57P6788E-D memory(en)

2014 Edition
ROHM GROUP
Memory Catalog
DRAM / EEPROM / FeRAM / NOR Flash / P2ROMTM
The ROHM Group offers a variety of memory
products, from DRAM to proprietary
non-volatile types, to suit a wide range of
market and customer needs.
Industry-leading quality and reliability
High rewrite transfer rate with excellent data
retention characteristics
DRAM
NOR Flash
Reliable quality • Stable supply
FeRAM
Short lead time • Eliminates
customer stock
P2ROMTM*
* P2ROMTM(Production Programmed ROM)
( )
Market-proven reliability
and performance
EEPROM
01
ROHM GROUP
Memory Products
Volatile Memory
DRAM
P.03
FP/EDO [4Mb/16Mb/64Mb,5V/3.3V]
SDRAM [16Mb-256Mb,3.3V]
SDRAM series for SiP (Chips)
Video memory series [3Mb,4Mb,5Mb,6Mb,10Mb,26Mb,5V/3.3V]
Non-Volatile Memory
EEPROM
P.07
I C BUS (2-Wire)
Microwire BUS (3-Wire)
SPI BUS
Ultra-Compact WL-CSP
Plug & Play EEPROM
2
FeRAM
P.13
Parallel BUS FeRAM [256Kb,3.3V]
I2C BUS FeRAM [64Kb,3.3V]
SPI BUS FeRAM [32Kb-2Mb,3.3V]
NOR Flash
P.13
Parallel BUS NOR Flash [32Mb-256Mb,3.3V]
P2ROMTM
Parallel BUS Standard P2ROMTM [8Mb-512Mb,3.3V]
Parallel BUS Page Mode P2ROMTM [16Mb-16Gb,3.3V]
SPI BUS P2ROMTM [16Mb-128Mb,3.3V]
[email protected] Series with Built-In Gate Array
02
P.15
DRAM Series lineup
Broad lineup of DRAM
[Density] bit
4M
DRAM
FP/EDO Series
Asynchronous clock Automotive grade
High speed EDO
Cu frame
Stable supply
Low power
Standard package
16M
MSM514xxxx Series
MSM5416258B Series
MSM51V4xxxx Series
MSM54V16258B Series
MSM514400xP Series
MSM514260EP Series
MSM51V4xxxxP Series
MSM54V16258BP Series
models
37
SDRAM Series
Synchronous clock
Automotive grade
166MHz operation
No damping resistor required
D R A M
SDRAM Series for SiP
Chip products
SiP failure analysis
Chip traceability
MSM56V16160K Series
100% KGD
Automotive grade
Testing program available
MD56V72160C Series
MD56V82160A Series
MD56V62xxxx Series
MD56V62xxxx-xxTAP Series MD56V72160C-xxTAP Series MD56V82160A-xxTAP Series
Under
MD56V62160M-xxTAP Series
development
MD58W82160A Series(DDR)
9 models
MD56V62160M Series
4 models
Assembly solutions
166MHz operation
Application
Skip
protection
8 models
Under
development
4 models
Frame
memory
Car audio
MUSIC
AAAAAA
BBBbbbbb
CCCCCcccccc
DDD
E_EEE
Car navigation
Frame
memory
Frame
memory/
sound
buffer
1
4
7
C
2
Industrial printers
Broadcast/industrial equipment
6
9
セッ
ト
Medical equipment
Frame
memory
Games/PC peripheral devices
Consumer communication equipment
Sound
buffer/skip
protection
AV Equipment
Data
buffer
Surveillance cameras
3
8
5
0
Most
suitable for
data
buffer
PC, games,
Communication devices
Component systems
Sound
buffer
Industrial communication device
Data
buffer
Compact/TV panels
3M
FIFO
Asynchronous input/output clock
Write mask function
Cascade function
Input/output clock rate control Self-refresh included
Automotive grade
2-port dual clock
Selectable top address
Application
AV/Car Equipment
4M
Frame/
working
memory
Frame
memory
Musical instruments
5M/6M
MSM8104160A Series
MS81V04160A Series
MS81V04166A Series
MS81V04160AP Series
MSM5412222B Series
MSM54V12222B Series
MS81V03120 Series
6 models
8 models
1
7
C
2
8
5
0
3
6
9
セッ
ト
MS81V10160 Series
3 models
MS81V26000 Series
MS81V26000-25TPZP3
2 models
3 models
Surveillance cameras/broadcast equipment/industrial equipment/industrial printers
Medical equipment
NTSC / PAL
Half HD
VGA / WVGA
www.lapis-semi.com/en
26M
Small panels/image processors
4
Panel size
[Density] bit
10M
Car navigation
Frame
memory
Industrial Equipment
MS81V05200-13TAZ03
MS81V06160 Series
Most
suitable for
data
buffer
Sound
buffer/skip
protection
Wide lineup of video memory
Video memory Series
11 models
MD56V72160C Series
5 models
Car Equipment
Industrial Equipment
256M
2 models
12 models
Stable supply
128M
MD51V65165E Series
32 models
MSM56V16800F Series
MSM56V16160x Series
MSM56V16160xP Series
Broad temp. range JEDEC-compliant
Cu frame
Adjustable driveability
16Mbit Min. chip size
64M
MSM511xxxxx Series
MSM51V1xxxxx Series
MSM511816xFP Series
MSM51V1xxxxxP Series
XGA
03
Full HD
DRAM
DRAM FP/EDO Series
×4
4Mb
×8
×16
5V
×4
16Mb ×8
×16
×4
4Mb
×8
×16
×4
3.3V
Orders require the complete part number, including the access time and package type.
1K
512
2K
4K
1K
1K
5V
3.3V
16Mb
4Mb
16Mb
Icon
Descriptions
×4
×16
×4
1K
×16
512
DRAM function
type
Flat
type
(H=1.2mm)
TOP
TSOP(II)28
MSM54V16258B
MSM54V16258BSL
MSM51V4265E
TSOP(II)44/40
TSOP(II)44/40
MSM51V16405F
TSOP(II)26/24
TSOP(II)26/24
MSM51V17405F
MSM51V17805F
TSOP(II)26/24
TSOP(II)28
TSOP(II)50/44
MSM51V16165F
TSOP(II)50/44
TSOP(II)50/44
MSM51V18165F
MD51V65165E
TSOP(II)50/44
TSOP(II)50
TSOP(II)26/20
TSOP(II)44/40
TSOP(II)50/44
MSM5118165FP
TSOP(II)50/44
TSOP(II)26/20
MSM54V16258BP
MSM51V4265EP
TSOP(II)44/40
TSOP(II)44/40
TSOP(II)26/24
MSM51V18165FP
Low power consumption
for Refresh
TSOP(II)50/44
Access time
Operating
temperature
Cu frame
16Mbit
4Mbit
300mill
1.27mm pitch
300mill
1.27mm pitch
400mill
1.27mm pitch
400mill
0.8mm pitch
400mill
0.8mm pitch
400mill
0.8mm pitch
TSOP(II)26/20
TSOP(II)26/24
TSOP(II)28
TSOP(II)44/40
TSOP(II)50/44
TSOP(II)50
04
×16bit
16Mbit
*Actual size shown
×8bit
4Mbit / 16Mbit
4Mbit
×4bit
TSOP(II)44/40
TSOP(II)26/24
MSM514400DP/EP
MSM514260EP
MSM5118160FP
High speed EDO
access function
TSOP(II)50/44
TSOP(II)26/20
MSM51V17400FP
2K
×16 1K
TSOP(II)28
MSM5118165F
MSM51V4400EP
×4
TSOP(II)26/24
TSOP(II)50/44
MSM51V18160F
1K
TSOP(II)44/40
MSM5117405F
MSM5117805F
MSM51V17800F
MSM51V16160F
1K
512
TSOP(II)44/40
TSOP(II)26/24
4K
Pin-Compatible Packages
I/O
Density
MSM514265E
MSM5416258B
MSM51V17400F
A utom o t i ve G rad e
4Mb
TSOP(II)28
MSM51V16400F
1K
Package
Other features
TSOP(II)28
512
4K
Access time
TSOP(II)26/20
MSM5116400F
MSM5117400F
MSM5117800F
MSM5116160F
MSM5118160F
MSM51V4400E
MSM51V4800E
4K
4K
64Mb
Function/Part No.
MSM514400E
MSM514800E
MSM514800ESL
MSM514260E
×8
×16
FP(Fast Page) and EDO(Extended Data Out) DRAMs are CMOS asynchronous clock types.
