CMOS LDO Regulators for Portable Equipments 1ch 150mA CMOS LDO Regulators No.11020ECT03 BH□□RB1WGUT series ●Description The BH□□RB1WGUT series is a line of 150 mA output CMOS regulators that deliver a highly stable precision (± 1%) output voltage. Proprietary ROHM technology enables a small load regulation of 2 mV and a dropout voltage of 100 mV. At just 1.0 mm 1.04 mm, the new VCSP60N1 package is extremely compact, and the IC's enhanced protection circuits contribute to improved end products characteristics. ●Features 1) High accuracy output voltage: ± 1% 2) Dropout voltage: 100 mV (at 100 mA) 3) Stable with ceramic capacitors 4) Low bias current: 34 μA 5) High ripple rejection ratio: 63 dB (Typ., 1 kHz) 6) Output voltage on/off control 7) Built-in overcurrent and thermal shutdown circuits 8) VCSP60N1 WL-CSP package : (1.0×1.04×0.6mm) ●Applications Battery-driven portable devices, etc. ●Product line 150 mA BH□□RB1WGUT Series Product name BH□□RB1WGUT 1.5 1.8 2.5 2.8 2.9 3.0 3.1 3.3 Package √ √ √ √ √ √ √ √ VCSP60N1 Model name: BH□□RB1W□ a b Symbol Description Output voltage specification a □□ Output voltage (V) □□ Output voltage (V) 15 1.5 V (Typ.) 29 2.9 V (Typ.) 18 1.8 V (Typ.) 30 3.0 V (Typ.) 25 2.5 V (Typ.) 31 3.1 V (Typ.) 28 2.8 V (Typ.) 33 3.3 V (Typ.) b www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Package GUT: VCSP60N1 1/8 2011.01 - Rev.C Technical Note BH□□RB1WGUT series ●Absolute maximum ratings Symbol Ratings Unit VMAX -0.3 to +6.5 V Pd 530*1 mW Operating temperature range Topr -40 to +85 °C Storage temperature range Tstg -55 to +125 °C Parameter Applied supply voltage Power dissipation *1: Reduce by 5.3 mW/C over 25C, when mounted on a glass epoxy PCB (7 mm 7 mm 0.8 mm). ●Recommended operating ranges (not to exceed Pd) Parameter Symbol Ratings Unit VIN 2.5 to 5.5 V IOUT 0 to 150 mA Power supply voltage Output current ●Recommended operating conditions Symbol Parameter Ratings Min. Typ. Max. Unit Input capacitor CIN 0.7*2 1.0 — µF Output capacitor CO 0.7*2 1.0 — µF Conditions The use of ceramic capacitors is recommended. The use of ceramic capacitors is recommended. *2: Make sure that the output capacitor value is not kept lower than this specified level across a variety of temperature, DC bias characteristic. And also make sure that the capacitor value cannot change as time progresses. ●Electrical characteristics *5 (Unless otherwise specified, Ta = 25°C, VIN = VOUT + 1.0 V , STBY = 1.5 V, CIN = 1 µF, CO = 1 µF) Limits Symbol Unit Parameter Conditions Min. Typ. Max. VOUT 0.99 VOUT1 VOUT - 25 mV VOUT VOUT2 0.97 Output voltage 1 Output voltage 2 VOUT VOUT VOUT 1.01 VOUT + 25 mV VOUT 1.03 V V IOUT = 1 mA, Ta = 25°C, BH25RB1WGUT or higher IOUT = 1mA, Ta = 25°C, BH15, 18RB1WGUT IOUT = 1 mA Ta = -40°C to 85°C*3 IOUT = 0 mA Ta = -40°C to 85°C*3 Circuit current IGND — 34 72 µA Circuit current (STBY) ICCST — — 1.0 µA RR — 63 — dB Dropout voltage VSAT — 100 150 mV Line regulation VDLI — 2 20 mV Load regulation VDLO — 2 30 mV IOUT = 1 mA to 100 mA Overcurrent protection limit current ILMAX — 300 — mA VO = VOUT 0.98 ISHORT — 40 — mA VO = 0 V ISTBY 0.5 1.3 3.6 µA Ta = -40°C to 85°C*3 ON VSTBH 1.2 — VIN V Ta = -40°C to 85°C*3 OFF VSTBL -0.2 — 0.2 V Ta = -40°C to 85°C*3 Ripple rejection ratio Short current STBY pin current STBY control voltage STBY = 0 V VRR = -20 dBV, fRR = 1 kHz, IOUT = 10 mA VIN = 0.98 VOUT, IOUT = 100 mA (Excluding BH15, 18RB1WGUT) IOUT = 10 mA VIN = VOUT + 0.5 V to 5.5 V*4 * This IC is not designed to be radiation-resistant. *3: These specifications are guaranteed by design. *4: For BH15, 18RB1WGUT, VIN = 3.0 V to 5.5 V. *5: For BH15, 18RB1WGUT, VIN = 3.5 V. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/8 2011.01 - Rev.C Technical Note BH□□RB1WGUT series 4.0 4.0 3.5 3.5 3.5 3.0 3.0 3.0 2.5 2.0 1.5 1.0 0.5 1 2 3 4 Input Voltage VIN[V] 1.5 1.0 5 2.5 2.0 1.5 1.0 0.5 0.0 0 Fig. 1 Output Voltage vs Input Voltage (BH15RB1WGUT) 1 2 3 4 Input Voltage VIN[V] 0 5 Fig. 2 Output Voltage vs Input Voltage (BH28RB1WGUT) 60 50 50 50 30 20 GND Current IGND[µA] 60 40 40 30 20 10 10 0 1 2 3 4 Input Voltage VIN[V] Fig. 4 GND Current vs Input Voltage (BH15RB1WGUT) 40 30 20 1 2 3 4 Input Voltage VIN[V] 5 0 Fig. 5 GND Current vs Input Voltage (BH28RB1WGUT) 3.0 3.0 3.0 2.0 1.5 1.0 Output Voltage VOUT[V] 3.5 Output Voltage VOUT[V] 3.5 2.5 2.0 1.5 1.0 0.5 0.5 0 100 200 300 Output Current IOUT[mA] Fig. 7 Output Voltage vs Output Current (BH15RB1WGUT) 100 200 300 Output Current IOUT[mA] 400 Fig. 8 Output Voltage vs Output Current (BH28RB1WGUT) 200 5 2.5 2.0 1.5 1.0 0.0 0 400 2 3 4 Input Voltage VIN[V] 0.5 0.0 0.0 1 Fig. 6 GND Current vs Input Voltage (BH33RB1WGUT) 3.5 2.5 5 0 0 5 2 3 4 Input Voltage VIN[V] 10 0 0 1 Fig. 3 Output Voltage vs Input Voltage (BH33RB1WGUT) 60 GND Current IGND[µA] GND Current IGND[µA] 2.0 0.0 0 Output Voltage VOUT[V] 2.5 0.5 0.0 0 100 200 300 Output Current IOUT[mA] 400 Fig. 9 Output Voltage vs Output Current (BH33RB1WGUT) 0.5 150 Dropout Voltage VSAT[V] Dropout Voltage VSAT[V] Output Voltage VOUT[V] 4.0 Output Voltage VOUT[V] Output Voltage VOUT[V] ●Typical characteristics 100 50 0 0.4 0.3 0.2 0.1 0.0 0 50 100 Output Current IOUT[mA] 150 Fig. 10 Dropout Voltage vs Output Current (BH28RB1WGUT) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 0 50 100 Output Current IOUT[mA] 150 Fig. 11 Dropout Voltage vs Output Current (BH33RB1WGUT) 3/8 2011.01 - Rev.C Technical Note BH□□RB1WGUT series 1.55 1.50 1.45 Output Voltage VOUT[V] Output Voltage VOUT[V] Output Voltage VOUT[V] 3.40 2.90 1.60 2.85 2.80 2.75 IOUT=1mA 0 25 50 Temp[℃] 75 100 Fig. 12 Output Voltage vs Temperature (BH15RB1WGUT) -50 IOUT=1mA -25 0 25 50 Temp[℃] 75 -50 100 Fig. 13 Output Voltage vs Temperature (BH28RB1WGUT) 80 70 70 70 50 40 30 Co=1.0μF Io=10mA 20 Ripple Rejection R.R.[dB] 80 60 60 50 40 30 Co=1.0μF Io=10mA 20 100 1k 10 k Frequency f[Hz] 100 k 1M Fig. 15 Ripple Rejection (BH15RB1WGUT) 100 1k 50 mV/div 40 30 Co=1.0μF Io=10mA 10 100 1k 10 k 100 k Frequency f[Hz] 1M Fig. 17 Ripple Rejection (BH33RB1WGUT) IOUT = 1 mA → 30 mA 50 mV/div 50 μs/div 50 μs/div Fig. 19 Load Response (Co = 1.0 μF) (BH28RB1WGUT) Fig, 20 Load Response (Co = 1.0 μF) (BH33RB1WGUT) 1 V/div 1 V/div STBY STBY 1 V/div 1 V/div Co = 1 μF RL = 2.8 kΩ Co = 1 μF 100 50 VOUT 1 V/div STBY 75 50 mV/div 50 μs/div Fig. 18 Load Response (Co = 1.0 μF) (BH15RB1WGUT) 25 50 Temp[℃] 60 IOUT = 1 mA → 30 mA VOUT Co = 1 μF RL = 3.3 kΩ 1 V/div RL = 1.5 kΩ VOUT 1M Fig. 16 Ripple Rejection (BH28RB1WGUT) IOUT = 1 mA → 30 mA VOUT 10 k 100 k Frequency f[Hz] 0 20 10 10 -25 Fig. 14 Output Voltage vs Temperature (BH33RB1WGUT) 80 Ripple Rejection R.R.