Data Sheet

PCF2003
32 kHz watch circuit with programmable adaptive motor pulse
and pulse period
Rev. 1 — 20 October 2015
Product data sheet
1. General description
The PCF2003 is a CMOS integrated circuit for battery operated wrist watches with a
32 kHz quartz crystal as timing element and a bipolar 1 Hz stepping motor. The quartz
crystal oscillator and the frequency divider are optimized for minimum power
consumption. A timing accuracy of 1 ppm is achieved with a programmable, digital
frequency adjustment.
To obtain the minimum overall power consumption for the watch, an automatic motor
pulse adaptation function is provided. The circuit supplies only the minimum drive current,
which is necessary to ensure a correct motor step. Changing the drive current of the
motor is achieved by chopping the motor pulse with a variable duty cycle. The pulse
period and the range of the variable duty cycle can be programmed to suit different types
of motors. The automatic pulse adaptation scheme is based on a safe dynamic detection
of successful motor steps.
A pad RESET is provided (used for stopping the motor) for accurate time setting and for
accelerated testing of the watch.
2. Features and benefits
 Amplitude-regulated 32 kHz quartz crystal oscillator, with excellent frequency stability
and high immunity to leakage currents
 Electrically programmable time calibration with 1 ppm resolution stored in One Time
Programmable (OTP) memory
 The quartz crystal is the only external component connected
 Very low supply current, typical 90 nA
 One second output pulses for bipolar stepping motor
 Five different programmable output periods (1 s to 30 s)
 Minimum power consumption for the entire watch, due to self adaptation of the motor
drive according to the required torque
 Reliable step detection circuit
 Motor pulse width, pulse modulation, and pulse adaptation range programmable in a
wide range, stored in OTP memory
 Stop function for accurate time setting and power saving during shelf life
 Test mode for accelerated testing of the mechanical parts of the watch and the IC
 Test bits for type recognition
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
3. Applications
 Driver circuits for bipolar stepping motors
 High immunity motor drive circuits
4. Ordering information
Table 1.
Ordering information
Type number
Topside
marking
Package
Name
Description
Version
PCF2003DUS/DA
L[1]
WLCSP8
wafer level chip-size package; 8 bumps;
1.16 mm  0.86 mm
PCF2003DUS
[1]
The only marking is the “L” symbol for pin 1 location; see Figure 14.
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable part
number
PCF2003DUS/DA PCF2003DUS/DAAZ
Package
Packing method
Minimum
Temperature
order quantity
WLCSP8
chips with solder bumps 4000
in tape and reel, 7 inch,
dry pack
Tamb = 10 C to +60 C
5. Block diagram
+]
N+]
26&,1
26&287
26&,//$725
',9,'(5
·
5(6(7
966
92/7$*('(7(&725
273&21752//(5
2730(025<
5(6(7
UHVHW
7,0,1*$'-8670(17
,1+,%,7,21
9''
+]
02725&21752/:,7+
$'$37,9(38/6(02'8/$7,21
LF
67(3
'(7(&7,21
3&)
027
Fig 1.
PCF2003
Product data sheet
027
DDD
Block diagram of PCF2003
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
6. Pinning information
6.1 Pinning
3&)'86
966
LF
5(6(7
26&,1
027
26&287
027
9''
DDD
Viewed from active side. For mechanical details, see Figure 13.
Fig 2.
Pin configuration of PCF2003DUS
6.2 Pin description
Table 3.
Pin description
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
Symbol
Pin
Description
VSS[1]
1
ground
i.c.[2]
2
internally connected
OSCIN
3
oscillator input
OSCOUT
4
oscillator output
VDD
5
supply voltage
MOT1
6
motor 1 output
MOT2
7
motor 2 output
RESET
8
reset input
[1]
The substrate (rear side of the chip) is connected to VSS. Therefore the die pad must be either floating or
connected to VSS.
[2]
Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal
pull-down resistance to VSS.
7. Functional description
7.1 Motor pulse
The motor output supplies pulses of different driving stages, depending on the torque
required to turn on the motor. The number of different stages can be selected between
three and six. With the exception of the highest driving stage, each motor pulse (tp in
Figure 3 and Figure 6) is followed by a detection phase during which the motor movement
is monitored, in order to check whether the motor has turned correctly or not.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
PV
WS
WS
GHWHFWLRQSKDVH
W S
PJZ
PV
PV
Fig 3.