A wide selection of compatible types are offered to suit various needs.
Function/Part No.
2K
16Mb
Video memory Series
64Mbit
www.lapis-semi.com/en
D R A M
Standard
SDRAM Series for SiP
Stable supply • Broad product lineup
FP/EDO Series
Power
Number
supply Memory of data Refresh
cycle
voltage density bits
DRAM SDRAM Series
DRAM
SDRAM is a synchronous type of DRAM.
Our multiple fab locations ensure stable supply around the world.
Standard
16Mb
3.3V
64Mb
128Mb
Under
developmen t
2.5V
256Mb
Orders require the complete part number, access time and package type. Note : Cycle time is applied to xx.
4K
×16
8K
Automotive Grade
D R A M
16Mb
4K
3.3V 64Mb ×16
128Mb
256Mb
Icon
Descriptions
Max.
frequency
Function/Part No.
×8
×16
8K
MSM56V16160FP
MSM56V16160KP
MD56V62160E-10TAP
MD56V62160M-xxTAP
MD56V72160C-xxTAP
MD56V82160A-xxTAP
TSOP(II)50
to
TSOP(II)50
TSOP(II)50
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)66
TSOP(II)50
TSOP(II)54
TSOP(II)54
TSOP(II)54
TSOP(II)54
Max.operatingfrequency
(MHz)
Cycle time
to
Top
400mill
0.8mm pitch
TSOP(II)44
DRAM
Icon
Descriptions
DRAM
function type
Top
400mill
0.8mm pitch
TSOP(II)50
TSOP(II)54
Stable supply • KGD
We offer KGD DRAM chips in the form of wafers, featuring quality equivalent to package products, for use in SiP
(System in Package) applications.
*All SDRAM products for SiP utilize custom part numbers.
Standard
Under
developmen t
64Mbit / 128Mbit / 256Mbit
400mill
0.8mm pitch
Power
Number
supply Memory of data Refresh
cycle Function/Part No.
voltage density bits
16Mb
3.3V 64Mb ×16 4K
128Mb
*Actual size shown
*JEDEC (JEDEC Solid State Technology Association) is a semiconductor engineeringtrade organization and standardization body
SDRAM Series
for SiP (Chips)
Automotive Grade
×16bit
16Mbit
Top
Under
developmen t
Drivability
control function
Cu frame
Operating
temperature
Pin-Compatible Packages(JEDEC-Compliant)
I/O
×8bit
16Mbit
Density
16Mb
3.3V 64Mb ×16 4K
128Mb
Package
Other features
TSOP(II)44
HALOGEN
FREE
(H=1.2mm)
Cycle time
MSM56V16800F
MSM56V16160F
MSM56V16160K
MD56V62160E
MD56V62160M
MD56V72160C
MD56V82160A
MD58W82160A
DRAM function
type
Flat
type
Video memory Series
Stable supply
SDRAM Series
Power
Number
supply Memory of data Refresh
cycle
voltage density bits
DRAM SDRAM Series SDRAM Series for SiP
DRAM FP/EDO Series
Max.
frequency
MSM56V16160K
MD56V62160M
MD56V72160C
Cycle time
MSM56V16160K
MD56V62160M
MD56V72160C
Max. operating
frequency
www.lapis-semi.com/en
to
Operating
temperature
Cycle time
05
KGD ensured
Other features
DRAM
LAPIS Semiconductor's video memory products were developed using DRAM technology. A diverse lineup of FIFO memory
is offered, enabling individual serial read/write control of each clock using asynchronous and differing clock rates. A built-in
self-refresh control circuit eliminates the need for external refresh. The lineup is optimized for processing image data.
Standard
Orders require a complete part number, including the access time and package type.
Power
Number
supply Memory of data Refresh
cycle Function/Part No.
voltage density bits
TSOP(II)44
TSOP(II)70
1
14
44
INDEX MARK
1
MIRROR FINISH
0.81 TYP.
0.17±0.05
+0.08
0.4 −0.07
0.20 M
70
M
18.41±0.10
INDEX MARK 1
MIRROR FINISH
0.71 TYP.
0.50
0.10
11.76±0.2
10.16±0.1
INDEX MARK 1
MIRROR FINISH
0.88TYP.
M
75
0.22 +0.08
−0.07
0.17±0.05
0.10
SEATING PLANE
M
23
0.16 M
SEATING PLANE
●TSOPⅡ50-P-400-0.80-1K
20.95±0.10
INDEX MARK
MIRROR FINISH
0.88 TYP.
26
0.145±0.050
1
25
+0.08
−0.07
0.80
0.32
0.16 M
SEATING PLANE
0.10
75
26
25
0.22±0.05
51
76
50
0.50
0.17±0.05
●P-QFP100-1414-0.50-K
51
1
22
0.37 +0.08
−0.07
0.80
0.10
SEATING PLANE
76
INDEX MARK
MIRROR FINISH
1.00 TYP.
0.145±0.05
18.41±0.1
1
50
0.17±0.05
25
+0.08
0.37 −0.07
0.16 M
100
0.08 M
0.08 SEATING PLANE
06
INDEX MARK
MIRROR FINISH
0.81 TYP.
26
●TQFP100-P-1414-0.50-K
36
35
0.80
0.10
SEATING PLANE
11.76±0.20
10.16±0.10
11.76±0.20
10.16±0.10
0.145±0.05
0.10 SEATING PLANE
0.16
●TSOPⅡ70-P-400-0.50-K
28
0.16
0.17±0.05
25 +0.08
0.37 -0.07
□16.00±0.20
□14.00±0.10
0.10
●TSOPⅡ54-P-400-0.80-K
27
+0.08
0.32 −0.07
0.80
SEATING PLANE
20.95±0.1
50
26
10.76
INDEX MARK 1
MIRROR FINISH
0.88 TYP.
0.16 M
44
23
●TSOPⅡ50-P-400-0.80-K
11.76±0.20
10.16±0.10
10.76
0.17±0.05
0.37 +0.08
−0.07
20.95±0.10
●TSOPⅡ44/40-P-400-0.80-K
22 0.145±0.050
0.32 +0.08
−0.07
0.16 M
0.80
0.10
●TSOPⅡ50/44-P-400-0.80-K
50
18.41±0.10
SEATING PLANE
0.10
TQFP100
●TSOPⅡ44-P-400-0.80-1K
15
1.27
14mm×14mm
0.5mm pitch
50
26
100
INDEX MARK 1
MIRROR FINISH
1.0±0.2
0.17±0.05
1.0±0.2
2.4MAX.
0.05∼0.25 2.1±0.10
INDEX MARK
MIRROR FINISH
0.95 TYP.
23
11.76±0.2
10.16±0.1
18.41±0.1
* Actual size shown
26Mbit
TOP
(H=1.2mm Max.)
11.76±0.2
10.16±0.1
9.22±0.2
7.62±0.1
13 0.17±0.05
+0.08
0.42 −0.07
0.21 M
0.10 SEATING PLANE
0.80
3Mbit / 5Mbit / 6Mbit / 10Mbit
●TSOPⅡ28-P-400-1.27-K
●TSOPⅡ44-P-400-0.80-K
INDEX MARK
MIRROR FINISH
0.71 TYP.
2 ports WCLK pin
setting
400mill
0.5mm pitch
28
Variable top address
Cu frame
400mill
0.8mm pitch
0.10 SEATING PLANE
1
Access time/
Cycle time
to
Flat
type
14
22
TQFP100
11.76±0.2
10.16±0.1
●TSOPⅡ26/24-P300-1.27-3K
17.14±0.1
QFP100
11.76±0.20
10.16±0.10
Packages [Unit : mm]
22.22±0.10
TQFP100
10.76
QFP100
TOP
54
TSOP(II)70
Density
14mm×14mm
0.5mm pitch
0.80
TSOP(II)70
11.76±0.20
10.16±0.10
Standard
INDEX MARK 1
MIRROR FINISH
0.81 TYP.
TSOP(II)70
□16.8±0.2
□14.0±0.1
4Mbit
18.41±0.1
QFP100
Operating
temperature
Pin-Compatible Packages
44
QFP100
Max. operating
frequency
to
FIFO cascade
connection function
1.27
TSOP(II)70
1.00 TYP.
DRAM function
type
INDEX MARK
1
MIRROR FINISH
0.95 TYP.
TSOP(II)44
MS81V04160AP
MS81V26000-25TPZP3
2
Port
CLK
26
QFP100
D R A M
Automotive Grade
TSOP(II)44
10.76±0.2
2
4Mb ×16 Port
CLK
3.3V
5Mb ×10
6Mb
×16
10Mb
26Mb ×24
Density
Package
Other features
25
0.5
0.10
0.22±0.05
1.4±0.2
0~10°
0.25
3Mb ×12
Icon
Descriptions
Access time/Cycle time
MSM5412222B
MS8104160A
MSM54V12222B
MS81V03120
MS81V04160A
MS81V04166A
MS81V05200
MS81V06160
MS81V10160
MS81V26000
2
Port
CLK
4Mb ×16
3.3V
26Mb ×24
Max.
frequency
10.76±0.2
3Mb ×12
4Mb ×16
Video memory Series
SDRAM Series for SiP
Stable supply • Broad lineup
Video memory Series
5V
DRAM SDRAM Series
DRAM FP/EDO Series
0.6TYP.
