221AH

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−220 FULLPACK, 3−LEAD
CASE 221AH
ISSUE F
DATE 30 SEP 2014
A
B
E
A
P
E/2
0.14
SCALE 1:1
Q
D
M
B A
H1
M
A1
C
NOTE 3
1 2 3
L
L1
3X
3X
SEATING
PLANE
c
b
b2
0.25
M
B A
M
C
A2
e
SIDE VIEW
FRONT VIEW
SECTION D−D
MILLIMETERS
MIN
MAX
4.30
4.70
2.50
2.90
2.50
2.90
0.54
0.84
1.10
1.40
0.49
0.79
14.70
15.30
9.70
10.30
2.54 BSC
6.60
7.10
12.50
14.73
--2.80
3.00
3.40
2.80
3.20
DIM
A
A1
A2
b
b2
c
D
E
e
H1
L
L1
P
Q
GENERIC
MARKING DIAGRAM*
A
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR UNCONTROLLED IN THIS AREA.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE
MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.
6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY
MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1
AND H1 FOR MANUFACTURING PURPOSES.
NOTE 6
H1
D
D
XX
XXXXXXXXX
AWLYWWG
A
SECTION A−A
ALTERNATE CONSTRUCTION
1
STYLE 1:
PIN 1. MAIN TERMINAL 1
2. MAIN TERMINAL 2
3. GATE
STYLE 2:
PIN 1. CATHODE
2. ANODE
3. GATE
DOCUMENT NUMBER:
98AON52577E
STATUS:
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
SemiconductorComponents
ComponentsIndustries,
Industries,LLC,
LLC,2000
2002
©© Semiconductor
October, DESCRIPTION:
2002
February,
2000 −
− Rev.
Rev. 009AA
http://onsemi.com
1
TO−220 FULLPACK, 3−LEAD 1
A
WL
Y
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case
Case Outline
Outline Number:
Number:
PAGE 1221A−09
OFXXX
2
DOCUMENT NUMBER:
98AON52577E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
10 AUG 2010
A
CHANGED DIMENSIONS D AND E. REQ. BY S. WINSTON.
09 AUG 2011
B
CHANGED DIMENSION H1. REQ. BY S. WINSTON.
07 SEP 2011
C
ADDED STYLES 1 AND 2. REQ. BY J. PEREZ.
13 JUN 2012
D
CHANGED DIMENSION L1 TO 2.10 MAX. REQ. BY D. VON BORSTEL.
19 FEB 2013
E
CHANGED DIMENSION A2 MAX VALUE TO 2.90. REQ. BY D. TRUHITTE.
30 APR 2013
F
ADDED ALTERNATE CONSTRUCTION VIEWS. MODIFIED DIMENSIONS H1 AND
L MIN VALUES AND DIMENSION L1 MAX VALUE. REQ. BY D. VON BORSTEL.
30 SEP 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. F
Case Outline Number:
221AH
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