Data Sheet

IP4283CZ10 series
ESD protection for ultra high-speed interfaces
Rev. 4 — 8 April 2013
Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect high-speed interfaces such as High-Definition
Multimedia Interface (HDMI), DisplayPort, external Serial Advanced Technology
Attachment (eSATA) and Low-Voltage Differential Signaling (LVDS) interfaces against
ElectroStatic Discharge (ESD).
The devices include four high-level ESD protection diode structures for ultra high-speed
signal lines. They are available in three package variants: DFN2510-10 (SOT1165-1),
DFN2510A-10 (SOT1176-1) and TSSOP10 (SOT552-1).
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.6 pF. These diodes provide protection to downstream components
from ESD voltages up to 8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
 System ESD protection for HDMI, DisplayPort, eSATA and LVDS
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 8 kV according to IEC 61000-4-2, level 4
 Matched 0.5 mm trace spacing
 Signal lines with  0.05 pF matching capacitance between signal pairs
 Line capacitance of only 0.6 pF for each channel
 Design-friendly ‘pass-thru’ signal routing
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection:
 TVs, monitors
 DVD recorders and players
 Notebooks, main board graphics cards and ports
 Set-top boxes and game consoles
IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pin
Pinning
Symbol
Description
Simplified outline
Graphic symbol
IP4283CZ10-TBA (SOT1165-1)
1
2
TMDS_CH1
TMDS_CH1+
negative channel 1
ESD protection
positive channel 1
ESD protection
3
GND
ground
4
TMDS_CH2
negative channel 2
ESD protection
5
TMDS_CH2+
positive channel 2
ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
9
8
7
6
1
2
3
4
5
1
2
4
5
Transparent top view
DFN2510-10
3, 8
001aai619
IP4283CZ10-TBR (SOT1176-1)
1
IP4283CZ10_SER
Product data sheet
TMDS_CH1
negative channel 1
ESD protection
2
TMDS_CH1+
positive channel 1
ESD protection
3
GND
ground
4
TMDS_CH2
negative channel 2
ESD protection
5
TMDS_CH2+
positive channel 2
ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
8
7
6
1
2
4
5
1
2
3
4
5
Transparent top view
DFN2510A-10
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Rev. 4 — 8 April 2013
9
3, 8
001aai619
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
Table 1.
Pin
Pinning …continued
Symbol
Description
Simplified outline
Graphic symbol
IP4283CZ10-TT (SOT552-1)
1
TMDS_CH1
negative channel 1
ESD protection
2
TMDS_CH1+
positive channel 1
ESD protection
3
GND
ground
4
TMDS_CH2
negative channel 2
ESD protection
5
TMDS_CH2+
positive channel 2
ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
6
1
2
4
3, 8
1
5
001aai619
5
TSSOP10
3. Ordering information
Table 2.
Ordering information
Type number
Package
IP4283CZ10-TBA
Name
Description
Version
DFN2510-10
plastic extremely thin small outline package;
SOT1165-1
no leads; 10 terminals; body 1  2.5  0.5 mm
IP4283CZ10-TBR DFN2510A-10
plastic extremely thin small outline package;
SOT1176-1
no leads; 10 terminals; body 1  2.5  0.5 mm
IP4283CZ10-TT
plastic thin shrink small outline package;
10 leads; body width 3 mm
TSSOP10
SOT552-1
4. Marking
Table 3.
IP4283CZ10_SER
Product data sheet
Marking codes
Type number
Marking code
IP4283CZ10-TBA
83
IP4283CZ10-TBR
83
IP4283CZ10-TT
4283
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
Conditions
electrostatic discharge
voltage
Min
Max
Unit
0.5
+5.5
V
contact discharge
8
8
kV
air discharge
15
15
kV
IEC 61000-4-2, level 4
[1]
Tstg
storage temperature
55
+125
C
Tamb
ambient temperature
40
+85
C
[1]
All pins to ground.
6. Characteristics
Table 5.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBR
breakdown voltage
Itest = 1 mA
6
-
9
V
ILR
reverse leakage current
per TMDS channel;
V=3V
-
-
1
A
VF
forward voltage
Itest = 1 mA
-
V
-
0.6
-
pF
line capacitance
f = 1 MHz;
Vbias = 2.5 V
Cline
line capacitance
difference
f = 1 MHz;
Vbias = 2.5 V
[1]
-
0.05
-
pF
Cline(mutual)
mutual line capacitance
f = 1 MHz;
Vbias = 2.5 V
[1][2]
-
0.07
-
pF
rdyn
dynamic resistance
surge
-
0.8
-