0.67±0.15
0.08 M
SEATING PLANE
www.lapis-semi.com/en
Serial EEPROM Series lineup
[Density] bit
1K
2
I C BUS
Consumer
fSCL=400kHz
Consumer
fSCL=1MHz
Consumer
Selectable Bit Format
Consumer
MicroWire Interchangeable BR93xxRxx-W
BUS
Consumer
Different Pin Layout
Automotive-Grade
Consumer
SPI BUS
Automotive-Grade
2K
BR24G01xxx-3 BR24G02xxx-3
Series
Series
4K
8K
16K
32K
64K
BR24G04xxx-3
Series
BR24G08xxx-3
Series
BR24G16xxx-3
Series
BR24G32xxx-3
Series
BR24G64xxx-3
Series
128K
256K
512K
1M
BR24G128xxx-3 BR24G256xxx-3
Series
Series
BR24G01xxx-3A BR24G02xxx-3A BR24G04xxx-3A BR24G08xxx-3A BR24G16xxx-3A BR24G32xxx-3A BR24G64xxx-3A BR24G128xxx-3A BR24G256xxx-3A BR24G512xxx-3A BR24G1Mxxx-3A
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
Series
BR93G46xxx-3 BR93G56xxx-3
Series
Series
BR93G66xxx-3
Series
BR93G76xxx-3
Series
BR93G86xxx-3
Series
BR93G46xxx-3A BR93G56xxx-3A BR93G66xxx-3A BR93G76xxx-3A BR93G86xxx-3A
Series
Series
Series
Series
Series
BR93G46xxx-3B BR93G56xxx-3B BR93G66xxx-3B BR93G76xxx-3B BR93G86xxx-3B
Series
Series
Series
Series
Series
BR93H46Rxxx-2C BR93H56Rxxx-2C BR93H66Rxxx-2C BR93H76Rxxx-2C BR93H86Rxxx-2C
Series
Series
Series
Series
Series
BR25L010xxx-W BR25L020xxx-W BR25L040xxx-W BR25L080xxx-W BR25L160xxx-W BR25S320xxx-W BR25S640xxx-W BR25G128xxx-3 BR25G256xxx-3
Series
Series
Series
Series
Series
Series
Series
Series
Series
BR25H010xxx-2C BR25H020xxx-2C BR25H040xxx-2C BR25H080xxx-2C BR25H160xxx-2C BR25H320xxx-2C BR25H640xxx-2C BR25H128xxx-2C
Series
Series
Series
Series
Series
Series
Series
Series
Application
T
TV
V
STB
STB
電源
DEGITAL CATV
SLRs
AV Equipment
DVC
DVD/BD
Air-conditioner
Home
Appliances
Refrigerator
EEPROM
EEPROM
Washing machine
Printer
MFP
2:13
Telephone / FAX
Search
glekripip
Ente
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Mail
fewlt:we [email protected]
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[@we[^g
Call
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Canc
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0901
Alarm
PC Peripherals
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Internet
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Phone
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Book
Mail
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Call
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Mouse keyboard
Monitor
18:30
19:15到着予定
100m
×
文
〒
G
IC
○○
521m
000
○○温泉
442
60km/
メニュー
1000m
3km
C
Car AV / Car navigation
ナビ
中止
Car air-conditioner
Metor
40
50
30
10
C
60
80
70
100 120
130
60
80
20
140
40
20
0
230km
H
1356
Car Electronics
E
160
0
230km
F
Body・ECU
Powertrain
ABS
LCD
Camera Module
Module
Wifi module / BT module
Power supply Module
Memory Module
XXX
Electric power Meter
Industrial
Equipment
Security Camera
Inverter
www.rohm.com
07
XXX
XXX
XXX
XXXXXXXXXXXXXXXXX
111111111111111111
EEPROM
I2C BUS(2-Wire) Series
I2C BUS(2-Wire) Series
−40℃ to +85℃ Operation
Part No.
Function
BR24G01
BR24G02
BR24G04
BR24G08
BR24G16
BR24G32
BR24G64
BR24G128
BR24G256
Part No.
Function
BR24G01
BR24G02
BR24G04
BR24G08
BR24G16
BR24G32
BR24G64
BR24G128
BR24G256
BR24G512
BR24G1M
Icon
Descriptions
to
Plug & Play EEPROM
The I2C BUS method, which simplifies wiring considerably, and has been widely adopted in a number of fields,
such as AV equipment, industrial systems, and the PC peripheral sector. ROHM’s I2C BUS EEPROM lineup
includes both standard 400kHz models as well as high-speed 1MHz types to suit a wide range of needs.
Density(bit)
Operating
frequency
Double Cell
SOP8
-3
F-3
FJ-3
FVT-3
-3
F-3
FJ-3
-3
F-3
-3
MSOP8
VSON008X2030
FVM-3
NUX-3
FVT-3
FVM-3
NUX-3
FJ-3
FVT-3
FVM-3
NUX-3
F-3
FJ-3
FVT-3
FVM-3
NUX-3
-3
F-3
FJ-3
FVT-3
FVM-3
NUX-3
-3
F-3
FJ-3
FVT-3
FVM-3
NUX-3
-3
F-3
FJ-3
FVT-3
FVM-3
NUX-3
-3
F-3
FJ-3
FVT-3
FVM-3
NUX-3
-3
F-3
FJ-3
FVT-3
-
-
DIP-T8
SOP8
MSOP8
VSON008X2030
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
FVM-3A
NUX-3A
-3A
F-3A
FJ-3A
FVT-3A
-
-
-3A
F-3A
FJ-3A
FVT-3A
-
-
-3A
F-3A
FJ-3A
-
-
-
Operating
frequency
Input voltage
range
Double Reset
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
DIP-T8
BR24Gxxxxxx-3A Series (SCL frequency=1MHz)
Feature
Ultra-Compact WL-CSP
Standard 2-Wire Serial EEPROMs
BR24Gxxxxxx-3 Series (SCL frequency=400kHz)
Feature
SPI BUS Series
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
Operating
temperature
Write cycle
time
Page write
function
ESD resistance(HBM)
*Actual size shown
DIP-T8
SOP8
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
Package
Lineup
08
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EEPROM
Standard
Microwire BUS(3-Wire) Series
EEPROM
Microwire BUS(3-Wire) Series
I2C BUS(2-Wire) Series
ROHM’s standard serial EEPROM lineup includes 3-wire Microwire bus models that feature a wide
operating temperature range up to +85°C and +125°C. In addition, original double cell construction
and double reset functionality provide unmatched reliability. The automotive-grade BR93Hxx Series
delivers remarkable 6kV ESD resistance, making it ideal for applications requiring superior reliability.
−40℃ to +85℃ Operation
BR93Gxxxxx-3/-3A/-3B Series
Feature
Plug & Play EEPROM
Ultra-Compact WL-CSP
Standard 3-Wire Serial EEPROMs
Microwire BUS(3-Wire) Series
Standard
SPI BUS Series
Part No.
