BD48xx

Datasheet
Voltage Detector IC Series
Standard CMOS
Voltage Detector IC
BD48xxx series
BD49xxx series
●Key Specifications
Detection voltage:
●General Description
ROHM’s BD48xxx and BD49xxx series are highly
accurate, low-current Voltage Detector IC series. The
family includes BD48xxx devices with N-channel open
drain output and BD49xxx devices with CMOS output.
The devices are available for specific detection voltages
ranging from 2.3V to 6.0V in increments of 0.1V.
2.3V to 6.0V (Typ.),
0.1V steps
High accuracy detection voltage:
±1.0%
Ultra-low current consumption:
0.9µA (Typ.)
Operating temperature range:
●Features
High accuracy detection
Ultra-low current consumption
Two output types (Nch open drain and CMOS output)
Wide Operating temperature range
Very small and low height package
Package SSOP5 is similar to SOT-23-5 (JEDEC)
Package SSOP3 is similar to SOT-23-3 (JEDEC)
-40°C to +105°C
●Package
SSOP5:
2.90mm x 2.80mm x 1.25mm
SSOP3:
2.92mm x 2.80mm x 1.25mm
VSOF5:
1.60 mm x 1.60mm x 0.60mm
●Applications
Circuits using microcontrollers or logic circuits that
require a reset.
●Typical Application Circuit
VDD1
VDD2
VDD1
RL
BD48xxx
RST
RST
BD49xxx
Micro
controller
CL
CL
( Capacitor for
noise filtering )
( Capacitor for
noise filtering)
GND
(Open Drain Output type)
BD48xxx series
Micro
controller
GND
(CMOS Output type)
BD49xxx series
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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TSZ02201-0R7R0G300030-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
1/15
TSZ22111・14・001
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Connection Diagram
N.C.
SSOP5
N.C.
VSOF5
VDD
5
Marking
Lot. No
Marking
VOUT
VOUT VDD GND
TOP VIEW
GND
4
1 2 3
SUB N.C
Lot. No
TOP VIEW
●Pin Descriptions
SSOP5
VSOF5
PIN No.
Symbol
Function
PIN No.
Symbol
Function
1
VOUT
Reset Output
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
2
SUB
Substrate*
3
GND
GND
N.C.
Unconnected Terminal
N.C.
GND
Unconnected Terminal
4
3
4
5
N.C.
Unconnected Terminal
5
VDD
Power Supply Voltage
GND
*Connect the substrate to GND.
SSOP3(1pin GND)
SSOP3(3pin GND)
VDD
GND
3
3
2
Marking
Marking
Lot. No
2
1
VOUT
GND
Lot. No
2
1
VOUT
VDD
TOP VIEW
TOP VIEW
●Pin Descriptions
PIN No.
SSOP3-1
Symbol
Function
PIN No.
GND
1
1
GND
2
VOUT
Reset Output
3
VDD
Power Supply Voltage
SSOP3-2
Symbol
Function
VOUT
Reset Output
2
VDD
Power Supply Voltage
3
GND
GND
Ordering Information
B
Part
Number
D
x
x
Output Type
48 : Open Drain
49 : CMOS
x
Package1
x
x
x
-
Reset Voltage Value
Package2
23 : 2.3V
0.1V step
60 : 6.0V
Package1
E
K
L
Blank
Blank
Package2
G
G
G
FVE
G
Package name
SSOP5
SSOP3(1pin GND)
SSOP3(3pin GND)
VSOF5
SSOP5
T
R
Packaging and
forming specification
Embossed tape and reel
TR :The pin number 1is
the upper right
:SSOP5
:VSOF5
TL :The pin number 1is
the upper left
:SSOP3-1
:SSOP3-2
Note: When ordering new SSOP5, select “E” for Package 1 and “G” for Package 2.
