498-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
DATE 10 MAY 2013
SCALE 4:1
E
D
q
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
2
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
A1
q
HE
SIDE VIEW
2X
b
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
(Note: Microdot may be in either location)
4.20
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT*
1.22
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
XXXMG
G
L
BOTTOM VIEW
2X
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
GENERIC
MARKING DIAGRAM*
c
2X
DIM
A
A1
b
c
D
E
L
HE
q
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2X
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON11184D
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOD−123FL
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11184D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. CULBERTSON.
18 FEB 2002
A
ADDED NOMINAL VALUES AND UPDATED GENERIC MARKING DIAGRAM. REQ. BY
HONG XIAO.
27 MAY 2005
B
ADMINISTRATIVE CHANGE TO REFLECT THE COMPLETE DOCUMENT HISTORY.
REQ. BY V. ILAS.
28 JUN 2010
C
MODIFED SOLDER FOOTPRINT TO MILLIMETER VALUES. REQ. BY D. TRUHITTE.
11 DEC 2012
D
CHANGED DIMENSION A MAX MM VALUE FROM 1.00 TO 0.98. REQ. BY D.
TRUHITTE.
10 MAY 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. D
Case Outline Number:
498
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