BU42xx

Datasheet
Voltage Detector IC Series
Low Voltage Free Delay Time Setting
CMOS Voltage Detector IC Series
BU42xx series
BU43xx series
●General Description
ROHM’s BU42xx and BU43xx series are CMOS Voltage
Detector ICs with adjustable output delay. It is a
high-accuracy, low current consumption Voltage Detector
IC series with a built-in delay circuit. The lineup was
established with two output types (Nch open drain and
CMOS output) and detection voltages range from 0.9V to
4.8V in increments of 0.1V, so that the series may be
selected according to application.
●Features
Delay Time Controlled by external Capacitor
Two output types (Nch open drain and CMOS output)
Ultra-low current consumption
Wide operating temperature range
Very small and low height package
Package SSOP5 and SOP4 is similar to SOT-23-5
and SC-82 respectively (JEDEC)
●Key Specifications
Detection voltage:
0.9V to 4.8V (Typ.)
0.1V steps
High accuracy detection voltage:
±1.0%
Ultra-low current consumption:
0.55µA (Typ.)
Operating temperature range:
-40°C to +125°C
●Package
SSOP5:
2.90mm x 2.80mm x 1.25mm
SOP4:
2.00mm x 2.10mm x 0.95mm
VSOF5:
1.60mm x 1.60mm x 0.60mm
●Applications
Circuits using microcontrollers or logic circuits that require
a reset.
●Typical Application Circuit
VDD1
VDD1
VDD2
RL
RST
BU42xx
CIN
CT
CIN
RST
BU43xx
Micro
controller
CT
CL
CL
(Capacitor for
noise filtering)
(Capacitor for
noise filtering)
GND
Open Drain Output type
BU42xx series
●Connection Diagram & Pin Descriptions
SSOP5
SOP4
N.C.
CT
TOP VIEW
TOP VIEW
VOUT
Function
CMOS Output type
BU43xx series
VOUT
4
PIN
Symbol
No.
VSOF5
TOP VIEW
CT
3
Lot. No
1
GND
VDD GND
PIN
Symbol
No.
GND
Marking
Lot. No
Marking
Micro
controller
Marking
1 2 3
VOUT SUB CT
2
VDD
Function
GND VDD
4
5
PIN
Symbol
No.
Lot. No
Function
1
2
VOUT
VDD
Reset output
Power supply voltage
1
2
GND
VDD
GND
Power supply voltage
1
2
VOUT
SUB
Reset output
Substrate*
3
GND
GND
3
CT
Capacitor connection
terminal for output
delay time
3
CT
Capacitor connection
terminal for output
delay time
4
N.C.
Unconnected terminal
4
VOUT
Reset output
4
VDD
Power supply voltage
5
CT
Capacitor connection
terminal for output
delay time
5
GND
GND
*Connect the substrate to VDD
○Product structure:Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
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03.Feb.2014 Rev.008
TSZ22111・14・001
BU42xx series
Datasheet
BU43xx series
●Ordering Information
B
U
x
Part
Number
x
x
Output Type
42 : Open Drain
43 : CMOS
x
x
Reset Voltage Value
09 : 0.9V
0.1V step
48 : 4.8V
-
T
Package
G : SSOP5
F : SOP4
FVE : VSOF5
R
Packaging and
forming specification
TR : Embossed tape
and reel
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6 °
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
TR
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
+0.05
0.13 −0.03
0.95
0.1
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Reel
(Unit : mm)
VSOF5
+6°
4° –4°
0.9±0.05
2
0.05
1.2 ± 0.05
2.1±0.2
1
4
5
+0.05
0.13 –0.03
(MAX 1.28 include BURR)
3
1.6 ± 0.05
1.3
4
0.2MAX
1.6±0.05
1.0±0.05
2.0±0.2
0.27±0.15
+0.2
1.25 –0.1
SOP4
1
2
3
S
0.13±0.05
+0.05
0.42 –0.04
0.1
0.6MAX
0.05±0.05
1.05Max.
