Data Sheet

XS
ON
10
PHDMI2F4
ESD protection for ultra high-speed interfaces
Rev. 1 — 31 July 2014
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as Transition Minimized
Differential Signaling (TDMS) lines of High-Definition Multimedia Interface (HDMI),
standard 2.0 and lower, against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for ultra high-speed
signal lines and is encapsulated in a leadless small DFN2510A-10 (SOT1176-1) plastic
package.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.5 pF. These diodes utilize a unique snap-back structure in order to
provide protection to downstream components from ESD voltages up to 10 kV contact
exceeding IEC 61000-4-2, level 4.
1.2 Features and benefits
 System ESD protection for HDMI, standard 2.0 and lower.
 All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 10 kV exceeding IEC 61000-4-2, level 4
 Matched 0.5 mm trace spacing
 Signal lines with  0.05 pF matching capacitance between signal pairs
 Line capacitance of only 0.5 pF for each channel
 Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
 TVs and monitors
 DVD recorders and players
 Notebooks, main board graphic cards and ports
 Set-top boxes and game consoles
PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pinning
Pin
Symbol
Description
Simplified outline
1
CH1
channel 1 ESD protection
2
CH2
channel 2 ESD protection
3
GND
ground
4
CH3
channel 3 ESD protection
5
CH4
channel 4 ESD protection
6
n.c.
not connected
7
n.c.
not connected
8
GND
ground
9
n.c.
not connected
10
n.c.
not connected
10
9
8
7
6
Graphic symbol
1
2
4
5
1
2
3
4
5
Transparent top view
3, 8
018aaa001
3. Ordering information
Table 2.
Ordering information
Type number
PHDMI2F4
Package
Name
Description
Version
DFN2510A-10
plastic extremely thin small outline package;
SOT1176-1
no leads; 10 terminals; body 1  2.5  0.5 mm
4. Marking
Table 3.
Marking codes
Type number
Marking code
PHDMI2F4
96
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
electrostatic discharge
voltage
Product data sheet
Min
Max
Unit
0.5
+5.5
V
contact discharge
10
+10
kV
air discharge
15
+15
kV
IEC 61000-4-2, level 4
[1]
Tamb
ambient temperature
40
+85
C
Tstg
storage temperature
55
+125
C
[1]
PHDMI2F4
Conditions
All pins to ground.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
6. Characteristics
Table 5.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBR
breakdown voltage
II = 1 mA
6
-
-
V
ILR
reverse leakage current
per channel; VI = 3 V
-
-
1
A
VF
forward voltage
II = 1 mA
-
0.7
-
V
Cline
line capacitance
f = 1 MHz; VI = 3.3 V
[1]
-
0.5
0.6
pF
-
0.05
-
pF
-
0.41
-