PV
Correction sequence after failed motor step
If a missing step is detected, a correction sequence is generated (see Figure 3) and the
driving stage is switched to the next level. The correction sequence consists of two
pulses: first a short pulse in the opposite direction (0.98 ms, modulated with the maximum
duty cycle) to give the motor a defined position, followed by a motor pulse of the strongest
driving level. Every 4 minutes, the driving level is lowered again by one stage.
The motor pulse has a constant pulse width. The driving level is regulated by chopping the
driving pulse with a variable duty cycle. The driving level starts from the programmed
minimum value and increases by 6.25 % after each failed motor step. The strongest
driving stage, which is not followed by a detection phase, is programmed separately.
Therefore, it is possible to program a larger energy gap between the pulses with step
detection and the strongest, not monitored, pulse. This might be necessary to ensure a
reliable and stable operation under adverse conditions (magnetic fields and vibrations). If
the watch works in the highest driving stage, the driving level jumps after the 4-minute
period directly to the lowest stage, and not just one stage lower.
To optimize the performance for different motors, the following parameters can be
programmed:
•
•
•
•
•
Pulse width: 0.98 ms to 7.8 ms in steps of 0.98 ms
Duty cycle of lowest driving level: 37.5 % to 56.25 % in steps of 6.25 %
Number of driving levels (including the highest driving level): 3 to 6
Duty cycle of the highest driving level: 75 % or 100 %
Enlargement pulse for the highest driving level: on or off
The enlargement pulse has a duty cycle of 25 % and a pulse width which is twice the
programmed motor pulse width. The repetition period for the chopping pattern is 0.98 ms.
Figure 4 shows an example of a 3.9 ms pulse.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
4 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
'87<&<&/(
PV
PV
PV
Fig 4.
PCF2003
Product data sheet
PV
PV
PV
PJZ
Possible modulations for a 3.9 ms motor pulse
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
5 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
7.2 Step detection
Figure 5 shows a simplified diagram of the motor driving and step detection circuit, and
Figure 6 shows the step detection sequence and corresponding sampling current.
Between the motor driving pulses, the switches P1 and P2 are closed, which means the
motor is short-circuited. For a pulse in one direction, P1 and N2 are open, and P2 and N1
are closed with the appropriate duty cycle; for a pulse in the opposite direction, P2 and N1
are open, and P1 and N2 closed.
9''
5'
'
3
3
3
3
02725
027
1
027
1
966
Fig 5.
PJZ
Simplified diagram of motor driving and step detection circuit
The step detection phase is initiated after the motor driving pulse. In phase 1 P1 and P2
are first closed for 0.98 ms and then in phase 2 all four drive switches (P1, N1, P2 and N2)
are opened for 0.98 ms. As a result, the energy stored in the motor inductance is reduced
as fast as possible.
The induced current caused by the residual motor movement is then sampled in phase 3
(closing P3 and P2) and in phase 4 (closing P1 and P4). For step detection in the opposite
direction P1 and P4 are closed during phase 3 and P2 and P3 during phase 4 (see
Figure 6).
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
6 of 30
PCF2003
NXP Semiconductors
SKDVH
SKDVH
, PRWRU
SKDVH
SKDVH
32 kHz watch circuit with programmable adaptive motor pulse
SRVLWLYHGHWHFWLRQOHYHO
W
QHJDWLYHGHWHFWLRQOHYHO
WS
PV
PRWRUVKRUWHG
W G PV
VDPSOLQJ
YROWDJH
SURJUDPPDEOHWLPHOLPLW
273&WR&
VDPSOLQJ
W
VDPSOLQJ
YROWDJH
SRVLWLYHGHWHFWLRQ
QHJDWLYHGHWHFWLRQ
VDPSOLQJUHVXOWV
W
PRWRUVKRUWHG
VDPSOLQJ
—V
Fig 6.
PV
PJZ
Step detection sequence and corresponding sampling voltage
The condition for a successful motor step is a positive step detection pulse (current in the
same direction as in the driving phase) followed by a negative detection pulse within a
given time limit. This time limit can be programmed between 3.9 ms and 10.7 ms (in steps
of 0.98 ms) in order to ensure a safe and correct step detection under all conditions (for
instance magnetic fields). The step detection phase stops after the last 31.25 ms, after the
start of the motor driving pulse.