)
S
+0.05
0.32 –0.04
0.5
(Unit : mm)
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TSZ22111・15・001
0.22±0.05
(Unit : mm)
2/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Lineup
Output Type
Open Drain
Detection Voltage Marking
Part Number
CMOS
Marking
Part Number
4.8V
ZR
BU4248
1H
BU4348
4.7V
ZQ
BU4247
1G
BU4347
4.6V
ZP
BU4246
1F
BU4346
4.5V
ZN
BU4245
1E
BU4345
4.4V
ZM
BU4244
1D
BU4344
4.3V
ZL
BU4243
1C
BU4343
4.2V
ZK
BU4242
1B
BU4342
4.1V
ZJ
BU4241
1A
BU4341
4.0V
ZH
BU4240
0Z
BU4340
3.9V
ZG
BU4239
0Y
BU4339
3.8V
ZF
BU4238
0X
BU4338
3.7V
ZE
BU4237
0W
BU4337
3.6V
ZD
BU4236
0V
BU4336
3.5V
ZC
BU4235
0U
BU4335
3.4V
ZB
BU4234
0T
BU4334
3.3V
ZA
BU4233
0S
BU4333
3.2V
YZ
BU4232
0R
BU4332
3.1V
YY
BU4231
0Q
BU4331
3.0V
YX
BU4230
0P
BU4330
2.9V
YW
BU4229
0N
BU4329
2.8V
YV
BU4228
0M
BU4328
2.7V
YU
BU4227
0L
BU4327
2.6V
YT
BU4226
0K
BU4326
2.5V
YS
BU4225
0J
BU4325
2.4V
YR
BU4224
0H
BU4324
2.3V
YQ
BU4223
0G
BU4323
2.2V
YP
BU4222
0F
BU4322
2.1V
YN
BU4221
0E
BU4321
2.0V
YM
BU4220
0D
BU4320
1.9V
YL
BU4219
0C
BU4319
1.8V
YK
BU4218
0B
BU4318
1.7V
YJ
BU4217
0A
BU4317
1.6V
YH
BU4216
ZZ
BU4316
1.5V
YG
BU4215
ZY
BU4315
1.4V
YF
BU4214
ZX
BU4314
1.3V
YE
BU4213
ZW
BU4313
1.2V
YD
BU4212
ZV
BU4312
1.1V
YC
BU4211
ZU
BU4311
1.0V
YB
BU4210
ZT
BU4310
0.9V
YA
BU4209
ZS
BU4309
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TSZ22111・15・001
3/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Absolute Maximum Ratings
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
Output Current
*1*4
SSOP5(SOT-23-5)
Power
*2*4
SOP4(SC-82)
Dissipation
*3*4
VSOF5
Operation Temperature Range
Ambient Storage Temperature
Symbol
VDD
VOUT
Io
Pd
Limit
-0.3 to +7
GND-0.3 to +7
GND-0.3 to VDD+0.3
70
540
400
210
Unit
V
-40 to +125
-55 to +125
°C
°C
Topt
Tstg
V
mA
mW
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 Reduced by 4.0mW/°C when used over 25°C.
*3 Reduced by 2.1mW/°C when used over 25°C.
*4 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C)
Parameter
Condition
Symbol
VDET(T)
VDET(T)
×1.01
VDET=1.8V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
1.782
1.741
1.718
1.8
-
1.818
1.860
1.883
VDET=2.5V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=3.0V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET=3.3V
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
2.475
2.418
2.386
2.970
2.901
2.864
3.267
3.191
3.150
4.158
4.061
4.009
0.70
0.90
VDD-0.5
2.5
3.0
3.3
4.2
0.15
0.20
0.25
0.30
0.35
0.40
0.30
0.35
0.40
0.45
0.50
0.55
-
2.525
2.584
2.615
3.030
3.100
3.139
3.333
3.410
3.452
4.242
4.341
4.394
0.88
1.05
1.23
1.40
1.58
1.75
1.40
1.58
1.75
1.93
2.10
2.28
-
VDD-0.5
-
-
0.05
0.5
0.5
VDET
Ta=+25°C
Ta=-40°C to 85°C
Ta=85°C to 125°C
VDET =0.9 to 1.3V
VDET =1.4 TO 2.1V
VDET =2.2 TO 2.7V
VDD=VDET-0.2V
VDET =2.8 to 3.3V
VDET =3.4 to 4.2V
VDET =4.3 to 4.8V
VDET =0.9 TO 1.3V
VDET =1.4 TO 2.1V
VDET =2.2 to 2.7V
VDD=VDET+2.0V
VDET =2.8 to 3.3V
VDET =3.4 to 4.2V
VDET =4.3 to 4.8V
VOL≤0.4V, Ta=25 to 125°C, RL=470kΩ
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ
VDD=4.8V, ISOURCE=1.7 mA,VDET=0.9V to 3.9V
VDET=4.2V
Circuit Current when ON
IDD1
Circuit Current when OFF
IDD2
Operating Voltage Range
VOPL
‘High’ Output Voltage (Pch)
VOH
VDD=6.0V, ISOURCE=2.0 mA,VDET=4.0V to 4.8V
VDD=0.85V, ISINK = 20 µA
‘Low’ Output Voltage (Nch)
VOL
VDD=1.5V, ISINK = 1 mA, VDET=1.7 to 4.8V
VDD=2.4V, ISINK = 3.6 mA, VDET=2.7 to 4.8V
*1: Design Guarantee. (Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
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TSZ22111・15・001
Max.
