BUxxTA2W

CMOS LDO Regulators for Portable Equipments
1ch 200mA
CMOS LDO Regulators
BUTA2WNVX series, BUTA2WHFV series
No.11020ECT01
●Description
BU□□TA2WNVX /HFV series is high-performance FULL CMOS regulator with 200-mA output, which is mounted on
microminiature package SSON004X1216 (1.2 mm  1.6 mm  0.6 mm) &HVSOF5(1.6mm  1.6mm  0.6mm). It has
excellent noise characteristics and load responsiveness characteristics despite its low circuit current consumption of 40 µA.
It is most appropriate for various applications such as power supplies for logic IC, RF, and camera modules.
Microminiature package SSON004X1216 & HVSOF5 with built-in heatsink is adopted for the package, which contributes to
the space-saving design of the set.
●Features
1) High-accuracy output voltage of 1% (25 mV on 1.5-V & 1.8-V products)
2) High ripple rejection: 70 dB (Typ., 1 kHz, VOUT1.8 V))
3) Compatible with small ceramic capacitor (CIN=Co=1.0 µF)
4) Low current consumption: 40 µA
5) ON/OFF control of output voltage
6) With built-in overcurrent protection circuit and overheat protection circuit
7) With built-in output discharge circuit
8) Adopting microminiature power package SSON004X1216
●Applications
Battery-powered portable equipment, etc.
●Line up
■ 200 mA BU□□TA2WNVX / HFV series
Product Name
1.5
1.8
2.5
2.6
2.7
2.8 2.85 2.9
3.0
3.1
3.2
3.3
3.4
Package
BU□□TA2WNVX
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○
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○
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○
○
○
○
○
○
○
SSON004X1216
BU□□TA2WHFV
○
○
○
○
○
○
○
○
○
○
○
○
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HVSOF5
Model name: BH□□TA2W□□□
a
b
Symbol
Contents
Specification of output voltage
a
b
□□
Output voltage (V)
□□
Output voltage (V)
□□
Output voltage (V)
15
1.5V(Typ.)
28
2.8V(Typ.)
32
3.2V(Typ.)
18
1.8V(Typ.)
2J
2.85V(Typ.)
33
3.3V(Typ.)
25
2.5V(Typ.)
29
2.9V(Typ.)
34
3.4V(Typ.)
26
2.6V(Typ.)
30
3.0V(Typ.)
-
-
27
2.7V(Typ.)
31
3.1V(Typ.)
-
-
Package
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© 2011 ROHM Co., Ltd. All rights reserved.
NVX :SSON004X1216
HFV :HVSOF5
1/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Absolute maximum rating
Parameter
Symbol
Ratings
Maximum applied power voltage VMAX
-0.3 ~
Unit
+6.5
V
Pd1
220*1 (SSON004X1216)
Pd2
410*2 (HVSOF5)
Maximum junction temperature
TjMAX
+125
Operational temperature range
Topr
-40 ~
+85
℃
Storage temperature range
Tstg
-55 ~
+125
℃
Power dissipation
*1
*2
mW
℃
When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 2.2 mW/C when used at Ta=25C or higher.
When 1 PCB (70 mm  70 mm, thickness 1.6-mm glass epoxy) a standard ROHM board is implemented.
Reduced to 4.1 mW/C when used at Ta=25C or higher.
●Recommended operating range (Do not exceed Pd.)
Parameter
Input power supply voltage
Maximum output current
Symbol
Ratings
VIN
2.5 ~
IMAX
Unit
5.5
V
200
mA
●Recommended operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Conditions
Input capacitor
CIN
0.5*3
1.0
-
μF
A ceramic capacitor is
recommended.
Output capacitor
CO
0.5*3
1.0
-
μF
A ceramic capacitor is
recommended.
*3
Set the capacity value of the capacitor so that it does not fall below the minimum value, taking temperature characteristics,
DC device characteristics, and change with time into consideration.
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2/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Electrical characteristics
(Unless otherwise specified
Parameter
Ta=25℃, VIN=VOUT+1.0 V (VIN=3.5 V on VOUT=1.8-V and1.5-V products),
STBY=1.5 V, CIN=1.0 µF, CO=1.0 µF)
Limits
Symbol
Unit
Conditions
Min.
Typ.
Max.
VOUT
×1.01
VOUT
×0.99
Output voltage
VOUT
-25 mV
Circuit current (at STBY)
VOUT
+25 mV
IOUT=10 μA, VOUT<2.5 V
IIN
-
40
95
μA
IOUT=0mA
ISTBY
-
-
1
μA
STBY=0 V
VRR=-20 dBv, fRR=1 kHz,
IOUT=10 mA, 1.5 V≤VOUT≤1.8 V
70
Ripple rejection
RR
55
-
dB
VRR=-20 dBv,fRR=1 kHz,
IOUT=10 mA, 2.5 V≤VOUT
65
Input/Output voltage difference
IOUT=10 μA, VOUT≥2.5 V
VOUT
VOUT
Circuit current
V
-
400
800
mV
2.5 V≤VOUT≤2.6 V
(VIN=0.98*VOUT, IOUT=200 mA)
-
360
720
mV
2.7 V≤VOUT≤2.85 V
(VIN=0.98*VOUT, IOUT=200 mA)
-
330
660
mV
2.9 V≤VOUT≤3.1 V
(VIN=0.98*VOUT,IOUT=200 mA)
-
300
600
mV
3.2 V≤VOUT≤3.4 V
(VIN=0.98*VOUT, IOUT=200 mA)
VSAT
Line regulation
VDL
-
2
20
mV
VIN=VOUT+1.0 V to 5.5 V,
IOUT=10 μA
Load regulation
VDLO
-
10
80
mV
IOUT=0.01 mA to 100 mA
Overcurrent protection detection
ILMAX
current
250
400
700
mA
Vo=VOUT*0.8
Output short-circuit current
ISHORT
20
70
150
mA
Vo=0 V
Output discharge resistance
RDSC
20
40
80
Ω
Standby pull-down resistance
RSTB
500
1000
2000
kΩ
Standby control
ON
VSTBH
1.5
-
5.5
V
OFF
VSTBL
-0.3
-
0.3
V
VIN=4.0 V, STBY=0 V
* This product does not have radiation-proof design.