-
0.26
-

-
0.43
-

-
0.28
-

-
4.6
-
V
-
2.2
-
V
Cline
line capacitance
difference
f = 1 MHz; VI = 3.3 V
[1]
rdyn
dynamic resistance
surge
[2]
positive transient
negative transient
TLP
[3]
positive transient
negative transient
VCL
clamping voltage
IPP = 5.2 A
[2]
positive transient
IPP = 4.4 A
negative transient
PHDMI2F4
Product data sheet
[1]
This parameter is guaranteed by design.
[2]
According to IEC 61000-4-5 (8/20 s current waveform).
[3]
100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
[2]
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 14
PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-009367
2
aaa-009368
1.2
Sdd21
(dB)
a
-2
0.8
-6
0.4
-10
-14
106
107
108
109
0
1010
0
1
2
3
4
5
VI (V)
f (MHz)
differential mode
C line
a = --------------------------------C line  V = 0 V 
I
Fig 1.
Insertion loss; typical values
Fig 2.
aaa-009369
0
Relative capacitance as a function of input
voltage; typical values
aaa-009370
120
Zdif
(Ω)
Sdd21
(dB)
110
-20
(2)
100
-40
90
(1)
-60
106
107
108
109
80
40.0
1010
40.5
41.0
Sdd21 normalized to 100 ;
differential pairs CH1/CH2 versus CH3/CH4
41.5
42.0
t (ns)
f (MHz)
tr = 200 ps; differential pair CH1 + CH2
(1) PHDMI2F4 on reference board
(2) Reference board without device under test (DUT)
Fig 3.
Crosstalk; typical values
PHDMI2F4
Product data sheet
Fig 4.
Differential Time Domain Reflectometer (TDR)
plot; typical values
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Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 14
PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-014159
Test frequency: 148.5 MHz
Differential swing voltage: 810 mV
Horizontal scale: 34 ps/div
Fig 5.
HDMI 2.0 TP1 eye diagram, PCB with PHDMI2F4 (2160p, 60 Hz)
aaa-014160
Test frequency: 148.5 MHz
Differential swing voltage: 800 mV
Horizontal scale: 34 ps/div
Fig 6.
PHDMI2F4
Product data sheet
HDMI 2.0 TP1 eye diagram, PCB without PHDMI2F4 (2160p, 60 Hz, reference)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 14
PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-014161
Test frequency: 148.5 MHz
Differential swing voltage: 809 mV
Horizontal scale: 34 ps/div
Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and
worst case positive skew.
Fig 7.
HDMI 2.0 TP2 eye diagram, PCB with PHDMI2F4 (2160p, 60 Hz)
aaa-014162
Test frequency: 148.5 MHz
Differential swing voltage: 820 mV
Horizontal scale: 34 ps/div
Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and
worst case positive skew.
Fig 8.
PHDMI2F4
Product data sheet
HDMI 2.0 TP2 eye diagram, PCB without PHDMI2F4 (2160p, 60 Hz, reference)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 14
PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
aaa-009371
6
aaa-009372
0
IPP
(A)
IPP
(A)
4
-2
2
-4
0
0
2
4
-6
-2.5
6
-2.0
-1.5
-1.0
-0.5
0
VCL (V)
VCL (V)
IEC 61000-4-5; tp = 8/20 s; positive pulse
Fig 9.
IEC 61000-4-5; tp = 8/20 s; negative pulse
Dynamic resistance with positive clamping;
typical values
Fig 10. Dynamic resistance with negative clamping;
typical values
aaa-009373
14
I
(A)
12
aaa-009374
0
I
(A)
-2
10
-4
8
-6
6
-8
4
-10
2
-12
0
-14
0
4
8
12
-6
VCL (V)
-4
-2
0
VCL (V)
tp = 100 ns; Transmission Line Pulse (TLP)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 11. Dynamic resistance with positive clamping;
typical values
Fig 12. Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the
ESD protection during an ESD event. Do not connect unlimited DC current sources to the
data lines to avoid keeping the ESD protection device in snap-back state after exceeding
breakdown voltage (due to an ESD pulse for instance).
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
7. Application information
The device is designed to provide high-level ESD protection for high-speed serial
data buses such as HDMI 2.0, DisplayPort and LVDS data lines.
When designing the Printed-Circuit Board (PCB), give careful consideration to impedance
matching and signal coupling. Do not connect the signal lines to unlimited current sources
like, for example, a battery.
A basic application diagram for the ESD protection of an HDMI interface is shown in
Figure 13.
PHDMI2F4
TMDS_D2+
5
4
8
3
2
1
TMDS_CH2+
TMDS_GND
TMDS_CH2–
TMDS_D2–
GND
TMDS_D1+
TMDS_CH1+
TMDS_GND
TMDS_CH1–
TMDS_D1–
PHDMI2F4
TMDS_D0+
5
TMDS_CH2+
TMDS_GND
4
8
3
2
1
TMDS_CH2–
TMDS_D0–
GND
TMDS_CLK+
TMDS_CH1+
HDMI
CONNECTOR
TMDS_GND
TMDS_CH1–
TMDS_CLKCEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
IP4221CZ6
1
2
100 nF
3
aaa-014178
Fig 13. Application diagram of HDMI ESD protection using PHDMI2F4
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
8. Package outline
1.1
0.9
0.2 min
5
0.127
6
2.6
2
2.4
0.25
0.15
0.5
1
10
0.45
0.35
Dimensions in mm
0.4
0.3
0.05 max
0.5 max
12-05-23
Fig 14. Package outline DFN2510A-10 (SOT1176-1)
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
9. Soldering
Footprint information for reflow soldering of DFN2510A-10 package
SOT1176-1
Hx
C
Hy
Ay
By
0.05
D
P
0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P
Ay
By
C
D
Hx
Hy
0.5
1.25
0.3
0.475
0.2
2.45
1.5
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
sot1176-1_fr
Fig 15. Reflow soldering footprint DFN2510A-10 (SOT1176-1)
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
10. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PHDMI2F4 v.1
20140731
Product data sheet
-
-
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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PHDMI2F4
NXP Semiconductors
ESD protection for ultra high-speed interfaces
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PHDMI2F4
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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ESD protection for ultra high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PHDMI2F4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 31 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
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ESD protection for ultra high-speed interfaces
13. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 31 July 2014
Document identifier: PHDMI2F4