dm00279614

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User manual
How to use the STEVAL-WESU1
Introduction
The STEVAL-WESU1 system reference design represents a highly efficient and effective solution for
precise motion sensing in wearable applications.
The system embeds a low power ARM Cortex-M3 microcontroller unit (STM32L151VE), an iNEMO
inertial module (LSM6DS3), a high performance magnetometer (LIS3MDL), a barometric pressure
sensor (LPS25HB), a Bluetooth® low energy wireless network processor (BLUENRG-MS) and power
management circuitry that allows fast charging and precise energy estimation (STNS01 and STC3115).
The connectivity, granted by the best in class BLUENRG-MS and supported by the integrated balun
(BALF-NRG-01D3), combines maximum RF performance with low area occupancy and design effort.
The system has passed the RF Test for FCC certification (FCC ID: S9NWESU1) and IC certification (IC
ID: 8976C-WESU1).
STEVAL-WESU1 FW provides a complete framework to build wearable applications, using inertial and
environmental sensor drivers, battery profile measurements, and Bluetooth low energy for data
communication. It is built on the STM32Cube™ framework, which facilitates customization and the
integration of further middleware algorithms.
An application layer based on the BlueST protocol (see Section 5: "BlueST Protocol SDK") streams data
from different devices (inertial and environmental sensors plus battery devices and RSSI) and
algorithms, while a serial console over BLE allows control over the configuration parameters of the
connected boards.
An ST-WESU™ app based on the the BlueST protocol logs all sensor data and provides demos for
algorithms, battery detection and RSSI levels. It includes a command line interface through a debug
console, allowing further control via internal permanent and session setting registers.
Figure 1: STEVAL-WESU1 package
May 2016
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www.st.com
Contents
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Contents
1
2
3
Getting started ................................................................................. 7
1.1
System setup guide ........................................................................... 9
1.2
ST WeSU app setup ......................................................................... 9
1.3
System requirements ...................................................................... 10
STEVAL-WESU1 hardware description........................................ 11
2.1
STEVAL-WESU1 board connections .............................................. 12
2.2
ST-LINK connections ...................................................................... 12
2.3
Exposed pad connectors ................................................................. 13
2.4
Hardware architecture ..................................................................... 14
2.4.2
Sensors ............................................................................................ 18
2.4.3
Bluetooth low energy connectivity .................................................... 19
2.4.4
Battery and power management ...................................................... 20
3.1
Overview ......................................................................................... 22
3.2
Architecture ..................................................................................... 22
3.3
Folder structure ............................................................................... 23
3.3.1
Documentation ................................................................................. 24
3.3.2
Drivers .............................................................................................. 24
3.3.3
Middleware ....................................................................................... 25
3.3.4
Projects folder ................................................................................... 25
3.3.5
Demonstration firmware overview .................................................... 26
3.3.6
Example firmware overview ............................................................. 31
3.4
Utilities ............................................................................................ 32
3.5
Device firmware upgrade ................................................................ 33
3.5.1
DFU using USB ................................................................................ 33
3.5.2
DFU using OTA ................................................................................ 36
Toolchains ....................................................................................... 38
ST WeSU app ................................................................................. 40
4.1
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Microcontroller .................................................................................. 15
STEVAL-WESU1 Firmware............................................................ 22
3.6
4
2.4.1
Demo overview ............................................................................... 44
4.1.1
Mems sensor fusion demo ............................................................... 45
4.1.2
Environmental demo......................................................................... 48
4.1.3
Plot data demo ................................................................................. 49
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Contents
4.1.4
4.2
5
Action list overview .......................................................................... 54
4.2.1
Start/stop logging .............................................................................. 54
4.2.2
Settings ............................................................................................. 54
4.2.3
Debug console .................................................................................. 55
4.2.4
Serial console ................................................................................... 57
4.2.5
BLE standby ..................................................................................... 57
4.2.6
Reboot .............................................................................................. 57
BlueST Protocol SDK .................................................................... 58
5.1
5.2
5.3
6
Algorithm demos............................................................................... 51
Advertising format ........................................................................... 58
5.1.1
Bluetooth low energy AD structure (max. 31 bytes) ......................... 58
5.1.2
AD structures .................................................................................... 58
Services/characteristics .................................................................. 59
5.2.1
HW single feature packet ................................................................. 60
5.2.2
Aggregate feature packet ................................................................. 61
5.2.3
SW single feature packet 1/2 ........................................................... 62
5.2.4
Configuration settings ....................................................................... 64
5.2.5
Debug ............................................................................................... 64
Registers ......................................................................................... 64
5.3.1
Register types ................................................................................... 65
5.3.2
Errors ................................................................................................ 65
Board schematic and bill of material ........................................... 66
6.1
Bill of material.................................................................................. 66
6.2
Schematic diagrams........................................................................ 70
7
Formal notices required by the U.S. Federal Communications
Commission ("FCC") ............................................................................. 77
8
Formal notices required by the Industry Canada ("IC") ............. 78
9
10
Acronyms and abbreviations ....................................................... 79
Revision history ............................................................................ 80
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List of tables
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List of tables
Table 1: Expansion connector GPIO description ...................................................................................... 16
Table 2: Memory mapping ........................................................................................................................ 30
Table 3: Permanent register location ........................................................................................................ 31
Table 4: Session register location ............................................................................................................. 31
Table 5: Package file list ........................................................................................................................... 34
Table 6: BLE advertising structure ............................................................................................................ 58
Table 7: BLE TX power level advertising field .......................................................................................... 58
Table 8: BLE advertising manuf.-specific advertising field ....................................................................... 58
Table 9: Group A features map ................................................................................................................ 59
Table 10: Group B features map .............................................................................................................. 59
Table 11: Device ID enumeration ............................................................................................................. 59
Table 12: Services/characteristics allocation map .................................................................................... 59
Table 13: Generic packet format .............................................................................................................. 60
Table 14: Motion sensors packet format................................................................................................... 61
Table 15: Battery packet format ................................................................................................................ 61
Table 16: Pressure packet format............................................................................................................. 61
Table 17: Temperature packet format ...................................................................................................... 61
Table 18: Motion packet format ................................................................................................................ 62
Table 19: Generic packet format .............................................................................................................. 62
Table 20: Sensor fusion packet format ..................................................................................................... 62
Table 21: Free fall packet format .............................................................................................................. 63
Table 22: Activity recognition packet format ............................................................................................. 63
Table 23: Valid activity types .................................................................................................................... 63
Table 24: Carry position packet format ..................................................................................................... 63
Table 25: Carry position type .................................................................................................................... 63
Table 26: Register access packet format ................................................................................................. 64
Table 27: Control field ............................................................................................................................... 64
Table 28: Error code mapping .................................................................................................................. 65
Table 29: Bill of material ........................................................................................................................... 66
Table 30: List of acronyms ........................................................................................................................ 79
Table 31: Document revision history ........................................................................................................ 80
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List of figures
List of figures
Figure 1: STEVAL-WESU1 package .......................................................................................................... 1
Figure 2: Inside the STEVAL-WESU1 package ......................................................................................... 7
Figure 3: STEVAL-WESU1 board ............................................................................................................... 7
Figure 4: LiPO battery ................................................................................................................................. 8
Figure 5: STEVAL-WESU1 SWD adapter .................................................................................................. 8
Figure 6: STEVAL-WESU1 silicone wristband ........................................................................................... 8
Figure 7: Plastic case housing the STEVAL-WESU1 board....................................................................... 9
Figure 8: ST WeSU Android iOS start page ............................................................................................. 10
Figure 9: STEVAL-WESU1 top side components .................................................................................... 11
Figure 10: STEVAL-WESU1 bottom side components ............................................................................ 12
Figure 11: STEVAL-WESU1 top and bottom side board connections ..................................................... 12
Figure 12: ST-Link connection using the adapter ..................................................................................... 13
Figure 13: STEVAL-WESU1 exposed pad connections for battery charging........................................... 13
Figure 14: USB plug with external USB connector for DFU update ......................................................... 14
Figure 15: USB connection with external plug after cutting ...................................................................... 14
Figure 16: STEVAL-WESU1 functional block diagram ............................................................................. 15
Figure 17: Microcontroller subsystem ....................................................................................................... 15
Figure 18: SWD connector and external peripheral connections ............................................................. 16
Figure 19: Programming adapter description ........................................................................................... 17
Figure 20: Sensor array ............................................................................................................................ 18
Figure 21: BLE connectivity subsystem .................................................................................................... 19
Figure 22: Battery and power management subsystem ........................................................................... 20
Figure 23: Battery connector .................................................................................................................... 21
Figure 24: USB connector with ESD protection ........................................................................................ 21
Figure 25: STEVAL-WESU1 firmware architecture .................................................................................. 23
Figure 26: STEVAL-WESU1 firmware package folder structure .............................................................. 23
Figure 27: firmware drivers folder ............................................................................................................. 24
Figure 28: BSP folders .............................................................................................................................. 24
Figure 29: Middleware folder .................................................................................................................... 25
Figure 30: Demonstrations and Examples folders .................................................................................... 26
Figure 31: Demo application folder ........................................................................................................... 27
Figure 32: Main function with internal infinite loop .................................................................................... 29
Figure 33: Example application files package .......................................................................................... 32
Figure 34: DFU driver installation ............................................................................................................. 33
Figure 35: DfuSe Demo ............................................................................................................................ 34
Figure 36: DfuSe Demo upgrade successful ............................................................................................ 35
Figure 37: DfuSe Demo leave DFU mode ................................................................................................ 36
Figure 38: ST BlueDFU start page ........................................................................................................... 37
Figure 39: ST BlueDFU working flow (Android Version) .......................................................................... 38
Figure 40: ST BlueDFU device update ..................................................................................................... 38
Figure 41: ST WeSU app start page (Android and iOS) ........................................................................... 40
Figure 42: ST WeSU app (Android and iOS) device list ........................................................................... 41
Figure 43: Node list (Android and iOS) commands .................................................................................. 41
Figure 44: Node status (Android and iOS) indication ............................................................................... 42
Figure 45: Nodes list (Android and iOS) menu ......................................................................................... 43
Figure 46: Demo index and Action menu (Android) ................................................................................. 43
Figure 47: Demo index and Action menu (iOS) ........................................................................................ 44
Figure 48: ST WeSU app (Android version) motion sensor fusion demo ................................................. 45
Figure 49: Freefall icons ........................................................................................................................... 45
Figure 50: Freefall events list .................................................................................................................... 46
Figure 51: Proximity sensor status (only if available) ............................................................................... 46
Figure 52: ST WeSU (Android) calibration ............................................................................................... 47
Figure 53: ST WeSU (Android) reset position .......................................................................................... 47
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Figure 54: Commands context menu........................................................................................................ 48
Figure 55: ST WeSU app (Android version) environmental demo ........................................................... 48
Figure 56: ST WeSU app (Android version) example plot (magnetometer values) ................................. 49
Figure 57: Plot length time scale selection ............................................................................................... 50
Figure 58: Features data plot selection .................................................................................................... 50
Figure 59: Activity recognition demo......................................................................................................... 51
Figure 60: Carry position demo ................................................................................................................ 52
Figure 61: Pedometer demo ..................................................................................................................... 53
Figure 62: RSSI and battery charging demo ............................................................................................ 54
Figure 63: Log settings ............................................................................................................................. 55
Figure 64: Debug console command list .................................................................................................. 56
Figure 65: Debug set node license dialog ................................................................................................ 57
Figure 66: IEEE 754 single reference ....................................................................................................... 62
Figure 67: Memory register mapping ........................................................................................................ 64
Figure 68: Main system blocks ................................................................................................................. 70
Figure 69: Microcontroller schematics ...................................................................................................... 71
Figure 70: Sensors subsystem schematics .............................................................................................. 72
Figure 71: Connectivity subsystem schematics ........................................................................................ 73
Figure 72: SWD and Reset connection schematics ................................................................................. 74
Figure 73: External connector schematics................................................................................................ 75
Figure 74: Battery and power management subsystem schematics ........................................................ 76
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1
Getting started
Getting started
The STEVAL-WESU1 is a system reference design for users wanting to develop wearable
applications, with every element of the system designed to accelerate the development
process: from embedded end-customer devices to mobile software development.
Inside the STEVAL-WESU1 package, you will find all the main components that you need
to experience the demo on our special platform firmware and dedicated mobile app.
Figure 2: Inside the STEVAL-WESU1 package
The package includes:

One STEVAL-WESU1 reference design board (max. 35X30 mm size)
Figure 3: STEVAL-WESU1 board
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Getting started
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One LiPo 100mAh battery (UN38.3 certified)
Figure 4: LiPO battery

ST-LINK adapter and cable
Figure 5: STEVAL-WESU1 SWD adapter

Silicone wristband with fastening clip
Figure 6: STEVAL-WESU1 silicone wristband
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Getting started

Moulded plastic board and battery case
Figure 7: Plastic case housing the STEVAL-WESU1 board
1.1
System setup guide
Follow these steps to assemble the kit:
1.
2.
3.
4.
5.
6.
1.2
Take the board and carefully remove the disclaimer tab (save it, as it contains the
FCC and IC certification numbers).
Plug the battery to the connector on the back of the board.
Open the plastic case and carefully place the board with the battery inside it, taking
care to align the user button with the external button hole. Put one of the two buttons
on this hole and then snap the case shut.
Connect the USB cable to turn the board on for the first time, and verify that the red
battery charging LED is lit.
Insert the plastic case inside the silicone wristband shroud and verify button operation
by pressing it to shut the board down and once more to turn the board on again.
Fasten the wristband clip and enjoy the experience.
ST WeSU app setup
To visualize the information sent via Bluetooth low energy connectivity, install one of the
following apps available for smartphones and tablets:


ST WESU Android app available at Google Play™ store;
ST WESU iOS app available at Apple Store™.
To install this app, you need a smartphone or tablet which supports BLE technology (4.0 or
higher) (i.e., iPhone 4S/Android OS 4.3 and above).
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Figure 8: ST WeSU Android iOS start page
Both versions of the app are based on a specific BlueST protocol SDK (see Section 5:
"BlueST Protocol SDK"), which allows:





1.3
Plotting and logging of the data from all of the sensors (supporting multiple
connections)
Sensor and algorithm demos (also with multiple connections)
Battery/RSSI information
Debug console for command line interface
Configurable run time settings
System requirements
The STEVAL-WESU1 reference board requires:





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A Windows™ (version 7, 8, 8.1 or 10) PC running an IAR, KEIL or System Workbench
for STM32 firmware development environment
One USB type A to micro B male cable to connect the STEVAL-WESU1 to the PC or
wall adapter for power supply
"ST-LINK/V2" (or equivalent) in-circuit debugger/programmer
"ST-LINK utility" for binary firmware download (find the latest embedded software
version on www.st.com).
An Android (4.3 or higher) or iOS (8.0 or higher) smartphone or tablet with BLE
technology (4.0 or higher).
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2
STEVAL-WESU1 hardware description
STEVAL-WESU1 hardware description
The STEVAL-WESU1 has the following main components mounted on the top side:











STM32L151VEY6, ultra-low-power ARM Cortex-M3 MCU with 512 Kbytes FLASH,
48kBytes of RAM in WLCSP100 package
BLUENRG-MS, Bluetooth low energy (BLE) single-mode network processor,
compliant with Bluetooth specification core 4.1
BALF-NRG-01D3, 50 Ω balun for BLUENRG-MS transceiver with integrated harmonic
filter
LSM6DS3, iNEMO inertial module 3D accelerometer (±2/4/8/16g) + 3D gyroscope
(±125/245/500/1000/2000dps)
LIS3MDL, MEMS 3D magnetometer (±4/8/12/16 gauss)
LPS25HB, MEMS pressure sensor, 260-1260 mBar absolute digital output barometer
USBULC6-2M6 ultra large bandwidth ESD protection
External oscillator LSE (32kHz) and HSE (24MHz) for the STM32L151VEY6
User button, white user LED and red charging LED
USB, SWD and uFL connector (not mounted)
chip antenna
Figure 9: STEVAL-WESU1 top side components
On the bottom side, the following main components are mounted:




STC3115, gas gauge IC with alarm output
STNS01, Li-Ion linear battery charger
Battery connector
External oscillator low speed (32 kHz) and high speed (32 MHz) for BlueNRG-MS.
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Figure 10: STEVAL-WESU1 bottom side components
2.1
STEVAL-WESU1 board connections
The STEVAL-WESU1 includes several hardware connectors described below:



micro-USB female plug, plus the same pins exposed in bottom pads.
SWD connector (1.27 mm pitch)
Battery connector
Figure 11: STEVAL-WESU1 top and bottom side board connections
2.2
ST-LINK connections
The ST-LINK V2 programmer is required to update the firmware. Plug the cable (with
adapter, bundled with the package) to the board and then connect the laptop as shown
below.
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STEVAL-WESU1 hardware description
Figure 12: ST-Link connection using the adapter
2.3
Exposed pad connectors
The STEVAL-WESU1 form factor can be reduced by cutting off the PCB tab hosting the
USB and expansion connectors; the exposed pads on the bottom can be wired to the
charger, as shown in the figure below:
Figure 13: STEVAL-WESU1 exposed pad connections for battery charging
The exposed external pads can also be used to upgrade the firmware via USB using the
DFU strategies with the simple four-wire connection shown below.
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Figure 14: USB plug with external USB connector for DFU update
The USB feature is accessible via the exposed pads on the bottom of the PCB using the
cable connection shown below:
Figure 15: USB connection with external plug after cutting
2.4
Hardware architecture
The whole system can be described in four separate functional subsystems:




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Microcontroller
Sensors
Connectivity
Battery management
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STEVAL-WESU1 hardware description
The sensors and the BLUENRG-MS devices are connected to the microcontroller through
two separate SPI peripherals, while the power management is driven via an I²C peripheral
and GPIOs.
Figure 16: STEVAL-WESU1 functional block diagram
2.4.1
Microcontroller
STM32L151VEY6 is an ultra-low-power microcontroller unit based on the ARM® Cortex®M3. It features a wide range of low power modes and voltage scaling for excellent power
saving capabilities.
Figure 17: Microcontroller subsystem
2.4.1.1
SWD Connector and external peripheral connections
The STEVAL-WESU1 is equipped with a custom 10 pin connector (1.27 mm pitch), which
can be used:
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STEVAL-WESU1 hardware description


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To program the microcontroller via a dedicated adapter connected to the programming
tool (like ST-Link)
As an expansion connector to allow user access to other board features, as described
in the following table
Figure 18: SWD connector and external peripheral connections
GSPG2403161120SG
SWD
TP501 TP502
1
1
D_VDD
SWD_SWDIO
J500
1
3
5
7
9
LED_User
PWR_I2C_SCL
PWR_I2C_SDA
2
4
6
8
10
SWD/JTAG
SWD_SWDIO
SWD_SWCLK
SWD_SWCLK
RX232_ConJ500
Button_PowerOn
1 nRESET
2
R506 0
SMR0201
nRESET
TP512
1
GND
PWR_I2C_SCL
PWR_I2C_SDA
EXT_ConJ500
PWR_I2C_SCL
PWR_I2C_SDA
EXT_ConJ500
Table 1: Expansion connector GPIO description
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Exp. Pin J500
Port/Pin
Default Func.
3
B0
User LED
5
B8
PWR_I2C_SCL
6
A3
-
7
B9
PWR_I2C_SDA
8
A2
Push Button
I²C
USART
PWM
ADC
TIM3CH3
ADC_CH8
USART2_RX
TIM2CH4
ADC_CH3
USART2_TX
TIM2CH3
ADC_CH2
I2C1_SCL
I2C1_SDA
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2.4.1.2
STEVAL-WESU1 hardware description
Programming adapter
Figure 19: Programming adapter description
The programming adapter can be used as an in-circuit debugger/programmer connection
through J9 or as an expansion connector through J5.
It is equipped with the following jumpers:

J1 and J2 for the UART: J1 and J2 must be set to the 2-3 position in order to use the
J5 connector for signal monitoring on an oscilloscope or external connections through
J5. Position 1-2 is reserved.
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
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J10 (single position) for reset pin connection: J10 must be fitted to enable the
programmer tool to reset the microcontroller; this also enables the S1 reset button.if
you connect the adapter to WeSU board with J10 fitted, a reset command is issued.
Sensors
The integrated sensors are perfect for motion algorithms in wearable motion tracking,
featuring extremely low power capabilities and advanced performance in terms of accuracy
and embedded digital features.
Figure 20: Sensor array
2.4.2.1
LSM6DS3
The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital
gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high performance mode and
enabling always-on low-power features for an optimal motion experience for the consumer.
Up to 8 Kbyte of FIFO with dynamic allocation of significant data (i.e., external sensors,
timestamp, etc.) allows overall system power saving.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing
processes already used for the production of micromachined accelerometers and
gyroscopes.
The various sensing elements are manufactured using specialized micromachining
processes, while the IC interfaces are developed using CMOS technology that allows the
design of a dedicated circuit which is trimmed to better match the characteristics of the
sensing element. The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and
an angular rate range of ±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system
designers for the creation and manufacturing of reliable products. The LSM6DS3 is
available in a plastic land grid array (LGA) package.
2.4.2.2
LIS3MDL
The LIS3MDL is an ultra-low-power high performance three-axis magnetic sensor. The
LIS3MDL has user-selectable full scales of ±4/ ±8/ ±12/±16 gauss.
The device may be configured to generate interrupt signals for magnetic field detection.
The LIS3MDL includes an I²C serial bus interface that supports standard and fast mode
(100 kHz and 400 kHz) and SPI serial standard interface.
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STEVAL-WESU1 hardware description
The LIS3MDL is available in a small thin plastic land grid array package (LGA) and is
guaranteed to operate over an extended temperature range of -40 °C to +85 °C.
2.4.2.3
LPS25HB
The LPS25HB is an ultra-compact absolute piezo-resistive pressure sensor with an
absolute range from 260 to 1260 hPa. It includes a monolithic sensing element and an IC
interface able to take the information from the sensing element and to provide a digital
signal to the external world.
Thanks to its high accuracy (1 Pa RMS, 24-bit ADC resolution), its bandwidth (1 – 25 Hz)
and its very low power consumption (4 µA low power mode, 25 µA high performance
mode), the integration of this sensor is suitable for height estimation (e.g., VRU vertical
reference unit) and to enhance standard IMU performance with a high frequency altitude
reference.
2.4.3
Bluetooth low energy connectivity
Figure 21: BLE connectivity subsystem
2.4.3.1
BLUENRG-MS and BALF-NRG-01D3
The BLUENRG-MS is a very low power Bluetooth low energy (BLE) single-mode network
processor, compliant with Bluetooth specification v4.1. The BLUENRG-MS can act as
master or slave. The entire Bluetooth low energy stack runs on the embedded Cortex M0
core. The non-volatile Flash memory allows on-field stack upgrading.
The BLUENRG-MS allows applications to meet the tight advisable peak current
requirements imposed with the use of standard coin cell batteries. The maximum peak
current is only 8.2 mA at 0 dBm of output power. Ultra low-power sleep modes and very
short transition times between operating modes allow very low average current
consumption, resulting in longer battery life. The BLUENRG-MS offers the option of
interfacing with external microcontrollers using the SPI transport layer.
BALF-NRG-01D3 is a 50Ω conjugate match to BLUENRG-MS (QFN32 package) that
integrates balun transformer and harmonics filtering. It features high RF performance with a
very small footprint and RF BOM reduction. It has been chosen as the best trade-off
between cost, size and high radio performance. The layout is optimized to suit a 4-layer
design and a chip antenna.
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2.4.3.2
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uFL connector
The uFL connector U201 (not mounted) is connected to the BLUENRG-MS RF path
through C206 (not mounted). By soldering a 51 pF capacitor and desoldering L204, the
uFL connector RF path can be activated; this is useful for debugging.
2.4.4
Battery and power management
The power management system allows USB battery charging with the STNS01 USB
battery charger; battery level information is provided by the STC3115 device.
Figure 22: Battery and power management subsystem
2.4.4.1
STNS01
The STNS01 is a linear charger for single-cell Li-Ion batteries.
In the STEVAL-WESU1 system, it is configured as a battery charger and also functions as
a power path switch between the USB power source and the battery power source.
The STNS01 battery charger is designed to charge single cell Li-Ion batteries up to 4.2 V
using a CC-CV charging algorithm (see the STNS01 datasheet for more details). When a
valid input voltage is detected, the STNS01 starts the charge cycle and the CHG pin
switches from high impedance to low level. The CHG pin is connected to LED2 to monitor
the charger.
The charging status LED (LED 2) can be:



