BDxxKA5(W)

Datasheet
500mA Variable/Fixed Output
LDO Regulators
BDxxKA5 Series
BDxxKA5W Series
BD00KA5W Series
●General Description
The BDxxKA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage
precision is ±1%. These LDO regulators are offered in several output voltages and package lineups with or without
ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of
applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in
overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown
circuit.
●Packages
SOP8
TO252-3
TO252-5
●Features
„ Output voltage precision: ±1%
„ Low-saturation voltage with PMOS output: 0.12V
Typ.(Io=200mA)
„ Built-in over-current protection circuit
„ Built-in thermal shutdown circuit
„ Shutdown switch (BDxxKA5WFP and BDxxKA5WF
series)
„ Ceramic capacitor compatible (recommended
capacitance: 1μF or greater)
●Key Specifications
„ Input Power Supply Voltage:
„ Output voltage type: BA00KA5
BAxxKA5
„ Output current:
„ Operating temperature range:
W (Typ.) x D (Typ.) x H (Max.)
5.00mm x 6.20mm x 1.71mm
6.50mm x 9.50mm x 2.50mm
6.50mm x 9.50mm x 2.50mm
5.5V (Max.)
Variable
Fixed
500mA (Max.)
-40℃ to +105℃
SOP8
●Applications
Microcontrollers and all electronic devices that use
logic circuit
TO252-5
TO252-3
●Lineup matrix
Output Voltage (V)
Part Number
1.0
○
○
○
BDxxKA5WFP
BDxxKA5WF
BDxxKA5FP
1.2
○
○
○
1.5
○
○
○
1.8
○
○
○
2.5
○
○
○
3.0
○
○
○
Package
3.3
○
○
○
Variable
○
○
-
TO252-5
SOP8
TO252-3
●Ordering Information
B
D
x
x
K
A
5
W
x
Part Number Output voltage Current capacity Shutdown Switch Package
W: Include
KA5: 500mA
00:Variable
Other: Fixed
None:without
○Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
x
FP : TO252-3
TO252-5
F : SOP8
-
E2
Packaging and forming specification
E2: Embossed tape and reel
○This product is not designed protection against radioactive rays.
1/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Lineup
Maximum output
current (Max.)
Shutdown
Switch
Package
TO252-5
Reel of 2000
With Switch
500mA
SOP8
No Switch
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TO252-3
Reel of 2500
Reel of 2000
2/15
Output
voltage (Typ.)
Orderable
Part Number
1.0V
BD10KA5WFP-E2
1.2V
BD12KA5WFP-E2
1.5V
BD15KA5WFP-E2
1.8V
BD18KA5WFP-E2
2.5V
BD25KA5WFP-E2
3.0V
BD30KA5WFP-E2
3.3V
BD33KA5WFP-E2
Variable
BD00KA5WFP-E2
1.0V
BD10KA5WF-E2
1.2V
BD12KA5WF-E2
1.5V
BD15KA5WF-E2
1.8V
BD18KA5WF-E2
2.5V
BD25KA5WF-E2
3.0V
BD30KA5WF-E2
3.3V
BD33KA5WF-E2
Variable
BD00KA5WF-E2
1.0V
BD10KA5FP-E2
1.2V
BD12KA5FP-E2
1.5V
BD15KA5FP-E2
1.8V
BD18KA5FP-E2
2.5V
BD25KA5FP-E2
3.0V
BD30KA5FP-E2
3.3V
BD33KA5FP-E2
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions
Fig.1
Fig.4
Fig.2
N.C.(2PIN)
Fig.5
[BDxxKA5FP]
GND(FIN)
Fig.3
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TSZ22111・15・001
3/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Power Supply Voltage
Output Control Terminal Voltage
TO252-3
Power Dissipation TO252-5
SOP8
Operating Temperature Range
Ambient Storage Temperature
Maximum Junction Temperature
*1
*2
*3
*4
Symbol
Vcc
VCTL
Limits
-0.3 to +7.0*1
-0.3 to Vcc*1
1200*2
1300*3
687.6*4
-40 to +105
-55 to +150
150
Pd
Topr
Tstg
Tjmax
Unit.
V
V
mW
℃
℃
℃
Must not exceed Pd
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃.
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃.
When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃.
●Recommended Operating Ratings (Ta=25℃)
Parameter
Symbol
Input Power Supply Voltage
Vcc
Output Current
Io
*5
Output Voltage Configuration Range
Vo
Output Control Terminal Voltage
VCTL
*5
Datasheet
BD00KA5W Series
Min.
2.3
0
1.0
0
Max.
5.5
500
4.0
Vcc
Unit.
