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TECHNICAL DATASHEET
Rev. B
JF24S15-1000
18-36VDC Wide Input Voltage Range
15VDC Output at 1A
DIP and SMT Type Packages
15W Open Frame DC/DC Power Converter
FEATURES
 15 Watts Maximum Output Power
 15VDC Single Output
 Cost Efficient Open Frame Design
 Small Size and Low Profile: 1.10” x 0.94” x 0.34”
 88% High Efficiency
 18-36VDC Input Voltage Range
 Fixed Switching Frequency
 Input to Output Isolation: 2250VDC
APPLICATIONS




Wireless Networks
Telecom / Datacom
Industry Control Systems
Measurement Equipment
 Semiconductor Equipment
 Distributed Power Architectures
OPTIONS
 SMT Type
 Without Trim Pin
 Without ON/OFF Pin
 Negative Logic Remote ON/OFF
 No Minimum Load Requirement
 Output Voltage Adjustability
 Industry Standard Pin-out
 Negative or Positive Remote ON/OFF Control
 Short Circuit, Over Current, Over Voltage, and Input Under
Voltage Protection
 Surface Mount and Through Hole Types Available
 SMT Package Qualified for Lead-free Reflow Solder Process
According to IPC J-STD-020D
 Compliant to RoHS EU Directive 2002/95/EC
 CE Mark Meets 2006/95/EC, 93/68/EEC, and 2004/108/EC
 UL60950-1, EN60950-1, and IEC60950-1 Licensed
DESCRIPTION
The JF24S15-1000 DC/DC power converter provides 15 Watts of output power in a low profile industry standard package
and footprint. This converter has a 15VDC single output and operate over a 2:1 input voltage range of 18-36VDC. The
JF24S15-1000 is also protected against short circuit, over current, over voltage, and input under voltage conditions. Some
features include 88% high efficiency, adjustable output voltage, and positive or negative remote ON/OFF control. This
converter is RoHS compliant and has UL60950-1, EN60950-1, and IEC60950-1 safety approvals. Both surface mount (“S”
suffix) and DIP (standard) packages are available.
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1 of 18
Rev B
TECHNICAL SPECIFICATIONS
TECHNICAL DATASHEET
JF24S15-1000
Model No. JF24S15-1000
All specifications are based on 25°C, Nominal Input Voltage, and Maximum Output Current unless otherwise noted.
We reserve the right to change specifications based on technological advances.
SPECIFICATION
TEST CONDITIONS
Min
Typ
Max
Unit
INPUT SPECIFICATIONS
Input Voltage Range
18
24
36
VDC
Input Current
Nominal input and full load
744
mA
Input Standby Current
Nominal input and no load
15
mA
Input Surge Voltage (100ms)
50
VDC
UVLO Turn-On Threshold
18
VDC
UVLO Turn-Off Threshold
14.5
VDC
Power Up
12
30
Start-Up Time
Nominal input and constant resistive load
ms
Remote ON/OFF
12
30
Input Reflected Ripple Current (See Page 10)
30
mAp-p
OUTPUT SPECIFICATIONS
Output Voltage
Nominal input, full load, and 25°C
14.85
15
15.15
VDC
Line Regulation
Low line to high line at full load
-0.2
+0.2
%
Load Regulation
No load to full load
-0.2
+0.2
%
Voltage Adjustability (See Page 7)
-10
+10
%
Output Power
15
W
Output Current
1
A
Output Capacitor Load
660
µF
Ripple & Noise (See Page 10)
Measured with a 1µF M/C and a 10µF T/C at 20MHz BW
100
125
mVp-p
Output Voltage Overshoot
Low line to high line at full load and 25°C
3
% Vout
Minimum Load
0
%
Transient Response Recovery Time
50% to 75% to 50% load change, ΔIo/Δt=0.1A/µs
300
µs
Temperature Coefficient
-0.02
+0.02
%/°C
REMOTE ON/OFF (See Page 5)
DC/DC ON (Open)
3
15
Positive Logic (standard)