steady ON: the USB plug is correctly connected and the board is charging
steady OFF: the board is not charging; reconnect the USB cable to force a re-start)
flashing: charging failure (e.g., overtemperature, three-wire battery not connected), or
battery not present.
The SYS pin is the voltage output of the STNS01 selected power path. This pin is
connected to the linear voltage regulator providing VDD to all other devices.
The STM32L151VE is also connected to its SHDN pin to disconnect the power delivery to
most of the devices and enable the shipment mode.
2.4.4.2
STC3115
The STC3115 includes the hardware functions required to implement a low-cost gas gauge
for battery monitoring. The STC3115 uses current sensing, Coulomb counting and accurate
measurements of the battery voltage to estimate the state-of-charge (SOC) of the battery.
An internal temperature sensor simplifies implementation of temperature compensation.
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STEVAL-WESU1 hardware description
An alarm output signals a low SOC condition and can also indicate low battery voltage. The
alarm threshold levels are programmable.
The STC3115 offers advanced features to ensure high performance gas gauging in all
application conditions.
2.4.4.3
Battery connector
Battery connector is placed as shown in Figure 11: "STEVAL-WESU1 top and bottom side
board connections", and the hardware connection is as shown in the figure below.
Resistor R505 is placed as close as possible to this connector in order to sense the battery
current more accurately, the value of which is then monitored by the STC3115 device.
Figure 23: Battery connector
BATTERY CONNECTOR
VBAT
BATT +
SMT 3W 1.2 mm pitch
Molex 78171-0003
RS: 700-0824P
2.4.4.4
2
2
J501
R505
PWR_NTC
BATT-
1
3
2
1
C501
47µ F 10V
SMD 080 5
1
GND
0.05
SMD 0402
GND
GSPG2403161345SG
USB connector
The USB connector accepts a micro USB type B and it is used to charge the battery and to
power the board even if battery is not present.
The USBULC6-2M6 ESD protection just after the USB connector, avoids any voltage spike
damages, due to the plug operations, towards all the devices powered.
Figure 24: USB connector with ESD protection
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3
STEVAL-WESU1 Firmware
3.1
Overview
This firmware package expands the functionality of the STM32Cube platform adding the
following features to build a wearable application:








3.2
Complete mid-level driver set necessary to build applications using pressure and
temperature sensor (LPS25HB) and motion sensors (LIS3MDL and LSM6DS3)
Data logger sample application about inertial and environmental sensors
measurements, battery profile measurements, and algorithm demos. The data
acquisition from different sensors is provided via SPI, and battery charging profile via
I2C.
Complete middleware to easily communicate with a BLE client application using a
proprietary protocol (BlueST Protocol SDK).
Low power setting configurable by app.
Command line interface (CLI) using a debug console by app.
Configuration interface: using EEPROM (permanent) and RAM (session) settings.
OTA/USB-DFU: Firmware upgrade over the air through BLE connectivity (using
BlueST APP) or USB IF.
Node locked license terms for open.MEMS algorithms.
Architecture
The firmware is based on the STM32Cube™ framework technology developed to build
applications with the STM32 microcontroller.
The package provides a board support package (BSP) for the sensors and the middleware
components for Bluetooth low energy communication with any external mobile device.
The firmware driver layers to access and use the hardware components are:


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STM32Cube HAL layer: simple, generic, multi-instance APIs (Application
Programming Interfaces) which interact with the upper layer applications, libraries and
stacks. These APIs are based on the common STM32Cube framework so other layers
like the middleware layer can function without requiring specific hardware information
for a given microcontroller unit (MCU). This structure improves library code reusability
and guarantees easy portability across other devices.
Board support package (BSP) layer: provides firmware support for the STM32
Nucleo board (excluding MCU) peripherals. These specific APIs provide a
programming interface for certain board specific components like LEDs, user buttons,
etc., but can also be used to fetch board serial and version information, and support
initializing, configuring and reading data from sensors. The BSP provides the drivers
for the STEVAL-WESU1 board peripherals, adding the connections to the
microcontroller peripherals.
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STEVAL-WESU1 Firmware
Figure 25: STEVAL-WESU1 firmware architecture
These specific APIs provide a programming interface for the on-board peripherals, but they
can also be used to provide user support for initializing, configuring and reading data from
communication buses, specific to STEVAL-WESU1.
This helps the user build the firmware using specific APIs for the following hardware
subsystems:



3.3
BNRG: to control connectivity
Platform: to control and configure all the devices in the battery and power subsystem
plus button, LEDs and GPIOs
Sensors: to link, configure and control all the sensors
Folder structure
Figure 26: STEVAL-WESU1 firmware package folder structure
Embedded firmware library version information is included in “Release_Notes.html”.
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Documentation
Contains a compiled HTML file generated from the source code and documentation that
describes the firmware framework, drivers for the on-board components and APIs to
manage all the different functions. See the “STEVAL-WESU1_FW.chm” manual for further
details.
3.3.2
Drivers
All firmware packages adhering to the STM32CUBE framework contain the following main
groups:



BSP: the board specific drivers for whole the HW components
CMSIS: vendor-independent hardware abstraction layer for ARM Cortex-M series.
STM32L1xx_HAL_Drivers: microcontroller HAL libraries
Figure 27: firmware drivers folder


Components: platform independent device drivers for LPS25HB, LIS3MDL,
LSM6DS3, and STC3115.
STEVAL-WESU1: mid-level drivers for each hardware subsystem, giving the
developer application-level control of the BlueNRG communication, platform, and
sensors subsystems.
Figure 28: BSP folders
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3.3.3
STEVAL-WESU1 Firmware
Middleware
Libraries and protocols for BlueNRG Bluetooth low energy, and other algorithm libraries,
including sensor fusion, real time activity recognition and carry position recognition
libraries. Further integration of ulterior algorithm is facilitated by the common STM32Cube
framework.
Figure 29: Middleware folder
3.3.4
Projects folder
This directory contains a “Demonstrations” folder with a project that directly supports the
ST WeSU app and an “Examples” folder with a project providing reference firmware.
With the ST WeSU app on an Android or iOS device, it is easy to display sensor and
algorithm data in customized plots or demos.
The demonstration firmware aims to provide the functions available in the ST WeSU app,
according to the BlueST protocol (see Section 5: "BlueST Protocol SDK").
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Figure 30: Demonstrations and Examples folders
To set up a suitable development environment for creating applications for the STEVALWESU1, the projects are available for the following environments:



3.3.5
IAR Embedded Workbench for ARM® (EWARM)
KEIL RealView Microcontroller Development Kit (MDK-ARM)
System Workbench for STM32 (SW4STM32)
Demonstration firmware overview
Typical demonstration firmware developed from the STM32Cube framework is found in an
application folder containing the files groups described below:


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Demo user application files
Standard STM32Cube application files
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Figure 31: Demo application folder
The demo application files include all the functions to support the ST WeSU mobile app:






algorithms.c: APIs to perform configuration, initialization, run, and processing for the
algorithms included in the middleware.
BlueST_Protocol.c: APIs to support the BlueST SDK protocol (see Section 5:
"BlueST Protocol SDK") in terms of service, characteristics, and data
transmission/reception with BLE.
console.c: APIs to provide the CLI commands for the debug console.
low_power.c: APIs to configure the low power modes for the system
main.c: The main demonstration routine including the top-level APIs
wesu_config.c: APIs to configure, initialize, and check system-level functions and to
control the permanent and session registers.
The standard STM32Cube application files have the same configuration as any standard
example using the STM32 HAL libraries, with the simple addition of the peripherals used
for the demo purposes in the following files:




3.3.5.1
clock.c
main.c
stm32l1xx_hal_msp.c
stm32l1xx_hal_it.c
Demo main
The main file includes the following functions:




HAL_Init: configures the FLASH prefetch, time base source, NVIC and HAL lowlevel driver APIs
Error_Handler: executed in case of error
HAL_Delay: commonly used in any standard HAL example to provide an accurate
delay (in milliseconds) based on the SysTick timer as time base source; in this case, it
is a user file implementation using the _WFI instruction
RTC_Config: configures RTC prescaler and data registers
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







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RTC_TimeStampConfigDefault: configures the default time and date
SystemClock_Config_APP_STARTUP: configures the main system clock; suitable
for application using one of the following clock configuration functions:

SystemClock_Config_HSI_32MHz

SystemClock_Config_RTC_HSE32MHz

SystemClock_Config_HSI_12MHz

SystemClock_Config_HSE_18MHz

SystemClock_Config_MSI_2MHz
DebugConfiguration: configures debug facilities
User_Init: initializes all the firmware sub-blocks used by the User_Process
function; specifically, it:

Initializes register management

configures LED GPIO, button GPIO and EXTI Line

configures the RTC

initializes all the devices in the PWR Subsystem

initializes the BlueNRG subsystem management

initializes the sensor subsystem management

initializes all the algorithms
User_Process: controls the process which is continuously executed in the main
loop; specifically, it executes the following actions:

get data time to use RTC as calendar

backup and save the system parameters

switch the system in run mode

manage the LED in order to give different feedback for each step executed

get all the sensors data

execute the algorithms

control the BLE connection

manage the debug console

control the low power transitions using the user button or the app
Read_Sensors: checks whether the sensor is enabled in the configuration registers.
If enabled, get the data and save the value directly in the corresponding session
registers
ManageBleConnection

check BLE connection

update the connection parameters

update the sensors and other data to be sent through BLE, according to the
corresponding configuration
HCI_Process: BlueNRG HCI provides a standard interface for accessing the
capabilities of the Bluetooth controller and BlueNRG LE stack.
Main: uses the predefined APIs to execute the principal process and perform the
demo application. This procedure allows the user to execute the most important
User_Process function, the interval in ms is adjusted using the “nTimerFrequency”
value. The functions executed include:

HAL_Init();

SystemClock_Config_APP_STARTUP();

DebugConfiguration();

User_Init();

DBG_PRINTF(Firmware
version);

APP_BSP_LED_Off(LED);
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
Infinite loop: HCI_Process(); check if the timestamp has increased by the
value “nTimerPeriod”; User_Process(); HAL_Delay (1 ms)
Figure 32: Main function with internal infinite loop
GSPG0504161400SG
Start
HAL_Init
SystemClock_Config_APP_STARTUP
Init & Configurations
for all the HW drivers
Configure all the Session and
Permanent Registers
Configure all the
HW Subsystems for
User_Process
DebugConfiguration
User_Init
HCI_Process
No
HAL_Delay
nTimer Period
is elapsed
Yes
User_Process
3.3.5.2
BLE services
This firmware uses three Bluetooth services:



HW_Features_Service: transmits hardware characteristics, including:

Temperature

Pressure

Battery voltage, battery current, battery SOC, battery status

3D gyroscope, 3D magnetometer, 3D accelerometer

Sensor fusion data (AHRS values)

Algorithm1 data (activity recognition)

Algorithm2 data (carry position)

Algorithm3 data (Pedometer provided by HW using LSM6DS3)

Algorithm4 data (FreeFall provided by HW using LSM6DS3)
Configuration_Service: for configuration management according to the BlueST
protocol:

Register management characteristics
Console_Service: to transmit two main characteristics:

Terminal

Stderr
This package is compatible with the ST WeSU Android/iOS application (Version 1.0 and
above) available at Google Play/Apple Store, respectively.
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This application can be used to display information sent with the BlueST SDK Protocol
(Section 5: "BlueST Protocol SDK").
3.3.5.3
Memory mapping
The demo application firmware is developed in order to provide all the functions necessary
to support mobile app data streaming, remote configuration settings, and firmware upgrade
using DFU or OTA.
To provide these features, specific firmware memory mapping has been implemented as in
the following tables.
Table 2: Memory mapping
Memory type
INTERNAL
FLASH (512K)
Section
Start
address
End
address
Size
(bytes)
Definition
USB DFU(1)
0x08000000
0x08002FFF
12 K
DFU using USB
connection
Reset
Manager
0x08003000
0x080037FF
2K
Application OTA
management
Service
manager(2)
0x08003800
0x08007FFF
18 K
OTA (over the air)
firmware upgrade
BlueNRG
GUI
0x08008000
0x0801FFFF
96 K
BlueNRG GUI
USB-BlueNRG
bridge
384K
Application
Used for application
firmware code:
Demo application or
Sensor example
Application
0x08020000
0x0807FFFF
Notes:
(1)Activation
through the APP, using settings page or at startup/reboot, pressing the button for at least 3 seconds
(2)Activation
through the APP, using settings page or at startup/reboot, without USB cable connection, pressing
the button during the first led blink
Internal EEPROM and RAM are used for the application; specific areas are dedicated for
register implementation. The following features are directly adjustable with the mobile app
(marked with a double asterix (**) in the following tables):



configure and control the on-board functions related to the microcontroller, sensors,
connectivity and power management..
store the data from the sensors, battery charging devices and other on-board devices,
including system status information.
allow remote control via the mobile app using settings menu or debug console in the
ST WeSU app.
Some information (e. g., the accelerometer full scale or output data rate settings) is stored
in the permanent registers only, while other data (e. g., sensor output data) is stored in the
session registers; some information (e. g., the timer setting) is stored in both locations for
temporary and permanent modifications.
A detailed description of permanent and session registers is available in the STEVALWESU1.chm.
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Table 3: Permanent register location
Memory
type
INTERNAL
EEPROM
(16K)
Section
Start
address
End
address
Size
(bytes)
USER EEPROM AREA
0x08080000
0x08080FEF
4080
NEW_APP_MEM_INFO
0x08080FF0
0x08080FF7
8
USB_DFU_MEM_INFO
0x08080FF8
0x08080FFF
8
**PERMREG_STRUCT
START_ADDRESS
0x08081000
0x080813FF
1K
PERSISTEN
T REGS
**PERMREG_STRUCT_
BCK START_ADDRESS
0x08081400
0x080817FF
1K
PERSISTEN
T BCK REGS
NOT USED
0x08081800
0x08082DFF
5632
reserved
TEST_ID_EEPROM
ADDRESS
0x08082E00
0x08082EDF
224
TEST_DATETIME_EEP
ROM ADDRESS
0x08082EE0
0x08082EFF
32
PRODUCTION_DATA
START_ADDRESS
0x08082F00
0x08082FFF
256
NOT USED
0x08083000
0x08083FFF
4K
reserved
Definition
Definition
Table 4: Session register location
Memory
type
INTERNAL
RAM (80K)
3.3.6
Section
Start
address
End
address
Size
(bytes)
USER RAM
0x20000000
0x20012FFF
76K
**SESSION REGISTERS
0x20013000
0x200133FF
1K
RFU (Reserved Future
Use)
0x20013400
0x20013FFF
3K
SESSION
REGS
Example firmware overview
The sample sensor firmware gives insight into the development of simple applications
involving data from a single sensor, use the BLE service and features, and other functions
called by the ST WeSU app, in accordance with the BlueST protocol (Section 5: "BlueST
Protocol SDK").
Firmware examples developed using the STM32Cube framework require an “Application”
folder with the files being either:


Example application files
Standard STM32Cube application files
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Figure 33: Example application files package
The “Example” application files are the same as those for the “Demonstration” application,
with some differences for certain files (identified with “filename_example.c”). You can use
the ST WeSU mobile app to evaluate data streaming as shown in the demo.
3.4
Utilities
The firmware can be updated using the IDE toolchain projects available in the package;
however, this procedure is only really useful to verify the code in debug mode. If this is not
required, the user can just download the available binary files to the FLASH memory and
proceed to test the application.
To use the binary firmware code, there are files dedicated to restoring functionality,
including the default settings; however, to update it directly, you must:





download and install "STM32 ST-LINK Utility" from www.st.com and run it
click on “Target” -> “Settings” and select SWD Connection
Click on “File” -> “Open” and select the binary file to be programmed
Click on “Target” -> “Program and verify” and then “Start”
Wait for the “Verification… OK” message in the log window and disconnect the
programming cable
The binary files are available in the “Utilities” folder.
There are different batch files in the same folder that allow you to work with the ST-LINK
programmer, without using the GUI.
The readme.txt file inside the folder will help you choose the appropriate batch file for the
desired activity. The main ones are:
1.
2.
3.
4.
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STEVAL-WESU1_FACTORY.bat: restore all the memory content to factory
conditions.
ProgApplication.bat: update the DEMO application code only.
ProgApplicationAndOTA.bat: update the DEMO application code plus the OTA
manager.
ProgExamples.bat: update the EXAMPLE application code only.
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3.5
STEVAL-WESU1 Firmware
Device firmware upgrade
The STEVAL-WESU1 firmware can be updated via:


3.5.1
a wired connection through the USB plug
a wireless connection with BLE Over The Air (OTA)
DFU using USB
Before connecting the USB cable, download and install the DfuSe demonstration software
from www.st.com.
Following installation, set the board to DFU mode thus:




Plug the USB cable, the board starts in normal mode running the demo application,
and the LED should blink every two seconds (at 0.5Hz).
Set the board to standby mode by pressing the user button. Wait until the LED goes
off.
With the USB cable still plugged, press and hold the user button for at least 3
seconds, until the LED turns on. The board then enters DFU Mode and the LED blinks
at 2.5 Hz. You can also use the ‘settings’ menu in the ST WeSU app (Settings ->
Node Configuration -> Device Firmware Upgrade -> USB DFU).
With the USB connection still active, you will see the following message:
Figure 34: DFU driver installation

Now run the “DfuSe Demonstration” software, see “STM Device in DFU Mode” in the
“Available DFU Devices” drop down list.
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Figure 35: DfuSe Demo
The user can upgrade the application firmware directly by choosing the *.dfu file.

Click on “Choose” button and select the file to update the desired firmware:
Table 5: Package file list
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DFU Files
Action
WeSU_demo.dfu
WeSU_examples.dfu
Program Flash DEMO or EXAMPLES APPLICATION
(@0x08020000)
WeSUandOTA.dfu
Program Flash APPLICATION (@0x08020000) +
OTA (@0x08003800)
WeSU_OTA_ServiceManager_App.dfu
Program Flash OTA SERVICE MANAGER (address
0x08003800)
SetAppAddress.dfu
Set Application address on EEPROM location
(@0x08080FF0)
WESU_BlueNRG_VCOM_1_8.dfu
Program Usb BlueNRG-MS Bridge (@0x08008000)
SetBluenrgUsbBridgeAddress.dfu
Program EEPROM: BlueNRG Bridge address on EEPROM
ResetManager.dfu
Program Flash RESET MANAGER (address 0x08003000)
ResetRegs.dfu
Program EEPROM Delete Registers
ResetLics.dfu
Program EEPROM: Delete Licenses
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
Once the dfu file is selected click on “Upgrade” and wait for the completion
confirmation
Figure 36: DfuSe Demo upgrade successful
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When finished, click “Leave DFU mode”; the board restarts and runs the loaded
firmware.
Figure 37: DfuSe Demo leave DFU mode
3.5.2
DFU using OTA
Before performing the OTA update, download and install the dedicated app on the mobile
devices used: ST BlueDFU, available on Google Play, (soon to be available on Apple
Store).
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Figure 38: ST BlueDFU start page
Following installation, set the board in DFU mode thus:



Push the user button to start the board in normal mode running the demo application;
the LED blinks every two seconds (at 0.5 Hz).
Set the board in standby mode by pressing the user button. Wait until the LED goes
off.
Without the USB cable plugged, press and hold the user button for at least for 3
seconds until the LED turns on. The board then enters OTA mode and the LED
toggles at 1 Hz.
If you want to exit OTA mode without updating the firmware, press the user button
three times (each time the LED performs a soft blink); the board will restart in
normal mode running the demo application.





When the board is in DFU OTA mode, run the ST BlueDFU application on your mobile
device and check the device list.
The board in OTA is recognizable by the name OTAWeSU.
Select your board (the LED toggles faster at 4 Hz); the BLE connection is ready to
download the firmware binary file. If there are different boards in OTA, you can check
the address or simply ‘try’ the connection and verify which one accelerates the LED
toggle frequency
Select the *.bin file from a dedicated folder in the mobile device or use the default file
already available in the folder with the star.
Click the download icon, and double check the address values, filename and size of
firmware code.
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Figure 39: ST BlueDFU working flow (Android Version)

Run the update and wait until it finishes after more or less 2.5 minutes; after which, the
board automatically restarts with the newly loaded firmware.
Figure 40: ST BlueDFU device update
It is possible to upgrade more than one device simultaneously with the same binary
firmware selected. Ensure you select the same device type (hardware configuration) and
download the right firmware to avoid rendering the device unusable.
3.6
Toolchains
The STM32Cube expansion framework supports the following development tool-chain and
compiler environments so you can build applications with the STEVAL-WESU1:

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IAR Embedded Workbench for ARM® (EWARM) toolchain + ST-LINK:

open IAR Embedded Workbench (V7.50 and above)

open the IAR project file EWARM\Project.eww

rebuild all files and load your image into target memory

run the application
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

KEIL RealView Microcontroller Development Kit (MDK-ARM) toolchain + ST-LINK:

open µVision (V5.14 and above) toolchain

open the µVision project file MDK-ARM\Project.uvprojx

rebuild all files and load your image into target memory

run the application
System Workbench for STM32 + ST-LINK:

open System Workbench for STM32 (1.8.0 and above)

set the default workspace proposed by the IDE (please be sure that there are not
placed in the workspace path)

select "File" -> "Import" -> "Existing Projects into Workspace"; press "Browse" in
"Select root directory" and choose the path where the System Workbench project
is located

rebuild all files and load your image into target memory

run the application
When establishing your IDE workspace, ensure that the folder installation path is not too
deep to avoid any eventual toolchain errors.
Any further firmware development can start using the reference projects included, and the
SWD as the mandatory debug interface.
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ST WeSU app
The STEVAL-WESU1 demo application firmware is designed to work with the ST WeSU
App (Android ver. 4.4.0 / iOS Ver. 8.0, or above), available free of charge at Google Play
and Apple Store.
The ST WeSU app opens with the start page below, from which you can command your
mobile device to scan for nearby nodes.
Figure 41: ST WeSU app start page (Android and iOS)
You can then choose from one of the available boards to start all the demos and other
supported functions.
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ST WeSU app
Figure 42: ST WeSU app (Android and iOS) device list
The app is able to support multiple node connections and switch from single to multiple
connections from the menu options at the top of the page; alternatively, you can simply
activate multiple connections by pressing and holding down an available node item.
Figure 43: Node list (Android and iOS) commands
The double tick (✔) mark for multiple nodes on the Android page is black when a particular
node is connected, and gray when the node is connecting; in iOS, the tick represents a
connected node. To start the demos you need to press the Action/Go button shown below.
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Figure 44: Node status (Android and iOS) indication
From the node list view, you can:





