y
A
Fig 9. 2-input XNOR gate
Y
A
001aab588
Read more on the link below
} General-purpose logic solutions brochure
VCC
A
C
1
6
2
5
3
4
Y
001aab589
Fig 10. Inverter
Read more on the link below
} 74LVC1G57 product page
49
11.
Logic for portable applications
11.3 Logic-controlled analog switches
The NX3 series offers a wide variety of switch configurations, ranging
from a single-channel SPST (single-pole, single-throw) to an SP8T
(single-pole, eight-throw). The supported bandwidths range from
15 MHz at the low end to 330 MHz at the high end, for dual-channel
USB 2.0 switching. All are suitable for use with analog and digital
signals, such as USB, microphone, speaker, and so on.
Features
} Supply voltage range of 1.4 to 4.3 V
} Leadless QFN package types
} Low THD due to low voltage dependence
} Pb-free and RoHS-compliant
Device type
RON MAX
(@2.7 V)
(Ω)
f -3dB
(MHz)
THD
(%)
X-talk
(dB)
NX3L1G66
0.75
60
0.024
-90
NX3VT384
0.45
25
0.01
-90
NX3L2G66
0.75
60
0.024
-90
NX3VT384
0.45
25
0.01
-90
NX3L1G3157
0.75
60
0.024
-90
NX3L1T3157
0.75
60
0.024
-90
NX3L1G53
0.75
60
0.024
-90
NX3L1T53
0.75
60
0.024
-90
NX3L4684
0.8
0.5
60
25
0.01
-90
NX3L2267
0.75
60
0.024
-90
NX3L2467
0.75
60
0.02
-90
NX3DV2567
9.5
330
-
-60
NX3DV3899
4.5
200
0.01
-90
1x SPTT
NX3L4357
0.75
30
0.02
-90
1x SP8T
NX3L4051
0.75
15
0.02
-90
3x SPDT
NX3L4053
0.8
60
0.02
-90
Configuration
1x SPST
2x SPST
1x SPDT
2x SPDT
Click here for pre-selection
2x DPDT
or 4PDT
1Y0
E
Z
Y
001aag487
1Y1
2Y0
6 Y1
S 5
2Y1
7 Y0
Z 1
3Y0
E
2
3Y1
001aad386
4Y0
4Y1
1Z
2Z
1S
3Z
4Z
2S
001aak174
50
Discretes for portable applications
Our comprehensive portfolio of ultra-small diodes and transistors
enables high performance in increasingly small portable electronics.
We safeguard sensitive ICs with advanced ESD protection diodes and
EMI filters, and guarantee the lowest power losses in battery-driven
systems with low-voltage-drop Schottky diodes and low VCEsat (BISS)
transistors. We also offer a full range of standard switching, Schottky,
and Zener diodes, along with small-signal transistors, MOSFETs, and
resistor-equipped transistors (RETs).
Package
Size
(mm)
SOD962
0.6 X 0.3
X 0.3
Number of protected lines
unibidirectional
C line
typ (pF)
VRWM
(V)
ESD rating 1)
max (kV)
35
5
30
0.0001
5
1
12
5
30
0.0001
5
PESD5V0L1BSF
1
3.5
5
15
0.0001
5
PESD5V0V1BSF
35
5
30
0.1
5
12
5
25
0.1
5
2.9
5
10
0.1
5
PESD5V0U1BL
0.9
5
9
0.1
5
PESD5V0X1BL
1
2
1
SOD882
SOD882D
1.0 x 0.6
x 0.5
1
IR @ VRWM
max (mA)
(V)
Configuration
Type
PESD5V0S1BSF
1
2
brb050
PESD5V0S1BL(D)
PESD5V0V1BL(D)
0.4
5
8
0.1
5
PESD5V0F1BL
150
5
30
1
5
PESD5V0S1UL(D)
2
5
9
0.1
5
PESD5V0U1UL
2
1
200
3.3
30
2
3.3
38
12
30
0.05
12
PESD3V3S1UL
PESD12VS1UL
5PESD5VX1ULD
006aaa152
0.95
5
8
1
5
2.9
5
10
0.1
5
22
3.3
15
0.3
3.3
16
5
15
0.025
5
Read more on the links below
} Pre-selection
} Portfolio overview
} Selection guide for ESD protection
} Selection guide for BISS transistors
SOT883
(SC-101)
1.0 x 0.6
x 0.5
2
1
PESD5V0U2BM
2
2
brb178
3
Innovation in small packages
NXP’s new SOD882D is the latest landmark in ultra-small
leadless plastic packages. It is the industry’s first to offer
solderable side pads. The very small size of only 1.0
x 0.6 x 0.37 mm and superior mechanical stability are
unmatched. For more details, please visit www.nxp.com/
package/SOD882D.html
ESD protection diodes
1
12.