VDET(T)
×0.99
VDD=HL, Ta=25°C, RL=470kΩ
Detection Voltage
Min.
Limit
Typ.
4/13
Unit
V
µA
µA
V
V
V
V
V
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125°C) - continued
Parameter
Leak Current when OFF
Ileak
CT pin Threshold Voltage
VCTH
Output Delay Resistance
RCT
CT pin Output Current
ICT
Detection Voltage
Temperature coefficient
Hysteresis Voltage
Limit
Condition
Symbol
Min.
VDD
×0.35
VDD
×0.40
9
5
200
Typ.
0
0
VDD
×0.45
VDD
×0.50
10
40
400
Max.
0.1
1
VDD
×0.55
VDD
×0.60
11
-
-
±30
-
VDET≤1.0V
VDET
×0.03
VDET
×0.05
VDET
×0.08
VDET≥1.1V
VDET
×0.03
VDET
×0.05
VDET
×0.07
VDD=VDS=7V Ta=-40 to 85°C
VDD=VDS=7V Ta=85 to 125°C
VDD=VDET×1.1, VDET=0.9 to 2.5V Ta=25°C
RL=470kΩ
VDD=VDET×1.1, VDET=2.6 to 4.8V Ta=25°C
RL=470kΩ
*1
VDD=VDET×1.1 VCT=0.5V Ta=25°C
VCT=0.1V VDD=0.85V
VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V
VDET/∆T Ta=-40°C to 125°C
∆VDET
VDD=LHL
Ta=-40 to 125°C
RL=470kΩ
Unit
µA
V
MΩ
µA
ppm/°C
V
*1: Design Guarantee. (Outgoing inspection is not done on all products.)
VDET(T) : Standard Detection Voltage (0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
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TSZ22111・15・001
5/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Block Diagrams
VDD
VOUT
Vref
CT
GND
Fig.1
BU42xx Series
VDD
VOUT
Vref
CT
GND
Fig.2
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TSZ22111・15・001
BU43xx Series
6/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Typical Performance Curves
"LOW" OUTPUT CURRENT : IOL [mA]
CIRCUIT CURRENT : IDD [µA]
0.6
【BU4216】
【BU4316】
0.5
0.4
0.3
0.2
0.1
0.0
1
2
3
4
5
6
7
【BU4216】
【BU4216F】
【BU4316】
4
3
2
VDD =1.2V
1
0
0.0
0.5
1.0
1.5
2.0
2.5
VDD SUPPLY VOLTAGE :VDD [V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.3 Circuit Current
Fig.4 “LOW” Output Current
25
7
【BU4318】
【BU4318G】
20
OUTPUT VOLTAGE : VOUT [V]
"HIGH" OUTPUT CURRENT : IOH [mA]
0
5
VDD =6.0V
15
VDD =4.8V
10
5
0
BU4216F】
【
【BU4216】
【BU4316】
6
5
4
3
2
1
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
DRAIN-SOURCE VOLTAGE : VDS[V]
VD D SUPPLY VOLTAGE :VD D [V]
Fig.5 “High” Output Current
Fig.6 I/O Characteristics
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7
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Typical Performance Curves – continued
0.8
700
【BU4216】
BU4216F】
【
【BU4316】
CT OUTPUT CURRENT : ICT [µA]
OUTPUT VOLTAGE : VOUT [V]
1.0
0.6
0.4
0.2
0.0
0.0
1.0
1.5
2.0
400
300
200
100
2.5
0
0.5
1
1.5
2
2.5
VDD SUPPLY VOLTAGE : VDD [V]
VDD SUPPLY VOLTAGE : VDD [V]
Fig.7 Operating Limit Voltage
Fig.8 CT Terminal Current
CIRCUIT CURRENT WHEN ON : IDD1 [µA]
DETECTION VOLTAGE : VDET[V]
500
0
0.5
2.0
Low to high(VDET+∆VDET)
1.5
High to low(VDET)
【BU4216】
BU4216F】
【【BU4316】
1.0
-40
【BU4216】
【BU4216F】
【BU4316】
600
0
40
80
120
TEMPERATURE : Ta[℃]
0.5
【BU4216】
【BU4216F】
【BU4316】
