Data Sheet

PUSB2X4Y
ESD protection for high-speed interfaces
Rev. 1 — 5 November 2013
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as USB 2.0 ports against
ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal
lines. It is encapsulated in a very small SOT363 (SC-88) Surface-Mounted Device (SMD)
plastic package.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of 0.85 pF maximum. This configuration provides protection to downstream
components from ESD voltages up to 12 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
 System ESD protection for USB 2.0
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 12 kV according to IEC 61000-4-2, level 4
 Line capacitance of 0.85 pF maximum for each channel
1.3 Applications
The device is designed for receiver and transmitter port protection in:
 Portable devices
 TVs, monitors
 DVD recorders and players
 Notebooks, mother boards, graphic cards and ports
 Set-top boxes and game consoles
PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Description
1
ESD protection for I/O signals
2
ground
3
ESD protection for I/O signals
4
ESD protection for I/O signals
5
n.c.
6
ESD protection for I/O signals
Simplified outline
6
5
4
1
2
3
Graphic symbol
1
3
4
6
2
018aaa176
3. Ordering information
Table 2.
Ordering information
Type number
PUSB2X4Y
Package
Name
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
4. Marking
Table 3.
Marking codes
Type number
Marking code[1]
PUSB2X4Y
PK*
[1]
* = placeholder for manufacturing site code.
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
PUSB2X4Y
Product data sheet
Symbol
Parameter
VI
input voltage
Conditions
VESD
electrostatic discharge
voltage
Min
Max
Unit
0.5
+5.5
V
contact discharge
12
+12
kV
air discharge
15
+15
kV
pins 1, 3, 4 and 6 to ground;
IEC 61000-4-2, level 4
Tamb
ambient temperature
40
+85
C
Tstg
storage temperature
55
+125
C
All information provided in this document is subject to legal disclaimers.
Rev. — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
6. Characteristics
Table 5.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
VBR
breakdown voltage
II = 1 mA
6
IRM
reverse leakage current
per channel; VI = 5 V
-
VF
forward voltage
II = 1 mA
-
0.7
VI = 0 V
-
0.7
0.85
pF
VI = 2.5 V
-
0.55
0.75
pF
-
-
0.1
pF
-
0.30
-

-
0.21
-

positive transient
-
0.35
-

negative transient
-
0.21
-

-
3.8
-
V
-
2.1
-
V
Cline
line capacitance
f = 1 MHz
Min
line capacitance
difference
f = 1 MHz; VI = 2.5 V
[1]
rdyn
dynamic resistance
surge
[2]
positive transient
negative transient
VCL
clamping voltage
positive transient
IPP = 4.5 A
Max
Unit
-
9
V
-
1
A
-
V
[1]
Cline
TLP
Typ
[3]
[2]
negative transient
IPP = 5.2 A
PUSB2X4Y
Product data sheet
[1]
This parameter is guaranteed by design.
[2]
According to IEC 61000-4-5 (8/20 s current waveform).
[3]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns.
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Rev. — 5 November 2013
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PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
aaa-009783
0
aaa-009785
0
S21
(dB)
S21
(dB)
-20
-4
-40
-8
-60
-12
1
102
10
103
-80
104
102
10
103
Fig 1.
104
f (MHz)
f (MHz)
Insertion loss; typical values
Fig 2.
Crosstalk; typical values
aaa-009784
1.2
a
0.8
0.4
0
0
2
4
6
VI (V)
C line
a = --------------------------------C line  V = 0 V 
I
Fig 3.
Relative capacitance as a function of input voltage; typical values
PUSB2X4Y
Product data sheet
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Rev. — 5 November 2013
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PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
aaa-009786
5
IPP
(A)
aaa-009787
0
IPP
(A)
4
-2
3
2
-4
1
-6
-2.5
0
0
2
3
5
-2.0
-1.5
-1.0
-0.5
0
VCL (V)
VCL (V)
IEC 61000-4-5; tp = 8/20 s; positive pulse
Fig 4.
IEC 61000-4-5; tp = 8/20 s; negative pulse
Dynamic resistance with positive clamping;
typical values
Fig 5.
Dynamic resistance with negative clamping,
typical values
aaa-009788
15
I
(A)
aaa-009789
0
I
(A)
12
-3
9
-6
6
-9
3
-12
0
-15
0
4
8
12
-6
VCL (V)
-2
0
VCL (V)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 6.
-4
tp = 100 ns; Transmission Line Pulse (TLP)
Dynamic resistance with positive clamping,
typical values
Fig 7.
Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure, which shows a negative dynamic
resistance. This snap-back behavior strongly reduces the clamping voltage to the system
behind the ESD protection during an ESD event. Do not connect unlimited DC current
sources to the data lines to avoid keeping the ESD protection device in snap-back state
after exceeding breakdown voltage (due to an ESD pulse for instance).
PUSB2X4Y
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
7. Package outline
2.2
1.8
6
2.2 1.35
2.0 1.15
1.1
0.8
5
4
2
3
0.45
0.15
pin 1
index
1
0.3
0.2
0.65
0.25
0.10
1.3
Dimensions in mm
Fig 8.
PUSB2X4Y
Product data sheet
06-03-16
Package outline SOT363 (SC-88)
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Rev. — 5 November 2013
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NXP Semiconductors
ESD protection for high-speed interfaces
8. Soldering
2.65
solder lands
2.35 1.5
0.4 (2×)
0.6 0.5
(4×) (4×)
solder resist
solder paste
0.5
(4×)
0.6
(2×)
occupied area
0.6
(4×)
Dimensions in mm
1.8
Fig 9.
sot363_fr
Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
0.3 2.5
4.5
solder resist
occupied area
1.5
Dimensions in mm
1.3
1.3
preferred transport
direction during soldering
2.45
5.3
sot363_fw
Fig 10. Wave soldering footprint SOT363 (SC-88)
PUSB2X4Y
Product data sheet
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Rev. — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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PUSB2X4Y
NXP Semiconductors
ESD protection for high-speed interfaces
9. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PUSB2X4Y v.1
20131105
Product data sheet
-
-
PUSB2X4Y
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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NXP Semiconductors
ESD protection for high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PUSB2X4Y
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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ESD protection for high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PUSB2X4Y
Product data sheet
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Rev. 1 — 5 November 2013
© NXP B.V. 2013. All rights reserved.
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NXP Semiconductors
ESD protection for high-speed interfaces
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 November 2013
Document identifier: PUSB2X4Y