V
mA
V
V
Only BD00KA5WFP and BD00KA5WF
●Electrical Characteristics
BDxxKA5 Series BDxxKA5W Series
(Unless otherwise specified,Ta=25℃, VCTL =2V, Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V), Vcc=3.3V(Vo=2.5V), Vcc=5.0V(Vo=3.0V,3.3V))
Shut Down Current
Bias Current
Dropout Voltage *6
Peak Output Current
Isd
Ib
ΔVd
Min
Vo(T)-0.015
Vo(T)×0.99
-
-
-
Io
500
Limit
Typ
Vo(T)
Vo(T)
0
350
0.12
-
Ripple Rejection
R.R.
-
50
-
dB
Reg.I
-
10
35
mV
Reg.L
-
25
75
mV
Parameter
Output Voltage
Line Regulation
Symbol
Vo
*7
Max
Vo(T)+0.015
Vo(T)×1.01
1
550
0.20
-
Unit
V
μA
μA
V
mA
Conditions
Io=200mA (Vo=1.0V,1.2V)
Io=200mA (Vo≧1.5V)
VCTL=0V, Io=0mA (OFFmode)
Io=0mA
Io=200mA, Vcc=0.95×Vo
f=120Hz, ein※9=-10dBV,
Io=100mA
Vcc=Vo+0.5V→5.5V,
Io=200mA
Io=0mA→500mA
Load Regulation
Temperature Coefficient
*8
of Output Voltage
CTL ON Mode Voltage
Tcvo
-
±100
-
VCTLON
2.0
-
-
CTL OFF Mode Voltage
VCTLOFF
-
-
0.8
V
OFF MODE, Io=0mA
ICTL
20
40
60
μA
Io=0mA
CTL Input Current
ppm/℃ Io=5mA,Tj=0 to 125℃
V
ACTIVE MODE, Io=0mA
Vo(T) : Output Voltage
6
Vo≧2.5V
1.0≦Vo≦1.8V,Vcc=2.3V→5.5V
Not 100% tested
ein : Input Voltage Ripple
*
*7
*8
*9
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TSZ22111・15・001
4/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Electrical Characteristics – continued
BD00KA5W Series
(Unless otherwise specified, Ta=25℃, Vcc=2.5V, VCTL=2V ,Vo=1.5V)
Limit
Parameter
Symbol
Min
Typ
Max
Shut Down Current
Isd
-
0
1
Bias Current
Ib
-
350
550
Reference Voltage
VADJ
0.742 0.750 0.758
ΔVd
-
Dropout Voltage *10
0.12
0.20
Peak Output Current
Io
500
-
-
Conditions
μA
μA
V
V
mA
VCTL=0V, Io=0mA (OFFmode)
Io=0mA
Io=50mA
Io=200mA, Vcc=0.95×Vo
dB
f=120Hz, ein※12=-10dBV, Io=100mA
R.R.
-
50
Line Regulation
Reg.I
-
10
35
mV
Vcc=Vo+0.5V→5.5V, Io=200mA
Load Regulation
Temperature Coefficient of
Output Voltage *11
CTL ON Mode Voltage
Reg.L
-
25
75
mV
Io=0mA→500mA
Tcvo
-
±100
-
VCTLON
2.0
-
-
V
ACTIVE MODE, Io=0mA
CTL OFF Mode Voltage
VCTLOFF
-
-
0.8
V
OFF MODE, Io=0mA
ICTL
20
40
60
μA
Io=0mA
Ripple Rejection
CTL Input Current
*10 Vo≧2.5V
*11 Not 100% tested
*12 ein : Input Voltage Ripple
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TSZ22111・15・001
-
Unit
5/15
ppm/℃ Io=5mA,Tj=0 to 125℃
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
OUTPUT VOLTAGE : VO[V]
CIRCUIT CURRENT : ICC[mA]
●Typical Performance Curves
(Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA)
SUPPLY VOLTAGE : Vcc[V]
Fig.6
Circuit current
Fig.7
Input Stability(Io=0mA)
OUTPUT VOLTAGE : VO[V]
OUTPUT VOLTAGE : VO[V]
SUPPLY VOLTAGE : Vcc[V]
OUTPUT CURRENT : IO[A]
SUPPLY VOLTAGE : Vcc[V]
Fig.9
Load Stability
Fig.8
Input Stability
(Io=500mA)
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TSZ22111・15・001
6/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Typical Performance Curves - continued
Fig.11
Ripple Rejection
(ein=10dBV,Io=100mA)
OUTPUT VOLTAGE : VO[V][V]
Fig.10
Input/Output Voltage Difference
(Vcc=3.135V)
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.12
Output Voltage
(Io=5mA)
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TSZ22111・15・001
Fig.13
Circuit Current
Temperature Characteristics
7/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
OUTPUT VOLTAGE : VO[V]
CIRCUIT CURRENT : ICC[mA]
[mA]
●Typical Performance Curves - continued
CONTROL VOLTAGE : VCTL[V]
OUTPUT CURRENT : IO[A]
Fig.15
CTL Voltage vs. Output Voltage
OUTPUT VOLTAGE : VO[V]
CONTROL CURRENT : ICTL[µA]
Fig.14
Circuit Current by load Level
CONTROL VOLTAGE : VCTL[V]
TEMPERATURE : Ta[℃]
Fig.16
CTL Voltage vs. Output Current
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TSZ22111・15・001
Fig.17
Thermal Shutdown
Circuit Characteristics (Io=5mA)
8/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●I/O equivalence circuit
Vcc Vcc
Vcc
Vcc
※
With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
31.25kΩ 2kΩ
OUT
between OUT and ADJ.