Function
BR93G46
BR93G56
BR93G66
BR93G76
BR93G86
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
DIP-T8
SOP8
MSOP8
VSON008X2030
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
-3/-3A/-3B
F-3/-3A/-3B
FJ-3/-3A/-3B
FVT-3/-3A/-3B
FVM-3/-3A/-3B
NUX-3/-3A/-3B
Pin Assignment
CS
SK
DI
VCC
BR93Gxx-3
DO
DU
ORG
GND
CS
Automotive Grade
BR93Gxx-3A
DI
DU
VCC
GND
SK
NC
DO
Selectable Bit Format
(8bit or 16bit)
DU
VCC
SK
CS
Interchangeable with the
BR93LxxRxx-W Series
Part No.
to
EEPROM
GND
DO
DI
−40℃ to +125℃ Operation
Function
Density(bit)
Write all function
Double Cell
Ready/Busy status
display capability
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
MSOP8
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
RF-2C
RFJ-2C
RFVT-2C
RFVM-2C
SOP8
BR93H46
BR93H56
BR93H66
BR93H76
BR93H86
Icon
Descriptions
BR93Gxx-3B
Rotated Pins
BR93Hxxxxxx-2C Series
Feature
NC
Input voltage
range
Double Reset
Noise cancelling
function built in
Operating
temperature
Write cycle
time
ESD resistance(HBM)
*Actual size shown
DIP-T8
SOP8
SOP-J8
TSSOP-B8
Package
Lineup
www.rohm.com
09
MSOP8
VSON008X2030
EEPROM
I2C BUS(2-Wire) Series
Part No.
Function
BR25L010
BR25L020
BR25L040
BR25L080
BR25L160
BR25S320
BR25S640
BR25G128
BR25G256
SOP8
FVT-W
FVM-W
-
F-W
FJ-W
FVT-W
FVM-W
-
F-W
FJ-W
FVT-W
FVM-W
-
F-W
FJ-W
FVT-W
-
-
F-W
FJ-W
FVT-W
-
-
F-W
FJ-W
FVT-W
FVM-W
NUX-W
F-W
FJ-W
FVT-W
FVM-W
-
F-3
FJ-3
FVT-3
FVM-3
NUX-3
F-3
FJ-3
FVT-3
-
-
BR25H010
BR25H020
BR25H040
BR25H080
BR25H160
BR25H320
BR25H640
BR25H128
Page write
function
Double
Cell
Status register
function
SOP8
Input voltage
range
Double
Reset
Operating
frequency
Ready/Busy status
display capability
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
MSOP8
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
FVM-2C
F-2C
FJ-2C
FVT-2C
―
F-2C
FJ-2C
―
―
Operating
temperature
Write cycle
time
ESD resistance(HBM)
*Actual size shown
SOP8
SOP-J8
TSSOP-B8
MSOP8
VSON008X2030
Package
Lineup
10
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EEPROM
Function
Density
(bit)
VSON008X2030
FJ-W
−40℃ to +125℃ Operation
Part No.
to
Package Type (According to Suffix)
SOP-J8
TSSOP-B8
MSOP8
F-W
BR25Hxxxxxx-2C Series
Icon
Descriptions
Plug & Play EEPROM
−40℃ to +85℃ Operation
Automotive Grade
Feature
Ultra-Compact WL-CSP
Our universally compliant SPI BUS Series are optimized for applications requiring high-speed operation up to
20MHz. Proprietary double cell construction and double reset functionality deliver superior reliability.
BR25L/S/Gxxxxxx-W/3 Series
Feature
SPI BUS Series
Ideal for high-speed, feature-rich applications
SPI BUS Series
Standard
Microwire BUS(3-Wire) Series
EEPROM
Microwire BUS(3-Wire) Series
I2C BUS(2-Wire) Series
Our broad ultra-compact WL-CSP lineup is designed for sets with severe space restrictions, such as camera
and communication modules.
Size(mm)
Part No.
Function
Microwire
interface
Write cycle
time
Operating
temperature
Resin
Pull-up
resistor
Package
0.5
○
-
VCSP50L1
0.25
0.5
○
-
VCSP50L1
0.55
0.25
0.5
○
-
VCSP50L1
0.94
0.33
0.20
0.4
-
-
UCSP30L1
1.30
0.77
0.35
0.20
0.4
-
-
UCSP30L1
1.10
1.15
0.55
0.25
0.4
-
-
UCSP50L1
1.30
0.77
0.20
None
0.4
-
WP
UCSP16X1
1.30
0.77
0.40
0.20
0.4
○
-
UCSP35L1
1.45
0.77
0.33
0.20
0.4
-
-
UCSP30L1
1.50
1.00
0.35
0.20
0.4
-
WP
UCSP30L1
1.50
1.00
0.30
0.20
0.4
-
-
UCSP25L1
1.50
1.00
0.36
0.20
0.4
○
-
UCSP25L1
2.44
1.99
0.55
0.25
0.5
○
-
VCSP50L2
2.09
1.85
0.55
0.25
0.5
○
-
VCSP50L2
1.74
1.65
0.55
0.25
0.5
○
-
VCSP50L1
2.00
2.63
0.40
0.25
0.5
○
-
VCSP35L2
1.00
0.55
0.25
0.5
○
-
VCSP50L1
Y
(Typ.)
Height
(Max.)
φ
Pitch
1.27
1.50
0.55
0.25
1.95
1.06
0.55
1.60
1.00
0.94
1.60
SPI BUS
interface
I2C BUS
Interface
to
Density(bit)
Page write
function
Solder ball(mm)
X
(Typ.)
Double Cell
Double Reset
Ready/Busy status
display capability
Status register
function
Packages [Unit : mm]
www.rohm.com
0.2±0.1
S
1.27 0.42±0.1
0.1 S
1.27
0.4 ±0.1
0.15±0.1
0.1
1 2 3 4
(0.52)
11
0.15 ±0.1
S
0.1 S
0.65
+0.06
0.22 −0.04
0.08
7
M
0.65
0.15 ± 0.1
0.1
0.22 ± 0.1
5.0±0.2
9
6.4±0.3
4.4±0.2
1
0.3MIN
7
6.4 ± 0.3
4.4 ± 0.2
1
16
0.3MIN
4
1.15 ± 0.1
3
0.3MIN
2
8
1.15±0.1
0.1S
0.42±0.1
1
14
1
0.10
1.27
0.545
0.10
S
+0.1
0.17 -0.05
5.0 ± 0.2
8 7 6 5
6.4 ±0.3
4.4 ±0.2
4
8
●SSOP-B16
●SSOP-B14
3.0 ±0.2
(MAX 3.35 include BURR)
0.1 1.15±0.1
3
14
6.2±0.3
4.4±0.2
2
●SSOP-B8
8.7±0.2
(MAX 9.05 include BURR)
0.3MIN
1
●SOP14
1.5±0.1
0.11
0.595
0.45MIN
5
6.0±0.3
3.9±0.2
6
4.9±0.2
(MAX 5.25 include BURR) 4°+6°
−4°
8 7 6 5
1.375±0.1
0.175
7
6.2±0.3
4.4±0.2
8
●SOP-J8
+6°
4°−4°
0.3MIN
0.9±0.15
●SOP8
5.0±0.2
(MAX 5.35 include BURR)
1.5±0.1
0.11
EEPROM
BU9833GUL-W
BU9847GUL-W
BU9889GUL-W
BRCB008GWZ-3
BRCA016GWZ-W
BRCB016GWL-3
BRCC016GWX-3
BRCD016GWZ-3
BRCB032GWZ-3
BRCB064GWZ-3
BRCE064GWZ-3
BRCG064GWZ-3
BU9897GUL-W
BU9832GUL-W
BU9829GUL-W
BR25S128GUZ-W
BU9891GUL-W
Icon
Descriptions
Plug & Play EEPROM
Optimized for compact modules
Ultra-Compact WL-CSP
Feature
Ultra-Compact WL-CSP
SPI BUS Series
0.65
8
0.1
0.22±0.1
0.15±0.1
Drawing
パッケー
EEPROM
Plug & Play EEPROM
For Memory Modules
Feature
I2C BUS
Interface
Plug & Play EEPROM
Write Protect
TSSOP-B8
VSON008X2030
Write Protect functionality based on
One-Time ROM
FVT-W
-
Resettable/One-Time ROM Write Protect
functions
FVT-3
NUX-3
Function
Density(bit)
Ultra-Compact WL-CSP
ROHM Plug & Play EEPROMs are tailored for specialized applications.
A number of models are offered for memory modules and displays.
BR34L02
BR34E02
Icon
Descriptions
SPI BUS Series
Ideal for specific applications
Part No.
