Data Sheet

IP4284CZ10-TBR;
IP4284CZ10-TT
ESD protection for ultra high-speed interfaces
Rev. 3 — 19 May 2011
Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect high-speed interfaces such as High-Definition
Multimedia Interface (HDMI), DisplayPort, SuperSpeed USB, external Serial Advanced
Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces
against ElectroStatic Discharge (ESD).
The devices include high-level ESD protection diodes for ultra high-speed signal lines and
are available in two package variants: XSON10 and TSSOP10.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.5 pF. These diodes provide protection to downstream components
from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
„ Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
„ System ESD protection for USB 2.0 and USB SuperSpeed 3.0, HDMI 1.3 and
HDMI 1.4, DisplayPort, eSATA and LVDS
„ All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of ±8 kV according to IEC 61000-4-2, level 4
„ Matched 0.5 mm trace spacing
„ Signal lines with ≤ 0.05 pF matching capacitance between signal pairs
„ Line capacitance of only 0.5 pF for each channel
„ 4-channel, XSON10 or TSSOP10 Pb-free package
„ Design-friendly ’pass-thru’ signal routing
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection:
„ TVs, monitors
„ DVD recorders and players
„ Notebooks, mother boards, graphic cards and ports
„ Set-top boxes and game consoles
IP4284CZ10-TBR/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pin
Pinning
Symbol
Description
Simplified outline
Graphic symbol
IP4284CZ10-TBR (SOT1176-1)
1
CH1
channel 1 ESD protection
2
CH2
channel 2 ESD protection
3
GND
ground
4
CH3
channel 3 ESD protection
5
CH4
channel 4 ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
9
8
7
6
2
1
4
5
1
2
3
4
5
Transparent top view
XSON10
3, 8
018aaa001
IP4284CZ10-TT (SOT552-1)
1
CH1
channel 1 ESD protection
2
CH2
channel 2 ESD protection
3
GND
ground
4
CH3
channel 3 ESD protection
5
CH4
channel 4 ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
6
2
1
4
3, 8
1
5
018aaa001
5
TSSOP10
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4284CZ10-TBR XSON10
plastic extremely thin small outline package;
no leads; 10 terminals; body 1 × 2.5 × 0.5 mm
SOT1176-1
IP4284CZ10-TT
plastic thin shrink small outline package; 10 leads; SOT552-1
body width 3 mm
TSSOP10
4. Marking
Table 3.
IP4284CZ10-TBR_TT
Product data sheet
Marking codes
Type number
Marking code
IP4284CZ10-TBR
84
IP4284CZ10-TT
4284
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ESD protection for ultra high-speed interfaces
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
Conditions
electrostatic discharge
voltage
Min
Max
Unit
−0.5
+5.5
V
contact discharge
-
±8
kV
air discharge
-
±15
kV
IEC 61000-4-2, level 4
[1]
Tamb
ambient temperature
−40
+85
°C
Tstg
storage temperature
−55
+125
°C
[1]
All pins to ground.
6. Characteristics
Table 5.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBRzd
Zener diode
breakdown voltage
Itest = 1 mA
6
-
9
V
ILRzd
Zener diode reverse
leakage current
per TMDS channel;
VI = 3.0 V
-
-
1
μA
VF
forward voltage
-
0.7
-
V
Cch(TMDS)
TMDS channel
capacitance
f = 1 MHz;
Vbias = 2.5 V
[1]
0.4
0.5
0.7
pF
ΔCch(TMDS)
TMDS channel
capacitance difference
f = 1 MHz;
Vbias = 2.5 V
[1]
-
0.05
-
pF
Cch(mutual)
mutual channel
capacitance
f = 1 MHz;
Vbias = 2.5 V
[1][2]
-
0.07
-
pF
Rdyn
dynamic resistance
I=1A
positive transient
-
1
-
Ω
negative transient
-
1
-
Ω
-
8
-
V
VCL(ch)trt(pos) positive transient channel VESD = 8 kV
clamping voltage
IP4284CZ10-TBR_TT
Product data sheet
[3]
[1]
This parameter is guaranteed by design.
[2]
Between signal pin and pin n.c.
[3]
According to IEC 61000-4-5 and IEC 61000-4-9.
