488AA

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE M
1
SCALE 2:1
DATE 27 MAY 2015
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
A
2
B
D1
2X
0.20 C
4X
E1
2
q
E
c
1
2
3
A1
4
TOP VIEW
C
DETAIL A
0.10 C
SEATING
PLANE
A
0.10 C
SIDE VIEW
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.00
5.15
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.00
6.15
6.30
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.575
0.71
1.20
1.35
1.50
0.51
0.575
0.71
0.125 REF
3.00
3.40
3.80
0_
−−−
12 _
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
GENERIC
MARKING DIAGRAM*
DETAIL A
1
0.10
b
C A B
0.05
c
8X
XXXXXX
AYWZZ
e/2
e
L
1
K
RECOMMENDED
SOLDERING FOOTPRINT*
2X
E2
PIN 5
(EXPOSED PAD)
G
XXXXXX= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
4
L1
M
0.495
4.560
2X
*This information is generic. Please refer
to device data sheet for actual part
marking.
1.530
D2
3.200
BOTTOM VIEW
4.530
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
STYLE 2:
PIN 1. ANODE
2. ANODE
3. ANODE
4. NO CONNECT
5. CATHODE
1.330
2X
0.905
1
0.965
4X
1.000
4X 0.750
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON14036D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD: REF TO JEDEC MO−240A
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN5 5X6, 1.27P (SO−8FL)
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON14036D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY K. KIME.
13 JAN 2004
A
ADDED STYLE 1. REQ. BY K. KIME.
23 MAR 2004
B
ADDED DIMENSION M AND SOLDERING FOOTPRINT. UPDATED DESCRIPTION.
REQ. BY K. KIME.
31 AUG 2005
C
CHANGED DIMENSION A NOM FROM 0.99 TO 1.00 & MAX FROM 1.20 TO 1.10.
REQ. BY L. DELUCA.
29 JUN 2007
D
CHANGED PACKAGE DESCRIPTION FROM DFN6 TO DFN5. REQ. BY D.
TRUHITTE.
31 MAR 2009
E
ADDED STYLE 2. REQ. BY D. TRUHITTE.
17 AUG 2010
F
CORRECTED MARKING DIAGRAM TO ADD LOT TRACEABILITY. REQ. BY J.
CARTER.
12 APR 2012
G
CHANGED K DIMENSIONS TO 1.2 MIN, 1.35 NOM, 1.5 MAX. REQ. BY D.
TRUHITTE.
23 APR 2012
H
MODIFIED DIMENSIONS D1, D2, E1, & E2. REQ. BY I. MARIANO.
05 MAR 2013
J
ADDED MIN AND MAX VALUES TO DIMENSIONS D AND E. REQ. BY D.
TRUHITTE.
17 JUN 2014
K
CHANGED DIMENSION L1 TO NOMINAL VALUE OF 0.125. REQ. BY D.
TRUHITTE.
10 JUL 2014
L
ROTATED SOLDER FOOTPRINT 180 DEGREES TO MATCH TOP VIEW PIN ONE
ORIENTATION. REQ. BY D. TRUHITTE.
26 SEP 2014
M
CHANGED NOMINAL VALUES FOR DIMENSIONS G AND L TO 0.575. REQ. BY I.
HYLAND.
27 MAY 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
May, 2015 − Rev. M
Case Outline Number:
488AA
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