318AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74R
CASE 318AA−01
ISSUE B
6
1
DATE 27 MAY 2005
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
D
4
5
3
2
6
E
HE
1
b
e
c
A
0.05 (0.002)
DIM
A
A1
b
c
D
E
e
L
HE
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.37
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
L
A1
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
2.4
0.094
XXXM
0.95
0.037
1.9
0.074
XXX
M
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”,
may or may not be present.
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLE 20:
PIN 1. COLLECTOR 1
2. BASE 2
3. EMITTER 2
4. COLLECTOR 2
5. BASE 1
6. EMITTER 1
DOCUMENT NUMBER:
STATUS:
STYLE 21:
PIN 1. COLLECTOR 1
2. EMITTER 2
3. BASE 2
4. COLLECTOR 2
5. EMITTER 1
6. BASE 1
98AON13505D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
 Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SC−74R
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON13505D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
30 SEP 2003
A
ADDED STYLE 21. REQ. BY D. BARLOW
03 NOV 2003
B
ADDED NOMINAL VALUES AND SOLDERING FOOTPRINT. REQ BY HONG XIAO
27 MAY 2005
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
 Semiconductor Components Industries, LLC, 2005
May, 2005 − Rev. 01B
Case Outline Number:
318AA
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