0.4
0.3
0.2
0.1
0.0
-40
0
40
80
120
TEMPERATURE : Ta[℃]
Fig.9 Detecting Voltage
Release Voltage
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TSZ22111・15・001
Fig.10 Circuit Current when ON
8/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Typical Performance Curves – continued
1.0
MINIMUM OPERATING VOLTAGE : V OPL[V]
CIRCUIT CURRENT WHEN OFF : IDD2 [µA]
1.0
【BU4216】
【BU4216F】
【BU4316】
0.8
0.6
0.4
0.2
0.0
-40
0
40
80
【BU4216】
【BU4216F】
【BU4316】
0.5
0.0
-40
120
0
TEMPERATURE : Ta[℃]
80
120
TEMPERATURE : Ta[℃]
Fig.11 Circuit Current when OFF
Fig.12 Operating Limit Voltage
18
10000
【BU4216F】
【BU4216】
【BU4316】
16
14
12
10
8
6
4
2
0
-40
BU4216F】
【【BU4216】
1000
DELAY TIME : TPLH[ms]
RESISTANCE OF CT : RCT [MΩ]
40
【BU4316】
100
10
1
0.1
0.01
0.001
0
40
80
120
0.0001
0.01
0.1
CAPACITANCE OF CT : CCT[µF]
TEMPERATURE : Ta[℃]
Fig.13 CT Terminal Circuit Resistance
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TSZ22111・15・001
0.001
Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance
9/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Application Information
Explanation of Operation
For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VouT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. BU42xx and BU43xx series have delay time function
which set tPLH (Output “Low””High”) using an external capacitor (CCT). Because the BU42xx series uses an open drain
output type, it is necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High”
voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
Q2
R1
R1
VDD
Vref
RESET
Vref
RESET
VOUT
R2
R2
Q1
VOUT
Q1
Q3
Q3
R3
R3
GND
GND
CT
Fig.15 (BU42xx series Internal Block Diagram)
CT
Fig.16 (BU43xx type Internal Block Diagram)
Setting of Detector Delay Time
The delay time of this detector IC can be set at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD tPLH:Time until when VouT rises to 1/2 of VDD after VDD rises up and beyond the release
voltage(VDET+∆VDET)
TPLH=-1×CCT×RCT×ln
CCT:
RCT:
VDD-VCTH
VDD
CT pin Externally Attached Capacitance
CT pin Internal Impedance(P.3 RCT refer.)
VCTH:
ln:
CT pin Threshold Voltage(P.3 VCTH refer.)
Natural Logarithm
Reference Data of Falling Time (tPHL) Output
Examples of Falling Time (tPHL) Output
Part Number
tPHL [µs]
BU4245
275.7
BU4345
359.3
* This data is for reference only.
The figures will vary with the application, so please confirm the actual operating conditions before use.
Timing Waveforms
Example: The following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are shown in
Fig.15 and 16).
① When the power supply is turned on, the output is unstable from
after over the operating limit voltage (VOPL) until tPHL. Therefore, it is
VDET+ΔVDET
possible that the reset signal is not outputted when the rise time of
⑤
VDET
VDD is faster than tPHL.
