Data Sheet

IP4359CX4
Dual channel low capacitance high performance ESD
protection
Rev. 1 — 6 August 2010
Product data sheet
1. Product profile
1.1 General description
The IP4359CX4 is a dual channel low capacitance ElectroStatic Discharge (ESD)
protection device, providing protection to downstream components from ESD voltages as
high as ±15 kV contact discharge and > ±15 kV air discharge according the
IEC 61000-4-2 model, far exceeding standard level 4.
The device is optimized for protection of high speed interfaces such as Universal Serial
Bus (USB) 2.0, High Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI)
and other interfaces requiring very low capacitance ESD protection.
The device is available in two different heights. 0.61 mm and reduced maximum height of
0.5 mm. Both versions contain identical circuits and show an identical electrical
performance. Both ESD protection channels share common ground connections, but are
electrically separated, thereby preventing current back drive into the adjacent channel.
IP4359CX4 is fabricated using monolithic silicon technology in a single Wafer-Level
Chip-Scale Package (WLCSP). These features make the IP4359CX4 ideal for use in
applications requiring component miniaturization such as mobile phone handsets and
other portable electronic devices.
1.2 Features and benefits
„
„
„
„
Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
2 ultra low input capacity rail-to-rail ESD protection diodes with C(I/O-GND) = 1.3 pF
Rdyn = 0.45 Ω
Integrated ESD protection withstanding ±15 kV contact discharge and > ±15 kV air
discharge, far exceeding IEC 61000-4-2 level 4
„ Standard height version (0.61 mm) available as IP4359CX4/LF
„ Reduced height version (maximum height of 0.5 mm) available as
IP4359CX4/LF-H500
„ 2 × 2 solder ball WLCSP with 0.4 mm pitch
1.3 Applications
„ High-speed interface ESD protection such as USB 2.0, HDMI, DVI etc.
„ Interfaces with special requirements on low capacitive ESD protection
„ Interfaces requiring separation of the positive clamping voltage/current path
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
2. Pinning information
Table 1.
Pinning
Pin
Description
A1 and A2
ESD protection
B1 and B2
ground
Simplified outline
Graphic symbol
bump A1
index area
1
2
A
A1
B1
A2
B2
008aaa239
B
008aaa236
transparent top view,
solder balls facing down
3. Ordering information
Table 2.
Ordering information
Type number
Package height
Name
Description
Version
IP4359CX4/LF
standard[1]
WLCSP4
wafer level chip-size package; 4 bumps (2 × 2)
IP4359CX4
IP4359CX4/LF-H500
reduced[2]
WLCSP4
wafer level chip-size package; 4 bumps (2 × 2)
IP4359CX4
[1]
For details see Table 5.
[2]
For details see Table 6.
IP4359CX4
Product data sheet
Package
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Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min Max
Unit
VI
input voltage
pins A1 and A2 to ground (B1, B2)
−0.5 +5.5
V
VESD
electrostatic discharge
voltage
pins A1 and A2 to ground (B1, B2)
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−20
+20
kV
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
−55
+150 °C
Treflow(peak) peak reflow temperature 10 s maximum
-
260
°C
Tamb
−35
+85
°C
IEC 61000-4-2 level 4;
pins A1 and A2 to ground (B1, B2)
Tstg
[1]
storage temperature
ambient temperature
Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
5. Characteristics
Table 4.
Electrical characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol
Product data sheet
Conditions
pins A1 and A2 to ground (B1,
B2); VI = 3.3 V; f = 1 MHz
[1]
Min
Typ Max
Unit
-
1.3
1.5
pF
C(I/O-GND)
input/output to ground
capacitance
ILR
reverse leakage current pins A1 and A2 to ground (B1,
B2); VI = 3.3 V
-
-
100
nA
VBRzd
Zener diode breakdown Itest = 1 mA
voltage
6
-
9
V
VF
forward voltage
-
0.7
-
V
Rdyn
dynamic resistance
positive discharge
-
0.45 -
Ω
negative discharge
-
0.45 -
Ω
[1]
IP4359CX4
Parameter
Itest = 1 A; IEC 61000-4-5
Guaranteed by design.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
6. Application information
6.1 Insertion loss
The IP4359CX4 is mainly designed as an ESD protection device for high speed interfaces
such as USB 2.0, DVI and HDMI high speed data lines etc. The insertion loss
measurement configuration of a typical 50 Ω NetWork Analyzer (NWA) system for
evaluation of the IP4359CX4 is shown in Figure 1.
The insertion loss of IP4359CX4 is depicted in Figure 2.
IN
OUT
DUT
50 Ω
50 Ω
TEST BOARD
Vgen
001aai755
Fig 1.