ージ名
Microwire BUS(3-Wire) Series
I2C BUS(2-Wire) Series
Double Cell
Supports
Serial Presence Detect
1M. Erase/
Write Cycle
Double Reset
For DDR1/2/3
*Actual size shown
TSSOP-B8
VSON008X2030
Package
Lineup
EEPROM
Plug & Play EEPROM
For Display
BR24C21
BU9882
BU9883
BU99022
Supports DDC1TM/DDC2TM
for displays
Bit configuration
and number of channels
Icon
Descriptions
Package Type (According to Suffix)
Function Descriptions
Function
Part No.
SOP8
SOP-J8
SSOP-B8
SOP14
SSOP-B14
SSOP-B16
VSON008X2030
Package
F
FJ
FV
-
-
-
-
Dual-port type compatible
with DDC2TM for displays
-
-
-
F-W
FV-W
-
-
2Kbit x 3ch EEPROM
for HDMI ports
-
-
-
-
-
FV-W
-
2Kbit x 2ch type
-
-
-
-
-
-
NUX-3
Double Cell
Supports
DDC1/2B
Double Reset
Compatible
with HDMI
*Actual size shown
SOP8
SOP-J8
SSOP-B8
SOP14
SSOP-B14
SSOP-B16
Package
Lineup
S
0.08 S
+0.05
0.65 0.245 −0.04
0.08 M
0.65
S
+0.05
0.22 −0.04
0.08 S
+0.05
0.145 −0.03
0.08 S 1.5±0.1
C0.25 0.5
1
8
0.25
4
5
+0.05
0.25 −0.04
8
5
1
4
S
12
6.5±0.3
1PIN MARK
3.4±0.3
0.51MIN
1PIN MARK
9.3±0.3
3.0±0.1
0.29±0.15
0.6±0.2
4.0±0.2
2.8±0.1
2 3 4
●DIP-T8
3.2±0.2
1.2MAX
1.0±0.05
0.1±0.05
+0.05
0.145 −0.03
1
0.475
2.0±0.1
+0.03
0.02 −0.02
(0.12)
1 2 34
0.525 1PIN MARK
8 7 6 5
0.9MAX
0.75±0.05
0.08±0.05
6.4±0.2
4.4±0.1
0.5±0.15
1.0±0.2
8765
4±4
●VSON008X2030
+6°
4° −4°
1.4±0.1
2.9±0.1
(MAX 3.25 include BURR)
0.6MAX
●MSOP8
3.0±0.1
(MAX 3.35 include BURR)
0.3±0.1
●TSSOP-B8
VSON008X2030
7.62
2.54
0°−15°
0.5±0.1
0.3±0.1
www.rohm.com
EEPROM
Feature
FeRAM Series lineup
Ideal for continuous log data acquisition and emergency backup applications
32K
64K
I2C
[Density] bit
256K
2M
MR45V256A
MR45V200A
MR44V064A
SPI
MR45V032A
Parallel
MR48V256C
Car navigation
Car Equipment
AAAAAA
Car audio
MUSIC
BBBbbbbb
CCCCCcccccc
DDD
E_EEE
Body Electrical Systems (Power Windows/Seats)
PLC (Programmable Controllers)
Copiers and MFPs
Industrial Equipment
Meters (Electric/Gas/Water)
Gaming Systems
Amusement Devices
NOR Flash Series lineup
Memory density
8M
16M
32M
64M
128M
256M
NOR Flash
1G
2G
電源
ST B
DEGITAL CATV
Programs
DVD/DVC
Programs
Programs, fonts,
and instruction manuals
Printer
PC Peripherals
Electric dictionary / translator
Programs
and content
al
Electric
Book
Content
Gaming
Equipment / Toys
Games
Programs, sounds, voices,
image data
Toys
Programs
and content
Educational toys
Amusement
Devices
8G
[Density] bit
Programs, bitmaps,
and font data
TV
Electronic musical instruments
AV Equipment
4G
MR29Vxxx52A Series
Application
FeRAM / NOR Flash
512M
Amusement (Control programs)
Amusement (Sound data)
Programs, sounds,
and image data
Application
Examples
Amusement (Graphic data)
Programs
Fonts and bit map data
Content
Manuals and advertisements
Configuration data
www.lapis-semi.com/en
13
Sound generator data
16G
FeRAM
FeRAM Series
Non-volatile memory featuring high Write speed (150ns) and
superior reliability (1 trillion Reads/Writes)
F e R A M Series
FeRAM memory Series provides 1 million times more rewrites at 100,000 times the speed of
Flash memory. Ideal for saving data during power outages, storing high frequency log data, and the like.
Parallel BUS FeRAM MR48Vxxxx Series
Supply
voltage
2.7V to
3.6V
Memory Number of
density data bits
Function
×8
256Kb
NOR Flash Series
Max. Operating
Frequency
Part No.
MR48V256C
No. of
Reads/Writes
Data Retention
Period
Operating
Temp. Range
Package
TSOP(I)28
I C BUS FeRAM MR44Vxxxx Series
2
2.5V to
3.6V
64Kb
2.7V to
3.6V
3.0V to
3.6V
2.7V to
3.6V
32Kb
×8
MR44V064A
SOP8
SPI BUS FeRAM MR45Vxxxx Series
×8
×8
256Kb
×8
2Mb
Icon
Descriptions
MR45V032A
MR45V256A
MR45V200A
Parallel
interface
SOP8
SOP8
DIP8
Max. operating
frequency
SPI
interface
I2C Bus
interface
Data retention
period
No. of Reads/
Writes (lifetime)
Operating
temp. range
*Actual size shown
SOP8
TSOP(I)28
DIP8
Package
Lineup
NOR Flash
High-speed Write/Erase with excellent data retention quality
N O R F l a s h Series
Current required for Write operation is minimized, enabling simultaneous writing to multiple cells for faster
Write operation. In addition, a floating gate structure and rewrite damage suppression ensures more than
10,000 rewrites and data retention for up to 20 years.
Supply
voltage
Memory
density
256Mb
Planned
Under
developmen t
Planned
128Mb
2.7V to
3.6V
Number of
data bits
Page size
(word×bit)
×8×16
64Mb
Function
16×16
32Mb
Under
developmen t
Icon
Descriptions
MR29V25652A-xxxTA
MR29V12852A-xxxTA
MR29V06452A-xxxTN
MR29V03252A-xxxTN
To be
determined
P2ROMTM
Function type
2.7V
access time
Part No.
Access
time
xxx denotes the ROM code number.
Page access
time
Other
features
Package
TSOP(I)56
TSOP(I)56
TSOP(I)48
FeRAM / NOR Flash
Parallel BUS NOR Flash
TSOP(I)48
Operating
temperature range
Page access
time
SEATING PLANE
25
14
0.80±0.20
0~5
0.50TYP.
0.60±0.15
28
+0.06
0.15 -0.05
29
6.5±0.2
SEATING PLANE
56
9.2±0.2
0.80±0.20
0~5
0.50TYP.
0.60±0.15
INDEX MARK
8
1
5
4
2.7±0.2
24
+0.06
0.15 -0.05
INDEX MARK
MIRROR FINISH 1
●DIP8
0.10
SEATING PLANE
0.10
0.80±0.20
0~8
0.50 TYP.
0.60±0.15
48
0.25TYP.
0.22±0.05 0.10 M
15
1
0.50
14
0.17±0.05
INDEX MARK
MIRROR FINISH
20.00±0.20
18.40±0.10
5.29
0.42±0.10
0.42MIN
INDEX MARK
MIRROR FINISH
28
●TSOP56(I)
2.55 TYP.
1.27
0~10
0.20+0.05/-0.01
11.8±0.10
20.00±0.20
18.40±0.10
1.20MAX.
1.00±0.05
0.05~0.15
0.25
0.10
4
1
●TSOP48(Ⅰ)
14.00±0.10
1
13.4±0.20
1.375±0.10
5
●TSOP(Ⅰ)28
12.00±0.10
INDEX MARK
0.545
8
0.175
6.00±0.30
3.90±0.20
4.90±0.20
5.25MAX(include BURR)
0.55 0.425 TYP.
+0.08
0.22 -0.07 0.10 M
●SOP8
1.20 MAX.
1.00±0.05
0.05~0.15
0.25
Packages [Unit : mm]
SEATING PLANE
0.10
12mm×20mm
0.5mm pitch
0.25
14mm×20mm
0.5mm pitch
1.20MAX.
1.00±0.05
0.05~0.15
TSOP48(I)
8±0.10
Package
Lineup
TSOP56(I)
0.50 0.25TYP.