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3/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Block diagram, recommended circuit diagram, and pin configuration diagram
BH□□TA2WNVX
VIN
VIN
4/3
VREF
VOUT
Cin
VOUT
1
1/4
2
OCP
Co
GND
VSTB Y
STBY
3/1
STBY
Discharge
Recommended ceramic capacitor for Cin & Co
Murata Manufacturing Co., Ltd.
GRM188B11A105KA61D
Fig.1 Recommended circuit diagram
BU□□TA2WNVX(SSON004X1216)
4
3
1
2
PIN No.
Symbol
Function
1
VOUT
Voltage output
2
GND
Grounding
3
STBY
ON/OFF control of output voltage
(High: ON, Low: OFF)
4
VIN
PIN No.
Symbol
1
STBY
ON/OFF control of output voltage
(High:ON, Low:OFF)
2
GND
Grounding
3
VIN
Power input
4
VOUT
5
N.C.
Power input
BU□□TA2WHFV(HVSOF5)
5
1
4
2
3
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© 2011 ROHM Co., Ltd. All rights reserved.
4/29
Function
Voltage output
No Connect
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Input/Output terminal equivalent circuit schematic
1pin (VOUT)
2pin (GND)
3pin (STBY)
VIN
4pin (VIN)
VIN
VOUT
STBY
Fig.2
Input/Output equivalent circuit
●About input/output capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
-10
Capacitance Change [%]
It is recommended to place a capacitor as close as possible to the
pins between the input terminal and GND or between the output
terminal and GND.
The capacitor between the input terminal and GND becomes valid
when source impedance increases or when wiring is long. The
larger the capacity of the output capacitor between the output
terminal and GND is, the better the stability and characteristics in
output load fluctuation become. However, please check the status
of actual implementation. Ceramic capacitors generally have
variation, temperature characteristics, and direct current bias
characteristics and the capacity value also decreases with time
depending on the usage conditions. It is recommended to select a
ceramic capacitor upon inquiring about detailed data of the related
manufacturer.
10-V withstand voltage
B characteristics
-20
6.3-V withstand voltage
B characteristics
-30
10-V withstand voltage
F characteristics
-40
-50
-60
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
-70
-80
-90
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
DC Bias Voltage [V]
Fig.3 Capacity – bias characteristics
●About the equivalent series resistance (ESR) of a ceramic capacitor
100
ESR [Ω]
Capacitors generally have ESR (equivalent series resistance) and it
operates stably in the ESR-IOUT area shown on the right. Since
ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc.
generally have different ESR, please check the ESR of the
capacitor to be used and use it within the stability area range shown
in the right graph for evaluation of the actual application.
Unstable area
10
Stability area
1
0.1
0.01
0
50
100
150
200
IOUT [mA]
Fig.4 Stability area characteristics (Example)
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5/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU15TA2WNVX / HFV
(Ta=25ºC unless otherwise specified.)
100
1.55
1.54
1.5
1.2
IO=0uA
IO=100uA
IO=50mA
IO=200mA
0.9
0.6
Temp=25°C
VIN = STBY
0.3
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.53
1.52
1.51
1.50
1.49
1.48
1.47
Temp=25°C
VIN = STBY
1.46
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.25 1.35 1.45
1.55 1.65 1.75 1.85 1.95
Vin Voltage (V)
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
0
2.05 2.15 2.25
0.5
1
1.5
2
2.5
3
60
Temp=-40°C
Temp=25°C
Temp=85°C
40
20
IO=200mA
VIN = STBY
Temp=85°C
8
Gnd Current (uA)
STBY Current (uA)
80
Temp=25°C
6
Temp=-40°C
4
2
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Vin Voltage (V)
Fig. 8 Circuit Current IGND
2
2.5
3
3.5
4
4.5
5
Temp=-40°C
1.51
1.50
1.49
1.48
Temp=85°C
VIN = 3.5V
STBY = 1.5V
1.46
0.1
0.15
VIN=3.5V
1.25
1.00
VIN=2.5V
0.75
0.50
Temp=25°C
STBY = 1.5V
0.00
0.2
0.10
Fig. 11 Load Regulation
0.20
0.30
0.40
0.50
1.50
1.49
VIN=3.5V
STBY=1.5V
Io=0.1mA
1.46
1.45
-15
10
35
Temp=85°C
Temp=25°C
Temp=-40°C
0.50
0.5
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
60
85
Temp (°C)
Fig. 14 VOUT vs. Temp
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-40
-15
10
35
60
Temp (°C)
Fig. 15 IGND vs. Temp
6/29
1
1.5
Fig. 13 STBY Threshold
0.00
-40
0.75
STBY Voltage (V)
Gnd Current (uA)
Input Current (uA)
1.51
1.47
1.00
0
50.00
1.52
0.2
0.00
1.54
1.53
0.15
1.25
0.25
0.60
Fig. 12 OCP Threshold
1.55
0.1
1.50
Output Current (A)
Output Current (A)
1.48
0.05
1.75
1.50
0.00
0.05
VIN = 3.5V
STBY = 1.5V
2.00
0.25
1.45
0
Temp=-40°C
60
Fig. 10 IOUT - IGND
Output Voltage (V)
Output Voltage (V)
Temp=25°C
1.47
70
Output Current (A)
VIN=5.5V
1.75
1.52
80
0
5.5
2.00
1.53
Temp=25°C
90
Fig. 9 STBY Input Current
1.54
5.5
Temp=85°C
STBY Voltage (V)
1.55
5
40
0
0
4.5
100
50
VIN = STBY
0
4
120
110
100
3.5
Fig. 7 Circuit Current IGND
10
120
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 6 Line Regulation
140
Gnd Current (uA)
60
Vin Voltage (V)
Fig. 5 Output Voltage
Output Voltage (V)
80
0
1.45
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
1.8
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 16 IGND vs. Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Ta=25ºC unless otherwise specified.)