The ON/OFF pin is referenced to -Input
VDC
DC/DC OFF (Short)
0
1.2
DC/DC ON (Short)
0
1.2
Negative Logic (optional)
The ON/OFF pin is referenced to -Input
VDC
DC/DC OFF (Open)
3
15
Input Current of Remote Control Pin
Nominal Input
-0.5
1
mA
Remote Off State Input Current
Nominal Input
20
mA
PROTECTION
Over Voltage Protection
Voltage clamped
16.8
20.5
VDC
Over Current Protection
% of FL at nominal input
1.1
1.25
1.5
A
Short Circuit Protection
Hiccup, automatic recovery
GENERAL SPECIFICATIONS
Efficiency
Nominal input and full load
88
%
Switching Frequency
Nominal input and full load
423
470
517
KHz
Isolation Voltage (Input to Output)
For 1 minute
2250
VDC
Isolation Resistance
10
MΩ
Isolation Capacitance
1000
pF
ENVIRONMENTAL SPECIFICATIONS
Operating Ambient Temperature (See Note 1)
With derating
-40
+85
°C
Storage Temperature
-55
+125
°C
Relative Humidity
5
95
% RH
Thermal Shock
MIL-STD-810F
Vibration
MIL-STD-810F
Lead-Free Reflow Solder Process
IPC J-STD-020D
Moisture Sensitivity Level (MSL)
IPC J-STD-033B Level 2a
BELLCORE TR-NWT-000332, Tc=40°C
2,200,000 hours
MTBF (See Page 17)
MIL-HDBK-217F
1,314,000 hours
PHYSICAL SPECIFICATIONS
Weight
0.36oz (10.5g)
Dimensions (L x W x H)
1.10 x 0.94 x 0.34 inches (27.9 x 23.9 x 8.5 mm)
SAFETY & EMI CHARACTERISTICS
Safety Approvals
IEC60950-1, UL60950-1, EN60950-1
EMI (See Page 11)
EN55022
Class A
Radiated Immunity
EN61000-4-3
10 V/m
Perf. Criteria A
Fast Transient (See Note 2)
EN61000-4-4
±2KV
Perf. Criteria B
Surge (See Note 2)
EN61000-4-5
±1KV
Perf. Criteria A
Conducted Immunity
EN61000-4-6
10 Vrms
Perf. Criteria A
Notes
1. The power module can operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.
2. An external input filter capacitor is required if the module has to meet EN61000-4-4 and EN61000-4-5. The filter capacitor suggested is Nippon Chemi-con KY series
220µF/100V, ESR 48mΩ.
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Page 2 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
MECHANICAL DRAWING
DIP TYPE (Standard)
SMT TYPE (Suffix “S”)
1. Unit: inches (mm)
2. Tolerance: X.XX±0.02 (X.X±0.5)
X.XXX±0.01 (X.XX±0.25)
3. Pin pitch tolerance: ±0.01 (±0.25)
4. Pin dimension tolerance: ±0.004 (±0.1)
PIN CONNECTIONS
ETERNAL OUTPUT TRIMMING
Output can be externally trimmed by using
the method shown below.
TRIM UP
TRIM DOWN
5
6
RU
5
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RD
4
PIN
JF SERIES
1
+INPUT
2
-INPUT
3
CTRL
4
+OUTPUT
5
TRIM
6
-OUTPUT
PRODUCT OPTIONS
Option
Positive Remote ON/OFF with DIP (standard)
Positive remote ON/OFF with SMT
Negative Remote ON/OFF with DIP
Negative Remote ON/OFF with SMT
DIP type without ON/OFF pin
SMT type without ON/OFF pin
DIP type without ON/OFF & TRIM pin
SMT type without ON/OFF & TRIM pin
DIP type, negative remote ON/OFF, without TRIM pin
SMT type, negative remote ON/OFF, without TRIM pin
DIP type, positive remote ON/OFF, without TRIM pin
SMT type, positive remote ON/OFF, without TRIM pin
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Suffix
No Suffix
S
R
SR
D
SD
G
SG
F
SF
J
SJ
Page 3 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
DESIGN CONSIDERATIONS
Output Over Current Protection
When excessive output currents occur in the system, circuit protection is required on all power supplies. Normally,
over load current is maintained at approximately 110~140% of rated current for the JF Series.
