Data Sheet

N3
PTVSxU1UPA series
HU
SO
300 W Transient Voltage Suppressor
Rev. 1 — 6 March 2014
Product data sheet
1. Product profile
1.1 General description
300 W unidirectional Transient Voltage Suppressor (TVS) in a DFN2020-3 (SOT1061)
leadless medium power Surface-Mounted Device (SMD) plastic package, designed for
transient overvoltage protection.
1.2 Features and benefits
 Rated peak pulse power: PPPM = 300 W  Reverse current: IRM = 1 nA
 Very low package height: 0.65 mm
 Reverse standoff voltage range:
VRWM = 7.5 V to 26 V
 AEC-Q101 qualified
1.3 Applications
 Power supply protection
 Industrial application
 Power management
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
PPPM
rated peak pulse power
VRWM
reverse standoff voltage
Conditions
[1][2]
[1]
In accordance with IEC 61643-321 (10/1000 s current waveform).
[2]
Measured from pin 1 and 2 to pin 3.
Min
Typ
Max
Unit
-
-
300
W
7.5
-
26
V
PTVSxU1UPA series
NXP Semiconductors
300 W Transient Voltage Suppressor
2. Pinning information
Table 2.
Pinning
Pin
Description
1 and 2
anode
3
cathode
Simplified outline
Graphic symbol
3
3
1, 2
006aab838
1
2
Transparent top view
3. Ordering information
Table 3.
Ordering information
Type number[1]
Package
Name
PTVSxU1UPA series
[1]
Description
Version
DFN2020-3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals;
body 2  2  0.65 mm
SOT1061
The series consists of 6 types with reverse standoff voltages from 7.5 V to 26 V.
4. Marking
Table 4.
PTVSXU1UPA_SER
Product data sheet
Marking codes
Type number
Marking code
PTVS7V5U1UPA
CX
PTVS10VU1UPA
CY
PTVS12VU1UPA
CZ
PTVS15VU1UPA
D1
PTVS18VU1UPA
D2
PTVS26VU1UPA
D3
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Rev. 1 — 6 March 2014
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300 W Transient Voltage Suppressor
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
PPPM
Parameter
Conditions
[1][3]
rated peak pulse power
[2][3]
Min
Max
Unit
-
300
W
W
-
3000
IPPM
rated peak pulse current
-
see Table 8
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1]
In accordance with IEC 61643-321 (10/1000 s current waveform).
[2]
In accordance with IEC 61000-4-5 and IEC 61643-321 (8/20 s current waveform).
[3]
Measured from pin 1 and 2 to pin 3.
Table 6.
ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol
VESD
PTVSXU1UPA_SER
Product data sheet
Parameter
Conditions
electrostatic discharge voltage
Min
Max
Unit
IEC 61000-4-2
(contact discharge)
[1][2]
-
30
kV
IEC 61000-4-2
(air discharge)
[1][2]
-
30
kV
[1]
Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses.
[2]
Measured from pin 1 and 2 to pin 3.
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Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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NXP Semiconductors
300 W Transient Voltage Suppressor
006aab319
150
001aaa630
120
IPP
(%)
100 % IPP; 8 µs
IPP
(%)
100 % IPP; 10 μs
100
80
e-t
50 % IPP; 20 µs
50 % IPP; 1000 μs
50
40
0
0
1.0
2.0
3.0
0
4.0
0
tp (ms)
Fig 1.
10
20
30
40
tp (ms)
10/1000 s pulse waveform according to
IEC 61643-321
Fig 2.
8/20 s pulse waveform according to
IEC 61000-4-5 and IEC 61643-321
001aaa631
IPP
100 %
90 %
10 %
tr = 0.6 ns to 1 ns
t
30 ns
60 ns
Fig 3.
ESD pulse waveform according to IEC 61000-4-2
PTVSXU1UPA_SER
Product data sheet
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Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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NXP Semiconductors
300 W Transient Voltage Suppressor
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from
junction to ambient
in free air
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1]
-
-
240
K/W
[2]
-
-
120
K/W
[3]
-
-
65
K/W
[4]
-
-
10
K/W
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[4]
Soldering point of cathode tab.
7. Characteristics
Table 8.
Characteristics per type; PTVS7V5U1UPA to PTVS26VU1UPA
Tj = 25 C unless otherwise specified.