80
80
0.7
f= 0 .1 kHz
70
Ripple Rejection [dB]
Ripple Re je c tion (dB )
70
O u tpu t N o is e D e n s ity [μ V / √ H z ]
●Reference data BU15TA2WNVX /HFV
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
f= 1 kHz
60
f= 1 0 kHz
50
40
30
f= 1 0 0 kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
2.5
0.1
1
10
100
1000
4.5
Input Voltage VIN[V]
Frequency (kHz)
Fig. 17 Ripple Rejection vs. Freq.
3.5
Fig. 18 Ripple Rejection vs. VIN
(Iout=10 mA)
5.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1
1
10
Frequency f [kHz]
Fig. 19 Output Noise Spectral Density
vs. Freq.
Fig. 20 Load Response
Fig. 21 Load Response
Fig. 22 Load Response
Fig. 23 Load Response
Fig. 24 Load Response
Current Pulse=10 kHz
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100
Fig. 25 Load Response
Current Pulse=10 kHz
7/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data
BU15TA2WNVX / HFV (Ta=25ºC unless otherwise specified.)
Fig. 26 Load Response
Current Pulse=100 kHz
Fig. 27 Load Response
Current Pulse=100 kHz
Fig. 28 Startup Time
Iout = 0 mA
Fig. 29 Startup Time
Iout = 200 mA
Fig. 31 Startup Time (STBY=VIN)
Iout = 200mA
Fig. 32 Discharge Time
Iout = 0 mA
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8/29
Fig. 30 Startup Time (STBY=VIN)
Iout = 0 mA
Fig. 33 VIN Response
Iout = 10 mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
3.5
1.84
2.5
2.0
1.5
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.0
0.5
Temp=25°C
VIN = STBY
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.83
1.82
1.81
1.80
1.79
1.78
1.77
Temp=25°C
VIN = STBY
1.76
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.75
1.85
1.95
Vin Voltage (V)
2.05
2.15
2.25
40
Temp=-40°C
Temp=25°C
Temp=85°C
20
0
2.35
0.5
1
1.5
2
2.5
3
60
Temp=-40°C
Temp=25°C
Temp=85°C
40
IO=200mA
VIN = STBY
20
Temp=85°C
8
Gnd Current (uA)
STBY Current (uA)
80
Temp=25°C
6
Temp=-40°C
4
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1.80
1.79
1.78
VIN = 3.5V
STBY = 1.5V
0.05
0.1
0.15
0.2
VIN=5.5V
2.00
VIN=3.5V
1.50
1.00
VIN=2.5V
Temp=25°C
STBY = 1.5V
0.10
0.20
0.30
0.40
0.50
0.60
1.81
1.80
1.79
VIN=3.5V
STBY=1.5V
Io=0.1mA
40.00
30.00
20.00
VIN=3.5V
STBY=1.5V
Io=0mA
10.00
0.00
1.75
-15
10
35
60
85
Temp (°C)
Fig. 43 VOUT vs Temp
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-40
-15
10
35
60
Temp (°C)
Fig. 44 IGND vs Temp
9/29
1
1.5
Fig. 42 STBY Threshold
G nd Current (uA)
Input Current (uA)
1.82
0.5
STBY Voltage (V)
Fig. 41 OCP Threshold
1.83
-40
Temp=85°C
Temp=25°C
Temp=-40°C
1.00
0
1.84
1.76
1.50
0.50
50.00
1.77
2.00
Output Current (A)
Fig. 40 Load Regulation
1.78
2.50
0.00
0.00
Output Current (A)
1.85
0.2
3.00
2.50
0.00
0
0.15
3.50
0.50
1.75
0.1
Fig. 39 IOUT - IGND
Output Voltage (V)
Output Voltage (V)
Temp=-40°C
1.81
1.76
0.05
Output Current (A)
3.00
Temp=25°C
Temp=85°C
VIN = 3.5V
STBY = 1.5V
0
5.5
3.50
1.77
Temp=-40°C
60
Fig. 38 STBY Input Current
1.84
1.82
70
STBY Voltage (V)
Fig. 37 Circuit Current IGND
1.83
80
40
Vin Voltage (V)
1.85
5.5
Temp=25°C
90
50
5.5
5
Temp=85°C
VIN = STBY
0
4.5
100
2
0
0
4
120
110
100
3.5
Fig. 36 Circuit Current IGND
10
120
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 35 Line Regulation
140
Gnd Current (uA)
60
Vin Voltage (V)
Fig. 34 Output Voltage
Output Voltage (V)
80
0
1.75
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
1.85
3.0
85
1.000
0.900
0.800
0.700
0.600
0.500
0.400
0.300
0.200
0.100
0.000
-0.100
-40
VIN=3.5V
STBY=0V
-15
10
35
60
85
Temp (°C)
Fig. 45 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
80
70
70
60
50
40
30
Vin= 3.5V
Io=10mA
Ta = 25℃
20
10
0.7
f= 0 .1 kHz
O u tpu t N oise D e n sity [μ V / √ H z]
80
Ripple Rejection [dB]
R ipple R ejection (dB)
●Reference data BU18TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
f= 1 kHz
60
f= 1 0 kHz
50
40
f= 1 0 0 kHz
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
1
10
100
2.5
1000
4.5
5.5
0.5
0.4
0.3
0.2
0.1
0
0.1
1
Input Voltage VIN[V]
Frequency (kHz)
Fig. 46 Ripple Rejection VS Freq.