1
3
2
brb051
PESD3V3L2UM
PESD5V0L2UM
51
12.
Discretes for portable applications
Low VCEsat (BISS) transistors
Polarity
NPN
VCEO
(V)
IC
(A)
ICM
(A)
RCEsat typ
(mΩ)
@ I C;
IC/IB = 10
VCEsat typ (mV)
@ IC = 0.5 A;
IB = 0.05 A
VCEsat
max (mV)
@ IC
(A)
@ IB
(A)
Type
Package
Size
(mm)
P tot
(mW) 1)
SOT883
(SC-101)
1.0 x 0.6 x 0.5
250
0.5
1.0
200/325
0.01
2
360
-
250
0.5
0.05
PBSS2515M
0.5
1.0
200/550
0.01
2
380
-
250
0.5
0.05
PBSS2540M
20
2.0
4.0
220/410
0.5
2
140
70
350
2
0.2
PBSS4220V
40
1.0
3.0
300/ -
0.5
5
150
70
440
2
0.2
PBSS4140V
2.0
3.0
300/400
0.5
5
150
70
400
2
0.2
PBSS4240V
1.0
2.0
200/400
0.5
5
200
110
250
1
0.1
PBSS4160V
15
0.5
1.0
200/425
0.01
2
300
200
250
0.5
0.05
PBSS2515E
40
0.5
1.0
200/350
0.01
2
380
200
250
0.5
0.05
PBSS2540E
15
0.5
1.0
200/260
0.01
2
300
150
250
0.5
0.05
PBSS3515M
40
0.5
1.0
200/380
0.01
2
440
220
350
0.5
0.05
PBSS3540M
20
2.0
4.0
220/440
0.1
2
140
75
390
2
0.2
PBSS5220V
1.0
2.0
300/ -
0.1
5
200
120
310
1
0.1
PBSS5140V
1.8
3.0
300/450
0.1
5
185
100
530
2
0.2
PBSS5240V
1.0
2.0
150/250
0.5
5
220
120
330
1
0.1
PBSS5160V
15
0.5
1.0
200/325
0.01
2
300
130
250
0.5
0.05
PBSS3515E
40
0.5
1.0
200/380
0.01
2
440
230
350
0.5
0.05
PBSS3540E
1.0
200/ -
0.01
2
300
170 2)
250
0.5
0.05
PBSS3515VS
1.0
200/ -
0.01
2
300
170 2)
250
0.5
0.05
PBSS2515VPN
1.0
200/ -
0.01
2
300
170 2)
250
0.5
0.05
PBSS2515VS
40
2 x PNP
NPN/PNP
15
0.5
2 x NPN
1)
@ VCE
(V)
15
60
2)
@ IC
(A)
40
60
PNP
hFE
min/typ
SOT666
1.6 x 1.2
x 0.55
500
SOT416
(SC-75)
1.6 x 0.8 x 0.77
250
SOT883
(SC-101)
1.0 x 0.6 x 0.5
250
SOT666
1.6 x 1.2 x 0.55
500
SOT416
(SC-75)
1.6 x 0.8 x 0.77
250
SOT666
1.6 x 1.2 x 0.55
500
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2
@ IC = 0.5 A; IB = 0.025 A
Package outline
Pins
Package size (mm)
2
1.0 x 0.6 x 0.5
2
1.2 x 0.8 x 0.6
3
1.0 x 0.6 x 0.5
SOD882 /SOD882D
SOD523 (SC-79)
SOT883 (SC-101)
52
Additional resources
The listed web pages provide access to additional
information about NXP and its product lines.
Mobile devices application page
http://www.nxp.com/applications/portable-devices/cellular-mobilephone-solution.html
Technical support (including application notes)
http://www.nxp.com/technical-support-portal.html
X-reference tool (search tool for NXP website, for use offline)
http://www.nxp.com/products/x-reference-offline-tool/
NXP Chinese website (simplified characters)
www.cn.nxp.com
NXP Chinese website (traditional characters)
www.tw.nxp.com
NXP Japanese website
www.jp.nxp.com
53
www.nxp.com
© 2012 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document
Date of release: February 2012
does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the
Document order number: 9397 750 17090
publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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