CTR (Low Ohms) Datasheet

CTR (Low Ohms)
www.vishay.com
Vishay Electro-Films
Thin Film Low Ohmic Value Resistor Divider Network
FEATURES
• Wire bondable
• Resistance range total: 1  to 9.9 
• Center tap
• Chip size: 0.030" x 0.030"
• Case: 0303
Product may not be to scale
The CTR low ohm series provides a center tap option down
to 1  for non-critical tolerance applications.
• Oxidized silicon substrate for good power dissipation
The CTRs are manufactured using Vishay Electro-Films (EFI)
sophisticated thin film equipment and manufacturing
technology. The CTRs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
• Resistor material: Tantalum nitride, self passivating
APPLICATIONS
For low values, the resistance of the six bonding pad
configurations can vary, depending on the method of
measurement used. Vishay EFI measures low value resistors
by the four-wire kelvin technique using the method
illustrated in the measurement schematic for resistors of
less than 10.
Consult Vishay EFI Applications Engineering for alternate
measurement method if tighter requirements are needed.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
VALUE
Total Resistance Range
1 to 9.9

Standard Tolerances
± 1, ± 5
%
± 100, + 600
ppm/°C
TCR
UNIT
Tightest Standard Tolerance Available
1.0 %
5%
± 100 ppm/°C
+ 600 to - 100 ppm/°C
1Ω
5.1 Ω
9.9 Ω
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
TCR Tracking Between Halves (RA/RB)
Voltage Ratio, RA/RB: Tolerance
Noise, MIL-STD-202, Method 308
Stability, 1000 h, + 125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
DC Power Rating at 70 °C (derated to zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
Revision: 25-Feb-13
VALUE
UNIT
± 200 typ.
ppm/°C
1±5
%
- 20 typ.
dB
± 0.25 ± 0.01 max. R/R
%
- 55 to + 125
°C
± 0.1 max. R/R
%
± 0.2 + 0.01 max. R/R
%
0.25
W
± 0.1 max. R/R
%
Document Number: 61028
1
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CTR (Low Ohms)
www.vishay.com
Vishay Electro-Films
DIMENSIONS in inches
0.005
0.030
TYPICAL RANGE
1 Ω to 6.7 Ω
TYPICAL RANGE
6.8 Ω to 9.9 Ω
SCHEMATIC
R T = RA + R B
V
I
RA
RB
I
V
V
MECHANICAL SPECIFICATIONS
PARAMETER
VALUE
Chip Size
0.030" x 0.030" ± 0.002" (0.762 mm x 0.762 mm ± 0.050 mm)
Chip Thickness
0.010" ± 0.002" (0.254 mm ± 0.05 mm)
Chip Substrate Material
Oxidized silicon, 10 kÅ minimum SiO2
Resistor Material
Tantalum nitride, self-passivating
Bonding Pad Size
0.005" x 0.005" (0.127 mm x 0.127 mm) min.
Number of Pads
6
Pad Material
10 kÅ minimum Al (Au optional)
Backing
None, lapped semiconductor silicon
GLOBAL PART NUMBER INFORMATION
Global Part Number: CTR5000CKNZNANHWS
Global Part Number Description: CTR 5K 10 % No ratio + 600/- 100 ppm/°C None Al No back metal H WS
C
T
MODEL
CTR
R
RESISTANCE
(R TOTAL)
First 4
digits are
significant
figures of
resistance
Revision: 25-Feb-13
5
0
0
0
C
RESISTANCE
MULTIPLIER
CODE
TOL.
CODE
(%)
RATIO
TOL.
(%)
C = 0.001
B = 0.01
F = 1.0
G = 2.0
J = 5.0
K = 10.0
M = 20.0
F = 1.0
G = 2.0
J = 5.0
N = No
K
TCR
(ppm/°C)
K = ± 100
M = ± 250
T = + 300/
- 100
Z = + 600/
- 100
N
TCR
TRACK
(ppm/°C)
N = No
Z
N
A
TERMINATION
G = Au
A = Al
N
BACK
METAL
H
W
S
VISUAL PACKAGING
CLASS
CODE
G = Au
H=
N = None Class H
K=
Class K
WS =
Waffle pack
100 min.,
1 mult
Document Number: 61028
2
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000