[dB] Ripple Rejection R.R.[dB] 3.25 3.20 2.70 -25 3.30 IOUT=1mA 1.40 -50 3.35 VOUT Co = 2.2 μF Co = 2.2 μF 100 μs/div 100 μs/div Fig. 21 Output Voltage Rise Time (BH15RB1WGUT) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Fig. 22 Output Voltage Rise Time (BH28RB1WGUT) 4/8 VOUT Co = 2.2 μF 100 μs/div Fig. 23 Output Voltage Rise Time (BH33RB1WGUT) 2011.01 - Rev.C Technical Note BH□□RB1WGUT series ●Block Diagram, Recommended Circuit Diagram, and Pin Assignment Diagram BH□□RB1WGUT VIN Pin No. Symbol B2 VIN B1 VOUT Voltage output A1 GND Ground A2 STBY Output voltage on/off control (High: ON, Low: OFF) VIN B2 VO LTAG E R EF ERE NCE Cin VOUT VOUT Function Power supply input B1 G ND TH ERM A L P RO T ECT IO N A1 Co O VER CU RRE NT P RO TE CTIO N VSTBY STBY 1PIN MARK 2 1 C O NT RO L BLO CK A2 A Cin: 1.0 µF Co: 1.0 µF B Fig. 24 TOP VIEW (Mark side) ●Power Dissipation (Pd) 1. Power dissipation (Pd) Power dissipation calculations include output power dissipation characteristics and internal IC power consumption. In the event that the IC is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation is not exceeded during IC operation. Calculating the maximum internal IC power consumption (PMAX) PMAX = (VIN - VOUT) IOUT (MAX.) VIN: Input voltage VOUT: Output voltage IOUT (MAX): Output current 2. Power dissipation/power dissipation reduction (Pd) VCSP60N1 0.6 530 mW Board: 7 mm 7 mm 0.8 mm Material: Glass epoxy PCB Pd[W] 0.4 0.2 0 0 25 50 75 100 125 Ta[℃] *Circuit design should allow a sufficient margin for the temperature range for PMAX < Pd. Fig. 25 VCSP60N1 Power Dissipation/Power Dissipation Reduction (Example) ●Input Output Capacitors It is recommended to insert bypass capacitors between input and GND pins, positioning them as close to the pins as possible. These capacitors are used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the IC has been mounted. Ceramic capacitors generally have temperature and DC bias characteristics. Use X5R or X7R ceramic capacitors, which offer good temperature and DC bias characteristics as well as stable high voltages. Typical ceramic capacitor characteristics 50 V torelance Capacitance of change (%)(%) Capacitancerate rate of change 50 V torelance 100 95 Capacitance rate of change [%] (%) 静電容量変化率 100 Capacitance rate rate of of change change (%)] (%) Capacitance 120 100 120 90 80 16 V torelance 85 60 10 V torelance 16 V torelance 10 V torelance 80 40 75 20 70 0 0 1 2 DC bias Vdc (V) 3 4 Fig. 26 Capacitance vs Bias (Y5V) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 0 1 2 DC bias Vdc (V) 3 Fig.27 Capacitance vs Bias (X5R, X7R) 5/8 4 X7R X5R 80 Y5V 60 40 20 0 -25 0 25 Temp[℃] 50 75 Fig. 28 Capacitance vs Temperature (X5R, X7R, Y5V) 2011.01 - Rev.C Technical Note BH□□RB1WGUT series ●Output capacitors Mounting input capacitor between input pin and GND (as close to pin as possible), and also output capacitor between output pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage supply source connected to the VCC. The higher value the output capacitor goes the more stable the whole operation becomes. This leads to high load transient response. Please confirm the whole operation on actual application board. Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value goes lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers. BH□□RB1WGUT 100 COUT = 1.0 µF Ta = +25°C ESR[Ω] 10 1 Stable region 0.1 0.01 0 50 100 150 出力電流IOUT[mA] Output Current Iout [mA] Fig. 29 Stable Operating Region Characteristics (Example) ●Operation Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 3. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 4. Thermal shutdown circuit (TSD) The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. 5. Overcurrent protection circuit The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to temperatures. 6. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 7. Ground wiring patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 8. Influence of strong light Exposure of the IC to strong light sources such as infrared light from a halogen lamp may cause the IC to malfunction. When it is necessary to use the IC in such environments, implement measures to block exposure to light from the light source. During testing, exposure to neither fluorescent lighting nor white LEDs had a significant effect on the IC. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/8 2011.01 - Rev.C Technical Note BH□□RB1WGUT series 9. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 10. Back Current In applications where the IC may be exposed to back current flow, it is recommended to create a path to dissipate this current by inserting a bypass diode between the VIN and VOUT pins. Back current VIN STBY OUT GND Fig. 30 Example Bypass Diode Connection 11. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 12. Regarding Input Pin of the IC (Fig.31) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Transistor (NPN) Resistor Pin A Pin B C Pin B B E Pin A N N N P+ P+ P N Parasitic element P+ P substrate Parasitic element GND B N P+ P N C E Parasitic element P substrate Parasitic element GND GND GND Other adjacent elements Fig. 31 Example of IC structure www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/8 2011.01 - Rev.C Technical Note BH□□RB1WGUT series ●Ordering part number B H 1 Part No. 5 R Output voltage 15: 1.5 V 18: 1.8 V 25: 2.5 V 28: 2.8 V 29: 2.9 V 30: 3.0 V 31: 3.1 V 33: 3.3 V B 1 W Series RB1 : High ripple rejection G Shutdown switch W : Includes switch U T Package GUT: VCSP60N1 - E 2 Packaging and forming specification E2: Embossed tape and reel VCSP60N1 <Tape and Reel information> 1.04±0.1 1Pin MARK 1.00±0.1 Tape Embossed carrier tape Quantity 3000pcs E2 0.21±0.05 0.6±0.075 Direction of feed (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand.) S 4-φ0.3±0.05 A 0.05 A B 0.27±0.1 0.08 S 0.5 A 1 0.25±0.1 1234 1234 1234 1234 1234 1234 B B 2 0.5 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. (Unit:mm) Reel 1Pin Direction of feed ※When you order , please order in times the amount of package quantity. 8/8 2011.01 - Rev.C Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001