Recommended Wave Soldering Profile Limiting Values* Profile Feature SnPb eutectic assembly Pb-free assembly Average ramp-up rate ~ 200 °C/s ~ 200 °C/s Heating rate during preheat typical 1-2, max 4 °C/s typical 1-2, max 4 °C/s Final preheat temperature TS ~ 130 °C ~ 130 °C Peak temperature TP 235 °C 260 °C Time within peak temperature tP 10 s 10 s Ramp-down rate 5 °C/s maximum 5 °C/s maximum * applicable for devices from NXP Business Line GA Discretes. Wave Soldering Profile temperature tp Tp second wave first wave Ts preheat ramp-down 25 °C time All information hereunder is per NXP Semiconductors’ best knowledge. In case NXP Semiconductors has tested the product, this documentation reflects the outcome of the analysis of the actually tested parts only. This document does not provide for any representation or warranty express or implied by NXP Semiconductors. Applications and test results, analysis or assessments that are described herein are for illustrative purposes only. NXP Semiconductors makes no representation or warranty neither that such applications will be suitable for the specified use nor that the information, test results, analysis or assessments are reliable without further testing or modification through customer. BL GA Discretes, Product Quality Engineering, Customer Support Discretes, Sep 2013