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restart scanning for nearby nodes from the search button or by swiping down the node
list;
switch from single multiple connection
clear list to remove unconnected devices
clear device cache (only Android) to clear Bluetooth device memory on specific node
data saved at first-time node connection; this command forces the closure of all
existing connections
add virtual node is primarily for debugging purposes; it adds a virtual node and
generates random data
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Figure 45: Nodes list (Android and iOS) menu
In single node connection mode, the AHRS motion demo showing a simple spinning cubes
starts as soon upon board selection, providing immediate STEVAL-WESU1 motion
information.
Other demos are accessible via the demo selector button indicated below, or by scrolling
the active page from right to left. The “Action” selector gives access to all available board
actions and application settings.
Figure 46: Demo index and Action menu (Android)
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Figure 47: Demo index and Action menu (iOS)
4.1
Demo overview
From the first page, you can access the following:





Sensor fusion demo
Environmental demo
Plot data demo: to set plot length (time scale), and start/stop logging data
Algorithms demos:

Activity Recognition

Carry Position

Pedometer
RSSI and battery charging:

RSSI value

TxPower

SOC battery in percentage

Battery status, voltage and current
The following sections relate to both Android and iOS versions, even if only Android
screenshots are actually shown.
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4.1.1
ST WeSU app
Mems sensor fusion demo
The Mems sensor fusion demo is automatically launched after board selection.
Figure 48: ST WeSU app (Android version) motion sensor fusion demo
It directly feeds all the available information associated with the board motion features and
actions.
Node name indicates which node is running, the start/stop logging command is discussed
below, and the reset command aligns the cube position
The extra sensor data and action area shows the extra available features and commands:

Freefall (if available) shows the freefall status:

no freefall

currently in freefall

Saved freefalls – if shown, it displays the list of the last 10 freefalls when clicked;
from here you can choose to either continue adding freefall events or clearing the
list entirely.
Figure 49: Freefall icons
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Figure 50: Freefall events list

Proximity sensor (if available) pressing it changes the status

proximity available not applied

proximity available and applied (the cube size changes with proximity)
Figure 51: Proximity sensor status (only if available)

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MEMS sensor fusion calibration (if available). The calibration status of the sensor
fusion library is normally gray before calibration. When pushed, a popup window
instructs you how to move the board to facilitate calibration; the symbol turns black
when calibration has been completed successfully.

calibration available (calibration status unknown)

node sensor fusion calibrated
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Figure 52: ST WeSU (Android) calibration

The reset action button allows resetting the cube position; when pushed, a popup
window explains how to physically move the board to the default position. Reset is
useful after calibration.
Figure 53: ST WeSU (Android) reset position
All demo commands are also available by tapping the demo area with a context menu, as
shown below.
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Figure 54: Commands context menu
4.1.2
Environmental demo
On the next page (scrolling display right to left or use the demo selector button), you can
run the environmental demo, with pressure and temperature feeds.
Figure 55: ST WeSU app (Android version) environmental demo
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4.1.3
ST WeSU app
Plot data demo
This demo includes the data plot from direct on-board sensor values, or values returned by
algorithms run by the firmware.
Figure 56: ST WeSU app (Android version) example plot (magnetometer values)
You can change the plot settings from the combo selection. From the Plot length menu,
you can select the time frame from 1 s to 30 s, as shown below.
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Figure 57: Plot length time scale selection
When multiple nodes are connected, it is also possible to select the device and feature to
plot.
Figure 58: Features data plot selection
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4.1.4
ST WeSU app
Algorithm demos
Apart from the sensor fusion demo already discussed, the following motion-related demos
are also available.
4.1.4.1
The osxMotionAR suite
The osxMotionAR suite features predictive software which recognizes common activities
and states, like:






stationary
walking
fast walking
jogging
biking
driving
Real-time activity recognition can significantly improve the user experience in advanced
motion-based applications for consumer, computer, industrial and medical purposes.
The algorithm exclusively manages the data acquired from the accelerometer at a low
sampling frequency (16 Hz) to minimize power consumption.
Figure 59: Activity recognition demo
The osxMotionAR engine is provided as a node-locked library which allows derivative
firmware images to run on a specific STM32-based board only.
Licensing activation code requests must be forwarded to ST and these codes must then be
included in the project prior to usage - failure to do so will prevent proper API execution.
The resulting firmware binary image will therefore be node-locked.
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The OSX MotionCP suite
This predictive software recognizes the carry position of the board using exclusively the
data acquired from the accelerometer; carry positions include:






on desk
in hand
near head
shirt pocket
trouser pocket
arm swinging
The real-time carry position algorithm can significantly improve motion-based applications
in the consumer, computer, industrial and medical fields.
The algorithm exclusively manages the data acquired from the accelerometer at a low
sampling frequency (50 Hz) to minimize power consumption.
Figure 60: Carry position demo
The osxMotionCP engine is provided as a node-locked library which allows derivative
firmware images to run on a specific STM32-based board only.
Licensing activation codes must be requested from ST and included in the project prior to
attempting its usage - failure to do so will prevent proper API execution.
The resulting firmware binary image will therefore be node-locked.
4.1.4.3
The pedometer suite
This is a simple demo to show the available data directly from the hardware, thanks to an
algorithm in the LSM6DS3 device which feeds accelerometer data at a very low sampling
frequency (1 Hz).
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The Demo is already implemented to also support the Step/min measurement, available in
the osxMotionPM embedded software.
Figure 61: Pedometer demo
4.1.4.4
RSSI and battery
This simple demo shows the data directly from the on-board power management
subsystem hardware. For the battery charging profile values, all the data comes directly
from the STC3115 and STNS01 devices placed in the battery circuit path.
The values shown are:




status of charge (SOC) in percentage
battery status
voltage
current
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Figure 62: RSSI and battery charging demo
4.2
Action list overview
From the action selector button at the top right of the screen, you can access:






4.2.1
Start/stop logging
Settings
Debug console
Serial console
BLE standby functions
Reboot functions
Start/stop logging
All the demos views have the start/stop logging command, which saves raw demo data in
the .csv format. Data is stored for each connected device in files that contain logs for each
feature. For example, logging environmental data results in
yyyymmdd_HHmm_Temperature.csv and yyyymmdd_HHmm_Pressure.csv files, where
the prefix represents the date and time when the log starts.
The file includes:


header information with date time of log start, devices connected, the logged feature,
data header and units
the raw data with the logged host date time stamp (relative to start time), node name
and feature timestamp.
Stopping the log triggers the prompt to send all available logged data by mail.
4.2.2
Settings
This menu provides the following settings groups:
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

General Settings: to enable free fall signalling
Log Settings: to set your export path and determine how logged data is treated:

saved directly in .csv files

saved in an sql db and exported to .csv once logging has finished in order to
send the data by mail

not saved, but sent to the logCat (Android Studio debug view)

clear log removes all .csv files logged from your export path
Figure 63: Log settings

4.2.3
Device Configuration: is divided into the following subgroups:
a. Device general settings control connection parameters
b. Session settings configure the firmware session registers to control high level
sensor and algorithm features, and low power mode.
c. Persistent settings configure the firmware persistent registers to control the same
features as the session settings, but with default values. it also contains others
low level sensor parameters like full scale (FS), output data rate (ODR) and BLE
output power.
d. System settings include RTC configuration, device firmware upgrade (DFU)
selector and five different Power-OFF modes.
Debug console
The Debug console can be opened from the actions menu to allow management of several
board features and command functions (sensor selection, read frequency, BlueNRG
communication subsampling) through a command line interface, and also to read register
values.
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Figure 64: Debug console command list
When the Debug console is open, all the functions implemented in the firmware can be
manipulated through a simple command line interface:


To get information, status and internal register in reading: ?command_name
To set a value, an internal register or other in writing mode: !command_name
An important role implemented in the Debug console is the window to set the License for all
the algorithms. In the text entry window, simply paste the contents of the email received as
a result of the request processed with the license wizard.
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Figure 65: Debug set node license dialog
4.2.4
Serial console
This is a terminal window for debugging, where you can read messages from the firmware
and control critical conditions.
4.2.5
BLE standby
This is a command to force the Bluetooth standby condition, causing demo interruption and
forcing the entire STEVAL-WESU1 system into STOP mode.
4.2.6
Reboot
Force a system reboot to guarantee control in case of problems with communications or
sensor data, or low power modes.
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BlueST Protocol SDK
5
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BlueST Protocol SDK
The Bluetooth low energy interface protocol is used by the BlueST app (iOS and Android)
with the STEVAL-WESU1 reference design. The sensor board exposes its functions and
communicates with the host through structured services and characteristics.
Each data characteristic can be signaled with different timings (setting the respective
register and therefore subsampling the application timer) and can be read asynchronously.
5.1
Advertising format
According to the Bluetooth 4.0 core specification Vol.3 part C, the 0xFF identifies vendorspecific information.
5.1.1
Bluetooth low energy AD structure (max. 31 bytes)
Table 6: BLE advertising structure
AD Field Name
ADType
AD Length
Record size
TX_POWER_LEVEL
0x0A
2
3
COMPLETE_NAME
0x09
Max. 10/16 (*)
11/17 (*)
MANUF_SPECIFIC
0xFF
13/7 (*)
14/8 (*)
FLAGS
0x01
2
3
(*) If the public device address is not set in the MANUF_SPECIFIC field, then the
COMPLETE_NAME can be maximum 16 bytes
5.1.2
5.1.2.1
AD structures
TX_POWER_LEVEL advertising item
Table 7: BLE TX power level advertising field
5.1.2.2
Octets LSB
0
1
2
Name
Len
Type
-100 a + 20 dBm
Value
0x02
0x0A
0xXX
MANUF_SPECIFIC advertising item
Table 8: BLE advertising manuf.-specific advertising field
Octets
LSB
0
1
2
3
4
Name
Len
Type
Ver
Dev
ID
Group A
Features
Group B
Features
Company
assigned
Company id
(proposal)
Value
0x0D
0xFF
0x01
0xXX
0xXXXX
0xXXXX
0xXXXXXX
0x2680E1
5
6
7
8
9
10
11
12
Public device address (48
bits)
(optional)
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BlueST Protocol SDK
3
2
1
0
RFU
4
BATT
5
3
2
1
0
RFU
RFU
6
TEMP
RFU
7
RFU
RFU
8
RFU
RFU
9
PRESS
Bit
10
MAG
11
GYRO
12
ACC
13
RFU
14
RFU
15
RFU
N
RFU
Table 9: Group A features map
5.1.2.3
4
Pedometer
5
Carry
Position
RFU
6
Recognition
RFU
7
Activity
RFU
8
RFU
RFU
9
RFU
Bit
10
Fusion
11
Sensor
12
RFU
13
Fall
14
Free
15
RFU
N
RFU
Table 10: Group B features map
Device ID enum
Table 11: Device ID enumeration
ID
HW
0x00
Generic
0x01
WeSU
0x02 – 0x7F
RFU
0x80 – 0xFF
Nucleo Map
If GPA or GPB bits are set, then the general purpose characteristics have to be
defined
The msb in the Device ID enum is used to indicate a Nucleo-based system
5.2
Services/characteristics
Table 12: Services/characteristics allocation map
Groups
Service
Max
Size
Char
Mode
Note
0x0000
0000
0001
Features
Data
UUID
Group A
16 single
features
n/a
r/n
0xXXXX
0000
0001
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TS + Value, 0xXXXX only one bit,
(e.g. Accelerometer bit 7 =>
0x00800001-)
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BlueST Protocol SDK
Groups
Service
UM2041
Char
Max
Size
Mode
UUID
Note
Group B
16 single
features
n/a
r/n
0x0000
XXXX
0001
TS + Value, Only one bit
0x0000
0000
0003
must use the characteristic
descriptor to configure the data
Unit, Name, Type (Size), Format
(Precision)
0xXXXX
XXXX
0003
TS + Value[s]
General
Purpose
GP XXXX
XXXX
n/a
r/n
0x0000
0000
000E
Debug
Term
n/a
r/w/n
0x0000
0001
000E
This characteristic is used for
debug purpose as a hyperterminal like connection (Stdio)
r/n
0x0000
0002
000E
This characteristic is used for
debug purpose as an output only
terminal in order for the BLE
device to send textual info on
errors (StdErr)
Debug
StdErr
n/a
Control
0x0000
0000
000F
64
Config
0x0000
0001
000F
Registers
access
Feature
Command
64
w/n
0x0000
0002
000F
Note:
1.
2.
3.
4.
5.
5.2.1
BLUETOOTH SPECIFICATION Version 4.2 [Vol 3, Part B] 2.5.1 UUID
Service UUID -11e1-9ab4-0002a5d5c51b
Char UUID -11e1-ac36-0002a5d5c51b
All data char contains TS [2 bytes] (first field)
TS is timestamp (uint16) relative to the board and valid for all features
HW single feature packet
All packets start with a uint16 timestamp (TS)
5.2.1.1
Generic packet format
Table 13: Generic packet format
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Octets LSB
0
1
Name
TS
Payload: Value[s]
Value
0xXXXX
0xXXXXXXXX
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3
…
N
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5.2.1.2
BlueST Protocol SDK
Motion sensors packet format
Accelerometer payload: mg, signed int16
Gyroscope payload: dps, signed int16
Magnetometer payload: mGa, signed int16
Table 14: Motion sensors packet format
5.2.1.3
Octets LSB
0
1
2
3
4
5
Name
X
Y
Z
Value
0xXXXX
0xXXXX
0xXXXX
Battery packet format
Battery payload:




Battery level: 0.1%, signed int16 (multiply by 10)
Battery Voltage: mV, signed int16
Average current: mA, signed int16
Power mgmt. Status: enum, unsigned int8
Table 15: Battery packet format
Octets LSB
0
1
2
3
4
5
6
Name
Battery
level
Battery
Voltage
Average
current
Power Mng Status
Value
0xXXXX
0xXXXX
0xXXXX
0xXX
Table 16: Pressure packet format
Octets LSB
0
1
Name
Pressure Value
Value
0xXXXXXXXX
2
3
Pressure payload: mbar, signed int32, multiply by 100
5.2.1.4
Temperature packet format
Temperature payload: Celsius, multiply by 10
Table 17: Temperature packet format
5.2.2
Octets LSB
0
Name
Value
Value
0xXXXX
1
Aggregate feature packet
To optimize the data throughput, you can aggregate multiple features in a single
characteristic. The resulting UUID is the OR of the UUID of the single features.
The features data must follow the feature mask order.
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Example: Motion packet (0x00700000) = Accelerometer (0x00400000) + Gyroscope
(0x00200000) + Magnetometer (0x00100000)
Table 18: Motion packet format
Octets
LSB
0
1
2
3
4
5
6
7
8
9
Accelerometer
Name
13 14 15 16
Gyroscope
17 18 19
Magnetometer
TS
X
Value
10 11 12
X
X
X
X
X
X
X
0xXXXX 0xXXXX 0xXXXX 0xXXXX 0xXXXX 0xXXXX 0xXXXX 0xXXXX
X
0xXXXX 0xXXXX
Accelerometer payload: mg, signed int16
Gyroscope payload: tenth of dps, signed int16
Magnetometer payload: mGa, signed int16
5.2.3
SW single feature packet 1/2
All packets start with a uint16 timestamp (TS)
5.2.3.1
Generic packet format
Table 19: Generic packet format
5.2.3.2
1
2
…
Octets LSB
0
3
Name
TS
Payload:Value[s]
Value
0xXXXX
0xXXXXXXXX
N
Sensor fusion payload: 4x float (IEEE 754 single)
Table 20: Sensor fusion packet format
Octets
LSB
0
Name
TS
qi
qj
qk
qs
Value
0xXXXX
0xXXXXXXXX
0xXXXXXXXX
0xXXXXXXXX
0xXXXXXXXX
1
2
3
4
5
6
7
8
9
10
11
12
13
Vector coefficients
14
15
Scalar coefficient
(optional)
If it only has 3 fields (qi,qj,qk), the vector coefficients are normalized
IEEE 754 single (Reference: AN4044 on www.st.com).
(Using floating-point unit (FPU) with STM32F405/07xx and STM32F415/417xx
microcontrollers)
Figure 66: IEEE 754 single reference
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5.2.3.3
BlueST Protocol SDK
Free fall payload
Free fall payload: 1 byte is needed if used in an aggregated fashion


1 = free fall event
0 = no free fall event
Table 21: Free fall packet format
5.2.3.4
Octets LSB
0
Name
Value
Value
0 or 1
Activity recognition payload
Activity recognition payload: 1 byte
Table 22: Activity recognition packet format
Octets LSB
0
Name
Value
Value
0 …. 6
Table 23: Valid activity types
Activity type
5.2.3.5
0x00
No activity
(no enough data for decide)
0x01
Stationary
0x02
Walking
0x03
Fast walking
0x04
jogging
0x05
Biking
0x06
driving
Carry position payload
Carry position payload: 1 byte
Table 24: Carry position packet format
Octets LSB
0
Name
Value
Value
0 …. 6
Table 25: Carry position type
Carry position type
0x00
Unknown
0x01
On Desk
0x02
In Hand
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Carry position type
0x03
Near Head
0x04
Shirt Pocket
0x05
Trouser Pocket
0x06
Arm Swing
5.2.4
Configuration settings
5.2.4.1
Register access
Table 26: Register access packet format
Octets LSB
0
1
2
3
4
Name
CTRL
ADDR
ERR
LEN
Payload

…
5
64
CTRL field
Table 27: Control field
N
7
6
5
4
3
2
1
0
Mode
Pending
Mode
Type
Error
Ack
RFU
RFU
RFU
1
Exec op
Persistent
Write
Error
Ack required
-
-
-
0
No op
Session
Read
No error
No ack
-
-
-