VDD
VOPL
② When VDD is greater than VOPL but less than the reset release
0V
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
1/2 VDD
③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT
VCT
switches from L to H (with a delay to the CT terminal).
④ If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
tPLH
tPHL
tPLH
VOUT switches to L (with a delay of tPHL).
tPHL
VOUT
⑤ The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The system
① ②
③ ④
is designed such that the output does not toggle with power supply
Fig.17 Timing Waveforms
fluctuations within this hysteresis width, preventing malfunctions due
to noise.
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TSZ22111・15・001
10/13
TSZ02201-0R7R0G300050-1-2
03.Feb.2014 Rev.008
BU42xx series
Datasheet
BU43xx series
●Circuit Applications
1) Examples of common power supply detection reset circuits
VDD1
VDD2
Application examples of BU42xx series
(Open Drain output type) and BU43xx series
(CMOS output type) are shown below.
RL
CASE1: Power supply of microcontroller (VDD2) differs
from the power supply of the reset detection (VDD1).
Use an open drain output Type (BU42xx series) device
with a load resistance RL as shown Fig.18.
Micro
RST controller
BU42xx
CT
CIN
CL
(Capacitor for
noise filtering)
GND
Fig.18 Open Drain Output type
VDD1
Micro
RST controller
BU43xx
CIN
CT
CL
(Capacitor for
noise filtering)
CASE2: Power supply of microcontroller (VDD1) is the
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BU43xx series) device or an
open drain output type (BU42xx series) device with a pull
up resistor between the output and VDD1.
When a capacitance CL for noise filtering is connected to
VouT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall time of the output voltage (VouT).
GND
Fig.19 CMOS Output type
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
VDD1
VDD2
VDD3
RL
BU42xx
NO.1
BU42xx
NO.2
RST
microcontroller
CT
CT
GND
Fig.20
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BU42xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller
(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.
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BU42xx series
Datasheet
BU43xx series
3) Examples of the power supply with resistor dividers
In applications wherein the power supply input terminal (VDD) of an IC has resistor dividers, it is possible that an in-rush
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillations).
(In-rush current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
V1
IDD
R2
I1
Through
Current
V DD
BU42xx
R1
CIN
V OUT
BU43xx
CL
GND
VDD
VDET
0
Fig.21
A voltage drop [in-rush current (I1)] × [input resistor (R2)] is caused by the in-rush current, and causes the input voltage
to drop when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection
voltage, the output voltage switches from “High” to “Low”. At this time, the in-rush current stops flowing through output
“Low”, and the voltage drop is reduced. As a result, the output switches from “Low” to “High”, which again causes the
in-rush current to flow and the voltage to drop. This operation repeats and will result to oscillation.
Consider the use of BD52xx when the power supply input has resistor dividers.
V D D - ID D P eak C urrent Ta=25°C
Tem p - ID D (B U 42xx)
B U 49xx,B U 43xx
10
V D D 3V
V D D 6V
V D D 7V
V D D 4V
2.5
B U 48xx,B U 42xx
B D 52xx
ID D -peak[m A ]
IDD peak Current[mA]
B D 53xx
1
0.1
0.01
0.001
2.0
1.5
1.0
0.5
0.0
3
4
5
6
7
8
9
10
-50 -30 -10
10
V D D [V ]
Fig.22
30 50
Tem p
70
90
110 130
Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm the actual operating conditions before use.
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BU42xx series
Datasheet
BU43xx series
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2)
Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3)
Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4)
Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5)
Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6)
Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7)
The VDD line impedance might cause oscillation because of the detection current.
8)
A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9)
Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The case of needless “Delay Time”, recommended to insert more 470kΩ resister between VDD and CT. The
recommended value of RL Resistor is over 50kΩ to 1MΩ for VDET=1.5V to 4.8V, and over 100kΩ to 1MΩ for VDET=0.9V
to 1.4V. The recommended value of CT Capacitor is over 100pF to 0.1µF. There are many factors (board layout, etc)
that can affect characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) CT pin discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
15) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance. The value of Rct depends on the external
resistor that is connected to CT terminal, so please consider the delay time that is decided by t × RCT × CCT changes.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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