+0.08
0.22 -0.07
0.10 M
*Actual size shown
1.5±0.1
7.6
0.5 TYP.
2.54
8.8
+0.11
0.25 -0.05
XX
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Non-Volatile Memory
P2ROMTM (Production Programmed ROM) lineup
Memory density
Parallel BUS Standard
P2ROMTM
[Density] bit
8M
16M
32M
MR27T802F Series
MR27V802F Series
64M
128M
MR27T12800L-xxxTN
256M
512M
1G
2G
4G
MR36V16G56C-xxxLB
MR36V08G87C-xxxMB
MR36V08G57C-xxxMB
MR26V02G54R-xxxMB Series
MR26Vxxx53L Series
MR27V12850L-xxxTN
MR36V01G52B-xxxTA
MR26V51252R-xxxTA
MR37V25653T-xxxMB
MR27V25653L-xxxMB
MR26V6455J-xxxMB
MR37Vxxx52x Series
MR27Vxxx52x Series
MR37V12841A-xxxMP
MR37Vxxx41B Series
MR37Vxxx43B Series
MR27Vxxx41L Series
SPIBUS
P2ROMTM
[email protected]
with Built-In
Gate Array
MR35Vxxx7xB Series
MR25Txxx7xL Series
(Application Specific P2ROMTM)
Application
Electronic musical instruments
電源
Sound generator data
Programs
DVD/DVC
Programs
Programs, fonts,
and instruction manuals
Printer
Electric dictionary / translator
Programs
and content
al
Electric
Book
Content
Gaming
Equipment
/ Toys
P2ROMTM
STB
DEGITAL CATV
PC
Peripherals
Amusement
Devices
Programs, bitmaps,
and font data
TV
AV
Equipment
Games
Programs, sounds, voices,
image data
Toys
Programs
and content
Educational toys
Amusement (Control programs)
Amusement (Sound data)
Programs, sounds,
and image data
Amusement (Graphic data)
Application
Examples
Programs
Fonts and bitmap data
Content
Manuals and advertisements
Configuration data
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16G
MR26T51203L-xxxTM
MR27T25603L-xxxTM
MR37T25602T-xxxTA
MR27Txxx02L Series
MR36Vxxx54x Series
Parallel BUS
Page Mode
P2ROMTM
8G
15
Parallel BUS Standard
P2ROMTM Series
Parallel BUS Standard
P2ROMTM Series
2.7V to
3.6V
512Mb
256Mb
Function
×8
×16
128Mb
×8
×16
xxx denotes the ROM code number.
128Mb
64Mb
2.7V to
3.6V
32Mb
×8
×16
16Mb
8Mb
3.0V to
3.6V
Die Form Products
128Mb
3.0V to
3.6V
64Mb
×8
32Mb ×16
16Mb
8Mb
Icon
descriptions
Function
type
MR26T51203L-xxxTM
MR27T25603L-xxxTM
Flat
type
3.0V
access time
2.7V
access time
Other
features
Package
frame
TSOP(II)50
MR27T12800L-xxxTN
TSOP(I)48
xxx denotes the ROM code number.
MR37T25602T-xxxTA
MR27T12802L-xxxTA
MR27T6402L-xxxMA
MR27T6402L-xxxTN
MR27T6402L-xxxLY
MR27T6402L-xxxTNA
MR27T3202L-xxxMA
MR27T3202L-xxxTN
MR27T3202L-xxxLA
MR27T3202L-xxxTNA
MR27T1602L-xxxMA
MR27T1602L-xxxTN
MR27T1602L-xxxLA
MR27T1602L-xxxTNA
MR27T802F-xxxMA
MR27T802F-xxxTN
MR27V802F-xxxMA
MR27V802F-xxxTN
TSOP(I)56
TSOP(I)56
SOP44
TSOP(I)48
TFBGA48
TSOP(I)48
SOP44
TSOP(I)48
TFBGA48
TSOP(I)48
SOP44
TSOP(I)48
TFBGA48
TSOP(I)48
SOP44
TSOP(I)48
SOP44
TSOP(I)48
xxx denotes the ROM code number.
Pad
size
MR27V12800L-xxxWE
MR27V6402L-xxxWE
MR27V3202L-xxxWE
MR27V1602L-xxxWE
MR27V802F-xxxWA
Supports socket
mounting
to
8Mbit / 16Mbit / 32Mbit / 64Mbit / 128Mbit
Top
Chip
Chip
Chip
Chip
Chip
Operating
temperature
Access
time
8Mbit / 16Mbit / 32Mbit / 64Mbit
Standard
600mill
1.27mm pitch
*Actual size shown
256Mbit / 512Mbit
14mm×20mm
0.5mm pitch
400mill
0.8mm pitch
TSOP(I)56
TSOP(II)50
Top
TSOP(I)48
Density
Pad size
Cu frame
128Mbit / 256Mbit
12mm×20mm
0.5mm pitch
Top
Package
TSOP(II)50
xxx denotes the ROM code number.
Pin-Compatible Packages
Density
Socket Mounting
Support
Part No.
NOR Flash-Compatible Pin Assignment
256Mb
[email protected] Series
with Built-In Gate Array
This Series offers selectable memory density from 8Mbit to 512Mbit and provides standard performance.
Parallel BUS products are available in NOR Flash-compatible switchable ×8bit/×16bit models as well as proprietary and Mask
ROM-compatible pin layouts. In addition, superior data reliability eliminates the need for error correction (ECC) required for NAND Flash.
Mask ROM-Compatible Pin Assignment
2.7V to
3.6V
SPI BUS
P2ROMTM Series
Replaces NOR Flash and Mask ROM in applications requiring no rewrite operation
Exclusive Pin Assignment
Supply Memory Number of
voltage density data bits
Parallel BUS Page Mode
P2ROMTM Series
Top
16Mbit / 32Mbit
Density
Top
Bottom
64Mbit
Top
Bottom
6.4mm×10mm
0.8mm pitch
6.0mm×8.0mm
0.8mm pitch
Compact
TFBGA48
TFBGA48
SOP44
16
www.lapis-semi.com/en
P2ROMTM
P2ROM
TM
P2ROM
Parallel BUS Standard
P2ROMTM Series
TM
Parallel BUS Page Mode
P2ROMTM Series
Memory Number of Page size
density data bits (word×bit)
16Gb
8Gb
4Gb
3.0V to
3.6V
2Gb
1Gb
512Mb
256Mb
64Mb
xxx denotes the ROM code number.
end
less
×64
endless
&
×32
16×32
end
less
×16
×32
8×32
×8
×16
8×16
×16
×32
8×32
Mask ROM-Compatible Pin Assignment
3.0V to
3.6V
128Mb
×8
×16
8×16
NOR Flash-Compatible Pin Assignment
1Gb
512Mb
256Mb
128Mb
3.0V to
3.6V
64Mb
×8
×16
8×16
32Mb
16Mb
Die Form Products
128Mb
64Mb
×8
×16
8×16
16Mb
P2ROMTM
Icon
descriptions
Function
type
Standard Packages
I/O
Density
Standard
MR36V16G56C-xxxLB
MR36V08G87C-xxxMB
MR36V08G57C-xxxMB
MR36V04G54B-xxxMB
MR36V04G54S-xxxMB
MR36V02G54B-xxxMB
MR26V02G54R-xxxMB
MR26V01G53L-xxxMB
MR26V51253L-xxxMB
MR37V25653T-xxxMB
MR27V25653L-xxxMB
MR26V6455J-xxxMB
Socket
Mounting
Support
3.0V
access time
Page access
time
Other
features
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
SSOP70
xxx denotes the ROM code number.
xxxの中にはROMコード番号が入ります。
MR27V12850L-xxxTN
TSOP(I)48
xxx denotes the ROM code number.
MR36V01G52B-xxxTA
MR26V51252R-xxxTA
MR37V25652T-xxxTA
MR27V12852L-xxxTA
MR37V12852B-xxxTA
MR37V6452B-xxxTN
MR27V6452L-xxxMA
MR27V6452L-xxxTN
MR27V6452L-xxxTA
MR27V6452R-xxxTN
MR27V3252J-xxxMA
MR27V3252J-xxxTN
MR27V1652L-xxxMA
MR27V1652L-xxxTN
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)56
TSOP(I)48
SOP44
TSOP(I)48
TSOP(I)56
TSOP(I)48
SOP44
TSOP(I)48
SOP44
TSOP(I)48
Pad
size
MR27V25653L-xxxWA
MR27V12850L-xxxWE
MR27V6452L-xxxWE
MR27V1652L-xxxWA
Supports socket
mounting
to
Access
time
×8bit / ×16bit / ×32bit
Top
Top
500mill
0.8mm pitch
600mill
1.27mm pitch
SSOP70
SOP44
Flat
type
17
Chip
Chip
Chip
Chip
to
I/O
Density
16Mbit / 32Mbit / 64Mbit / 256Mbit / 512Mbit / 1Gbit / 2Gbit / 4Gbit / 8Gbit
www.lapis-semi.com
www.lapis-semi.com/en
Package
LGA140
xxx denotes the ROM code number.
