HFA3767 ® Data Sheet P RE L I M I N A RY February 1998 130MHz CDMA/AMPS Quadrature Modulator and AGC Features • I/Q Amplitude and Phase Balance . . . . . . . . . . . 0.5dB, 2o The HFA3767 is a monolithic bipolar quadrature modulator with gain control for CDMA/AMPS cellular applications. An upconverter quadrature mixer and an output gain control stage with better than 70dB of dynamic range are integrated in the design. A local oscillator input requires low drive levels and a divide by two phase shifter with duty cycle compensation achieves excellent phase and amplitude balance properties. The HFA3767 is one of the four chips in the PRISM™ chip set and is housed in a 20 lead SSOP package ideally suited to cellular handset applications. • 130MHz AGC Amplifier/Attenuator range . . . . . . . .>70dB • Low LO Drive Level . . . . . . . . . . . . . . . . . . . . . . . .-10dBm • Power Enable/Disable Control • Single Supply Battery Operation . . . . . . . . . . . 2.7 to 3.3V Applications • IS95A CDMA/AMPS Dual Mode Handsets • Wideband CDMA Handsets • Full Duplex Transceivers • CDMA/TDMA Packet Protocol Radios Ordering Information PART NUMBER FN4298.3 • Portable Battery Powered Equipment TEMP. RANGE (oC) PACKAGE HFA3767IA -40 to 85 20 Ld SSOP HFA3767IA96 -40 to 85 Tape and Reel PKG. NO. Pinout M20.15 HFA3767 (SSOP) TOP VIEW Simplified Block Diagram TXI TX_PE 1 20 VCC GND 2 19 AGC_CTRL TXI+ 3 18 GC TXI- 4 IF LO ∑ ÷2 0/90 o IF OUTPUT TXQ BIAS NETWORK TX_PE 17 AGC_VCC NC 5 16 TX_IF- TXQ- 6 15 TX_IF+ TXQ+ 7 14 AGC_GND MIX_GND 8 13 CAP DPS_GND 9 12 LO_IN DPS_VCC 10 11 LO_GND AGC_CTRL 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002. All Rights Reserved PRISM® is a registered trademark of Intersil Americas Inc. PRISM and design is a trademark of Intersil Americas Inc. HFA3767 Pin Descriptions PIN NUMBER NAME 1 TX_PE 2 GND Bias and AGC control ground return. 3 TXI+ Positive I channel baseband input. Requires a 1.2VDC common mode bias voltage. 4 TXI- Negative I channel baseband input. Requires a 1.2VDC common mode bias voltage. 5 NC No connect pin. Tie to ground to improve isolation from I to Q channels. 6 TXQ- Negative QI channel baseband input. Requires a 1.2VDC common mode bias voltage. 7 TXQ+ Positive Q channel baseband input. Requires a 1.2VDC common mode bias voltage. 8 MIX_GND Quadrature Mixers ground return. 9 DPS_GND Digital Phase shifter ground return. 10 DPS_VCC Digital Phase Shifter Power Supply. Use high quality RF decoupling capacitors right at the pin. 11 LO_GND Local Oscillator Input ground return. 12 LO_IN 13 CAP 14 AGC_GND 15 TX_IF+ Positive IF output port. Requires a DC return to VCC thru a choke or match inductor. 16 TX_IF- Negative IF output port. Requires a DC return to VCC thru a choke or match inductor. 17 AGC_V CC AGC circuit Power Supply.Use high quality RF decoupling capacitors right at the pin. 18 GCT 19 AGC_CTRL 20 VCC 2 DESCRIPTION Power enable control input. HIGH for normal operation. LOW for power down. Local Oscillator Current Input. Use a 50Ω power to current converter.See applications diagram. AGC Bias circuit filter capacitor. Typical value of 1000pF to 10000pF. AGC circuit ground return. Gain and temperature compensation external resistor. See applications diagram. AGC control input. Require a 1% resistor divider at this input. See applications diagram. Bias and AGC control Power Supply.Use high quality RF decoupling capacitors right at the pin. HFA3767 Absolute Maximum Ratings TA = 25oC Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V Voltage on Any Other Pin . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Operating Conditions Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 3.3V Temperature Range. . . . . . . . . . . . . . . . . . . . . . .-40oC ≤ TA ≤ 85oC Thermal Information θJA ( oC/W) Thermal Resistance (Typical, Note 1) SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . -65oC ≤ TA ≤ 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VCC = 2.7V to 3.3V, LO_IN = -10dBM at 260MHz. Refer to Applications diagram PARAMETER TEST CONDITIONS (NOTE 2) TEST LEVEL TEMP (oC) MIN TYP MAX UNITS CDMA MODE SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500KHz in Quadrature (SSB Output) Output Power into 50Ω Vagc = 0.5V , Output from 400 to 50Ω Differential to single end converter (0dB Attenuation) P1dBO/Output Power Ratio Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 10dB of attenuation Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 