[4]
Human Body Model (HBM) according to JESD22-A-J114D.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 19 May 2011
[4]
© NXP B.V. 2011. All rights reserved.
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ESD protection for ultra high-speed interfaces
018aaa002
3
Sdd21;
Scc21
(dB)
018aaa003
0
Sdd21;
NEXT
(dB)
(1)
−3
−30
(2)
−9
−60
−15
106
107
108
109
1010
−90
108
109
1010
f (Hz)
f (Hz)
(1) Sdd21
Sdd21
(2) Scc21
normalized to 100 Ω;
differential pairs CH1/CH2 versus CH3/CH4
normalized to 100 Ω;
differential pairs at CH1/CH2 or at CH3/CH4
Fig 1.
Mixed-mode differential and common-mode
insertion loss; typical values
IP4284CZ10-TBR_TT
Product data sheet
Fig 2.
Mixed-mode differential NEXT crosstalk;
typical values
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ESD protection for ultra high-speed interfaces
018aaa004
018aaa005
5 Gbit/s; USB 3.0 CP0 pattern
Fig 3.
5 Gbit/s; USB 3.0 CP0 pattern
Eye diagram using reference PCB
Fig 4.
Typical eye diagram for IP4284CZ10
018aaa006
0.4
Cd
(pF)
0.2
(1)
0.0
(2)
−0.2
−0.4
−0.5
1.5
3.5
5.5
Vbias (V)
(1) Pin 2
(2) Pin 1
Deviation from typical capacitance normalized at Vbias = 2.5 V
Fig 5.
Line capacitance as a function of bias voltage; typical values
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
018aaa008
8.5
018aaa007
3.5
VCL
(V)
VCL
(V)
3.0
8.0
2.5
7.5
2.0
7.0
0.5
1.0
1.5
2.0
1.5
0.5
2.5
1.0
1.5
2.0
I (A)
IEC 61000-4-5; tp = 8/20 μs; positive pulse
Fig 6.
IEC 61000-4-5; tp = 8/20 μs; negative pulse
Dynamic resistance with positive clamping
Fig 7.
Dynamic resistance with negative clamping
018aaa009
18
2.5
I (A)
018aaa010
0
VCL
(V)
VCL
(V)
−4
12
−8
6
−12
0
0
2
4
6
8
10
12
I (A)
14
−16
−16
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 8.
Product data sheet
−8
−4
0
I (A)
tp = 100 ns; Transmission Line Pulse (TLP)
Dynamic resistance with positive clamping
IP4284CZ10-TBR_TT
−12
Fig 9.
Dynamic resistance with negative clamping
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ESD protection for ultra high-speed interfaces
7. Application information
The devices are designed to provide high-level ESD protection for high-speed serial
data buses such as HDMI, DisplayPort, eSATA and LVDS data lines.
When designing the Printed-Circuit Board (PCB), careful consideration should be given to
basic high-speed routing guidelines, impedance matching, and signal coupling.
Basic application diagrams for the ESD protection of an HDMI interface are shown in
Figure 10 and Figure 11.
IP4284CZ10-TBR
5
4
8
3
2
1
TMDS_D2+
TMDS_CH2+
TMDS_GND
TMDS_CH2–
TMDS_D2–
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1–
TMDS_D1–
IP4284CZ10-TBR
5
TMDS_D0+
TMDS_CH2+
TMDS_GND
4
8
3
2
1
TMDS_CH2–
TMDS_D0–
GND
TMDS_CLK+
TMDS_CH1+
HDMI
CONNECTOR
TMDS_GND
TMDS_CH1–
TMDS_CLKCEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
IP4221CZ6
1
2
100 nF
3
018aaa115
Fig 10. Application diagram of HDMI ESD protection using IP4284CZ10-TBR
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
IP4284CZ10-TT
TMDS_D2+
TMDS_D2+
TMDS_GND
TMDS_D2–
TMDS_D2–
TMDS_D1+
TMDS_D1+
TMDS_GND
TMDS_D1–
TMDS_D1–
IP4284CZ10-TT
TMDS_D0+
TMDS_D0+
TMDS_GND
TMDS_D0–
TMDS_D0–
TMDS_CLK+
TMDS_CLK+
HDMI
CONNECTOR
TMDS_GND
TMDS_CLK1–
TMDS_CLK–
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
IP4220CZ6
100 nF
018aaa012
Fig 11. Application diagram of HDMI ESD protection using IP4284CZ10-TT
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
8. Package outline
XSON10: plastic extremely thin small outline package; no leads;
10 terminals; body 1 x 2.5 x 0.5 mm
SOT1176-1
X
B
D