7.3 Time calibration
The quartz crystal oscillator has an integrated capacitance of 5.2 pF, which is lower than
the specified capacitance (CL) of 8.2 pF for the quartz crystal (see Table 11). Therefore,
the oscillator frequency is typically 60 ppm higher than 32.768 kHz. This positive
frequency offset is compensated by removing the appropriate number of 8192 Hz pulses
in the divider chain (maximum 127 pulses), every 1 or 2 minutes. The time correction is
given in Table 4.
Table 4.
Time calibration
Calibration
period
Correction per step (n = 1)
Correction per step (n = 127)
ppm
Seconds per day ppm
Seconds per day
1 minute
2.03
0.176
258
22.3
2 minutes
1.017
0.088
129
11.15
After measuring the effective oscillator frequency, the number of correction pulses must
be calculated and stored together with the calibration period in the OTP memory (see
Section 7.7).
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
The oscillator frequency can be measured at pad RESET, where a square wave signal
1
with the frequency of ------------  f osc is provided. This frequency shows a jitter every minute or
1024
every two minutes, which originates from the time calibration, depending on the
programmed calibration period.
Details on how to measure the oscillator frequency and the programmed inhibition time
are given in Section 7.10.
7.4 Reset
1
At pad RESET an output signal with a frequency of ------------  f osc = 32 Hz is provided.
1024
Connecting pad RESET to VDD stops the motor drive and opens all four (P1, N1, P2 and
N2) driver switches (see Figure 5). Connecting pad RESET to VSS activates the test
mode. In this mode the motor output frequency is 32 Hz, which can be used to test the
mechanical function of the watch.
After releasing the pad RESET, the motor starts exactly one second later with the smallest
duty cycle and with the opposite polarity to the last pulse before stopping. The debounce
time for the RESET function is between 31 ms and 62 ms.
7.5 Programming possibilities
The programming data is stored in OTP cells (EPROM cells). At delivery, all memory cells
are in state 0. The cells can be programmed to the state 1, but then there is no more set
back to state 0. The programming data is organized in an array of four 8-bit words
(see Table 5): word A contains the time calibration, words B and C contain the setting for
the motor pulses and word D contains the type recognition.
Table 5.
Word
Words and bits
Bit
1
2
3
4
A
number of 8192 Hz pulses to be removed
B
lowest stage: duty cycle
C
pulse width
D
type
5
6
7
8
calibration
period
number of driving stages
highest
stage: duty
cycle
pulse
stretching
maximum time delay between positive
and negative detection pulses
output period
output
period
factory test
bit
factory test bits
Table 6.
Description of word A bits
Bit
Value
Description
-
adjust the number of the 8192 Hz pulses to be removed;
bit 1 is the MSB and bit 7 is the LSB
0
1 minute
1
2 minutes
Inhibition time
1 to 7
Calibration period
8
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
8 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
Table 7.
Description of word B bits
Bit
Value
Description
Duty cycle lowest driving stage
1 to 2
00
37.5 %
01
43.75 %
10
50 %
11
56.25 %
Number of driving stages
3 to 4
00
3
01
4
10
5
11
6[1]
Duty cycle highest driving stage
5
0
75 %[2]
1
100 %
0
no pulse stretching
1
pulse of 2  tp and duty cycle of 25 % are added
00
1s
01
5s
10
10 s
11
20 s
Pulse stretching
6
Output period
7 to 8
PCF2003
Product data sheet
[1]
Including the highest driving stage, which one has no motor step detection.
[2]
If the maximum duty cycle of 75 % is selected, not all programming combinations are possible since the
second highest level must be smaller than the highest driving level.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
9 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
Table 8.
Description of word C bits
Bit
Value
Description
000
0.98 ms
001
1.95 ms
010
2.90 ms
011
3.90 ms
100
4.90 ms
101
5.90 ms
110
6.80 ms
111
7.80 ms
Pulse width tp
1 to 3
Time delay td(max)
4 to 6
[1]
000
3.91 ms
001
4.88 ms
010
5.86 ms
011
6.84 ms
100
7.81 ms
101
8.79 ms
110
9.77 ms
111
10.74 ms
0
bit 7 and 8 of word B active
1
30 s, bit 7 and 8 of word B inactive
-
-
Output period
7
Factory test bit
8
[1]
Between positive and negative detection pulses.
Byte D is read to determine which type of the PCA200x family is used in a particular
application.
Table 9.