Hiccup-mode is a method of operation in a power supply whose purpose is to protect the power supply from being
damaged during an over current fault condition. It also enables the power supply to restart when the fault condition
is removed. There are other ways of protecting the power supply when it is over-loaded such as maximum current
limiting and current foldback methods.
One of the problems resulting from over current is that excessive heat may be generated in the power devices;
especially MOSFET and Schottky diodes and the temperature of those devices may exceed their specified limits. A
protection mechanism has to be used to prevent those power devices from being damaged.
Hiccup operates in the following way. When the current sense circuit sees an over current event the controller
shuts off the power supply for a given time and then tries to start up the power supply again. If the over load
condition has been removed the power supply will start up and operate normally; otherwise, the controller will see
another over current event and shut off the power supply again, repeating the previous cycle. Hiccup operation has
none of the drawbacks of the other two protection methods; although, its circuit is more complicated because it
requires a timing circuit. The excess heat due to overload lasts for only a short duration in the hiccup cycle; hence,
the junction temperature of the power devices is much lower.
The hiccup operation can be done in various ways. One can start hiccup operation any time an over current event is
detected, or prohibit hiccup during a designated start-up which is usually larger than during normal operation and it
is easier for an over current event to be detected, or one can prohibit hiccup during a designated start-up interval
(usually a few milliseconds). The reason for the latter operation is that during start-up, the power supply needs to
provide extra current to charge up the output capacitor. Thus, the current demand during start-up is usually larger
than during normal operation and it is easier for an over current event to occur. If the power supply starts to hiccup
once there is an over current, it might never start up successfully. Hiccup mode protection will give the best
protection for a power supply against over current situations since it will limit the average current to the load at a
low level; therefore, reducing power dissipation and case temperature in the power devices.
Output Over Voltage Protection
The output over voltage protection consists of a Zener diode that monitors the output voltage on the feedback loop.
If the voltage on the output terminals exceeds the over voltage protection threshold, then the Zener diode will send
a current signal to the control IC to limit the output voltage.
Input Source Impedance
The power module should be connected to a low impedance input source. Highly inductive source impedance can
affect the stability of the power module. Input external C-L-C filter is recommended to minimize input reflected
ripple current. The inductor is simulated source impedance of 12μH and capacitor is Nippon chemi-con KZE series
220μF/100V and 33μF/100V. The capacitor must be placed as close as possible to the input terminals of the power
module for lower impedance.
Short Circuit Protection
Continuous, hiccup and auto-recovery mode.
During a short circuit the converter will shut down. The average current during this condition will be very low and
the device can be handled safely in this condition.
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Page 4 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Thermal Consideration
The power module operates in a variety of thermal environments. However, sufficient cooling should be provided
to help ensure reliable operation of the unit. Heat is removed by conduction, convention, and radiation to the
surrounding environment. Proper cooling can be verified by measuring the point shown in the figure below. The
temperature at this location should not exceed 120°C. When operating, adequate cooling must be provided to
maintain the test point temperature at or below 120°C. Although the maximum point temperature of the power
modules is 120°C, you can limit this temperature to a lower value for extremely high reliability.
TOP VIEW
Figure 1
Temperature Measurement Point
Remote ON/OFF Control
The remote ON/OFF pin allows the user to turn the DC/DC power module on and off from a remote switch device.
The ON/OFF input can be switched by a number of switching devices. Figure 2 gives several examples of
acceptable configurations. The remote ON/OFF switch is activated by the voltage difference between the ON/OFF
pin and the –Vin pin (with –Vin as the reference voltage). The user-supplied switch must be capable of sinking up
to 1mA of current at low-level logic voltage. The leakage current of the user-supplied switch must be 0.5mA or
less at 15Vdc.