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TSZ22111・15・001
2/15
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6 °
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
)
0.95
0.1
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VSOF5
4
(MAX 1.28 include BURR)
1.2 ± 0.05
5
1.6 ± 0.05
0.2MAX
1.6±0.05
1.0±0.05
1
3
2
0.6MAX
0.13±0.05
0.22±0.05
0.5
(Unit : mm)
SSOP3
2.92±0.1
4°±4°
L
0.45±0.15
1.6±0.1
2.8±0.15
3
1
2
1.1±0.05
1.25MAX
0.15±0.05
XXX
XXX
0.95
XXX
XXX
XXX
XXX
XXX
XXX
XXX
XXX
0.4±0.1
1.9±0.1
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3/15
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Lineup
Table 1. Lineup for VSOF5 and SSOP5 Package
VSOF5 or SSOP5
Package Type
Output Type
Detection
Voltage
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Open Drain
SSOP5
CMOS
Open Drain
CMOS
Marking
Part Number
Marking
Part Number
Marking
Part Number
Marking
Part Number
EW
EV
EU
ET
ES
ER
EQ
EP
EN
EM
EL
EK
EJ
EH
EG
EF
EE
ED
EC
EB
EA
DV
DU
DT
DS
DR
DQ
DP
DN
DM
DL
DK
DJ
DH
DG
DF
DE
DD
BD4860
BD4859
BD4858
BD4857
BD4856
BD4855
BD4854
BD4853
BD4852
BD4851
BD4850
BD4849
BD4848
BD4847
BD4846
BD4845
BD4844
BD4843
BD4842
BD4841
BD4840
BD4839
BD4838
BD4837
BD4836
BD4835
BD4834
BD4833
BD4832
BD4831
BD4830
BD4829
BD4828
BD4827
BD4826
BD4825
BD4824
BD4823
GW
GV
GU
GT
GS
GR
GQ
GP
GN
GM
GL
GK
GJ
GH
GG
GF
GE
GD
GC
GB
GA
FV
FU
FT
FS
FR
FQ
FP
FN
FM
FL
FK
FJ
FH
FG
FF
FE
FD
BD4960
BD4959
BD4958
BD4957
BD4956
BD4955
BD4954
BD4953
BD4952
BD4951
BD4950
BD4949
BD4948
BD4947
BD4946
BD4945
BD4944
BD4943
BD4942
BD4941
BD4940
BD4939
BD4938
BD4937
BD4936
BD4935
BD4934
BD4933
BD4932
BD4931
BD4930
BD4929
BD4928
BD4927
BD4926
BD4925
BD4924
BD4923
Cm
Ck
Ch
Cg
Cf
Ce
Cd
Cc
Cb
Ca
By
Br
Bp
Bn
Bm
Bk
Bh
Bg
Bf
Be
Bd
Bc
Bb
Ba
Ay
Ar
Ap
An
Am
Ak
Ah
Ag
Af
Ae
Ad
Ac
Ab
Aa
BD48E60
BD48E59
BD48E58
BD48E57
BD48E56
BD48E55
BD48E54
BD48E53
BD48E52
BD48E51
BD48E50
BD48E49
BD48E48
BD48E47
BD48E46
BD48E45
BD48E44
BD48E43
BD48E42
BD48E41
BD48E40
BD48E39
BD48E38
BD48E37
BD48E36
BD48E35
BD48E34
BD48E33
BD48E32
BD48E31
BD48E30
BD48E29
BD48E28
BD48E27
BD48E26
BD48E25
BD48E24
BD48E23
Ff
Fe
Fd
Fc
Fb
Fa
Ey
Er
Ep
En
Em
Ek
Eh
Eg
Ef
Ee
Ed
Ec
Eb
Ea
Dy
Dr
Dp
Dn
Dm
Dk
Dh
Dg
Df
De
Dd
Dc
Db
Da
Cy
Cr
Cp
Cn
BD49E60
BD49E59
BD49E58
BD49E57
BD49E56
BD49E55
BD49E54
BD49E53
BD49E52
BD49E51
BD49E50
BD49E49
BD49E48
BD49E47
BD49E46
BD49E45
BD49E44
BD49E43
BD49E42
BD49E41
BD49E40
BD49E39
BD49E38
BD49E37
BD49E36
BD49E35
BD49E34
BD49E33
BD49E32
BD49E31
BD49E30
BD49E29
BD49E28
BD49E27
BD49E26
BD49E25
BD49E24
BD49E23
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TSZ22111・15・001
4/15
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Lineup - continued
Table 2. Lineup for SSOF3(1pin GND) and SSOP3(3pin GND) Package
SSOP3(1pin GND)
Package Type
Output Type