256Mb
3.0V to
3.6V
[email protected] Series
with Built-In Gate Array
LAPIS Semiconductor provides a wide variety of products ranging from parallel page mode products
with 16bit / 8bit BUS width which are widely used for NOR Flash and Mask ROM, to large density and
high speed products with expanded BUS width which are ideal for sound / image data storage.
Part No.
Function
SPI BUS
P2ROMTM Series
Replaces NOR Flash and Mask ROM products
Exclusive Pin Assignment
Supply
voltage
Parallel BUS Page Mode
P2ROMTM Series
Operating
temperature
Page access
time
Pad size
*Actual size shown
×8bit / ×16bit
16Mbit / 32Mbit / 64Mbit / 128Mbit / 256Mbit / 512Mbit / 1Gbit
Top
Top 12mm×20mm
0.5mm pitch
14mm×20mm
0.5mm pitch
TSOP(I)48
TSOP(I)56
P2ROM
Parallel BUS Standard
P2ROMTM Series
TM
P2ROMTM
Supply
voltage
Memory
density
128Mb
Under
developmen t
Under
developmen t
Under
developmen t
3.0V to
3.6V
Under
developmen t
64Mb
32Mb
16Mb
Number of Function
data bits
×1
×1
×1×2×4
×1
×1
×1×2×4
×1
×1
Die Form Products
3.0V to
3.6V
64Mb
32Mb
16Mb
Icon
descriptions
SPI BUS
P2ROMTM Series
Our SPI BUS P2ROMTM lineup supports the SPI (Serial Peripheral Interface) standard. In addition, adopting the
same package for all densities (16Mbit to 128Mbit) makes it possible to change the density without
changing/modifying the PCB.
xxx denotes the ROM code number.
Part No.
MR37V12841A-xxxMP
MR37V12841B-xxxMP
MR37V12843B-xxxMP
MR27V6441L-xxxMP
MR37V6441B-xxxMP
MR37V6443B-xxxMP
MR27V3241L-xxxMP
MR27V1641L-xxxMP
FAST
READ
READ
Other
features
SOP16
SOP16
SOP16
SOP16
SOP16
SOP16
SOP16
Pad
size
MR27V6441L-xxxWA
MR27V3241L-xxxWE
MR27V1641L-xxxWA
Operating
frequency
Function
type
Standard Packages
Package
SOP16
xxx denotes the ROM code number.
×1
×1
×1
[email protected] Series
with Built-In Gate Array
Reduces material costs and noise while contributing to greater
space savings
SPI BUS
P2ROMTM Series
SPI BUS
Parallel BUS Page Mode
P2ROMTM Series
Chip
Chip
Chip
Operating
Temperature
Pad size
*Actual size shown
×1bit ×2bit ×4bit
16Mbit / 32Mbit / 64Mbit / 128Mbit
I/O
Density
Top
375mill
1.27mm pitch
Standard
SOP16
[email protected] Series
with Built-In Gate Array
Customizable functionality and interface provides greater versatility
[email protected] incorporate a P2ROMTM core with a gate array on a single chip.
Security functions can be added and the interface customized to meet set needs by gate array.
The lineup includes medium speed and high speed types up to 1Gbit and 128Mbit, respectively.
Medium Speed Type (Die Forms Available)
Supply
voltage
3.0V to
3.6V
Memory Gate array
density
size
1Gb
512Mb
256Mb
Function
x denotes product ID number.
Part No.
MR35V01G7xB
MR35V5127xB
MR35V2567xB
30K
High Speed Type (Die Forms Available)
2.7V to
3.6V
128Mb
64Mb
25K
16Mb
Icon
descriptions
Function
type
Standard Packages
I/O
Density
MR25T1287xL
MR25T647xL
MR25T167xL
MR25T1671L
Command
control
×8bit / ×16bit
Random
access
Page
access
Package
TSOP(I)48
TSOP(II)44
TSOP(II)44
x denotes product ID number.
TSOP(I)48
TSOP(II)44
TSOP(I)48
TSOP(II)44
TSOP(I)48
TSOP(II)44
TSOP(I)48
Number of
input only pins
×8bit
Number of
input and
output pins
Access
time
Page
access time
*Actual size shown
16Mbit / 64Mbit / 128Mbit / 1Gbit
16Mbit / 64Mbit / 128Mbit / 256Mbit / 512Mbit
12mm×20mm
0.5mm pitch
400mill
0.8mm pitch
TSOP(I)48
TSOP(II)44
Top
Flat
type
Password
authentication
function
Number of Number of
input pins I/O pins
P2ROMTM
P2ROMTM
Top
XX
18
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www.lapis-semi.com
P2ROM
Parallel Standard
P2ROMTM Series
TM
Parallel Page Mode
P2ROMTM Series
SPI BUS
P2ROMTM Series
[email protected] Series
with Built-In Gate Array
Packages [Unit : mm]
0.15 S B
0.50TYP.
0.60±0.15
INDEX MARK
f0.51±0.05
0.35±0.05
1.1±0.1
1.2
HGFEDCBA
24
25
+0.06
0.15 -0.05
0.10 SEATING PLANE
0.10 S
0.10
SEATING PLANE
SEATING PLANE
●SOP44-P-600-1.27-K
0〜8
0.25TYP.
29
28
0.50±0.10
0.60
+0.06
0.15 -0.05
28.60±0.15
28.15±0.20
70
0.70TYP.
0〜10
0.80±0.20
0.17±0.05
35
+0.08
0.32 -0.07
0.16
M
SEATING PLANE
0.86TYP.
1.60±0.20
0.25
0.80
0.05~0.25 2.70±0.20
SEATING PLANE
0.10
1
3.05MAX.
0.20 M
0.25
+0.08
0.42 -0.07
1.27
0.74TYP.
INDEX MARK
MIRROR FINISH
1.50±0.20
3.10MAX.
0.17±0.05
22
0.05~0.25 2.65±0.20
1
36
12.70±0.10
15.90±0.20
15.24
13.00±0.20
16.00±0.30
23
0.10
0〜8
0.80
0.90±0.10
●P-LFBGA140-2729-0.80-6-MC
●SSOP70-P-500-0.80-K
24.50±0.075
36
27.0
INDEX AREA
+0.08
0.32-0.07
0.16
M
INDEX MARK
MIRROR FINISH
29.0
0.80
0.17±0.05
3.05 MAX.
2.70±0.20
0.70TYP.
35
1.60±0.20
(1.10)
0〜8
0.10
SEATING PLANE
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0.05〜0.25
0.25
1
8.75±0.10 9.50±0.075 8.75±0.10
(1.25)
(0.70)
28.60±0.15
70
0.80
0.90±0.10
0.15
19
106
71
36
1
140
105
70
35
1.60±0.10
0〜5
0.50TYP.
0.60±0.15
0.85TYP.
●P-SSOP70-500-0.80-EK-MC
44
INDEX MARK
MIRROR FINISH
0.22±0.05
0.80±0.20
15.90±0.20
12.70±0.10
P2ROMTM
0.17±0.05
25
+0.08
0.37 -0.07
0.16 M
56
0.85TYP.
1.20MAX.
1.00±0.05
0.05~0.15
0.16 M
0.80
20.00±0.20
18.40±0.10
14.00±0.10
0.50
1
INDEX MARK
MIRROR FINISH
0.88TYP.
0.17±0.05
1
0.80±0.05
0.40±0.05
0.10
25
+0.08
0.37-0.07
0.95±0.05
0.80
INDEX MARK
MIRROR FINISH
0.25
1
26
10.76
11.76±0.20
10.16±0.10
10.76
11.76±0.2
10.16±0.1
INDEX MARK
MIRROR FINISH
0.88TYP.
20.95±0.10
0.05~0.25
50
26
1.20MAX.