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Page 5 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Remote ON/OFF Implementation Circuits
Figure 2
Isolated-Closure Remote ON/OFF
Level Control Using TTL Output
Level Control Using Line Voltage
There are two remote control options available: Positive logic and Negative logic
a. The positive logic structure turned the DC/DC module ON when the ON/OFF pin is at high-level logic and
turned the DC/DC module OFF when the ON/OFF pin is at low-level logic.
Figure 3
When JF module is turned OFF at Low-level logic
When JF module is turned ON at High-level logic
b. The negative logic structure turned the DC/DC module ON when the ON/OFF pin is at low-level logic and
turned the DC/DC module OFF when the ON/OFF pin is at high-level logic.
Figure 4
When JF module is turned ON at Low-level logic
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When JF module is turned OFF at High-level logic
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Page 6 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
External Trim Adjustment
Output voltage set point adjustment allows the user to increase or decrease the output voltage set point of a
module. This is accomplished by connecting an external resistor between the TRIM pin and either the +Vout or
-Vout pins. With an external resistor between the TRIM and +Vout pin, the output voltage set point decreases.
With an external resistor between the TRIM and -Vout pin, the output voltage set point increases. The external
TRIM resistor needs to be at least 1/16W.
 (Vout , down  2.5)  10,000

 5110 
Rdown  
(Vout  Vout , down)


 10,000  2.5

 5110
Rup  
 (Vout , up  2.5  12.5)

Vout,up is the desired up output voltage
Vout,down is the desired down output voltage
Trim Resistor Values
Figure 5
-OUTPUT
Rup
-INPUT
TRIM
+INPUT
Rdown
+OUTPUT
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Trim
Vout,up
Rup
Vout,down
Rdown
1%
2%
3%
4%
5%
6%
7%
8%
9%
10%
15.150V
15.300V
15.450V
15.600V
15.750V
15.900V
16.050V
16.200V
16.350V
16.500V
161.557 kΩ
78.223 kΩ
50.446 kΩ
36.557 kΩ
28.223 kΩ
22.668 kΩ
18.700 kΩ
15.723 kΩ
13.409 kΩ
11.557 kΩ
14.850V
14.700V
14.550V
14.400V
14.250V
14.100V
13.950V
13.800V
13.650V
13.500V
818.223 kΩ
401.557 kΩ
262.668 kΩ
193.223 kΩ
151.557 kΩ
123.779 kΩ
103.938 kΩ
89.057 kΩ
77.483 kΩ
68.223 kΩ
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Page 7 of 18
TECHNICAL DATASHEET
Rev B
Graph 1: Efficiency vs. Output Current
JF24S15-1000
Graph 2: Efficiency vs. Input Voltage (Full Load)
88
87.5
87
86.5
86
85.5
85
18
20
22
24
26
28
30
32
34
36
Graph 3: Output Current vs. Ambient Temperature & Airflow
(Nominal Vin)
Graph 4: Typical Output Ripple and Noise
(Nominal Vin and Full Load)
Graph 5: Typical Input Start-Up and Output Rise Characteristic
(Nominal Vin and Full Load)
Graph 6: Using ON/OFF Voltage Start-Up and Output Rise
Characteristic (Nominal Vin and Full Load)
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TECHNICAL DATASHEET
Rev B
Graph 7: Transient Response to Dynamic Load Change
From 75% to 50% to 75% of Full Load
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JF24S15-1000
Graph 8: Conducted Emission of EN55022 Class B
(Nominal Vin and Full Load)
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Page 9 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
TEST SETUP:
The JF24S15-1000 specifications are tested with the following configurations:
Input Reflected-Ripple Current Measurement Test Setup
Figure 6
Component
L
C
C
Value
12μH
220μF
33μF
Voltage
---100V
100V
Reference