A
A
E
A1
A3
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1
5
C
C A B
C
y1 C
y
L1
k
L
10
6
0
1
scale
Dimensions
Unit(1)
mm
max
nom
min
2 mm
A
A1
0.5
0.05
A3
b
0.25
0.127 0.20
0.00
0.15
D
E
2.6
2.5
2.4
1.1
1.0
0.9
e
e1
0.5
k
L
2
0.2
L1
0.40 0.45
0.35 0.40
0.30 0.35
v
0.1
w
y
y1
0.05 0.05 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References
Outline
version
IEC
JEDEC
JEITA
SOT1176-1
---
---
---
sot1176-1_po
European
projection
Issue date
10-06-21
10-06-22
Fig 12. Package outline SOT1176-1 (XSON10)
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
D
E
SOT552-1
A
X
c
y
HE
v M A
Z
6
10
A2
(A3)
A1
A
pin 1 index
θ
Lp
L
1
5
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.15
0.23
0.15
3.1
2.9
3.1
2.9
0.5
5.0
4.8
0.95
0.7
0.4
0.1
0.1
0.1
0.67
0.34
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-07-29
03-02-18
SOT552-1
Fig 13. Package outline SOT552-1 (TSSOP10)
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
9. Soldering
Footprint information for reflow soldering of XSON10 package
SOT1176-1
Hx
C
Hy
By
Ay
0.05
D
P
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
Hx
Hy
0.5
1.25
0.3
0.475
0.2
2.45
1.5
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
sot1176-1_fr
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering footprint SOT1176-1 (XSON10)
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
Footprint information for reflow soldering of TSSOP10 package
SOT552-1
Hx
Gx
P2
(0.125)
Hy
Gy
(0.125)
By
Ay
C
D2 (4x)
D1
P1
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1
D2
Gx
Gy
Hx
Hy
0.500
0.550
5.400
3.200
1.100
0.300
0.400
2.750
3.900
3.700
5.650
sot552-1_fr
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOT552-1 (TSSOP10)
IP4284CZ10-TBR_TT
Product data sheet
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ESD protection for ultra high-speed interfaces
10. Abbreviations
Table 6.
IP4284CZ10-TBR_TT
Product data sheet
Abbreviations
Acronym
Description
DVD
Digital Versatile Disc
eSATA
external Serial Advanced Technology Attachment
ESD
ElectroStatic Discharge
HBM
Human Body Model
HDMI
High-Definition Multimedia Interface
LVDS
Low Voltage Differential Signaling
NEXT
Near End Crosstalk
RoHS
Restriction of Hazardous Substances
TLP
Transmission Line Pulse
TMDS
Transition Minimized Differential Signaling
UTLP
Ultra Thin Leadless Package
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ESD protection for ultra high-speed interfaces
11. Revision history
Table 7.
Revision history
Document ID
Release date
IP4284CZ10-TBR_TT v.3 20110519
Modifications:
•
•
•
•
•
•
Data sheet status
Change notice
Supersedes
Product data sheet
-
IP4284CZ10-TB_TT v.2
Deleted type number IP4284CZ10-TB.
Added type number IP4284CZ10-TBR.
Section 4 “Marking”: added.
Table 4 “Limiting values”: updated VESD values.
Section 9 “Soldering”: added.
Section 12 “Legal information”: updated.
IP4284CZ10-TB_TT v.2
20100401
Product data sheet
-
IP4284CZ10-TB_TT v.1
IP4284CZ10-TB_TT v.1
20100304
Preliminary data sheet
-
-
IP4284CZ10-TBR_TT
Product data sheet
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12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
IP4284CZ10-TBR_TT
Product data sheet
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
IP4284CZ10-TBR_TT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 19 May 2011
© NXP B.V. 2011. All rights reserved.
16 of 17
NXP Semiconductors
IP4284CZ10-TBR/TT
ESD protection for ultra high-speed interfaces
14. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 May 2011
Document identifier: IP4284CZ10-TBR_TT