TSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network (Standard) FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) Actual Size Available • Exceptional ratio stability over time and temperature (R ± 0.015 % 2000 h at 70 °C) Available • Rugged low profile molded case 6 pins, 8 pins, and 10 pins available Designed to meet MIL-PRF-83401 characteristic “V” and “H” These resistor networks are available in 6 pins, 8 pins and 10 pins styles in both standard and custom circuits. They incorporate Vishay Dale Thin Film’s patented passivated nichrome film to give superior performance on temperature coefficient of resistance, thermal stability, noise, voltage coefficient, power handling and resistance stability. The leads are attached to the metallized alumina substrates by Thermo-Compression bonding. The body is molded thermoset plastic with gold plated copper alloy leads. This product will outperform all of the requirements of characteristic “V” and “H” of MIL-PRF-83401. • Compatible with automatic insertion equipment • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information/tables in this datasheet for details. TYPICAL PERFORMANCE ABSOLUTE TCR TOL. TRACKING 25 2 ABSOLUTE RATIO 0.1 0.05 SCHEMATIC Schematic 01 1 2 3 4 Schematic 03 N 1 2 3 4 Schematic 06 N-1 N 1 2 3 4 N STANDARD ELECTRICAL SPECIFICATIONS TEST Material Pin/Lead Number Resistance Range TCR: Absolute TCR: Tracking Tolerance: Absolute Tolerance: Ratio Power Rating: Resistor Power Rating: Package Stability: Absolute Stability: Ratio Voltage Coefficient Working Voltage Operating Temperature Range Storage Temperature Range Noise Thermal EMF Shelf Life Stability: Absolute Shelf Life Stability: Ratio SPECIFICATIONS Passivated nichrome 6, 8, 10 100 to 200 k per resistor ± 25 ppm/°C (standard) ± 2 ppm/°C (typical less 1 ppm/°C equal values) (1) ± 0.1 % to ± 1.0 % ± 0.05 % to ± 0.1 % to R1 0.100 W (per element typical at + 25 °C) 0.500 W R ± 0.05 % R ± 0.015 % < 0.1 ppm/V 100 V - 55 °C to + 125 °C - 55 °C to + 125 °C < - 30 dB < 0.08 μV/°C R ± 0.01 % R ± 0.002 % CONDITIONS - 55 °C to + 125 °C - 55 °C to + 125 °C + 25 °C + 25 °C Maximum at + 70 °C Maximum at + 70 °C 2000 h at + 70 °C 2000 h at + 70 °C 1 year at + 25 °C 1 year at + 25 °C Note (1) Consult factory for TCR tracking specifications 01 schematic Revision: 21-Oct-13 Document Number: 60037 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSP www.vishay.com Vishay Dale Thin Film DIMENSIONS AND IMPRINTING in inches and millimeters Part Number L Indicates Pin 1 G Date Code Vishay Logo DIMENSION A B C D E F G H L (6 Pins) L (8 Pins) L (10 Pins) E A F B H C D INCHES 0.035 0.040 0.100 ± 0.005 non-accum. 0.019 ± 0.006 typical 0.187 ± 0.010 0.135 0.095 0.012 ± 0.004 0.583 ± 0.015 0.783 ± 0.015 0.983 ± 0.015 MILLIMETERS 0.89 1.02 2.54 ± 0.13 0.48 ± 0.15 4.75 ± 0.25 3.43 2.41 0.31 ± 0.10 14.81 ± 0.38 19.89 ± 0.38 24.97 ± 0.38 CONSTRUCTION High Purity Alumina Substrate Gold Plated Copper Leads Sputtered TAMELOX Film System Gold to Gold Thermo-Compression Bond (No Internal Solder) MECHANICAL SPECIFICATIONS Resistive Element Substrate Material Body Molded Terminals Plating Model TSP - Lead (Pb)-free Standard Model TSPS - Lead (Pb)-free Solder Coated Option Model TSPL - Tin/Lead Solder Coated Option Tin/Lead and Lead (Pb)-free Finish Passivated nichrome or tantalum nitride Alumina Epoxy Copper alloy Nickel/gold Gold plated Sn96.5, Ag3.0, Cu0.5 Sn63 Hot solder dip GLOBAL PART NUMBER INFORMATION New Global Part Numbering: TSP6011002BUF T T S P S P S 6 1 GLOBAL MODEL PIN COUNT (3 or 4 digits) (1 or 2 digits) TSP (Lead (Pb)-free) (e4) TSPL (Tin/lead) TSPS (Lead (Pb)-free) (e1) 6 8 10 0 SCHEMATICS 01 (1) = 5, 7 or 9 resistors with Pin 1 common 03 = 3, 4 or 5 isolated resistors 06 = 5, 7 or 9 series connected 0 1 1 0 0 2 B U F 0 1 1 0 0 2 C U F TCR CHARACTERISTICS ppm/°C (2) R = ± 25 H = ± 50 ppm/°C K = ± 100 ppm/°C Note 01 Schematic greater than 250 only (2) Note Consult factory for TCR tracking specifications 01 schematic (1) RESISTANCE First 3 digits are significant figures and the last digit specifies the number of zeroes to follow. e.g.: 1001 = 1K 1002 = 10K TOLERANCE AND RATIO TOLERANCE Absolute A = 0.1 % (3) B = 0.1 % C = 0.25 % D = 0.5 % F = 1.0 % Ratio 0.05 % 0.1 % 0.1 % 0.1 % 0.5 % PACKAGING UF = Tubed Note (3) Tol. available on 1K and up only. R is reference resistor. 1 Historical Part Number example: TSP803R1001F (for reference purposes only) TSP SERIES Revision: 21-Oct-13 8 PINS 03 R SCHEMATIC TCR CHARACTERISTIC 1001 F RESISTANCE TOLERANCE AND RATIO TOLERANCE Document Number: 60037 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TSP www.vishay.com Vishay Dale Thin Film DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 Revision: 21-Oct-13 0 25 50 70 Ambient Temperature °C 100 125 Document Number: 60037 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000