CTL
25kΩ
ADJ
R2
(BD00KA5WFP/WF)
R1
Fig.18
Fig.19
●Power Dissipation
TO252-3
TO252-5
2.0
Rohm standard board mounting
Board size:70×70×1.6mm
2
Copper foil area:7×7mm
θja=96.2(℃/W)
1.30
許容損失:Pd(W)
1.6
Power Dissipation:Pd(W)
Power
Pd(W)
Power Dissipation
Dissipation::
Pd(W)
2.0
1.2
0.8
0.4
Rohm standard board mounting
Board size:70×70×1.6mm
2
Copper foil area:7×7mm
θja=104.2(℃/W)
1.6
1.20
1.2
0.8
0.4
0.0
0.0
0
25
50
75
100
125
0
150
25
50
75
100
125
150
Ambient
temperature:Ta(℃)
周囲温度:Ta(℃)
Ambient temperature:Ta(℃)
Fig.21 Power Dissipation heat
reducing characteristics
Fig.20 Power Dissipation heat
reducing characteristics
SOP8
許容損失:Pd(W)
Power Dissipation:Pd(W)
1000
(1)When using a standard board:
θj-c=181.8(℃/W)
(2) When using an IC alone
θj-a=222.2(℃/W)
800
687.6mW
600
(1)
562.6mW
400
(2)
200
0
0
25
50
75
100
125
Ambient temperature:Ta(℃)
150
周囲温度:Ta(℃)
Fig.22 Power Dissipation heat
reducing characteristics
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.
Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
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TSZ22111・15・001
9/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
The calculation method for power consumption Pc(W) is as follows :
Vcc:Input voltage
Vo:Output voltage
Io:Load current
Icca:Circuit current
Pc = (Vcc-Vo)×Io+Vcc×Icca
Acceptable loss Pd≧Pc
Solving for the load current IO in order to operate within the acceptable loss,
Io≦
Pc – Vcc×Icca
Vcc-Vo
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
Calculation Example
Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V
BA10KA5WFP(TO252-5 packaging)
0.676-2.5×Icca
Io≦
2.5-1.0
Io≦440mA (Icca : 6mA)
θja=96.2℃/W → -10.4mW/℃
25℃=1300mW → 85℃=676mW
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges.
The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Icca+Ishort)
*Ishort : Short circuit current
●Terminal Vicinity Settings and Cautions
・Vcc Terminal
Please attach a capacitor (greater than 1μF) between Vcc and GND.
The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the
operation on actual board.
・GND Terminal
Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not
arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not
be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns
as wide as possible and reducing the distance between the set ground and the IC ground as much as possible.
・CTL Terminal
The CTL terminal is turned ON at 2.0V and higher, and OFF at
31.25kΩ
0.8V and lower, within the operating power supply voltage range.
CTL
The power supply and the CTL terminal may be started up and
shut down in any order without problems.
25kΩ
Fig.23 Input equivalent circuit
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10/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
ESR ( Ω)
●Vo Terminal
Please be sure to attach an anti-oscillation capacitor between Vo and GND.
100
Oscillation region
発振領域
10
OUT
Stable
安 定region
領域
IC
1
ESR
Cin
ESR(Ω)
1μF
Vcc
OUT 1μF
Vcc
1μF
CTL GND ADJ R2
Io(ROUT)
VCTL
2V
0.1
R1
R1=30kΩ,R2=2kΩ
0.01
0
100
200
300
400
500
Io(mA)
Iout
(m A)
Fig.24 Output Equivalent Circuit
Fig.25 ESR-Io Characteristics
Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the
capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance
(ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have
favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage
capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is
recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after
sufficiently confirming its properties according to its specifications in the actual application.