Open Drain
SSOP3(3pin GND)
CMOS
Open Drain
CMOS
Detection
Voltage
Marking
Part Number
Marking
Part Number
Marking
Part Number
Marking
Part Number
6.0V
5.9V
5.8V
5.7V
5.6V
5.5V
5.4V
5.3V
5.2V
5.1V
5.0V
4.9V
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
Cm
Ck
Ch
Cg
Cf
Ce
Cd
Cc
Cb
Ca
By
Br
Bp
Bn
Bm
Bk
Bh
Bg
Bf
Be
Bd
Bc
Bb
Ba
Ay
Ar
Ap
An
Am
Ak
Ah
Ag
Af
Ae
Ad
Ac
Ab
Aa
BD48K60
BD48K59
BD48K58
BD48K57
BD48K56
BD48K55
BD48K54
BD48K53
BD48K52
BD48K51
BD48K50
BD48K49
BD48K48
BD48K47
BD48K46
BD48K45
BD48K44
BD48K43
BD48K42
BD48K41
BD48K40
BD48K39
BD48K38
BD48K37
BD48K36
BD48K35
BD48K34
BD48K33
BD48K32
BD48K31
BD48K30
BD48K29
BD48K28
BD48K27
BD48K26
BD48K25
BD48K24
BD48K23
Ff
Fe
Fd
Fc
Fb
Fa
Ey
Er
Ep
En
Em
Ek
Eh
Eg
Ef
Ee
Ed
Ec
Eb
Ea
Dy
Dr
Dp
Dn
Dm
Dk
Dh
Dg
Df
De
Dd
Dc
Db
Da
Cy
Cr
Cp
Cn
BD49K60
BD49K59
BD49K58
BD49K57
BD49K56
BD49K55
BD49K54
BD49K53
BD49K52
BD49K51
BD49K50
BD49K49
BD49K48
BD49K47
BD49K46
BD49K45
BD49K44
BD49K43
BD49K42
BD49K41
BD49K40
BD49K39
BD49K38
BD49K37
BD49K36
BD49K35
BD49K34
BD49K33
BD49K32
BD49K31
BD49K30
BD49K29
BD49K28
BD49K27
BD49K26
BD49K25
BD49K24
BD49K23
Kb
Ka
Hy
Hr
Hp
Hn
Hm
Hk
Hh
Hg
Hf
He
Hd
Hc
Hb
Ha
Gy
Gr
Gp
Gn
Gm
Gk
Gh
Gg
Gf
Ge
Gd
Gc
Gb
Ga
Fy
Fr
Fp
Fn
Fm
Fk
Fh
Fg
BD48L60
BD48L59
BD48L58
BD48L57
BD48L56
BD48L55
BD48L54
BD48L53
BD48L52
BD48L51
BD48L50
BD48L49
BD48L48
BD48L47
BD48L46
BD48L45
BD48L44
BD48L43
BD48L42
BD48L41
BD48L40
BD48L39
BD48L38
BD48L37
BD48L36
BD48L35
BD48L34
BD48L33
BD48L32
BD48L31
BD48L30
BD48L29
BD48L28
BD48L27
BD48L26
BD48L25
BD48L24
BD48L23
Np
Nn
Nm
Nk
Nh
Ng
Nf
Ne
Nd
Nc
Nb
Na
My
Mr
Mp
Mn
Mm
Mk
Mh
Mg
Mf
Me
Md
Mc
Mb
Ma
Ky
Kr
Kp
Kn
Km
Kk
Kh
Kg
Kf
Ke
Kd
Kc
BD49L60
BD49L59
BD49L58
BD49L57
BD49L56
BD49L55
BD49L54
BD49L53
BD49L52
BD49L51
BD49L50
BD49L49
BD49L48
BD49L47
BD49L46
BD49L45
BD49L44
BD49L43
BD49L42
BD49L41
BD49L40
BD49L39
BD49L38
BD49L37
BD49L36
BD49L35
BD49L34
BD49L33
BD49L32
BD49L31
BD49L30
BD49L29
BD49L28
BD49L27
BD49L26
BD49L25
BD49L24
BD49L23
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TSZ22111・15・001
5/15
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Absolute Maximum Ratings
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
Output Current
*1*4
SSOP5
Power
*2*4
SSOP3
Dissipation
*3*4
VSOF5
Operating Temperature
Ambient Storage Temperature
*1
*2
*3
*4
Symbol
VDD-GND
VOUT
Io
Limits
-0.3 to +10
GND-0.3 to +10
GND-0.3 to VDD+0.3
70
540
Unit
V
700
210
-40 to +105
-55 to +125
mW
Pd
Topr
Tstg
V
mA
°C
°C
Reduced by 5.4mW/°C when used over 25°C.
Reduced by 7.0mW/°C when used over 25°C.
Reduced by 2.1mW/°C when used over 25°C.
When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C)
Parameter
Symbol
Condition
VDET=2.5V
Ta=+25°C
Ta=-40°C to 85°C
Min.
VDET(T)
×0.99
2.475
2.418
VDET=3.0V
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
2.5
-
Max.
