CC CC 34 OPPER CLAD LAMINATE ATALOGUE R-8700 EF (FR-1) ( SINGLE SIDE ) Lead Free Reflow Soldering Material u_FEATURES 1) Excellent Heat resistance. Capable of Lead Free Soldering Re-flow ( 250°C/ 2 times). 2) Low warp when re-flow. 3) Excellent long term electric reliability. 4) Low Radiation volume of Formaldehyde・phenol. 5) Other general characteristics, workability are equivalent to our R-8700 u_APPLICATIONS -TV, VTR, Audio Device, Game Device, Remote control, etc. u SPECIFICATIONS Stand Panel Size Standard Panel Size (Length XWidth) Width (Length X Copper Foil Copper Foil Thickness Thickness Manufacturing Manufacturing Thickness Thickness 0.8 mm. 1,020 20 X1,020 20 2 1,22020 X1,020 0 0.035 mm. 0.035mm(35µm) (35µm.) Thickness Standard Special Products Products ±0.10 Warp/Twist Tolerance Rate (%) (%) Less than 14.0% 0.8 mm ±0.10mm 1.0mm 1.0 mm. ±0.12mm 1.2mm ±0.13mm 1.6mm ±0.14mm 1.6 mm. 2.0mm ±0.16mm ±0.14 ±0.14mm Less than 10.0% ±2 1.2 mm. 2.0 mm. Note : Warp/Twist Thickness Tolerance Tolerance of ±0.10mm ±2 ±0.12 ±0.11mm Less than 14.0% ±2 ±0.13 ±0.11mm ±2 Less than 12.0% ±0.13mm ±0.16 ±2 Less than 7.0% 1) Measured thickness on 10 points according to JISC-6481-5.3.3, 9 of them were in above margin tolerance, out of tolerance referred to within 125% of margin tolerance. 2) For thickness positioned between the nominal thickness, the tolerance for the next thicker value applies. 3) Copper foil thickness is included. 4) For thickness positioned between the nominal thickness, the twist and warp tolerance for the next thicker value applies. 4Single side for PbH Solder Reflow R8700 EF 1.Single side for Pb Free Reflow Soldering R8700 EF : 250℃、2times 2.Warpage after reflow is smaller. 3.Decrease VOC (Formal dehyde,Phenol) Reflow Heat Resistance Evaluated result (Measuring Value) O ： No Blister × ： Blister PCB Sureface Peak Temperature (℃) 245 250 255 Tickness : 1.6 mm C OPPER CLAD LAMINATE Reflow frequency ( times) 1 time 2 times 1 time 2 times 1 time 2 times R8700EF R8700 Ο Ο Ο Ο Ο X Ο Ο Ο X X X CC CC 35 OPPER CLAD LAMINATE ATALOGUE u_GENERAL PROPERTIES1 Test Item Volume Resistance Treatment Conditions C-96/20/65 Unit MW∙m Surface Resistance - Adhesive sureface -Laminate surface 8x105 Above 5x104 C-96/20/65+C96/40/90 5x105 Above 5x103 C-96/20/65 5x106 Above 1x105 C-96/20/65+C96/40/90 1x106 Above 1x104 C-96/20/65 1x105 Above 1x104 C96/20/65+C96/40/90 1x105 Above 1x102 C-96/20/65 7x106 Above 1x105 C-96/20/65+D2/100 5x104 Above 1x103 C-96/20/65 4.4 Less than 5.3 C-96/20/65+D24/23 4.5 Less than 5.6 MW Dielectric Constant(1MHz) - C-96/20/65 0.032 Less than 0.045 Dissipation Factor(1MHz) - C-96/20/65+D24/23 0.033 Less than 0.055 Solder Heat Resistance (260°C) Seconds A 40 Above 10 A 20.0(2.0) Above 14.7(1.5) S2 20.0(2.0) Above 14.7(1.5) 200°C30min, 190°C30min, No blistering No blistering A 160 Above 118 0.6 Less than 0.75 94V-0 Suitable temperature 50~80°C 94V-0 Suitable temperature 50~80°C Peel Strength Heat Resistance Flexure Strength (Crosswise direction) N/cm(N/mm) - A 2 N/mm Water Absorption % E-24/50+D24/23 Flame Resistance - A+E-168/70 Punching process - A NaOH Resistance - Dip (3min) Normal Normal Tracking Resistance (IEC method) CTI A 600 - 1) Test piece thickness is 1.6 mm. 2) The above test methods are accordance with JIS-C6481. However, the punching process would be determined by internal standard test method. 3) Details of test methods and treatment conditions are available on request. COPPER CLAD LAMINATE CATALOGUE C MW Assured Value Insulation Resistance (copper foil 0.035 mm) Note : MW Actual Value OPPER CLAD LAMINATE 39 CC CC OPPER CLAD LAMINATE C OPPER CLAD LAMINATE ATALOGUE 36 CC CC OPPER CLAD LAMINATE ATALOGUE 37