3.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
0.6
Fig. 47 Ripple Rejection VS VIN
10
Frequency f [kHz]
100
Fig. 48 Output Noise Spectrl
Density VS Freq.
Fig. 49 Load Response
Fig. 50 Load Response
Fig. 51 Load Response
Fig. 52 Load Response
⇔
Fig. 53 Load Response
Current Pulse=10kHz
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 54 Load Response
Current Pulse=10kHz
10/29
2011.01 - Rev.C
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU18TA2WNVX / HFV
Technical Note
(Unless otherwise specified, Ta=25℃)
⇔
Fig. 55 Load Response
Current Pulse=100kHz
Fig. 57 Start Up Time
Iout = 0mA
Fig. 60 Start Up Time(STBY=VIN)
Iout = 200mA
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 56 Load Response
Current Pulse=100kHz
Fig. 58 Start Up Time
Iout = 200mA
Fig. 61 Discharge Time
Iout = 0mA
11/29
Fig. 59 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 62 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
3.5
2.54
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
0.5
Temp.=25°C
VIN=STBY
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
2.52
2.51
2.50
2.49
2.48
2.47
Temp.=25°C
VIN=STBY
2.46
0.0
0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
2.53
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
2.55
3.0
2.4
2.5
2.6
2.7
2.8
40
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
2.9
0
3
0.5
1
1.5
2
2.5
0.35
Temp.=25°C
0.30
0.25
Temp.=-40°C
0.20
0.15
0.10
VIN=0.98*VOUT
STBY=1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
110
Temp.=85°C
Temp.=25°C
6
Temp.=-40°C
4
2
0.05
0.1
0.15
4
4.5
5
5.5
Temp.=-40°C
100
Temp.=25°C
90
80
Temp.=85°C
70
60
50
0
0.00
0
3.5
120
10
0.45
0.40
3
Fig. 65 Circuit Current IGND
Fig. 64 Line Regulation
0.50
IO=0uA
VIN=STBY
Vin Voltage (V)
Vin Voltage (V)
Fig. 63 Output Voltage
Dropout Voltage (V)
60
0
2.45
5.5
Vin Voltage (V)
80
40
0
0.2
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5.5
0.05
STBY Voltage (V)
Output Current (A)
Fig. 66 Dropout Voltage
Fig. 67 STBY Input Current
2.55
0.1
0.15
0.2
Output Current (A)
Fig. 68 IOUT - IGND
3.00
3.50
Temp.=25°C
2.52
Temp.=85°C
2.51
2.50
2.49
2.48
2.47
VIN=3.5V
STBY=1.5V
Temp.=-40°C
2.46
3.00
2.50
VIN=5.5V
VIN=3.5V
2.00
VIN=3.0V
1.50
1.00
Temp.=25°C
0.50
0.00
0
0.05
0.1
0.15
0.2
0
0.1
0.2
Output Current (A)
0.3
0.4
0.5
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.00
0.6
0
0.5
1.5
Fig. 71 STBY Threshold
1.000
50.00
VIN=3.5V
STBY=1.5V
Io=0.1mA
1
STBY Voltage (V)
Fig. 70 OCP Threshold
2.55
0.900
2.52
2.51
2.50
2.49
2.48
2.47
0.800
40.00
Gnd Current (uA)
Gnd Current (uA)
2.53
2.00
Output Current (A)
Fig. 69 Load Regulation
2.54
2.50
0.50
STBY=1.5V
2.45
Output Voltage (V)
Output Voltage (V)
2.53
Output Voltage (V)
Output Voltage (V)
2.54
VIN=3.5V
STBY=1.5V
Io=0mA
30.00
20.00
10.00
0.700
0.600
0.500
0.400
0.300
0.200
VIN=3.5V
STBY=0V
0.100
2.46
0.000
2.45
-0.100
0.00
-40
-15
10
35
60
85
Temp. (°C)
Fig. 72 VOUT vs Temp
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© 2011 ROHM Co., Ltd. All rights reserved.
-40
-15
10
35
60
Temp. (°C)
Fig. 73 IGND vs Temp
12/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 74 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
80
80
1.2
O utput N oise D ensity [μ V /√ H z]
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Rejection (dB )
70
50
40
30
20
Vin= 3.5V
Io=10mA
Ta = 25℃
10
60
f= 1 kHz
50
f= 1 0 kHz
40
f= 1 0 0 kHz
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
0
0.1
1
10
100
1000
Frequency (kHz)
2.5
3.5
4.5
5.5
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1
0.8
0.6
0.4
0.2
0
0.1
I OU T=0m A →100m A
10
Frequency f [kHz]
I OU T=100m A →0m A
Fig. 79 Load Response
Fig. 78 Load Response
Fig. 80 Load Response
Fig. 81 Load Response
⇔
⇔
Fig. 83 Load Response
Current Pulse=10kHz
Fig. 82 Load Response
Current Pulse=10kHz
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© 2011 ROHM Co., Ltd. All rights reserved.
100
Fig. 77 Output Noise Spectrl
Density VS Freq.
Fig. 76 Ripple Rejection VS VIN
Fig. 75 Ripple Rejection VS Freq.