---Aluminum Electrolytic Capacitor
Aluminum Electrolytic Capacitor
Peak-to-Peak Output Ripple & Noise Measurement Setup
Figure 7
Figure 8
Output Voltage and Efficiency Measurement Setup
Figure 9
 Vout  Iout 
Efficiency  
  100%
 Vin  Iin 
NOTE: All measurements are taken at the module terminals
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Page 10 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
EMI Considerations:
Suggested Schematic for EN55022 Conducted Emission Class A Limits
C3
L1
+INPUT
+Vin
+Vout
Figure 10
C1
DC/DC CONVERTER
-Vin
-INPUT
Load
-Vout
C2
To meet conducted emissions EN55022 CLASS A the following components are needed:
JF24S15-1000
Component
Value
Voltage
L1
10µH
----
C1
C2, C3
6.8µF
470pF
50V
3KV
Reference
1.4A 0.1Ω 0504 SMD Inductor
P/N: PMT-047
1812 MLCC
1808 MLCC
Recommended Layout with Input Filter
Figure 11
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Page 11 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
EMI Considerations (Continued):
Suggested Schematic for EN55022 Conducted Emission Class B Limits
C5
L1
L2
+Vin
+INPUT
C1
Figure 12
C2
C3
+Vout
DC/DC CONVERTER
-Vin
-INPUT
LOAD
-Vout
C4
To meet conducted emissions EN55022 CLASS B the following components are needed:
JF24S15-1000
Component
L1
Value
145µF
Voltage
----
L2
10µF
----
C1, C2
C3
C4, C5
6.8µF
6.8µF
470pF
50V
50V
3KV
Reference
Common Choke, P/N: PMT-051
1.44A 0.1Ω 0504 SMD Inductor
P/N: PMT-047
1812 MLCC
1812 MLCC
1808 MLCC
Recommended Layout with Input Filter
Figure 13
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Page 12 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Recommended Pad Layout for DIP Type
Figure 14
Recommended Pad Layout for SMT Type
Figure 15
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Page 13 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
Soldering and Reflow Considerations:
Lead Free Wave Solder Profile for DIP Type
Figure 16
Zone
Preheat Zone
Actual Heating
Reference Parameter
Rise temp. speed: 3°C/sec max.
Preheat temp: 100~130°C
Peak temp: 250~260°C
Peak time (T1+T2 time): 4~6 sec
Lead free reflow profile for SMT type
Figure 17
Zone
Preheat Zone
Actual Heating
Cooling
Reference Parameter
Rise temp. speed: 1~3°C/sec
Preheat time: 60~120sec
Preheat temp.155~185°C
Rise temp. speed: 1~3°C/sec
Melting time: 30~60 sec Melting temp: 217°C
Peak temp: 240~245°C
Peak time: 10 sec max
Rise temp. speed: -1~ -5°C/sec
NOTES:
1. Reference Solder: Sn-Ag-Cu
2. The curves define the maximum peak reflow temperature permissable to be measured on pin 1 or Vin pin of the DC/DC converter
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Page 14 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Cleaning & Drying Considerations:
Cleaning
a. PWB Cooling Prior to Cleaning:
Power modules and their associated application PWB assemblies should not be wash-cleaned after soldering
until the power modules have had an opportunity to cool to within the cleaning solution temperature. This will
prevent vacuum absorption of the cleaning liquid into the module between the pins and the potting during
cooling.
b. Cleaning Process
In aqueous cleaning, it is preferred to have an in-line cleaner system consisting of several cleaning stages
(prewash, wash, rinse, final rinse, and drying). Deion-ized (DI) Water is recommended for aqueous cleaning, the
minimum resistivity level is 1MΩ-cm. Tap-water quality varies per region in terms of hardness, chloride, and
solid contents, therefore, the use of tap water is not recommended for aqueous cleaning. The total time of
ultrasonic wave shall be less than 3 minutes.