80
60
16V Max.Input
40
10V Max.Input
20
0
50V Max.Input
100
80
静電容量変化率(%)
静電容量変化率(%)
50V Max.Input
100
120
Rate of change in electrostatic capacitance (%)
120
Rate of change in electrostatic capacitance (%)
静電容量変化率(%)
Rate of change in electrostatic capacitance (%)
120
16V Max.Input
60
10V Max.Input
40
20
0
0
1
2
3
4
DC bypass Vdc(V)
直流バイアスVdc(V)
(a)
Capacitance-bypass
characteristics (Y5V)
100
80
X7R
X5R
Y5V
60
40
Vdc=0
20
0
0
1
2
3
4
-25
DC bypass Vdc(V)
直流バイアスVdc(V)
0
25
50
75
Temp(℃)
Temp(℃)
(b)Capacitance-bypass
characteristics(X5R,X7R)
(C)Capacitance-temperature
characteristics(X5R,X7R,Y5V)
Fig.26 General characteristics of ceramic capacitors
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TSZ22111・15・001
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TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Operational Notes
○Protection Circuits
Over-current Protection Circuit
A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when
there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is
restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance
capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents,
it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the
over-current protection circuit has negative current capacity characteristics with regard to temperature.
○Thermal Shutdown Circuit (Thermal Protection)
This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As
shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously
exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown
circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip
temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Fig.17 for the temperatures at
which the temperature protection circuit operates).
There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to
avoid leaving the IC in the overloaded state.
○Reverse Current
In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode
be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27).
Reverse current
Vcc
OUT
CTL
GND
Fig.27 Bypass diode
○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N
junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as :
- a parasitic diode when the electric potential relationship is GND> Pin A, GND> Pin B, or
- a parasitic transistor when the electric potential relationship is Pin B > GND> Pin A.
Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference
between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in
ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board)
to the input terminal.
(Pin B) C
Transistor (NPN)
B
E
Resistor
(Pin A)
(Pin B)
B
GND
E
N
P+
P
P+
P+
P
GND
N
N
P+
N
N
N
P
P
Parasitic element
or transistor
N
Parasitic element
GND
Parasitic element
or transistor
C
GND
(Pin A)
Parasitic element
GND
Fig.28 Basic structure example
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to
help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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TSZ22111・15・001
12/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Physical Dimension Tape and Reel Information
SOP8
<Tape and Reel information>
5.0±0.2
(MAX 5.35 include BURR)
+6°
4° −4°
5
0.3MIN
6
1 2
3
0.9±0.15
7
4.4±0.2
6.2±0.3
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
0.11
S
1.27
0.42±0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-3
<Tape and Reel information>
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
Tape
Embossed carrier tape
Quantity
2000pcs
2.3±0.2
0.5±0.1
Direction
of feed
1.5
2
3
0.8
1
0.65
E2
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2.5
9.5±0.5
5.5±0.2
FIN
0.65
0.5±0.1
0.75
2.3±0.2
1.0±0.2
2.3±0.2
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TO252-5
<Tape and Reel information>
2.3±0.2
6.5±0.2
C0.5
1.5±0.2
+0.2
5.1 -0.1
0.5±0.1
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
The direction is the 1pin of product is at the lower left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.5
4 5
0.8
1 2 3
2.5
9.5±0.5
5.5±0.2
FIN
E2
0.5±0.1
0.5
1.27
1.0±0.2
1pin
(Unit : mm)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reel
13/15
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
Datasheet
BD00KA5W Series
●Marking Diagrams
SOP8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TO252-3
(TOP VIEW)
TO252-5
(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
Orderable
Part Number
Package
LOT Number
Part Number Marking
BD10KA5WFP-E2
10KA5W
BD12KA5WFP-E2
12KA5W
BD15KA5WFP-E2
15KA5W
BD18KA5WFP-E2
BD25KA5WFP-E2
TO252-5
18KA5W
25KA5W
BD30KA5WFP-E2
30KA5W
BD33KA5WFP-E2
33KA5W
BD00KA5WFP-E2
00KA5W
BD10KA5WF-E2
10KA5W
BD12KA5WF-E2
12KA5W
BD15KA5WF-E2
15KA5W
BD18KA5WF-E2
BD25KA5WF-E2
SOP8
18KA5W
25KA5W
BD30KA5WF-E2
30KA5W
BD33KA5WF-E2
33KA5W
BD00KA5WF-E2
00KA5W
BD10KA5FP-E2
10KA5
BD12KA5FP-E2
12KA5
BD15KA5FP-E2
15KA5
BD18KA5FP-E2
TO252-3
18KA5
BD25KA5FP-E2
25KA5
BD30KA5FP-E2
30KA5
BD33KA5FP-E2
33KA5
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
BDxxKA5 Series BDxxKA5W Series
BD00KA5W Series
Datasheet
●Revision History
Date
Revision
26.Jun.2012
001
Changes
New Release
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/15
TSZ02201-0R6R0A600150-1-2
26.Jun.2012 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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