20dB of attenuation Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 30dB of attenuation Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 40dB of attenuation Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 50dB of attenuation Output Noise Floor P1dBO/Output Power Ratio AGC_CTRL set for 70dB of attenuation Output Noise Floor A 25 -13.1 -12.7 -12.3 dBm A Full 8 12.4 - dB B 25 - -142.3 -140 dBm/Hz B Full 8 12.4 - dB B 25 - -144 - dBm/Hz B 25 8 12.4 - dB B 25 - -148.5 - dBm/Hz B 25 8 12.4 - dB B 25 - -153.4 - dBm/Hz A Full 8 12.4 - dB B 25 - -160 - dBm/Hz A Full 8 12.4 - dB B 25 - -163 - dBm/Hz B 25 8 12.4 - dB B 25 - -165 -162 dBm/Hz FM MODE SPECIFICATIONS Q INPUT ONLY at 0.44VPP DC Differential at Q Input. Commom Mode Voltage at I Input Output Power into 50Ω Vagc = 0.5V , Output from 400 to 50Ω Differential to single end converter (0dB Attenuation) P1dBO/Output Power Ratio Output Noise Floor A Full -10.2 -9.76 -9.3 dBm A Full 7 10.2 - dB B 25 - -142.3 -140 dBm/Hz GENERAL SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500kHz in Quadrature (SSB Output) AGC Gain Control Voltage A 25 0.5 - 2.4 V AGC Gain Control Sensitivity B 25 - 50 - dB/V AGC Gain Control Input Impedance Externally set C 25 - 18 - kΩ AGC Switching Speed, Full Scale To ±1dB Settling B 25 - - 10 µs 3 HFA3767 Electrical Specifications VCC = 2.7V to 3.3V, LO_IN = -10dBM at 260MHz. Refer to Applications diagram (Continued) PARAMETER TEST CONDITIONS (NOTE 2) TEST LEVEL TEMP (oC) MIN TYP MAX UNITS AGC Insertion Phase 20dB step B 25 - 1.6 - deg/dB IF Frequency Range Applications diagram B 25 - 130 - MHz GENERAL SPECIFICATIONS: I AND Q INPUTS at 0.63VPP Sinusoidal, 500kHz in Quadrature (SSB Output) TX_IF Single End Equivalent Series R 130MHZ, IF+ or IF- B 25 - 115 - W TX_IF Single End Equivalent Series C 130MHz, IF+ or IF- B 25 - 4.9 - pF B 25 DC - 1.0 MHz Baseband Frequency Range LO Frequency Range Applications diagram A 25 - 260 - MHz Amplitude Balance (Note 3) Deviation from ideal SSB characteristics AGC_CTRL = 0.5V B 25 -0.5 - +0.5 dB B 25 -2 - +2 Degrees A Full 32 35 - dBc (Vagc = 0.5V) (0dB attenuation) A 25 -30 - - dBc AGC_CTRL set for 20dB attenuation A 25 -30 - - dBc AGC_CTRL set for 70dB attenuation B 25 -29 - - dBc LO Input Impedance Single end C 25 - 130 - Ω LO Drive Level Applications diagram A 25 - -10 - dBm LO Drive Optimal Current Range B 25 50 200 300 µArms Baseband Differential Input Impedance C 25 2K - - Ω A Full 1.14 1.20 1.26 V B 25 2.7 - 3.3 V AGC_CTRL = 0.5V A Full - - 40 mA AGC_CTRL = 2.4V A Full - - 25 mA TX_PE = Low A 25 - - 100 µA Power Down Speed B Full - - 10 µs TX_PE VIL A Full - - 0.8 V TX_PE VIH A Full 2.0 - - V PE = 2.0V A Full -50 - +50 µA PE = 0.66V, 2.7VCC A Full -50 - +50 µA Phase Balance (Note 3) Single Sideband Suppression Carrier Suppression VCM Common Mode Input Voltage Into I+, I-, Q+ and Q- POWER SUPPLY AND LOGIC SPECIFICATIONS Supply Voltage Range Supply Current at 3.3V Power Down Supply Current TX_PE Input Bias Current at VCC = 3.3V NOTES: 2. A = Production Tested, B = Based on Characterization, C = By Design 3. I leading Q produces a positive frequency offset from the carrier (USB).Test garanteed by sideband suppression. 4 HFA3767 Applications Diagram VCC .01 BEAD .1 0.03 POWER ENABLE 1 TX_PE AGC_CTRL BIAS CONTROL TXI- I- 3.6k 1% 3.6k 1% GC AGC_VCC TX_IF- NC ∑ TXQ- Q- 1000p 4.7p IF- TXQ+ 100p 4.7p AGC_GND MURATA LFSH33 0.01 CAP MIX_GND 0o/90o DPS_GND 0.03 100p DPS_VCC IF+ TX_IF+ 0.03 Q+ 180n TXI+ I+ AGC_CTRL 180n GND 15K 1% VCC ÷2 LO_IN 220 1000p LO_GND LO_IN 56 VCC TEST OUTPUT NETWORK DIFFERENTIAL TO 50Ω SINGLE END CONVERTER (1.1dB INSERTION LOSS) 220n 220n 4p 50Ω OUTPUT TX_IFMINI CIRCUITS. TC8-1 TX_IF+ 4p 5 HFA3767 Shrink Small Outline Plastic Packages (SSOP) M20.15 N INDEX AREA H 0.25(0.010) M 20 LEAD SHRINK NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E GAUGE PLANE -B- INCHES SYMBOL 1 2 3 L 0.25 0.010 SEATING PLANE -A- h x 45o A D -C- e α B 0.17(0.007) M A2 A1 C 0.10(0.004) C A M B S NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm (0.004 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact. 6 MIN MAX MILLIMETERS MIN MAX NOTES A 0.053 0.069 1.35 1.75 - A1 0.004 0.010 0.10 0.25 - A2 - 0.061 - 1.54 - B 0.008 0.012 0.20 0.30 9 C 0.007 0.010 0.18 0.25 - D 0.337 0.344 8.56 8.74 3 E 0.150 0.157 3.81 3.98 4 e 0.025 BSC 0.635 BSC - H 0.228 0.244 5.80 6.19 - h 0.0099 0.0196 0.26 0.49 5 L 0.016 0.050 0.41 1.27 6 N α 20 0o 20 8o 0o 7 8o Rev. 0 5/96