[3]
-
0.85
-

positive transient;
IPP = 3.8 A
[3]
-
9.5
-
V
negative transient;
IPP = 2.8 A
[3]
-
3.2
-
V
negative transient
VCL
Product data sheet
0.7
Cline
positive transient
IP4283CZ10_SER
[1]
clamping voltage
[1]
This parameter is guaranteed by design.
[2]
Between signal pin and pin n.c.
[3]
According to IEC 61000-4-5 (8/20 s).
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Rev. 4 — 8 April 2013
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
7. Application information
The devices are designed to provide high-level ESD protection for high-speed serial
data buses such as HDMI, DisplayPort, eSATA and LVDS data lines.
When designing the Printed-Circuit Board (PCB), give careful consideration to impedance
matching, and signal coupling.
Basic application diagrams for the ESD protection of an HDMI interface are shown in
Figure 1 and 2.
IP4283CZ10-TBR
5
4
8
3
2
1
TMDS_D2+
TMDS_CH2+
TMDS_GND
TMDS_CH2–
TMDS_D2–
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1–
TMDS_D1–
IP4283CZ10-TBR
5
TMDS_D0+
TMDS_CH2+
TMDS_GND
4
8
3
2
1
TMDS_CH2–
TMDS_D0–
GND
TMDS_CLK+
TMDS_CH1+
HDMI
CONNECTOR
TMDS_GND
TMDS_CH1–
TMDS_CLK–
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
IP4221CZ6
1
2
100 nF
3
018aaa144
Fig 1.
IP4283CZ10_SER
Product data sheet
Application diagram of HDMI ESD protection using IP4283CZ10-TBR
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
IP4283CZ10-TT
TMDS_D2+
TMDS_D2+
TMDS_GND
TMDS_D2−
TMDS_D2−
TMDS_D1+
TMDS_D1+
TMDS_GND
TMDS_D1−
TMDS_D1−
IP4283CZ10-TT
TMDS_D0+
TMDS_D0+
TMDS_GND
TMDS_D0−
TMDS_D0−
TMDS_CLK+
TMDS_CLK+
HDMI
CONNECTOR
TMDS_GND
TMDS_CLK1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
IP4220CZ6
100 nF
001aaj794
Fig 2.
IP4283CZ10_SER
Product data sheet
Application diagram of HDMI ESD protection using IP4283CZ10-TT
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
8. Package outline
0.5
max
1.1
0.9
0.25
0.15
0.2 min
0.05 max
6
5
2.6
2.4
2
0.45
0.35
0.5
10
1
0.127
0.43
0.33
Dimensions in mm
Fig 3.
13-02-21
Package outline DFN2510-10 (SOT1165-1)
1.1
0.9
0.127
0.2 min
6
5
2.6
2
2.4
0.25
0.15
0.5
10
1
0.4
0.3
0.45
0.35
Dimensions in mm
Fig 4.
0.05 max
0.5 max
12-05-23
Package outline DFN2510A-10 (SOT1176-1)
3.1
2.9
10
1.1
max
6
0.7
0.4
5.0
4.8
3.1
2.9
pin 1 index
1
0.5
5
0.30
0.15
0.23
0.15
Dimensions in mm
Fig 5.
03-02-18
Package outline TSSOP10 (SOT552-1)
IP4283CZ10_SER
Product data sheet
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
9. Soldering
Footprint information for reflow soldering of DFN2510-10 package
SOT1165-1
Hx
P
C
Hy
Ay
By
0.05
D
D1
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
D1
Hx
Hy
0.500
1.3
0.25
0.525
0.20
0.40
2.45
1.6
Fig 6.
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
sot1165-1_fr
Reflow soldering footprint DFN2510-10 (SOT1165-1)
IP4283CZ10_SER
Product data sheet
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
Footprint information for reflow soldering of DFN2510A-10 package
SOT1176-1
Hx
C
Hy
Ay
By
0.05
D
P
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
Hx
Hy
0.5
1.25
0.3
0.475
0.2
2.45
1.5
Fig 7.
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
sot1176-1_fr
Reflow soldering footprint DFN2510A-10 (SOT1176-1)
IP4283CZ10_SER
Product data sheet
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
Footprint information for reflow soldering of TSSOP10 package
SOT552-1
Hx
Gx
P2
(0.125)
Hy
Gy
(0.125)
By
Ay
C
D2 (4x)
D1
P1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500
0.550
5.400
3.200
1.100
0.300
0.400
2.750
3.900
3.700
5.650
Fig 8.
sot552-1_fr
Reflow soldering footprint TSSOP10 (SOT552-1)
IP4283CZ10_SER
Product data sheet
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
10. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4283CZ10_SER v.4
20130408
Product data sheet
-
IP4283CZ10_SER v.3
Modifications:
•
•
•
•
•
•
•
•
Section 1.1 “General description”: updated
Section 1.2 “Features and benefits”: updated
Section 2 “Pinning information”: updated
Section 3 “Ordering information”: updated
Table 5 “Characteristics”: updated; rdyn value corrected
Section 8 “Package outline”: drawings replaced with minimized package outline drawings
Section 9 “Soldering”: updated
Section 11 “Legal information”: updated
IP4283CZ10_SER v.3
20110624
Product data sheet
-
IP4283CZ10_SER v.2
IP4283CZ10_SER v.2
20100827
Product data sheet
-
IP4283CZ10 v.1
IP4283CZ10 v.1
20090507
Product data sheet
-
-
IP4283CZ10_SER
Product data sheet
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
IP4283CZ10_SER
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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IP4283CZ10 series
NXP Semiconductors
ESD protection for ultra high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Product data sheet
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ESD protection for ultra high-speed interfaces
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 April 2013
Document identifier: IP4283CZ10_SER
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