1
Input Voltage VIN[V]
13/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU25TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
⇔
⇔
Fig. 84 Load Response
Current Pulse=100kHz
Fig. 86 Start Up Time
Iout = 0mA
Fig. 89 Start Up Time(STBY=VIN)
Iout = 200mA
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Fig. 85 Load Response
Current Pulse=100kHz
Fig. 87 Start Up Time
Iout = 200mA
Fig. 90 Discharge Time
Iout = 0mA
14/29
Fig. 88 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 91 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU28TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
3.5
IO=0uA
2.84
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
Temp.=25°C
VIN = STBY
0.5
0.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
2.83
2.82
2.81
80
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
2.85
3.0
2.80
2.79
2.78
Temp.=25°C
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
2.76
VIN = STBY
5.5
2.8
2.9
3
3.1
3.2
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Vin Voltage (V)
Vin Voltage (V)
Fig. 94 Circuit Current IGND
Fig. 93 Line Regulation
10
0.40
120
0.35
110
Temp.=85°C
0.25
Temp.=25°C
0.20
Temp.=-40°C
0.15
0.10
8
Temp.=85°C
Temp.=25°C
6
Temp.=-40°C
4
2
VIN=0.98 x VOUT
0.05
Gnd Current (uA)
0.30
STBY Current (uA)
90
Temp.=25°C
80
70
0
0.05
0.1
0.15
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.15
0.2
3.50
VIN=3.8V
3.00
3.00
2.82
Output Voltage (V)
STBY = 1.5V
0.1
Fig. 97 IOUT - IGND
3.50
2.85
2.83
0.05
Output Currnt (A)
Fig. 96 STBY Input Current
Fig. 95 Dropout Voltage
VIN = 3.8V
STBY = 1.5V
0
5.5
STBY Voltage (V)
Output Current (A)
2.84
VIN = 3.8V
50
40
0
0.2
Temp.=-40°C
60
0
0.00
Temp.=85°C
100
VIN = STBY
STBY = 1.5V
Temp.=-40°C
2.81
2.80
2.79
2.78
2.77
Temp.=85°C
Temp.=25°C
VIN=3.8V
2.50
VIN=5.5V
2.00
VIN=3.3V
1.50
1.00
Temp=25°C
STBY = 1.5V
0.50
2.76
Output Voltage (V)
Dropout Voltage (V)
Temp.=-40°C
Temp.=25°C
Temp.=85°C
0
2.7
Fig. 92 Output Voltage
Output Voltage (V)
40
20
2.77
Vin Voltage (V)
2.50
2.00
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.50
0.00
2.75
0
0.05
0.1
0.15
0
0.2
0.1
0.2
0.3
0.4
0.5
0.6
0.00
Output Current (A)
Output Currnt (A)
0
0.5
1
1.5
STBY Voltage (V)
Fig. 98 Load Regulation
Fig. 99 OCP Threshold
Fig. 100 STBY Threshold
50.00
2.85
1.000
0.900
2.84
2.82
2.81
2.80
2.79
2.78
VIN=3.8V
STBY=1.5V
Io=0.1mA
2.77
2.76
0.800
40.00
Gnd Current (uA)
2.83
Gnd Current (uA)
Output Voltage (V)
60
2.75
0
VIN = STBY
30.00
20.00
VIN=3.8V
STBY=1.5V
Io=0mA
10.00
-40
-15
10
35
60
85
Temp. (°C)
Fig. 101 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.600
0.500
0.400
0.300
VIN=3.8V
STBY=0V
0.200
0.100
0.000
0.00
2.75
0.700
-0.100
-40
-15
10
35
60
Temp. (°C)
Fig. 102 IGND vs Temp
15/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 103 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Unless otherwise specified, Ta=25℃)
80
80
1.6
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Rejection (dB )
70
O utput N oise D ensity [μ V /√ H z]
●Reference data BU28TA2WNVX / HFV
50
40
30
20
Vin= 3.8V
Io=10mA
Ta = 25℃
10
1
10
f= 1 kH z
50
f= 1 0 kH z
40
f= 1 0 0 kH z
30
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
1.2
1
0.8
0.6
0.4
0.2
0
0
0.1
60
100
2.8
1000
3.8
0
4.8
0.1
100
Fig. 108 Load Response
Fig. 107 Load Response
Fig. 110 Load Response
Fig.109 Load Response
⇔
⇔
Fig. 112 Load Response
Current Pulse=10kHz
Fig. 111 Load Response
Current Pulse=10kHz
www.rohm.com
10
Frequency f [kHz]
Fig. 106 Output Noise Spectrl
Density VS Freq.
Fig. 105 Ripple Rejection VS VIN
© 2011 ROHM Co., Ltd. All rights reserved.
1
Input Voltage VIN[V]
Frequency (kHz)
Fig. 104 Ripple Rejection VS Freq.
