TSMP77000 Datasheet

TSMP77000
www.vishay.com
Vishay Semiconductors
IR Sensor Module for Remote Control Systems
FEATURES
• Photo detector and preamplifier in one package
• AC coupled response from 20 kHz to 60 kHz, all
data formats
• Improved shielding against electrical field
disturbance
4
3
• TTL and CMOS compatibility
2
1
• Output active low
• Supply voltage 2.5 V to 5.5 V, typically the
device works in the range between 2.0 V and
5.5 V
20953
• Carrier out signal for code learning functions
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
Pinning:
DESCRIPTION
1, 4 = GND, 2 = VS, 3 = carrier OUT
The TSMP77000 is a two lens miniaturized sensor for
receiving various kinds of modulated IR signals. Two PIN
diodes and a preamplifier are assembled on a lead frame,
the epoxy package is designed as an IR filter. The
modulated output signal, carrier out, can be used for code
learning applications.
ORDERING CODE
Taping:
TSMP77000TT - top view taped
TSMP77000TR - side view taped
This component has not been qualified according to
automotive specifications.
PARTS TABLE
Carrier frequency
20 kHz to 60 kHz
TSMP77000
Package
Heimdall
Pinning
1, 4 = GND, 2 = VS, 3 = carrier OUT
Dimensions (mm)
6.8 W x 3.0 H x 3.2 D
Mounting
SMD
Application
Code learning
BLOCK DIAGRAM
APPLICATION CIRCUIT
19750-2
Circuit
3 Carrier out
TIA
Amp
V
S
Transmitter TSMPxxxx
with
C1 =
TSALxxxx
4.7 µF
2 VS
Signal shaping
OUT
GND
R1 = 100 Ω
R2 =
4.7 kΩ
+ VS
µC
VO
GND
1, 4 GND
R1 + C1 recommended to suppress power supply disturbances.
R2 recommended to get faster slopes and a correct high level of the
output pulses.
19746-3
Rev. 1.6, 14-Apr-16
1
Document Number: 82478
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
UNIT
Supply voltage (pin 2)
TEST CONDITION
VS
-0.3 to +6
V
Output voltage (pin 3)
VO
-0.3 to (VS + 0.3)
V
Output current (pin 3)
IO
5
mA
Tj
100
°C
Storage temperature range
Junction temperature
Tstg
-25 to +85
°C
Operating temperature range
Tamb
-25 to +85
°C
Note
• Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS CARRIER OUT
(Tamb = 25 °C, unless otherwise specified, VS = 3 V)
PARAMETER
Supply current (pin 2)
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Ev = 0
ISD
0.55
0.7
0.9
mA
VS
2.5
-
5.5
V
d
-
5
-
m
Supply voltage
Ev = 0, test signal see fig. 1,
IR diode TSAL6200,
IF = 400 mA
Transmission distance
IOSL = 0.5 mA, test signal see fig. 1
VOSL
-
-
250
mV
Minimum irradiance
Output voltage low (pin 3)
VS = 3 V, (20 kHz to 60 kHz)
Ee min.
-
12
25
mW/m2
Maximum irradiance
test signal see fig. 1, (20 kHz to 60 kHz)
Ee max.
