Data Sheet

PRTR5V0U4Y
Integrated quad ultra-low capacitance ESD protection
Rev. 01 — 8 May 2008
Product data sheet
1. Product profile
1.1 General description
The PRTR5V0U4Y is designed to protect Input/Output (I/O) ports that are sensitive to
capacitive load, such as USB 2.0, Ethernet and DVI from destruction by ElectroStatic
Discharge (ESD). It provides protection to downstream signal and supply components
from ESD voltages as high as ±8 kV (contact discharge).
The PRTR5V0U4Y incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus
a Zener diode. The rail-to-rail diodes are connected to the Zener diode which allows ESD
protection to be independent of supply voltage. The PRTR5V0U4Y is fabricated using thin
film-on-silicon technology integrating four ultra-low capacitance rail-to-rail ESD protection
diodes in a miniature 6-lead SOT363 package.
1.2 Features
n
n
n
n
n
Pb-free and RoHS compliant
ESD protection compliant to IEC 61000-4-2 level 4, ±8 kV contact discharge
Four ultra-low input capacitance (1 pF typical) rail-to-rail ESD protection diodes
Low-voltage clamping due to integrated Zener diode
Small 6-lead SOT363 package
1.3 Applications
n General-purpose downstream ESD protection high frequency analog signals and
high-speed serial data transmission for ports inside:
u Cellular and PCS mobile handsets
u PC-/notebook USB 2.0/IEEE 1394 ports
u DVI/HDMI interfaces
u Cordless telephones
u Wireless data (WAN/LAN) systems
u PDAs
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
2. Pinning information
Table 1.
Pinning
Pin
Description
Simplified outline
1
ESD protection I/O 1
2
ground (GND)
3
ESD protection I/O 2
4
ESD protection I/O 3
5
supply voltage (VCC)
6
ESD protection I/O 4
6
5
4
1
2
3
Graphic symbol
6
5
4
1
2
3
001aag273
3. Ordering information
Table 2.
Ordering information
Type number
PRTR5V0U4Y
Package
Name
Description
Version
SC-88
plastic surface-mounted package; 6 leads
SOT363
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
Vesd
electrostatic discharge
voltage
Tstg
Conditions
Min
Max
Unit
−0.5
+5.5
V
all pins; IEC 61000-4-2;
level 4
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
−55
+125
°C
storage temperature
5. Recommended operating conditions
Table 4.
Operating conditions
Symbol
Parameter
Conditions
Tamb
ambient temperature
PRTR5V0U4Y_1
Product data sheet
Min
Max
Unit
−40
+85
°C
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
2 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
6. Characteristics
Table 5.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
C(I/O-GND)
input/output to ground
capacitance
pins 1, 3, 4 and 6; VI = 0 V; f = 1 MHz;
VCC = 3.0 V
-
1.0
-
pF
ILR
reverse leakage current
pins 1, 3, 4 and 6 to ground; VI = 3.0 V
-
-
100
nA
VBR
breakdown voltage
Zener diode; I = 1 mA
6
-
9
V
VF
forward voltage
-
0.7
-
V
7. Application information
7.1 IEEE 1394a/b protection
The PRTR5V0U4Y is optimized to protect both the IEEE 1394 physical layer and the
IEEE 1394 connector ports against ESD.
TPBIAS
Shld1
1 µF
BUS PWR
PWR
56 Ω
1
56 Ω
TPA+
TPA+
TPA−
TPA−
IEEE 1394
PHYSICAL
LAYER
7
1
6
5
6
1394
CONNECTOR
2
5
3
4
TPB+
TPB+
TPB−
TPB−
GND
56 Ω
56 Ω
Shld2
220 pF
5 kΩ
1 nF
10 nF
4
3
2
8
1 MΩ
001aag050
Fig 1.
Typical application for IEEE 1394a/b ESD protection
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
3 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.2 Universal serial bus 2.0 protection
The PRTR5V0U4Y is optimized to protect USB 2.0 ports with or without OTG functionality
against ESD.
VBUS
DAT+
DAT−
to phone
USB OTG
RECEPTACLE
CARKIT
ID
GND
Shld GND
mini B receptacle
mini A receptacle
1
6
2
5
3
4
001aag051
The device is capable of protecting the USB data lines as well as VBUS supply and the ID pin.
Fig 2.
Typical application for USB OTG ESD protection
7.3 Universal SIM-card protection
The PRTR5V0U4Y protects the SIM-card interfaces against ESD.
I/O
CLOCK
RESET
SIM
VCC
GND
1
6
2
5
3
4
001aag052
This device also protects VCC.
Fig 3.
Typical application for universal SIM-card ESD protection
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
4 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.4 Gigabit Ethernet transceiver protection
The PRTR5V0U4Y protects the gigabit Ethernet transceiver against ESD.
TPOPA
R1
C1
C5
C2
C6
TPONA
1
6
2
5
3
4
TPOPB
R2
TPONB
GIGABIT
ETHERNET
TPOPC
TRANSCEIVER
QUAD
TRANSFORMER
R3
RJ45
C3
C7
C4
C8
TPONC
1
6
2
5
3
4
TPOPD
R4
TPOND
001aag053
Fig 4.
Typical application for gigabit Ethernet transceiver ESD protection
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
5 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
7.5 Universal microSD/TransFlash and SD-memory card protection
The PRTR5V0U4Y protects each data line of the microSD/TransFlash device against
ESD.
DAT0
DAT1
DAT2
DAT3/CD
TRANSFLASH
CMD
CLK
VCC
GND
1
6
1
6
2
5
2
5
3
4
3
4
001aag054
Fig 5.
Typical application for universal microSD/TransFlash and SD-memory card ESD
protection
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
6 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
8. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
Fig 6.
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Package outline SOT363 (SC-88)
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
7 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
9. Abbreviations
Table 6.
Abbreviations
Acronym
Description
DVI
Digital Video Interface
ESD
ElectroStatic Discharge
HDMI
High Definition Multimedia interface
LAN
Local Area Network
OTG
On-The-Go
PCS
Personal Computing System
PDA
Personal Digital Assistant
RoHS
Restriction of Hazardous Substances
SIM
Subscriber Identity Module
USB
Universal Serial Bus
WAN
Wide Area Network
10. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PRTR5V0U4Y_1
20080508
Product data sheet
-
-
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
8 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PRTR5V0U4Y_1
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 01 — 8 May 2008
9 of 10
PRTR5V0U4Y
NXP Semiconductors
Integrated quad ultra-low capacitance ESD protection
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Recommended operating conditions. . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 3
IEEE 1394a/b protection. . . . . . . . . . . . . . . . . . 3
Universal serial bus 2.0 protection . . . . . . . . . . 4
Universal SIM-card protection . . . . . . . . . . . . . 4
Gigabit Ethernet transceiver protection . . . . . . 5
Universal microSD/TransFlash and
SD-memory card protection . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 May 2008
Document identifier: PRTR5V0U4Y_1
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