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
16/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU28TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
⇔
⇔
Fig. 113 Load Response
Current Pulse=100kHz
Fig. 115 Start Up Time
Iout = 0mA
Fig. 118 Start Up Time(STBY=VIN)
Iout = 200mA
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 114 Load Response
Current Pulse=100kHz
Fig. 116 Start Up Time
Iout = 200mA
Fig. 119 Discharge Time
Iout = 0mA
17/29
Fig. 117 Start Up Time (STBY=VIN)
Iout = 0mA
Fig.120 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
(Unless otherwise specified, Ta=25℃)
3.05
3.0
3.04
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
Temp.=25°C
0.5
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
3.03
3.02
3.01
3.00
2.99
2.98
2.97
Temp.=25°C
VIN=STBY
2.96
VIN=STBY
0
100
IO=0uA
IO=100uA
IO=50mA
IO=200mA
Gnd Current (uA)
3.5
Output Voltage (V)
Output Voltage (V)
●Reference data BU30TA2WNVX / HFV
2.95
5.5
2.9
3
3.1
3.2
3.3
3.4
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
3.5
0
0.5
1
1.5
2
2.5
110
Temp.=25°C
0.20
Temp.=-40°C
0.15
0.10
VIN=0.98*VOUT
STBY=1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
0.25
Temp.=25°C
6
Temp.=-40°C
4
2
0
0
0.05
0.1
0.15
0.2
4.5
5
5.5
Temp.=25°C
100
Temp.=85°C
90
80
Temp=-40°C
70
60
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.05
STBY Voltage (V)
0.1
0.15
0.2
Output Current (A)
Fig. 125 STBY Input Current
Fig. 126 IOUT - IGND
3.50
3.05
4
40
0
Output Current (A)
Fig. 124 Dropout Voltage
3.5
50
VIN=STBY
0.00
3
120
10
Temp.=85°C
VIN=STBY
Fig. 123 Circuit Current IGND
0.35
0.30
IO=0uA
Vin Voltage (V)
Fig. 122 Line Regulation
0.40
3.50
VIN=4.0V
3.04
3.00
3.02
3.01
3.00
2.99
2.98
2.97
Temp.=-40°C
VIN=4.0V
STBY=1.5V
2.96
3.00
VIN=5.5V
VIN=4.0V
2.50
VIN=3.5V
2.00
1.50
1.00
Temp.=25°C
STBY=1.5V
0.50
Temp.=85°C
Output Voltage (V)
Output Voltage (V)
Temp.=25°C
3.03
0.00
2.95
0
0.05
0.1
0.15
0.1
0.2
Fig. 127 Load Regulation
0.3
0.4
0.5
0.6
1
1.5
Fig. 129 STBY Threshold
1.000
Input Current (µA)
0.900
3.02
3.01
3.00
2.99
2.98
2.97
0.800
40.00
30.00
20.00
VIN=4.0V
STBY=1.5V
Io=0mA
10.00
2.96
2.95
10
35
60
85
Temp. (°C)
Fig. 130 VOUT vs Temp
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
0.700
0.600
0.500
0.400
VIN=4.0V
STBY=0V
Io=0mA
0.300
0.200
0.100
0.000
-0.100
0.00
-15
0.5
STBY Voltage (V)
50.00
VIN=4.0V
STBY=1.5V
Io=0.1mA
-40
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0
Fig.128 OCP Threshold
3.05
3.03
1.50
Output Current (A)
Output Current (A)
3.04
2.00
0.00
0
0.2
2.50
0.50
Input Current (µA)
Dropout Voltage (V)
40
Vin Voltage (V)
Fig. 121 Output Voltage
Output Voltage (V)
60
0
Vin Voltage (V)
Output Voltage (V)
80
-40
-15
10
35
60
Temp. (°C)
Fig. 131 IGND vs Temp
18/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 132 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU30TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
80
80
1.6
O u tpu t N o ise D e n sity [μ V / √ H z]
f= 0 .1 kHz
70
60
Ripple Rejection [dB]
Ripple Re je c tio n (dB )
70
50
40
30
Vin= 4.0V
Io=10mA
Ta = 25℃
20
10
60
f= 1 kH z
50
f= 1 0 kHz
40
30
f= 1 0 0 kHz
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
20
10
0
3
0
0.1
1
10
Frequency (kHz)
100
1000
Fig. 133 Ripple Rejection VS Freq.
4
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
1.2
1
0.8
0.6
0.4
0.2
0
5
0.1
Input Voltage VIN[V]
Fig. 134 Ripple Rejection VS VIN
Fig. 136 Load Response
1
10
Frequency f [kHz]
Fig. 135 Output Noise Spectrl
Density VS Freq.
Fig. 137 Load Response
Fig. 138 Load Response
Fig. 139 Load Response
Fig. 140 Load Response
Current Pulse=10kHz
Fig. 141 Load Response
Current Pulse=10kHz
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© 2011 ROHM Co., Ltd. All rights reserved.
100
19/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU30TA2WNVX / HFV
(Unless otherwise specified, Ta=25℃)
Fig. 142 Load Response
Current Pulse=100kHz
Fig. 144 Start Up Time
Iout = 0mA
Fig. 147 Start Up Time(STBY=VIN)
Iout = 200mA
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© 2011 ROHM Co., Ltd. All rights reserved.
Fig. 143 Load Response
Current Pulse=100kHz
Fig. 145 Start Up Time
Iout = 200mA
Fig. 148 Discharge Time
Iout = 0mA
20/29
Fig. 146 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 149 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
3.5
3.34
2.5
2.0
IO=0uA
IO=100uA
IO=50mA
IO=200mA
1.5
1.0
0.5
Temp.=25°C
VIN = STBY
IO=0uA
IO=100uA
IO=50mA
IO=200mA
3.33
3.32
3.31
3.30
3.29
3.28
3.27
Temp=25°C
VIN = STBY
3.26
0.0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
3.2
3.3
3.4
Vin Voltage (V)
3.5
40
Temp.=-40°C
Temp.=25°C
Temp.=85°C
20
0
3.7
0.5
1
1.5
2
2.5
0.15
Temp.=-40°C
0.10