50
80
-
W/m2
Angle of half transmission distance
ϕ1/2
-
± 50
-
deg
fC = 20 kHz to 60 kHz,
Ee = 25 mW/m2 to 50 W/m2,
testsignal see fig. 1, BER ≤ 2%
N
carrier
pulses
Directivity
Output accuracy
input burst
input burst
input burst
length
length
length
- 1 cycle
+ 1 cycle
counts
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Carrier cycle
(26.3 μs in case of 38 kHz)
Optical burst
(input signal)
Delay time td
Output voltage
Fig. 1 - Testsignal
Rev. 1.6, 14-Apr-16
2
Document Number: 82478
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
S(λ)rel - Relative Spectral Sensitivity
1.0
0.8
0.6
0.4
0.2
0
700
800
900
1000
1100
λ - Wavelength (nm)
22102
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength
0°
10°
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.6
0.4
0.2
0
drel - Relative Transmission Distance
21427
Fig. 3 - Horizontal Directivity
0°
10°
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
80°
0.6
21428
0.4
0.2
0
drel - Relative Transmission Distance
Fig. 4 - Vertical Directivity
Rev. 1.6, 14-Apr-16
3
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
6.8
6.6 ± 0.1
3.2
(3.4)
Mold residue
Mold residue
2.5
(1.8)
1.2 ± 0.2
3
0.8
2.2
(0.635)
(1)
1.27
(3 x)
0.5 ± 0.1
(4 x)
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
Marking area
2.2
Not indicated tolerances ± 0.15
(1.65)
Tool separation line
(2.2)
Proposed pad layout
from component side
(for reference only)
3 x 1.27 = 3.81
1.27
Pick and place area
1.8
(R1.3)
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
0.8
22608
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled off
• Finish soldering within 3 s
• Handling after reflow should be done only after the work
surface has been cooled off
Rev. 1.6, 14-Apr-16
4
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
300
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
T (°C)
200
max. 20 s
150
max. 100 s
max. 120 s
100
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
50
0
0
50
100
150
t (s)
19800
200
250
300
max. 2 cycles allowed
0.3
3.6
TAPING VERSION TSMP..TR DIMENSIONS in millimeters
16
7.5
1.75
1.34 ref.
Ø 1.5
4
Direction of feed
8
2
Ø 1.5 min.
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5337.01-4
Issue: 2; 06.10.15
Rev. 1.6, 14-Apr-16
5
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
3.65
0.3
TAPING VERSION TSMP..TT DIMENSIONS in millimeters
16
1.75
7.5
Ø 1.5
4
8
Direction of feed
2
Ø 1.5
technical drawings
according to DIN
specifications
Drawing-No.: 9.700-5338.01-4
Issue: 4; 12.06.13
Rev. 1.6, 14-Apr-16
6
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
REEL DIMENSIONS in millimeters
16734
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
no devices
Leader
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
LABEL
According to DIN EN 60286-3
Standard bar code labels for finished goods
0.1 N to 1.3 N
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
300 mm/min. ± 10 mm/min.
165° to 180° peel angle
Rev. 1.6, 14-Apr-16
7
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITTING
Item-description
Item-number
Selection-code
LOT-/serial-number
Data-code
Plant-code
Quantity
Accepted by
Packed by
Mixed code indicator
Origin
LONG BAR CODE TOP
Item-number
Plant-code
Sequence-number
Quantity
Total length
SHORT BAR CODE BOTTOM
Selection-code
Data-code
Batch-number
Filter
Total length
ABBREVIATION
INO
SEL
BATCH
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx+
TYPE
N
N
X
N
TYPE
X
N
X
-
DRY PACKING
LENGTH
18
8
3
10
3 (YWW)
2
8
Company logo
LENGTH
8
2
3
8
21
LENGTH
3
3
10
1
17
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
Aluminum bag
Label
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
LEVEL
CAUTION
Reel
This bag contains
MOISTURE-SENSITIVE DEVICES
4
15973
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
RECOMMENDED METHOD OF STORAGE
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or
2a. or 2b. are not met.
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C ± 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
• Storage temperature 10 °C to 30 °C
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
• Storage humidity ≤ 60 % RH max.
22522
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
Rev. 1.6, 14-Apr-16
EIA JEDEC standard J-STD-020 level 4 label
is included on all dry bags
8
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSMP77000
www.vishay.com
Vishay Semiconductors
ESD PRECAUTION
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
22178
Rev. 1.6, 14-Apr-16
9
Document Number: 82478
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Disclaimer
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product with the properties described in the product specification is suitable for use in a particular application. Parameters
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operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000