Drying
After cleaning, dry converters at 100°C, more than 10 minutes to assure that the moisture and other potential
foreign contaminants are driven out. For open power module constructions with magnetic structures (transformers
and inductors) that have unspotted windings, a baking process of 100°C for 30 min. is recommended for the
assembly to ensure that the moisture and other potential foreign contaminants are driven out from the open
windings.
The drying section of the cleaner system should be equipped with blowers capable of generating 1000CFM1500CFM of air so that the amount of rinse water left to be dried off with heat is minimal. Handheld air guns are
not recommended due to the variability and consistency of the operation.
Product Post-Wash External Appearance
The marking or date-code may fade or disappear after cleaning. This is not a problem on the converter’s
characteristics.
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Page 15 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Packaging Information:
DIP Type
Figure 18
SMT Type
Figure 19
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Page 16 of 18
TECHNICAL DATASHEET
Rev B
JF24S15-1000
Safety and Installation Instructions:
Isolation Consideration
The JF series features 2250VDC isolation from input to output. The input to output resistance is greater than
10MΩ. If the system using the power module needs to receive safety agency approvals certain rules must be
followed in the design of the system using this model. In particular, all of the creepage and clearance requirements
of the end-use safety requirements must be observed. These documents include UL60950-1, EN60950-1, and CSA
22.2-960, although specific applications may have other or additional requirements.
Fusing Consideration
Caution: This power module is not internally fused. An input line fuse must always be used.
This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of sophisticated power architecture. To maximum flexibility, internal fusing is not
included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety
agencies require a normal-blow fuse with maximum rating of 2A for JF24Sxx-xxxx modules and 1A for JF48Sxxxxxx modules. Based on the information provided in this data sheet on Inrush energy and maximum DC input
current; the same type of fuse with lower rating can be used. Refer to the fuse manufacturer’s data for further
information.
MTBF and Reliability
The MTBF of the JF Series of DC/DC converters has been calculated using Bellcore TR-NWT-000332 Case I:
50% stress, Operating Temperature at 40°C (Ground fixed and controlled environment). The resulting figure for
MTBF is 2.2 × 106 hours.
MIL-HDBK 217F NOTICE2 FULL LOAD, Operating Temperature at 25°C. The resulting figure for MTBF is
1.3 × 106 hours.
Ordering Information
Part Number Example:
JF 24 S 15 – 1000 S
Series
Designation
Maximum Output
Current (mA)
Nominal Input
Voltage
Single Output
Nominal Output
Voltage
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PRODUCT OPTIONS
Option
Positive Remote ON/OFF with DIP (standard)
Positive remote ON/OFF with SMT
Negative Remote ON/OFF with DIP
Negative Remote ON/OFF with SMT
DIP type without ON/OFF pin
SMT type without ON/OFF pin
DIP type without ON/OFF & TRIM pin
SMT type without ON/OFF & TRIM pin
DIP type, negative remote ON/OFF, without TRIM pin
SMT type, negative remote ON/OFF, without TRIM pin
DIP type, positive remote ON/OFF, without TRIM pin
SMT type, positive remote ON/OFF, without TRIM pin
Suffix
No Suffix
S
R
SR
D
SD
G
SG
F
SF
J
SJ
Page 17 of 18
Rev B
TECHNICAL DATASHEET
JF24S15-1000
Company Information
Wall Industries, Inc. has created custom and modified units for over 50 years. Our in-house research and development
engineers will provide a solution that exceeds your performance requirements on-time and on budget. Our ISO9001-2008
certification is just one example of our commitment to producing a high quality, well-documented product for our customers.
Our past projects demonstrate our commitment to you, our customer. Wall Industries, Inc. has a reputation for working
closely with its customers to ensure each solution meets or exceeds form, fit and function requirements. We will continue to
provide ongoing support for your project above and beyond the design and production phases. Give us a call today to discuss
your future projects.
Contact Wall Industries for further information:
Phone:
Toll Free:
Fax:
E-mail:
Web:
Address:
(888) 597-WALL
(603)778-2300
(888)587-9255
(603)778-9797
[email protected]
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5 Watson Brook Rd.
Exeter, NH 03833
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