CC CC 31 OPPER CLAD LAMINATE ATALOGUE R-8705 EF (FR-1) ( DOUBLE SIDE ) V-0 Silver Through Holes u_FEATURES 1) High quality for heat and humidity resistance -Suitable for Lead Free Reflow Soldering .Instead at Reflow peak temperature 250 oC 2 time. 2) Perfect for silver through-hole printed circuit board -Excellent migration resistance to silver, having high humidity resistance and strong reliability for printed circuit boards having circuits of silver through-holes. 3) No retardant agent with halogen is absorbed. 4) Excellent punching workability. u_APPLICATIONS -VTR, CD player, Telephone, Game equipment, Computer devices, etc. u SPECIFICATIONS Standard Panel Size Stand Panel Size (Length X Width) (Length X Width Copper Foil 0.035 mm. (35µm.) 1,020 20 X1,020 20 2 1,22020 X1,020 0 Note : Manufacturing Copper Foil Manufacturing Thickness Thickness Thickness Thickness 0.035mm(35µm) mm 1.00.8 mm. 1.0mm Warp/Twist Tolerance Thickness Tolerance Tolerance of Warp/Twist Standard Special Products (%) Thickness Tolerance (%) Products ±0.10mm ±0.12 ±0.10mm ±2 Less than 14.0% ±0.12mm ±0.11mm 1.2 mm. ±0.13 ±2 Less than 12.0% 1.2mm ±0.13mm ±0.11mm 1.6 1.6mm mm. ±0.14 ±0.14mm Less than 10.0% ±0.13mm ±2 2.0 2.0mm mm. ±0.16mm ±0.14mm ±0.16 ±2 ±2 Less than 7.0% 1) Measured thickness on 10 points according to JISC-6481-5.3.3, 9 of them were in above margin tolerance, out of tolerance referred to within 125% of margin tolerance. 2) For thickness positioned between the nominal thickness, the tolerance for the next thicker value applies. 3) Copper foil thickness is included. 4) For thickness positioned between the nominal thickness, the twist and warp tolerance for the next thicker value applies. 4Double side for PbH Solder Reflow R8705 EF 1.Able to correspond Lead Free Solder Reflow : 250℃/2 times 2.Excellent Silver through hole Trust Reflow Heat Resistance Evaluated result (Measuring Value) ： No Blister × ： Blister PCB Sureface Peak Temperature (℃) 240 245 250 255 Tickness : 1.6 mm C OPPER CLAD LAMINATE Reflow frequency ( times) 1 time 2 times 1 time 2 times 1 time 2 times 1 time 2 times R8705EF R8705 Ο Ο Ο Ο Ο Ο Ο X Ο Ο Ο Ο Ο X X X CC CC 32 OPPER CLAD LAMINATE ATALOGUE u_GENERAL PROPERTIES1 Test Item Volume Resistance Surface Resistance MW∙m MW Treatment Conditions C-96/20/65 Actual Value Assured Value 8x105 Above 5x104 C-96/20/65+C96/40/90 5x105 Above 5x103 C-96/20/65 5x106 Above 1x105 C-96/20/65+C96/40/90 1x106 Above 1x104 C-96/20/65 7x106 Above 1x105 C-96/20/65+D2/100 5x104 Above 1x103 Insulation Resistance MW C-96/20/65 4.4 Less than 5.3 Dielectric Constant(1MHz) - C-96/20/65+D24/23 4.5 Less than 5.6 C-96/20/65 0.032 Less than 0.045 Dissipation Factor(1MHz) - C-96/20/65+D24/23 0.033 Less than 0.055 Solder Heat Resistance (260°C) Seconds A 50 Above 10 A 20.0(2.0) Above 14.7(1.5) S2 20.0(2.0) Above 14.7(1.5) 200°C30min, 190°C30min, No blistering No blistering Peel Strength (copper foil 0.035 mm) N/cm(N/mm) Heat Resistance - A Flexure Strength (Crosswise direction) N/mm2 A 160 Above 98 Water Absorption % E-24/50+D-24/23 0.4 Less than 0.75 Flame Resistance - A+E-168/70 Punching process - A 94V-0 Suitable temperature 50~80°C 94V-0 Suitable temperature 50~80°C NaOH Resistance - Dip (3min) Normal Normal Tracking Resistance (IEC method) CTI A 600 - Note : C Unit 1) Test piece thickness is 1.6 mm. 2) The above test methods are accordance with JIS-C6481. However, flame resistance is in accordance with UL94, and optimum punching temperature would be determined by internal standard test method. 3) Details of test methods and treatment conditions are available on request OPPER CLAD LAMINATE CC CC OPPER CLAD LAMINATE C OPPER CLAD LAMINATE ATALOGUE 33 CC CC OPPER CLAD LAMINATE ATALOGUE 34