20.95±0.1
50
●P-TSOP I 56-1420-0.50-K-MC
0.10 M
●P-TSOP II 50-400-0.80-K-MC
●TSOPⅡ50-P-400-0.80-K
SEATING PLANE
0.50 0.25TYP.
+0.08
0.22-0.07
0.10 M
+0.05
0.16 -0.04
22
+0.08
0.37 -0.07
0.16 M
48
1
0.25
0.80
20.00±0.20
18.40±0.10
INDEX MARK
MIRROR FINISH
23
0.10
0.10 S
0.10
1
f0.08 M S AB
0.25
INDEX MARK
MIRROR FINISH
0.81TYP.
6
5
4
3
2
1
1.20MAX.
1.00±0.05
0.05~0.15
f0.08 M S AB
A
SEATING PLANE
f0.51±0.05
0.20 S
S
10.76
(1.0)
HGFEDCB A
0.8
6.4
0〜5
12.00±0.10
6
5
4
3
2
1
0.35±0.05
1.2MAX.
0.20 S
18.41±0.1
44
A
×4
0.15
0.8
B
●TSOP I 48-P-1220-0.50-1K
11.76±0.2
10.16±0.1
0.80
0.15 S B
6.0
S
0.80
B
0.15 S A
2.2
0.80±0.20
●TSOPⅡ44-P-400-0.80-K
(1.2)
0.15 S A
x4
0.15
0.10 M
+0.06
0.15 -0.05
●P-TFBGA48-6.0X8.0-0.80
INDEX MARK
0.25TYP.
28
SEATING PLANE
0.10
8.0
29
10.0
INDEX MARK
MIRROR FINISH
0.25
0.80TYP.
0.88±0.15
1.20MAX.
1.00±0.05
0.05~0.15
M
56
0.22±0.05
0.42+0.08/-0.07 0.12
1.27
1
0.50
8
20.00±0.20
18.40±0.10
INDEX MARK
MIRROR FINISH
14.00±0.10
0.705 TYP.
8.53 TYP.
1
INDEX MARK
MIRROR FINISH
1.41±0.20
0.15±0.10
4 ±4
0.25
10.32±0.20
7.50±0.10
9
0.17±0.05
10.30±0.20
16
●P-TFBGA48-6.4X10.0-0.80
SEATING PLANE
0.10
●P-TSOP I 56-1420-0.50-K
2.50±0.15
2.35±0.20
●P-SOP16-375-1.27-K
(1.25)
1.50±0.05
0〜5
0.50TYP.
0.60±0.15
ROHM Website Updates
In order to meet the needs of current design
practices we have expanded operability by enhancing
3 functions: Search, View, and Buy.
ROHM Semiconductor
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A variety of search types are now
possible. Perform a cross-reference,
inventory, product, or site search.
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Find applicable products from our Application Block Diagrams.
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Download product data including
datasheets, application notes, and
package information
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Check for product availability at a range of
distributors, then order parts directly.
20
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e-book and PDF directly from our
home page to view the most
up-to-date product information
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LAPIS Semiconductor Website Updates
Selection Catalog
*Please contact the ROHM sales for more infomation.
DRAM
www.lapis-semi.com/en
P2ROMTM
21
ROHM Group Locations (Japan)
● Design Centers
● Main Sales Offices
Nagoya
Fukuoka
Kyoto
Tokyo
Yokohama
Kyoto Technology Center (Head Office)
Kyoto Technology Center (Kyoto Ekimae)
Yokohama Technology Center
LAPIS Semiconductor Co., Ltd.(Shin-Yokohama)
LAPIS Semiconductor Co., Ltd. Miyazaki Design Center
LAPIS Semiconductor Co., Ltd. Tsukuba Office
Sendai
Takasaki
Utsunomiya
Matsumoto
Mito
Nishi-Tokyo
● Manufacturing Facilities
ROHM Hamamatsu Co., Ltd.
ROHM Wako Co., Ltd.
ROHM Apollo Co., Ltd.
ROHM Mechatech Co., Ltd.
LAPIS Semiconductor Miyagi Co., Ltd.
LAPIS Semiconductor Miyazaki Co., Ltd.
AGLED Co., Ltd.
● QA Centers
Kyoto QA Center
Yokohama QA Center
ROHM Mechatech
Main Sales Offices
Kyoto
(Headquarters)
Matsumoto Takasaki
ROHM
Wako Co., Ltd.
(Okayama)
Manufacturing Facilities
Design Centers
QA Centers
Fukuoka
ROHM
Apollo Co., Ltd.
(Fukuoka)
Nishi-Tokyo
AGLED
Nagoya
LAPIS Semiconductor
Miyazaki Design Center
LAPIS Semiconductor
Miyazaki Co., Ltd.
(Miyazaki)
LAPIS Semiconductor Miyagi Co., Ltd.
(Miyagi)
Sendai
Utsunomiya
Mito
LAPIS Semiconductor Tsukuba Office
Tokyo
Yokohama/
LAPIS Semiconductor (Headquarters)
ROHM Hamamatsu Co., Ltd.
(Shizuoka)
Trade Name / LAPIS Semiconductor Co., Ltd.
Address / 2-4-8 Shinyokohama,Kouhoku-ku,
Yokohama 222-8575, Japan
TEL+81-45-476-9212
Date of Establishment / October 1, 2008
Noriaki Okada, Chairman of the Board, President
ROHM Group Locations (Global)
● Manufacturing Facilities
● Main Sales Offices
ASIA
AMERICA
EUROPE
ROHM Semiconductor Korea Corporation
ROHM Semiconductor Trading (Dalian) Co., Ltd.
ROHM Semiconductor (Shanghai) Co., Ltd.
ROHM Semiconductor (Shenzhen) Co., Ltd.
ROHM Semiconductor Hong Kong Co., Ltd.
ROHM Semiconductor Taiwan Co., Ltd.
ROHM Semiconductor Singapore Pte. Ltd.
ROHM Semiconductor Philippines Corporation
ROHM Semiconductor (Thailand) Co., Ltd.
ROHM Semiconductor Malaysia Sdn. Bhd.
ROHM Semiconductor India Pvt. Ltd.
ROHM Semiconductor U.S.A., LLC
ROHM Semiconductor do Brasil Ltda.
ROHM Semiconductor GmbH
Main Sales Offices
● Design Centers
ASIA
AMERICA
Manufacturing Facilities
EUROPE
Design/QA Centers
AMERICA
EUROPE
ROHM Korea Corporation
ROHM Electronics Philippines, Inc.
ROHM Integrated Systems (Thailand) Co., Ltd.
ROHM Semiconductor(China) Co., Ltd.
ROHM Electronics Dalian Co., Ltd.
ROHM-Wako Electronics (Malaysia) Sdn. Bhd.
ROHM Mechatech Philippines, Inc.
ROHM Mechatech (Thailand) Co., Ltd.
ROHM Mechatech (Tianjin) Co., Ltd.
ASIA
Kionix, Inc.
SiCrystal AG
● QA Centers
Korea Design Center
Shanghai Design Center
Shenzhen Design Center
Taiwan Design Center
India Design Center
America Design Center (Santa Clara)
America Design Center (San Diego)
Europe Design Center
ASIA
AMERICA
EUROPE
Korea QA Center
Shanghai QA Center
Shenzhen QA Center
Taiwan QA Center
Singapore QA Center
Thailand QA Center
USA QA Center
Europe QA Center
QA Centers
ROHM Semiconductor(China)
ROHM Mechatech (Tianjin)
GmbH
ROHM Integrated Systems(Thailand)
ROHM Mechatech (Thailand)
SiCrystal
Dalian
ROHM Electronics Dalian
Hong Kong
Thailand
Korea
ROHM Korea
Shanghai
Taiwan
Shenzhen
India
U.S.A.
Santa Clara
Detroit
Kionix
San Diego
Philippines
ROHM-Wako Electronics (Malaysia)
Malaysia
Singapore
ROHM Electronics Philippines
ROHM Mechatech Philippines
22
Brazil
www.rohm.com
• All DRAM, FeRAM, NOR Flash, and P2ROMTM products that appear in this catalog have been developed and manufactured by LAPIS Semiconductor
• P2ROMTM is a trademark of LAPIS Semiconductor
• All products mentioned in this catalog (including LAPIS Semiconductor products) are sold by ROHM Co., Ltd.
• P2ROMTM is a trademark of LAPIS Semiconductor
• [email protected] is a LAPIS Semiconductor P2ROMTM with integrated gate array
August 1st 2014
No.57P6788E-D 04.2014
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