TC1107 300mA CMOS LDO with Shutdown and VREF Bypass Features General Description • • • • • • • • • The TC1107 is a fixed output, high accuracy (typically ±0.5%) CMOS upgrade for older (bipolar) low dropout regulators. Total supply current is typically 50A at full load (20 to 60 times lower than in bipolar regulators). Extremely Low Supply Current (50A, Typ.) Very Low Dropout Voltage 300mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Power Saving Shutdown Mode Bypass Input for Ultra Quiet Operation Over Current and Over Temperature Protection Space-Saving MSOP Package Option The TC1107 incorporates both over temperature and over current protection. The TC1107 is stable with an output capacitor of only 1F and has a maximum output current of 300mA. Applications • • • • • • • TC1107 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. Supply current is reduced to 0.05A (typical) and VOUT falls to zero when the shutdown input is low. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VOUT 1 + C1 1μF 2 Device Selection Table VOUT VIN GND NC 8 VIN 7 TC1107 Part Number Package Junction Temp. Range 3 TC1107-xxVOA 8-Pin SOIC -40°C to +125°C 4 TC1107-xxVUA 8-Pin MSOP -40°C to +125°C NC NC Bypass SHDN 6 5 CBYPASS 470pF (Optional) NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Shutdown Control (from Power Control Logic) Other output voltages are available. Please contact Microchip Technology Inc. for details. Package Type 8-Pin MSOP VOUT GND NC Bypass 8-Pin SOIC 1 8 2 7 3 TC1107VUA 4 6 5 VIN NC NC SHDN VOUT 1 GND 2 NC 3 Bypass 4 2002-2012 Microchip Technology Inc. 8 VIN TC1107VOA 7 NC 6 NC 5 SHDN DS21356C-page 1 TC1107 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1107 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 300 — — mA VOUT Output Voltage — VR – 2.5% VR ±0.5% — — VR + 2.5% V Test Conditions Note 7 Note 1 VOUT/T VOUT Temperature Coefficient — 40 — ppm/°C VOUT/VIN Line Regulation — 0.05 0.35 % (VR + 1V) VIN6V VOUT/VOUT Load Regulation — 1.1 2.0 % IL = 0.1mA to IOUTMAX VIN-VOUT Dropout Voltage — — — 20 80 270 30 160 480 mV IL = 0.1mA IL = 100mA IL = 300mA (Note 4) ISS1 Supply Current — 50 90 A SHDN = VIH, ISS2 Shutdown Supply Current — 0.05 0.5 A SHDN = 0V PSRR Power Supply Rejection Ratio — 60 — dB FRE 1kHz IOUTSC Output Short Circuit Current — 550 650 mA VOUT = 0V VOUT/PD Thermal Regulation — 0.04 — V/W eN Output Noise — 260 — nV/Hz VIH SHDN Input High Threshold 45 — — %VIN VIL SHDN Input Low Threshold — — 15 %VIN Note 2 Note 5 F = 1kHz, COUT = 1F, RLOAD = 50 SHDN Input Note 1: 2: 3: 4: 5: 6: 7: VR is the regulator output voltage setting. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. DS21356C-page 2 2002-2012 Microchip Technology Inc. TC1107 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) (8-Pin MSOP) Symbol 1 VOUT Regulated voltage output. 2 GND Ground terminal. Description 3 NC 4 Bypass No connect. Reference bypass input. Connecting a 470pF to this input further reduces output noise. 5 SHDN Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05A (typical). 6 NC No connect. 7 NC No connect. 8 VIN Unregulated supply input. 2002-2012 Microchip Technology Inc. DS21356C-page 3 TC1107 3.0 DETAILED DESCRIPTION 3.1 The TC1107 is a precision regulator available in fixed voltages. Unlike bipolar regulators, the TC1107’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05A (typical), VOUT falls to zero. FIGURE 3-1: VOUT TYPICAL APPLICATION CIRCUIT 1 + C2 1μF 2 8 VOUT VIN GND NC 4 CBYPASS 470pF (Optional) C1 1μF 7 TC1107 3 + NC Bypass Battery + Output Capacitor A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. 3.2 Bypass Input A 470pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. – 6 NC SHDN 5 Shutdown Control (from Power Control Logic) DS21356C-page 4 2002-2012 Microchip Technology Inc. TC1107 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 Power Dissipation EQUATION 4-2: PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: VINMAX ILOADMAX = 250mA EQUATION 4-1: PD (VINMAX – VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 8-Pin SOIC package has a JA of approximately 160°C/Watt, while the 8-Pin MSOP package has a JA of approximately 200°C/Watt. = 3.0V + 10% VOUTMIN = 2.7V – 2.5% TJMAX = 125°C TAMAX = 55°C 8-Pin MSOP Package Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .975)]250 x 10–3 = 167mW Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) JA = (125 – 55) 220 = 318mW In this example, the TC1107 dissipates a maximum of 167mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.3 Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit. 2002-2012 Microchip Technology Inc. DS21356C-page 5 TC1107 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.00 10.0 RLOAD = 50Ω COUT = 1μF NOISE (μV/√HZ) 0.008 0.006 0.004 0.002 1.80 LOAD REGULATION (%) 0.010 LINE REGULATION (%) Load Regulation Output Noise Line Regulation 0.012 1.0 0.1 0.000 -0.002 1.60 1.40 1.20 1.00 0.80 0.60 1 to 100mA 0.40 1 to 50mA 0.20 0.0 0.01 -0.004 -40° -20° 0° 20° 40° 60° 80° 100° 120° 0.01 TEMPERATURE (°C) 10 1 100 0.00 -40° -20° 0° 20° 40° 60° 80° 100° 120° 1000 TEMPERATURE (°C) FREQUENCY (kHz) Supply Current VOUT vs. Temperature 0.40 0.35 DROPOUT VOLTAGE (V) 90.0 80.0 70.0 60.0 50.0 3.075 125°C 85°C C 0.30 70°C 0.25 VIN = 4V ILOAD = 100μA CLOAD = 3.3μF 3.025 VOUT (V) 100.0 SUPPLY CURRENT (μA) 1 to 300mA 25°C 0.20 0°C C 0.15 2.975 0.10 -40°C 0.05 40.0 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) 0.00 0 50 100 150 200 LOAD CURRENT (mA) 250 300 2.925 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) Power Supply Rejection Ratio -30dB PSRR (dB) VOUT = 5V -35dB R LOAD = 50Ω -40dB VINAC = 50mV p-p -45dB -50dB COUT = 1μF -55dB -60dB -65dB -70dB -75dB -80dB 10 100 1K 10K 100K 1M FREQUENCY (Hz) DS21356C-page 6 2002-2012 Microchip Technology Inc. TC1107 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) 2002-2012 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21356C-page 7 TC1107 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) .008 (0.20) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) DS21356C-page 8 2002-2012 Microchip Technology Inc. TC1107 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) 8° MAX.. .050 (1.27) .016 (0.40) Dimensions: inches (mm) 2002-2012 Microchip Technology Inc. DS21356C-page 9 TC1107 REVISION HISTORY Revision C (November 2012) Added a note to each package outline drawing. DS21356C-page 10 2002-2012 Microchip Technology Inc. TC1107 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002-2012 Microchip Technology Inc. DS21356C-page11 TC1107 NOTES: DS21356C-page12 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767368 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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