VIN=0.98 x VOUT
STBY = 1.5V
0.05
Temp.=85°C
8
Gnd Current (uA)
STBY Current (uA)
Temp.=25°C
0.20
Temp.=25°C
6
Temp.=-40°C
4
2
0
0.05
0.1
0.15
0.2
3.34
3.32
Temp.=25°C
Output Voltage (V)
3.33
Temp.=-40°C
3.31
3.30
3.29
3.28
Temp.=85°C
3.27
VIN = 4.3V
STBY = 1.5V
3.26
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0.05
0.1
Temp.=-40°C
80
70
60
VIN = 4.3V
STBY = 1.5V
0
5.5
0.05
0.15
3.50
3.00
VIN=3.8V
2.50
VIN=4.3V
2.00
1.50
1.00
STBY = 1.5V
2.50
2.00
1.50
Temp.=85°C
Temp.=25°C
Temp.=-40°C
1.00
0.00
0.1
0.2
0.3
0.4
0.5
0.6
0
0.5
Output Current (A)
Output Current (A)
Fig. 156 Load Regulation
1
1.5
STBY Voltage (V)
Fig. 158 STBY Threshold
Fig. 157 OCP Threshold
3.35
0.2
VIN=4.3V
0.50
Temp=25℃
0
0.2
0.15
Fig. 155 IOUT - IGND
3.00
VIN=5.5V
0.1
Output Current (A)
0.00
0
90
3.50
0.50
3.25
5.5
Temp.=85°C
Fig. 154 STBY Input Current
3.35
5
Temp.=25°C
V STBY Voltage (V)
Fig. 153 Dropout Voltage
4.5
40
0
Output Current (A)
Output Voltage (V)
0
4
100
50
VIN = STBY
0.00
3.5
120
110
Temp.=85°C
3
Fig. 152 Circuit Current IGND
10
0.30
0.25
IO=0uA
VIN = STBY
Vin Voltage (V)
Fig. 151 Line Regulation
0.35
50.00
1.000
3.34
0.900
3.32
3.31
3.30
3.29
3.28
VIN=4.3V
STBY=1.5V
Io=0.1mA
3.27
3.26
0.800
40.00
30.00
20.00
VIN=4.3V
STBY=1.5V
Io=0mA
10.00
3.25
Gnd Current (uA)
3.33
Gnd Current (uA)
Output Voltage (V)
60
Vin Voltage (V)
Fig. 150 Output Voltage
Dropout Voltage (V)
3.6
80
0
3.25
0
Output Voltage (V)
Gnd Current (uA)
Output Voltage (V)
Output Voltage (V)
100
3.35
3.0
-15
10
35
60
85
Temp. (°C)
Fig. 159 VOUT vs Temp
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© 2011 ROHM Co., Ltd. All rights reserved.
0.600
0.500
0.400
0.300
VIN=4.3V
STBY=0V
0.200
0.100
0.000
0.00
-40
0.700
-0.100
-40
-15
10
35
60
Temp. (°C)
Fig. 160 IGND vs Temp
21/29
85
-40
-15
10
35
60
85
Temp. (°C)
Fig. 161 IGND vs Temp (STBY)
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
80
1.8
80
50
40
30
Vin= 4.3V
Io=10mA
Ta = 25℃
20
10
60
O u tpu t N o ise D e n sity [μ V / √ H z ]
f= 1 kHz
70
60
Ripple Rejection [dB]
R ipple R e je c tio n (dB )
70
f= 0 .1 kHz
50
f= 1 0 kHz
40
30
f= 1 0 0 kHz
20
10
Co=1.0μF
Cin=none
Iout=10mA
temp=25℃
0
0
3.3
0.1
1
10
100
1000
1.2
1
0.8
0.6
0.4
0.2
0.1
Fig. 163 Ripple Rejection VS VIN
Fig. 165 Load Response
Co=1.0μF
Cin=1.0μF
Iout=10mA
temp=25℃
1.4
0
5.3
Input Voltage VIN[V]
Frequency (kHz)
Fig. 162 Ripple Rejection VS Freq.
4.3
1.6
1
10
Frequency f [kHz]
Fig. 164 Output Noise Spectrl
Density VS Freq.
Fig. 166 Load Response
Fig. 167 Load Response
Fig. 168 Load Response
Fig. 169 Load Response
Current Pulse=10kHz
Fig. 170 Load Response
Current Pulse=10kHz
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© 2011 ROHM Co., Ltd. All rights reserved.
100
22/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Reference data BU33TA2WNVX / HFV (Unless otherwise specified, Ta=25℃)
Fig. 172 Load Response
Current Pulse=100kHz
Fig. 171 Load Response
Current Pulse=100kHz
Fig. 173 Start Up Time
Iout = 0mA
Fig. 174 Start Up Time
Iout = 200mA
Fig. 176 Start Up Time(STBY=VIN)
Iout = 200mA
Fig. 177 Discharge Time
Iout = 0mA
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23/29
Fig. 175 Start Up Time (STBY=VIN)
Iout = 0mA
Fig. 178 VIN Response
Iout = 10mA
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1
(Single-side Board)
Evaluation Board 2
(Double-side Board)
40
40
20
20
40 20
40 20
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
Top Layer (Top View)
40
40
20
IC Implementation Position
40
40 20
Bottom Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Single-side board)
Glass epoxy resin (Double-side board)
Board Size
40 mm x 40 mm x 0.8 mm
40 mm x 40 mm x 0.8 mm
Top layer
Metal (GND) wiring rate: Approx. 25%
Metal (GND) wiring rate: Approx. 25%
Bottom layer
Metal (GND) wiring rate: Approx 0%
Metal (GND) wiring rate: Approx 25%
Through Hole
0 holes
Diameter 0.5 mm  12 holes
Power Dissipation
1100 mW
1250 mW
Thermal Resistance
θja=91℃/W
θja=80℃/W
Wiring Rate
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© 2011 ROHM Co., Ltd. All rights reserved.
24/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
○SSON004X1216
1500
1250 mW
* Please design the margin so that PMAX becomes is than Pd
(PMAXPd) within the usage temperature range.
Evaluation board 2
(Double-side board)
1000
Pd (mW)
1100 mW
- Standard ROHM board Size: 70 mm  70 mm  1.6 mm
Material: Glass epoxy board
Evaluation board 1
(Single-side board)
500
Standard ROHM board
220 mW
0
0
25
50
75
100
125
Ta ( ℃)
Fig.179 SSON004X1216
Power dissipation heat reduction characteristics
(Reference)
Pd(W)
○HVSOF5
* Please design the margin so that PMAX
becomes is than Pd (PMAXPd) within
the usage temperature range.