VDET(T)
×1.01
2.525
2.584
2.404
2.970
2.901
3.0
-
2.597
3.030
3.100
VDET=3.3V
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
2.885
3.267
3.191
3.3
-
3.117
3.333
3.410
VDET=4.2V
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
3.173
4.158
4.061
4.2
-
3.428
4.242
4.341
VDET=4.8V
Ta=85°C to 105°C
Ta=+25°C
Ta=-40°C to 85°C
4.039
4.752
4.641
4.8
-
4.364
4.848
4.961
4.616
-
4.987
-
-
100
0.95
1.20
0.51
0.56
0.60
0.66
0.75
0.80
0.85
0.90
-
1.53
1.68
1.80
1.98
2.25
2.40
2.55
2.70
-
RL=470kΩ, VDD=H L
Detection Voltage
VDET
Ta=85°C to 105°C
CL=100pF RL=100kΩ
Output Delay Time “L H”
tPLH
Vout=GND 50%
VDET=2.3-3.1V
VDET=3.2-4.2V
*1
Circuit Current when ON
ICC1
VDD=VDET-0.2V
VDET=4.3-5.2V
VDET=5.3-6.0V
VDET=2.3-3.1V
VDET=3.2-4.2V
*1
Circuit Current when OFF
ICC2
VDD=VDET+2.0V
VDET=4.3-5.2V
VDET=5.3-6.0V
VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.
*2 tPLH:VDD=(VDET typ.-0.5V) (VDET typ.+0.5V)
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TSZ22111・15・001
Limit
Typ.
6/15
*1
VDET(T)
Unit
V
*2
µs
µA
µA
V
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Electrical Characteristics (Unless Otherwise Specified, Ta=-40 to 105°C) - continued
Parameter
Symbol
‘Low’Output Voltage (Nch)
VOL
‘High’Output Voltage (Pch)
(BD49Exxx Series)
VOH
VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V)
VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V)
VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V)
Leak Current when OFF
Ileak
VDD=VDS=10V
(BD48xxx Series)
Detection Voltage
Ta=-40°C to 105°C
VDET/∆T
Temperature coefficient
(Designed Guarantee)
Hysteresis Voltage
∆VDET VDD=L H L, RL=470kΩ
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guaranteed at Ta=25°C.
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TSZ22111・15・001
Limit
Condition
7/15
*1
Unit
Min.
VDD-0.5
VDD-0.5
VDD-0.5
Typ.
-
Max.
0.5
0.5
-
-
-
0.1
µA
-
±100
±360
ppm/°C
VDET×0.03 VDET×0.05 VDET×0.08
V
V
V
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Block Diagrams
VDD
VOUT
Vref
GND
Fig.1 BD48xxx series
VDD
VOUT
Vref
GND
Fig.2 BD49xxx series
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TSZ22111・15・001
8/15
TSZ02201-0R7R0G300030-1-2
22.May.2013.Rev.008
BD48xxx series
Datasheet
BD49xxx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
2.0
CIRCUIT CURRENT : IDD[µA]
【BD48x42】 】
【BD4842G/FVE
【BD49x42】
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
7
8
9
10
20
BD4842G/FVE
BD48x42】 】
【【
【BD49x42】
15
10
VDD =2.4V
5
VDD =1.2V
0
0.0
1.0
1.5
2.0
2.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD[V]
Fig.3 Circuit Current
Fig.4 “Low” Output Current
45
9
BD4942G/FVE
【【
BD49x42】 】
40
OUTPUT VOLTAGE: VOUT [V]
"HIGH" OUTPUT CURRENT : IOH[mA]
0.5
35
30
25
20
VDD=8.0V
15
VDD=6.0V
10
5
VDD=4.8V
0
1
2
3
4
5
6
【BD49x42】
7
6
5
4
3
Ta=25℃
2
1
0
0
BD4842G/FVE
BD48x42】 】
【【
8
Ta=25℃
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
DRAIN-SOURCE VOLTAGE : VDS[V]
VDD SUPPLY VOLTAGE :VDD [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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1.0
【BD49x42】
0.8
【
BD48x42
】】 】
BD48x42x
【
【BD4842G/FVE
5.4
【
】 】】
BD48x42x
【BD48x42
【BD4842G/FVE
DETECTION VOLTAGE: VDET[V]
OUTPUT VOLTAGE
: VOUT [V]
●Typical Performance Curves – continued
0.6
0.4
0.2
【BD49x42】
5.0
Low to High(VDET+∆VDET)
4.6
4.2
3.8
High to Low(VDET)
3.4
0.0
0
0.5
1
1.5
2
3.0
2.5
~
~
-40
1.5
BD48x42x
【【
【BD4842G/FVE
BD48x42】】 】
【BD49x42】
1.0
0.5
0
20
40
60
40
80
Ta[℃]
Fig.8 Detection Voltage
Release Voltage
CIRCUIT CURRENT WHEN OFF : I DD2[μA]
CIRCUIT CURRENT WHEN ON : IDD1[μA]
Fig.7 Operating Limit Voltage
0.0
-40 -20
0
TEMPERATURE :
SUPPLY VOLTAGE : [V]
80 100
1.5
BD48x42x
BD4842G/FVE
【【【
BD48x42】】 】
【BD49x42】
1.0
0.5
0.0
-40 -20
0
20
40
60
80 100
TEMPERATURE : Ta[℃]
TEMPERATURE : Ta[℃]
Fig.9 Circuit Current when ON
Fig.10 Circuit Current when OFF
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Datasheet
BD49xxx series
●Typical Performance Curves – continued
MINIMUM OPERATION VOLTAGE : VOPL[V]
1.5
【BD4842G/FVE
【 BD48x42x 】 】
【BD48x42】
【BD49x42】
1.0
0.5
0.0
-40 -20
0
20
40
60
80
100
TEMPERATURE : Ta[℃]
Fig.11 Operating Limit Voltage
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●Application Information
Explanation of Operation
For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the appropriate threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis.