Type number
Reverse
standoff
voltage
Breakdown voltage
VBR (V)
IR = 1 mA
VRWM (V)
Max
Reverse
Rated
leakage current peak pulse
IRM (nA) at VRWM current
IPPM (A)
Rated
peak pulse
current
IPPM (A)
[1][3]
[2][3]
Clamping
voltage
VCL (V);
at IPPM
(A)[1][3]
Clamping
voltage
VCL (V);
at IPPM
(A)[2][3]
Min
Typ
Max
Typ
Max
Max
Max
Max
Max
PTVS7V5U1UPA 7.5
8.33
8.77
9.21
200
1000
178
23.3
19.7
12.9
PTVS10VU1UPA 10
11.10 11.70
12.30 2
50
148
17.6
23.0
17.0
PTVS12VU1UPA 12
13.30 14.00
14.70 1
50
131
15.1
25.2
19.9
PTVS15VU1UPA 15
16.70 17.60
18.50 1
50
111
12.3
28.8
24.4
PTVS18VU1UPA 18
20.00 21.00
22.10 1
50
97
10.3
32.0
29.2
PTVS26VU1UPA 26
28.90 30.40
31.90 1
50
69
7.0
43.5
42.1
[1]
In accordance with IEC 61000-4-5 and IEC 61643-321 (8/20 s current waveform).
[2]
In accordance with IEC 61643-321 (10/1000 s current waveform).
[3]
Measured from pin 1 and 2 to pin 3.
PTVSXU1UPA_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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PTVSxU1UPA series
NXP Semiconductors
300 W Transient Voltage Suppressor
I
006aab321
1.2
PPPM
PPPM(25°C)
0.8
−VCL −VBR −VRWM
V
−IRM
−IR
0.4
−
+
P-N
−IPP
0
0
50
100
150
200
−IPPM
Tj (°C)
Fig 4.
Relative variation of rated peak pulse power as
a function of junction temperature; typical
values
Fig 5.
006aab324
V-I characteristics for a unidirectional TVS
protection diode
aaa-011962
104
PPPM
(W)
103
102
10
10
102
103
104
tp (µs)
Tamb = 25 °C
Fig 6.
Rated peak pulse power as a function of a pulse duration; typical values
PTVSXU1UPA_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
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300 W Transient Voltage Suppressor
8. Application information
line to be protected
(positive signal polarity)
line to be protected
(negative signal polarity)
ESD protection diode
ESD protection diode
GND
GND
unidirectional protection of one line
Fig 7.
aaa-004394
Application diagram
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
10. Package outline
1.3
0.65
max
0.35
0.25
1
1.05
0.95
2
0.45
0.35
1.1
0.9
0.3
0.2
2.1
1.9
3
1.6
1.4
Dimensions in mm
Fig 8.
PTVSXU1UPA_SER
Product data sheet
2.1
1.9
09-11-12
Package outline DFN2020-3 (SOT1061)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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NXP Semiconductors
300 W Transient Voltage Suppressor
11. Soldering
2.1
1.3
0.5 (2×)
0.4 (2×)
0.5 (2×)
0.6 (2×)
1.05
2.3
0.6
0.55
0.25
1.1
0.25
1.2
0.25
0.4
0.5
1.6
1.7
Dimensions in mm
solder paste = solder lands
solder resist
Fig 9.
PTVSXU1UPA_SER
Product data sheet
occupied area
sot1061_fr
Reflow soldering footprint DFN2020-3 (SOT1061)
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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PTVSxU1UPA series
NXP Semiconductors
300 W Transient Voltage Suppressor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PTVSXU1UPA_SER v.1
20140306
Product data sheet
-
-
PTVSXU1UPA_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
9 of 12
PTVSxU1UPA series
NXP Semiconductors
300 W Transient Voltage Suppressor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PTVSXU1UPA_SER
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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PTVSxU1UPA series
NXP Semiconductors
300 W Transient Voltage Suppressor
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PTVSXU1UPA_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 March 2014
© NXP B.V. 2014. All rights reserved.
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NXP Semiconductors
PTVSxU1UPA series
300 W Transient Voltage Suppressor
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 7
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 March 2014
Document identifier: PTVSXU1UPA_SER