Frequency response measurement configuration
008aaa237
5
s21
(dB)
−5
−15
−25
−35
10−1
1
10
102
103
104
f (MHz)
Pin A1 and pin A2 to ground.
Fig 2.
IP4359CX4
Product data sheet
Measured insertion loss magnitude
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Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
6.2 Crosstalk
The crosstalk measurement configuration of a typical 50 Ω NWA system for evaluation of
the IP4359CX4 is shown in Figure 3.
The crosstalk measurement results of IP4359CX4 are depicted in Figure 4.
IN_1
50 Ω
DUT
IN_2
OUT_2
OUT_1
TEST BOARD
50 Ω
50 Ω
50 Ω
Vgen
001aai756
Fig 3.
Crosstalk measurement configuration
008aaa238
0
αct
(dB)
−20
−40
−60
−80
−100
1
10
102
103
104
f (MHz)
Pin A1 to pin A2.
Fig 4.
IP4359CX4
Product data sheet
Measured crosstalk between different channels
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Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
7. Package outline
WLCSP4: wafer level chip-size package; 4 bumps (2 x 2)
D
bump A1
index area
A2
E
A
A1
detail X
e
b
B
e
A
1
2
X
European
projection
wlcsp4_2x2_po
Fig 5.
Table 5.
Package outline IP4359CX4 (WLCSP4)
Dimensions of IP4359CX4/LF for Figure 5
Symbol
Min
Typ
Max
Unit
A
0.57
0.61
0.65
mm
A1
0.18
0.20
0.22
mm
A2
0.39
0.41
0.43
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
IP4359CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
6 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
Table 6.
Dimensions of IP4359CX4/LF-H500 for Figure 5
Symbol
Min
Typ
Max
Unit
A
0.41
0.45
0.49
mm
A1
0.18
0.20
0.22
mm
A2
0.23
0.25
0.27
mm
b
0.21
0.26
0.31
mm
D
0.71
0.76
0.81
mm
E
0.71
0.76
0.81
mm
e
-
0.4
-
mm
8. Design and assembly recommendations
8.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to Table 7 for the recommended PCB design parameters.
Table 7.
Recommended PCB design parameters
Parameter
Value or specification
PCB pad diameter
250 μm
Micro-via diameter
100 μm (0.004 inch)
Solder mask aperture diameter
325 μm
Copper thickness
20 μm to 40 μm
Copper finish
AuNi or OSP
PCB material
FR4
8.2 PCB assembly guidelines for Pb-free soldering
Table 8.
IP4359CX4
Product data sheet
Assembly recommendations
Parameter
Value or specification
Solder screen aperture diameter
290 μm
Solder screen thickness
100 μm (0.004 inch)
Solder paste: Pb-free
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
Solder / flux ratio
50 / 50
Solder reflow profile
see Figure 6
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Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
T
(°C)
Treflow(peak)
250
230
cooling rate
217
pre-heat
t1
t2
t3
t4
t (s)
t5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6.
Pb-free solder reflow profile
Table 9.
IP4359CX4
Product data sheet
Characteristics
Symbol
Parameter
Conditions
Treflow(peak)
peak reflow temperature
t1
time 1
t2
t3
Min Typ Max Unit
230 -
260
°C
soak time
60
-
180
s
time 2
time during T ≥ 250 °C
-
-
30
s
time 3
time during T ≥ 230 °C
10
-
50
s
t4
time 4
time during T > 217 °C
30
-
150
s
t5
time 5
-
-
540
s
dT/dt
rate of change of temperature
cooling rate
-
-
−6
°C/s
pre-heat
2.5
-
4.0
°C/s
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
9. Abbreviations
Table 10.
Abbreviations
Acronym
Description
DUT
Device Under Test
DVI
Digital Visual Interface
ESD
ElectroStatic Discharge
FR4
Flame Retard 4
HDMI
High Definition Multimedia Interface
IEC
International Electrotechnical Commission
NSMD
Non-Solder Mask Defined
NWA
NetWork Analyzer
OSP
Organic Solderability Preservative
PCB
Printed-Circuit Board
RoHS
Restriction of Hazardous Substances
USB
Universal Serial Bus
WLCSP
Wafer-Level Chip-Scale Package
10. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4359CX4 v.1
20100806
Product data sheet
-
-
IP4359CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
9 of 12
IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4359CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4359CX4
Product data sheet
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Rev. 1 — 6 August 2010
© NXP B.V. 2010. All rights reserved.
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IP4359CX4
NXP Semiconductors
Dual channel low capacitance ESD protection
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
6.1
6.2
7
8
8.1
8.2
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Design and assembly recommendations . . . . 7
PCB design guidelines . . . . . . . . . . . . . . . . . . . 7
PCB assembly guidelines for Pb-free
soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 August 2010
Document identifier: IP4359CX4