5.2.5
Debug



5.3
ADDR: register address (0x00 – 0xFF)
ERR: error code (0x00, no ERROR – 0x01-0xFF specific error code)
LEN: register number (len * 2 = payload size in byte)
The package doesn’t contain a timestap
If the package doesn’t end in ‘\0’, the message finishes in the next package
Max package size is 20 bytes
Registers
The control registers (16 bit) are for hardware configuration and runtime operation. The
default configuration is stored in FLASH memory and loaded into RAM and EEPROM
during runtime.
Figure 67: Memory register mapping
Access at this memory area is regulated through write and read operations in the Memory
Access characteristic and through notification events.
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5.3.1
BlueST Protocol SDK
Register types
Persistent registers are stored in EEPROM, data is preserved in case of power loss
(battery discharge or failure).
Session registers are stored in RAM, data is preserved as long as the system is supplied
(battery or external power).
5.3.2
Errors
Table 28: Error code mapping
Name
Error code
Session
NO_ERROR_CODE
0x00
No error
ERROR_LENGHT
0x01
Max payload length is 16 (TBC)
ERROR_WRONG_FORMAT
0x02
Incorrect payload data format
ERROR_NOT_IMPLEMENTED
0x03
Register not implemented (optional)
ERROR_ACTION_NOT_ALLOWED
0x04
Action not allowed
ERROR_REG_IS_READ_ONLY
0x05
Read only register
ERROR_NOT_ALLOWED
0x06
Ctrl field mask is not allowed
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Board schematic and bill of material
UM2041
6
Board schematic and bill of material
6.1
Bill of material
Table 29: Bill of material
66/81
Item
Qty
Reference
Value
Description
Part Number
Manuf.
1
1
ANT1
2.4 GHz
Chip
Antenna,SMD
W3008C
Pulse
2
1
CN500
Micro_USB
_AB
47590-0001
Molex
3
5
C110,C200,
C216,C401,
C411
1µF,6.3V,
±10%
Ceramic
X5R,SMD 0402
GRM155R60J105K
E19D
Murata
4
23
C111,C112,
C113,C114,
C115,
C116,C201,
C219,C222,
C225,
C228,C302,
C304,C305,
C306,
C307,C308,
C309,C406,
C407,
C412,C504,
C505
100nF,16V
±10%
Ceramic
X5R,SMD 0201
GRM033R61C104K
E84D
Murata
5
4
C117,C303,
C400,C404
10µF,6.3V,
±20%
Ceramic
X5R,SMD 0402
C1005X5R0J106M0
50BC
TDK
6
2
C118,C119
10pF,25V,
±0.5pF
Ceramic C0G,
NP0,SMD 0201
C0603C0G1E100D
030BA
TDK
7
1
C206
51pF not
mounted,
50V,±10%
Ceramic
C0G,SMD 0402
GRM1555C1H510G
A01D
Murata
8
2
C212,C213
12pF,50V,
±0.1pF
CH,SMD 0201
GRM0335C1H120G
A01
Murata
9
2
C214,C221
100pF,16V
,±10%
Ceramic
X7R,SMD 0201
GRM033R71C101K
D01D
Murata
10
2
C223,C224
not
mounted
SMD 0402
any
any
11
4
C226,C227,
C22, C23
15pF,25V,
±0.1pF
C0G,SMD 0201
GJM0336C1E150F
B01D
Murata
12
1
C229
150nF,6.3
V,±10%
Ceramic
X5R,SMD 0402
GRM155R60J154K
E01D
Murata
13
2
C402,C403
2.2uF,6.3V
,±20%
Ceramic
X5R(EIA),SMD
0402
GRM155R60J225M
E95D
Murata
14
3
C405,C408,
C409
10nF,10V,
±10%
Ceramic
X7R,SMD 0201
GRM033R71A103K
A01D
Murata
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Board schematic and bill of material
Item
Qty
Reference
Value
Description
Part Number
Manuf.
15
1
C410
220nF,16V
,±10%
Ceramic
X7R,SMD 0402
GRM155R71C224K
A12D
Murata
16
1
C500
4.7nF,50V,
±10%
Ceramic
X7R,SMD 0402
GRM155R71H472K
A01D
Murata
17
1
C501
47µF,10V,
±20%
Ceramic
X5R,SMD 0805
C2012X5R1A476M
125AC
TDK
18
1
D401
RED
LED
VLMS1500-GS08
VISHAY
19
1
D500
WHITE
LED
VLMW1500-GS08
VISHAY
20
1
D501
ESDALC6
V1-1U2
ST0201
ESDALC6V1-1U2
ST
21
1
D502
ESDA7P60
-1U1M
QFN
ESDA&P60-1U1M
ST
22
1
J500
SWD/
JTAG
THR 1.27 mm 2x5
FTSH-105-01-F-D-K
SAMTEC
23
1
J501
CON3
SMT 3W 1.2 mm
pitch
78171-0003
Molex
24
1
L203
10µH,20%
SMD 0805
LQM21FN100M70L
Murata
25
1
L204
0Ω,±0.1%
SMD 0402
any
any
26
2
L205, L206
3.9nH,±0,3
nH
SMD 0402
LQG15HN3N9SO2D
Murata
27
3
L401, L402,
L403
1.5Ω, 215
mA
SMD 0201
BLM03BD471SN1D
Murata
28
4
R113,R309,
R405,R506
0Ω,±1%
SMD 0201
any
any
29
10
R116,R117,
R119,R120,
R121,
R122,R123,
R200,R201,
R501
10kΩ,±1%
SMD 0201
any
any
30
5
R301,R302,
R303,R307,
R308
0Ω,±1%
SMD 0201
any
any
31
5
R114,R118,
R304,R305,
R306
0Ω,±1%,
not
mounted
SMD 0201
any
any
32
1
R400
2kΩ,±1%
SMD 0201
any
any
33
1
R401
1Ω,±1%
SMD 0201
any
any
34
1
R402
60Ω 0.05W,
±1%
SMD 0201
any
any
35
2
R403,R408
1KΩ,±1%
SMD 0201
any
any
R404
10KΩ NTC
-not
mounted,
±1%
SMD 0402
NTCS0402E3103FLT
Vishay
36
1
DocID029122 Rev 2
67/81
Board schematic and bill of material
Item
Qty
Reference
Value
Description
Part Number
Manuf.
37
1
R412
1MΩ,±1%
SMD 0201
any
any
38
1
R413
33kΩ,±1%
SMD 0201
any
any
39
1
R500
1MΩ,±1%
SMD 0402
any
any
40
2
R502,R503
100kΩ,
±1%
SMD 0201
any
any
41
1
R504
100Ω,±1%
SMD 0201
any
any
42
1
R505
0.05Ω,±1%
SMD 0402
LRCS04020R05FT5
WELWYN
SW500
SW
PUSHBUT
TONDPST
B3U-3000P
Omron
SMD Coaxial
Connector,SMT
U.FL-R-SMT-1(10)
Hirose
43
68/81
UM2041
1
44
1
U201
uFL
connector not
mounted,
50Ω - 6
GHz
45
1
U100
STM32L15
1VEY6
WLCSP104
STM32L151VEY6
ST
46
1
U200
BLUENRG
-MS
VFQPN32 5x5
mm
BLUENRG-MSQTR
ST
47
1
U202
BALFNRG-01D3
FLIP CHIP 4 ball
BALF-NRG-01D3
ST
48
1
U301
LPS25HB
HLGA-10L (2.5 x
2.5x 0.76 mm)
LPS25HB
ST
49
1
U302
LSM6DS3
LGA-14L
(2.5x3x0.83mm)
LSM6DS3
ST
50
1
U303
LIS3MDL
VFLGA-12
(2.0x2.0x1.0mm)
LIS3MDL
ST
51
1
U400
STNS01
DFN12L (3x3 mm)
STNS01
ST
52
1
U401
STC3115
CSP (1.4 x 2.0
mm)
STC3115
ST
53
1
U402
Voltage
Regulator
3.1V
SOT666
STLQ015XG31R
ST
54
1
U502
USBULC62M6
uQFN
USBULC62M6(uQFN)
ST
55
2
Y2, Y201
NX2012SA
32kHz
EXS00AMU00389
NDK
56
1
Y101
NX2016SA
24MHZ
EXS00ACS05544
NDK
DocID029122 Rev 2
UM2041
Board schematic and bill of material
Item
57
Qty
1
Reference
Value
Y202
NX2016SA
32MHz
EXS00ACS06644
Description
Part Number
Manuf.
NDK
Adapter Board
1
2
J1-J2
Con3
Strip Line Male
THR 2,54 mm 1x3
any
2
1
J5
External
Connector
Strip Line Male
THR 2,54 mm 1x8
any
3
1
J9
JTAGConnector
THR 2,54 mm
2x10
4
1
J10
Jump_JTD
Strip Line Male
THR 2,54 mm 1x2
5
1
J12
SWD/TAG
THR 1.27 mm 2x5
FTSH-105-01-F-D-K
SAMTEC
6
1
C1
100nF,
16V, ±10%
Ceramic X5R,
SMD 0201
GRM033R61C104K
E84D
Murata
7
1
R1
10kΩ, ±1%
SMD 0201
any
any
8
1
S1
SW
PUSHBUT
TON
Adapter
KMR221GLFS
C&K
9
1
FFSD-05-D-08.0001-N
SAMTEC
SWD flat
cable
Cable
DocID029122 Rev 2
2-1634688
Tyco
Electronics
any
69/81
70/81
DocID029122 Rev 2
PWR_I2C_SCL
PWR_GAS_CG
PWR_I2C_SDA
PWR_NTC
5-Connectors
PWR_I2C_SDA
PWR_I2C_SCL
PWR_NTC
PWR_GAS_CG
Connectors
SWD_SWCLK
SWD_SWDIO
LED_User
nRESET
USB_Monitor
EXT_ConJ500
1-CPU
SWD_SWCLK
SWD_SWDIO
LED_User
nRESET
USB_Monitor
EXT_ConJ500
USB_DM
USB_DP
Button_PowerOn
Button_PowerOn
USB_DM
USB_DP
RX232_ConJ500
BluNRG_SPI_MISO
BluNRG_SPI_MOSI
BluNRG_SPI_SCK
BluNRG_SPI_CS
BluNRG_RST
BluNRG_IRQ
RX232_ConJ500
BluNRG_SPI_MISO
BluNRG_SPI_MOSI
BluNRG_SPI_SCK
BluNRG_SPI_CS
BluNRG_RST
BluNRG_IRQ
CPU
PWR_SD
9X_SPI_SCK
9X_SPI_MISO
9X_SPI_MOSI
6X_SPI_CS
MAG_SPI_CS
Mag_DRDY
6X_INT1
6X_INT2
MAG_INT
Press_SPI_CS
Press_INT
PWR_I2C_SDA
PWR_I2C_SCL
PWR_CHG
PWR_ALM
PWR_RSTIO/BATD
PWR_CEN
3-Sensor
9X_SPI_SCK
9X_SPI_MISO
9X_SPI_MOSI
6X_SPI_CS
MAG_SPI_CS
Mag_DRDY
6X_INT1
6X_INT2
MAG_INT
Press_SPI_CS
Press_INT
Sensors
4-Power Managment
PWR_I2C_SDA
PWR_I2C_SCL
PWR_I2C_SCL
PWR_I2C_SDA
PWR_NTC
PWR_GAS_CG
PWR_CHG
PWR_ALM
PWR_RSTIO/BATD
PWR_CEN
PWR_SD
Power Managment
PWR_GAS_CG
PWR_NTC
6.2
2-BluNRG
BluNRG
Board schematic and bill of material
UM2041
Schematic diagrams
Figure 68: Main system blocks
GSPG2503161330SG
1
2
smr0201
1
2
1
15pF25V
smc0201
2
WKUP
U100
STM32L151VEY6
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
PB0
PB1
PB2-BOOT1
PB4-NJTRST
PB5
PB6
PB7
PB8
PB9
PB10
PB11
PB12
PB13
PB14
PB15
PA0-WKUP1
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PA8
PA9
PA10
PA11
PA12
PA15-JTDI
PH0-OSC_IN
PH1-OSC_OUT
NRST
BOOT0
GND
C22
C23
15pF 25V
smc0201
NX2012SA 32k EXS00A-MU00389
Y2
OSC32_IN 1
OSC32_OUT
2
smr0201
D_VDD
K9
L9
Button_PowerOn
J8
RX232_ConJ500
H7
CK232_ConJ500
J7
BluNRG_SPI_SCK
M8
R120
10k smr0201 BluNRG_SPI_MISO H6
BluNRG_SPI_MOSI K7
F3
BluNRG_RST
F1
F2
USB_DM
E1
USB_DP
E2
B1
D_VDD
LED_User
J6
D_VDD
K6
M6
BOOT1
9X_SPI_MISO
A5
R121
9X_SPI_MOSI
A6
R122 10k
6X_SPI_CS
C5
10k
MAG_SPI_CS
B6
PWR_I2C_SCL
D5
PWR_I2C_SDA
C6
M2
Press_SPI_CS
L3
EXT_ConJ500
J4
PWR_RSTIO/BATD J3
D_VDD
L1
PWR_ALM
K2
R123
B7
10k
A8
D6
D7
smr0201
C8
B9
E6
L6
F8
F9
F7
A7
PE15
PE14
PE13
PE12
PE11
PE10
PE9
PE8
PC15-OSC32_OUT
PC14-OSC32_IN
PC13-TAMPER-WKUP2
PC12
PC11
PC10
PC9
PC8
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PD15
PD14
PD13
PD12
PD11
PD10
PD9
PD8
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PH2
K4
L4
K5
M3
L5
J5
M4
M5
D9
D8
C9
B2
C2
E4
F4
G2
G1
H1
M7
L7
G8
G9
H9
F6
G3
J1
H2
H3
G4
K1
J2
H4
A4
B4
B3
A3
C4
C3
D4
A2
D1
E3
D3
B5
GND
OSC_IN
C119
10pF 25V
smc0201
NDK:NX2016SA24MHzEXS00A-CS0554
4
1
GND
NX2016SA 24MHZ EXS00A-CS05544
TP102
C118
10pF 25V
smc0201
Y101
OSC_OUT
3
TP103
VLCD
VDD_A
PA13-JTMS-SWDIO
PA14-JTCK-SWCLK
PB3-JTDO-TRACESWO
STM32L151VEY6
cercareCapacità
GND
1
OSC_IN
OSC_OUT
nRESET
BOOT0
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
1
H8
VREF2
4
1
2
K3 VDD_1
C1 VDD_2
B8 VDD_3
A9
M9 VDD_4
L8
E9
VDD_1
VDD_2
VDD_3
VDD_3A
VDD_4A
VDD_4
VDD_5
G7
G6
E7
VREF+
VDDA
VLCD
VSSA
J9
VDD_4
GND
C114
16V 100nF
SMD 0201
GND
C116
16V 100nF
SMD 0201
R117
10k
SMR0201
2
6X_INT1
Button_PowerOn
nRESET
D_VDD
GND
2
2
0
SMR0201
1
1
WKUP
SMR0201
0 NOT MOUNT
R113
R118
1 PWR_RSTIO/BATD
SMR0201
0 NOT MOUNT
R114
GND
R119
10k
SMR0201
BOOT1
TP105
C110
6.3V1uF
SMD 0402
R116
10k
SMR0201
BOOT0
TP104
C117
10uF 6.3V
smc0402
SENS_A_VDD
D_VDD
GND
C115
16V 100nF
SMD 0201
VDD_A
GND
C113
16V 100nF
SMD 0201
Boot/Reset/Wakeup
GND
VLCD
GND
C112
16V 100nF
SMD 0201
VDD_3
D_VDD
D_VDD
VDD_2
D_VDD
D_VDD
VDD_1
C111
16V 100nF
SMD 0201
MAG_INT
MAG_DRDY
Press_INT
6X_INT2
6X_INT1
USB_Monitor
PWR_SD
BluNRG_SPI_CS
PWR_CHG
PWR_CEN
OSC32_OUT
OSC32_IN
BluNRG_IRQ
SWD_SWDIO
SWD_SWCLK
9X_SPI_SCK
1
2
1
2
1
9X_SPI_SCK
1
2
1
L2
D2
C7
K8
E8
A1
M1
2
1
2
1
2
2
1
2
1
1
2
2
1
1
2
1
2
1
2
1
1
2
1
DocID029122 Rev 2
2
BluNRG_SPI_CS
BluNRG_SPI_SCK
BluNRG_SPI_MOSI
BluNRG_SPI_MISO
BluNRG_IRQ
BluNRG_RST
PWR_ALM
PWR_RSTIO/BATD
PWR_SD
PWR_CHG
PWR_CEN
PWR_I2C_SCL
PWR_I2C_SDA
Power managment
MAG_INT
Mag_DRDY
6X_INT2
6X_INT1
MAG_SPI_CS
6X_SPI_CS
9X_SPI_SCK
9X_SPI_MOSI
9X_SPI_MISO
Press_INT
Press_SPI_CS
Sensors
CK232_ConJ500
RX232_ConJ500
nRESET
USB_Monitor
Button_PowerOn
LED_User
EXT_ConJ500
USB_DP
USB_DM
SWD_SWCLK
SWD_SWDIO
PWR_ALM
PWR_RSTIO/BATD
PWR_SD
PWR_CHG
PWR_CEN
PWR_I2C_SCL
PWR_I2C_SDA
MAG_INT
Mag_DRDY
6X_INT2
6X_INT1
MAG_SPI_CS
6X_SPI_CS
9X_SPI_SCK
9X_SPI_MOSI
9X_SPI_MISO
Press_INT
Press_SPI_CS
RX232_ConJ500
nRESET
USB_Monitor
Button_PowerOn
LED_User
EXT_ConJ500
USB_DP
USB_DM
SWD_SWCLK
SWD_SWDIO
Connectors and Interfaces
BluNRG_SPI_CS
BluNRG_SPI_SCK
BluNRG_SPI_MOSI
BluNRG_SPI_MISO
BluNRG_IRQ
BluNRG_RST
BluNRG-MS
UM2041
Figure 69: Microcontroller schematics
Board schematic and bill of material
GSPG2503161415SG
71/81
Board schematic and bill of material
UM2041
Figure 70: Sensors subsystem schematics
72/81
DocID029122 Rev 2
1
MOSI 1
CLK 2
IRQ 3
4
VBAT35
6
7
8
U200
VBAT1
C216
C228
6.3V1uF
16V 100nF
SMD 0402 SMD 0201
BLU_GND
2
2
SPI_MOSI
SPI_CLK
SPI_IRQ
TEST1
VBAT3
TEST2
TEST3
TEST4
BlueNRG-MS
BLU_GND
C225
16V 100nF
SMD 0201
VBAT2
BLU_VDD
1
2
L206
3.9nH
SMD 0402
BLU_GND
C226
C227
15p
15p
SMD 0201SMD 0201
1
Y201
BLU_GND
VBAT3
BLU_VDD
BLU_GND
RX_N
GND
A2
1
BLU_GND
L205
3.9nH
SMD 0402
NX2016SA 32MHz EXS00A-CS06644
BALF-NRG-01D3
B2
GND1 GND
U201
Line 50 Ohm
BLU_GND
1
BluNRG_SPI_CS
BluNRG_SPI_SCK
BluNRG_SPI_MOSI
BluNRG_SPI_MISO
BluNRG_IRQ
BluNRG_RST
Pulse
W3008C
BLU_GND
ANT1
3
2.4 GHz
1
TP206 TP205
C224
TBD
SMD 0402
CSN
CLK
MOSI
MISO
IRQ
RST
BLU_GND
pi greek filter
SMD 0402
L204
TBD
C223
TBD
SMD 0402
2
BLU_GND
TP204 TP203 TP202 TP201
SMR0201
U.FL connector NOT MOUNT
3
51pF NOT MOUNT
SMD 0402
C206
2
1
1
BLU_GND
BLU_GND
NX2012SA 32k EXS00A-MU00389
U202
B1
A1
RX_P
ANT
2
C213
12p
SMD 0201
BLU_GND
2
Y202
BLU_GND
VBAT2
C212
12p
SMD 0201
24
23
22
21
20
19
18
17
C219
16V 100nF
SMD 0201
C222
100nF
16V SMD 0201
BLU_GND
C214
100p
SMD 0201
VBAT1
SXTAL0
SXTAL1
RF0
RF1
VBAT2
FXTAL0
FXTAL1
2
SMD 0805
L203 10uH
1
R201
10k
1
BLU_VDD
1
1
BLU_GND
1
C201
16V 100nF
SMD 0201
C221
C229
100p
150n
SMD 0201 SMD 0402
BLU_GND
BLU_VDD
BLU_GND
GND
2
R200
10k SMR0201
1
C200
6.3V1uF
SMD 0402
BLU_GND
1
2
33
1
1
1
2
1
2
1
2
2
GND
2
1
SIG
2
1
2
1
2
1
2
1
2
32
MISO
31
CSN
30 TEST10
29
28
27NO_SMPS
26
25
RST
1
2
1
SPI_MISO
SPI_CS
TEST10
VDD1V2
SMPSFILT2
NO_SMPS
SMPSFILT1
RESETN
TEST5
TEST6
TEST7
VDD1V8
TEST8
TEST9
TEST11
TEST12
1
2
2
1
VBAT1
2
1
9
10
11
12
13
14
15
16
2
1
2
DocID029122 Rev 2
1
UM2041
Figure 71: Connectivity subsystem schematics
Board schematic and bill of material
GSPG3003160815SG
73/81
Board schematic and bill of material
UM2041
Figure 72: SWD and Reset connection schematics
74/81
DocID029122 Rev 2
UM2041
Board schematic and bill of material
Figure 73: External connector schematics
DocID029122 Rev 2
75/81
0
PWR_I2C_S DA
PWR_I2C_SCL
STC3115
PWR_RSTIO/B ATD
PWR_ALM
1
TP405
BLU_GND
SMR0201
R405
BLU_GND
2
PWR_I2C_S DA
PWR_I2C_SCL
PWR_ALM
PWR_RSTIO/B ATD
R405shall not be the only poi nt
of conjunction between the
grounds. It has been inserted
only to differentiate GNDs label
GND
2
L403
1.5 Ohm 215 mA
SML0201
1
C3
B1
C1
A1
VDD
L402
BLU_VDD
1
1.5 Ohm 215 mA
SML0201
VDD
1.5 Ohm 215 mA
SML0201
C408 10nF
10V
smc0201
1
TP401
GND
10V
SMD 0201
2
1
GND
1
TP403
RSTIO/BATD
STC3115
C409
10nF
10V
SMD 0201
D_VDD
SDA
SCL
ALM
U401
2
2
1
C405
10nF
2
GND
1
TP407
VCC
VIN
CG
1
R401
1R
SMD 0201
6.3V
D3
B2
B3
A3
PWR_GAS_ CG
TP413
SMD 0201
2
1K
PWR_B ATT+
GND
C411
1uF
6.3V
R403
1
1
2
3
STNS01
ISET
SYS
IN
U400
GND
SMD 0402
10K NTC
R404
GND
R412
1
C410
16V
SMD 0402
NTC
BATSNS
BAT
BATMS
CEN
CHG
SD
LDO
TP414
GND
220nF
4
5
6
STLQ015 XG30R
EN
OUT
GND NC
IN
NC1
U402
SMD 0201
2 PWR_N TC
1K
SMD 0402
PWR_S YS
2
1
6.3V 9
GND
I_fast = (V_iset/R_iset) *200
-- V_iset =1V --- I_fast
from 15mA to 200mA
GND
R400
2K
SMD 0201
C402
2.2uF
SMC0402
PWR_S YS
C406 100nF
16V
SMD 0201
PWR_GAS_ CG
R408
1
10uF
6.3V
smc0402
C404
STLQ015
GND
C403
C407
2.2uF
16V 100nF SMC0402
SMD 0201
BATD/CD
2
L401
2
1
1
2
1
1
1
2
2
1
1
1
1
2
1
2
1
2
USB_5V
1
2
13
7
EXP_PAD
GND
SMD 0201
2 PWR_B ATT+
1M
GND
C412
100nF
SMD 0402
1
2V 20mA
The BATSNS pin must
be connected as close
as possible to the
battery’s positive
terminal.
33K
VBAT
VISHAYVLMS1500 -GS08
RED
D401
R402
60 - 0.05W
SMD 0201
SMD 0201
1 R413
2
10uF
6.3V
smc0402
3.0V 150mA
GND
1
2
C400
PWR_N TC
BATSNS
PWR_B ATT+
GND
PWR_CEN
PWR_CHG
PWR_SD
VDD
8
11
12
10
6
5
4
3
C401
6.3V 1uF
SMD 0402
1
TP402
GND
D1
NC
D2
1
2
1
SENS_A_VDD
2
1
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2
1
2
PWR_CHG
TP408
PWR_I2C_S DA
PWR_I2C_SCL
PWR_ALM
PWR_RSTIO/B ATD
PWR_GAS_ CG
PWR_N TC
- End of charge;
TP409
TP410
PWR_N TC
- Battery voltage bel ow VPRE a fter
the fast-charge has already
started;
- Charging timeout (p recharge,
fast-charge);
A t ransition H-> L->H restarts the
charger stopped for:
Low level disables the b attery
charger.
Leave floating or H at power on
PWR_CEN
Fault --> Toggling 1Hz
Charging --> Low
Not charging --> High Z
PWR_CHG
POWER_SHUTDOWN --> High
level SD on
1
2
PWR_SD
1
VDD
1
STNS01
TP411
1
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TP412
PWR_CEN
PWR_SD
1
Voltage References and GNDs
Board schematic and bill of material
Figure 74: Battery and power management subsystem schematics
UM2041
GSPG0404161400SG
UM2041
7
Formal notices required by the U.S. Federal
Communications Commission ("FCC")
Formal notices required by the U.S. Federal
Communications Commission ("FCC")
Model: STEVAL-WESU1
FCC ID: S9NWESU1
Any changes or modifications to this equipment not expressly approved by
STMicroelectronics may cause harmful interference and void the user’s authority to operate
this equipment.
This device complies with part 15 of the FCC rules. Operation is subject to the following
two conditions:
1.
2.
This device may not cause harmful interference, and
This device must accept any interference received, including interference that may
cause undesired operation.
For Class A Digital Devices
This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his own expense.
For Class B Digital Devices
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference's by one or more of the following measures:




Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
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Formal notices required by the Industry Canada
("IC")
8
UM2041
Formal notices required by the Industry Canada
("IC")
Model: STEVAL-WESU1
IC: 8976C-WESU1
English:
This Class A or B digital apparatus complies with Canadian CS-03.
Changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
French:
Cet appareil numérique de la classe A ou B est conforme à la norme CS-03 du Canada.
Les changements ou les modifications pas expressément approuvés par la partie
responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner
l'équipement.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. 'exploitation est autorisée aux deux conditions suivantes: (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter
tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
78/81
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UM2041
9
Acronyms and abbreviations
Acronyms and abbreviations
Table 30: List of acronyms
Acronym
Description
AHRS
Attitude heading reference system
API
Application programming interface
BLE
Bluetooth low energy
BSP
Board support package
CLI
Command line interface
DFU
Device firmware upgrade
FS
Full scale (MEMS sensor setting)
HAL
Hardware abstraction level
HCI
Host command interface
IDE
Integrated development environment
ODR
Output data rate (MEMS sensor setting)
OTA
Over the air
SOC
Status of charge
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Revision history
10
UM2041
Revision history
Table 31: Document revision history
80/81
Date
Version
Changes
07-Apr-2016
1
Initial release.
17-May-2016
2
Minor text edits
Updated Section 3.6: "Toolchains"
DocID029122 Rev 2
UM2041
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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the
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© 2015 STMicroelectronics – All rights reserved
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