Fig.180 HVSOF5
Power dissipation heat reduction characteristics
(Reference)
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© 2011 ROHM Co., Ltd. All rights reserved.
25/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●DEVICE TYPE & Mark
○HVSOF5
○SSON004X1216
Device type:
BUXXTA2WNVX
Device type:
BUXXTA2WHFV
a
a
a
package
XX
output
voltage
SSON004X1216
HVSOF5
15
1.5V typ.
AA
BA
18
1.8V typ.
AB
BB
25
2.5V typ.
AC
BD
26
2.6V typ.
AD
BE
27
2.7V typ.
AE
BF
28
2.8V typ.
AF
BG
2J
2.85V typ.
AG
BH
29
2.9V typ.
AH
BJ
30
3.0V typ.
AJ
BK
31
3.1V typ.
AK
BL
32
3.2V typ.
AL
BM
33
3.3V typ.
AM
BN
34
3.4V typ.
AN
BP
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© 2011 ROHM Co., Ltd. All rights reserved.
26/29
2011.01 - Rev.C
BUTA2WNVX series, BUTA2WHFV series
Technical Note
○SSON004X1216
Mark
Lot No.
○HVSOF5
Mark
Lot No.
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© 2011 ROHM Co., Ltd. All rights reserved.
27/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Notes for use
・About absolute maximum rating
Breakage may occur when absolute maximum ratings such as applied voltage and operating temperature range are
exceeded. Short mode or open mode cannot be specified at occurrence of a break, so please prepare physical safety
measures (e.g., fuse) if such special mode in which the absolute maximum rating is exceeded can be assumed.
・About GND potential
Please be sure that the potential of the GND terminal is the lowest in any operating condition.
・About thermal design
Please provide thermal design with sufficient margin, taking power dissipation (Pd) in actual usage conditions into
consideration.
・About short between pins and misattachment
Please be careful regarding the IC direction and misalignment at attachment onto a printed circuit board. Misattachment
may cause a break of IC. Short caused by foreign matter between outputs, output and power supply, or GNDs may also
lead to a break.
・About operation in a strong electromagnetic field
Please note that usage in a strong electromagnetic field may cause malfunction.
・About common impedance
Please give due consideration to wiring of the power source and GND by reducing common-mode ripple or making ripple
as small as possible (e.g., making the wiring as thick and short as possible, or reducing ripple by LC), etc.
・About STBY terminal voltage
Set STBY terminal voltage to 0.3 V or less to put each channel into a standby state and to 1.5 V or more to put each
channel into an operating state. Do not fix STBY terminal voltage to 0.3 V or more and 1.5 V or less or do not lengthen
the transition time. This may cause malfunction or failure. When shorting the VIN terminal and STBY terminal for usage,
the status will be “STBY=VIN=LOW” at turning the power OFF, and discharge of the VOUT terminal cannot operate,
which means voltage may remain for a certain time in the VOUT terminal. Since turning the power ON again in this state
may cause overshoot, turn the power ON for use after the VOUT terminal is completely discharged.
・About overcurrent protection circuit
Output has a built-in overcurrent protection circuit, which prevents IC break at load short. Note that this protection circuit
is effective for prevention of breaks due to unexpected accidents. Please avoid usage by which the protection circuit
operates continuously.
・About thermal shutdown
Output is OFF when the thermal circuit operates since a temperature protection circuit is built in to prevent thermal
breakdown. However, it recovers when the temperature returns to a certain temperature. The thermal circuit operates at
emergency such as overheating of IC. Since it is prepared to prevent IC breakdown, please do not use it in a state in
which protection works.
●About reverse current
For applications on which reverse current is assumed to flow into IC,
it is recommended to prepare a path to let the current out by putting
a bypass diode between the VIN-VOUT terminals.
Reverse current
VIN
STBY
OUT
GND
Fig.181 Example of bypass diode connection
●About testing on a set board
When connecting a capacitor to a terminal with low impedance for testing on a set board, please be sure to discharge for
each process since IC may be stressed. As a countermeasure against static electricity, prepare grounding in the assembly
process and take sufficient care in transportation and storage. In addition, when connecting a capacitor to a jig in a testing
process, please do so after turning the power OFF and remove it after turning the power OFF.
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© 2011 ROHM Co., Ltd. All rights reserved.
28/29
2011.01 - Rev.C
Technical Note
BUTA2WNVX series, BUTA2WHFV series
●Ordering part number
B
U
1
5
T
Lineup
Output voltage
Part No.
A
15: 1.5V 29: 2.9V
18: 1.8V 30: 3.0V
25: 2.5V 31: 3.1V
26: 2.6V 32: 3.2V
27: 2.7V 33: 3.3V
28: 2.8V 34: 3.4V
2J: 2.85V
2
W
N
Shutdown Swich
W : Includes
switch
V
X
-
Package
NVX : SSON004X1216
HFV : HVSOF5
T
R
Packaging and forming specification
TR: Embossed tape and reel
SSON004X1216
<Tape and Reel information>
1.6 ± 0.1
1.2±0.1
Tape
Embossed carrier tape
Quantity
5000pcs
Direction
of feed
0.6MAX
1PIN MARK
1
2
4
3
+0.03
0.02 -0.02
0.65±0.1
)
0.8 ± 0.1
0.2 ± 0.1
0.08 S
+0.05
0.2 -0.04
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
(0.12)
S
TR
Direction of feed
1pin
0.75±0.1
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF5
<Tape and Reel information>
4
Embossed carrier tape
(0.3)
Quantity
3000pcs
(0.91)
4
0.2MAX
(0.05)
5
Tape
5
(0.41)
1.6±0.05
1.0±0.05
(0.8)
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 –0.02
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
29/29
∗ Order quantity needs to be multiple of the minimum quantity.
2011.01 - Rev.C
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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