Because the BD48xxx series uses an open drain output type, it is necessary to connect a pull-up resistor to VDD or another
power supply if needed [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power
supply].
VDD
VDD
R1
R1
RL
Vref
Vref
Q2
VOUT
VOUT
R2
R2
Q1
Q1
R3
R3
GND
GND
Fig.12 (BD48xxx series Internal Block Diagram)
Fig.13 (BD49xxx series Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
Part Number
BD48x45
tPLH (µs)
39.5
tPHL (µs)
87.8
BD49x45
32.4
VDD=4.3V 5.1V
52.4
VDD=5.1V 4.3V
*These data are for reference only.
The figures will vary with the application, so please check actual operating conditions before use.
Timing Waveform
Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the
input power supply voltage VDD swept up and down (the circuits are those in Fig.12 and 13).
1
VDD
VDET+ΔVDET
VDET
⑤
VOPL
0V
VOUT
VOH
tPHL
tPLH
tPLH
tPHL
VOL
①
②
③
④
Fig.14 Timing Waveform
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When the power supply is turned on, the output is unstable
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not outputted when
the rise time of VDD is faster than tPHL.
2 When V
DD is greater than VOPL but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
3 If V
DD exceeds the reset release voltage (VDET + ∆VDET), then
VOUT switches from L to H.
4 If V
DD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply
fluctuation, VOUT switches to L (with a delay of tPHL).
5 The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET). The
system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
malfunctions due to noise.
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Datasheet
BD49xxx series
●Circuit Applications
1) Examples of a common power supply detection reset circuit.
VDD2
VDD1
RL
BD48xxx
RST
Micro
controller
Application examples of BD48xxx series (Open Drain
output type) and BD49xxx series (CMOS output type)
are shown on the left.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection IC
(VDD1).
Use an open drain output type (BD48xxx) device with a
load resistance RL attached as shown in figure 15.
CL
( capacitor is for
noise filtering )
GND
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection IC
(VDD1).
Use a CMOS output type (BD49xxx) device or an open
drain device with a pull up resistor between output and
VDD1.
Fig.15 Open Drain Output Type
VDD1
Micro
RST controller
BD49xxx
CL
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the rise and
fall waveform of the output voltage (VOUT).
( capacitor is for
filtering)
The Electrical characteristics were measured using
RL= 470kΩ and CL = 100pF.
GND
Fig.16 CMOS Output Type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BD48xxx
BD48xxx
Microcontroller
RST
GND
Fig.17
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD48xxx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow
into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of
current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow
may cause malfunction in the systems operation such as output oscillations, etc.
V1
R2
I1
VDD
BD48xxx
BD49xxx
R1
CIN
VOUT
CL
GND
Fig.18
When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the
VDD voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at
“Low” condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will
switches again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will
result to oscillation.
IDD
Through Current
0
VDD
VDET
Fig.19 Current Consumption vs. Power Supply Voltage
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●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
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4.
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5.
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6.
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7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
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8.
Confirm that operation temperature is within the specified range described in the product specification.
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Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
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[b] the temperature or humidity exceeds those recommended by ROHM
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[d] the Products are exposed to high Electrostatic
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ROHM’s Products against warning, caution or note contained in this document.
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