Description of word D bits
Bit
Value
Description
0000
PCA2002
1000
PCA2000
0100
PCA2001
1100
PCA2003
-
-
Type recognition
1 to 4
Factory test bits
5 to 8
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
7.6 Programming procedure
For a watch it is essential that the timing calibration can be made after the watch is fully
assembled. In this situation, the supply pads are often the only terminals which are still
accessible.
Writing to the OTP cells and performing the related functional checks is achieved in the
PCF2003 by modulating the supply voltage. The necessary control circuit consists
basically of a voltage level detector, an instruction counter which determines the function
to be performed, and an 8-bit shift register which allows writing to the OTP cells of an 8-bit
word in one step and acts as a data pointer for checking the OTP content.
There are six different instruction states (state 3 and state 5 are handled as state 4):
•
•
•
•
•
•
State 1: measurement of the quartz crystal oscillator frequency (divided by 1024)
State 2: measurement of the inhibition time
State 3: write/check word A
State 4: write/check word B
State 5: write/check word C
State 6: check word D (type recognition)
Each instruction state is switched on with a pulse to VP(prog)(start). After this large pulse, an
initial waiting time of t0 is required. The programming instructions are then entered by
modulating the supply voltage with small pulses (amplitude VP(mod) and pulse width tmod).
The first small pulse defines the start time, the following pulses perform three different
functions, depending on the time delay (td) from the preceding pulse
(see Figure 7, Figure 8, Figure 11 and Figure 12):
• td = t1 (0.7 ms); increments the instruction counter
• td = t2 (1.7 ms); clocks the shift register with data = logic 0
• td = t3 (2.7 ms); clocks the shift register with data = logic 1
The programming procedure requires a stable oscillator. This means that a waiting time,
determined by the start-up time of the oscillator is necessary after power-on of the circuit.
After the VP(prog)(start) pulse, the instruction counter is in state 1 and the data shift register
is cleared.
The instruction state ends with a second pulse to VP(prog)(stop) or with a pulse to Vstore.
In any case, the instruction states are terminated automatically 2 seconds after the last
supply modulation pulse.
7.7 Programming the memory cells
Applying the two-stage programming pulse (see Figure 7) transfers the stored data in the
shift register to the OTP cells.
Perform the following to program a memory word:
1. Starting with a VP(prog)(start) pulse wait for the time period t0 then set the instruction
counter to the word to be written (td = t1).
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
11 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
2. Enter the data to be stored in the shift register (td = t2 or t3). LSB first (bit 8) and the
MSB last (bit 1).
3. Applying the two-stage programming pulse Vprestore followed by Vstore stores the word.
The delay between the last data bit and the prestore pulse Vprestore is td = t4. Store the
word by raising the supply voltage to Vstore; the delay between the last data bit and the
store pulse is td.
The example shown in Figure 7 performs the following functions:
•
•
•
•
Start
Setting instruction counter to state 4 (word B)
Entering data word 110101 into the shift register (sequence: LSB first and MSB last)
Writing to the OTP cells for word B
WZSUHVWRUH
9''
9VWRUH
WSVWDUW
93SURJVWDUW
9SUHVWRUH
W
W W W
W
W
W
W
W
W
W
WZVWRUH
93PRG
9''QRP
966
PJZ
VDD(nom): nominal supply voltage.
The example shows the programming of B = 110101 (the sequence is MSB first and LSB last).
Fig 7.
Supply voltage modulation for programming
7.8 Checking memory content
The stored data of the OTP array can be checked bit wise by measuring the supply
current. The array word is selected by the instruction state and the bit is addressed by the
shift register.
To read a word, the word is first selected (td = t1), and a logic 1 is written into the first cell
of the shift register (td = t3). This logic 1 is then shifted through the entire shift register
(td = t2), so that it points with each clock pulse to the next bit.
If the addressed OTP cell contains a logic 1, a 30 k resistor is connected between VDD
and VSS, which increases the supply current accordingly.
Figure 8 shows the supply voltage modulation for reading word B, with the corresponding
supply current variation for word B = 110101 (sequence: first MSB and last LSB).
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
12 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
9''
WSVWDUW
WSVWRS
93SURJVWDUW
93SURJVWRS
W
W W W
W
W
W
W
W
W
93PRG
9''QRP
966
,''
PJZ
VDD(nom): nominal supply voltage.
V DD
(1) I DD = --------------30 k
Fig 8.
PCF2003
Product data sheet
Supply voltage modulation and corresponding supply current variation for
reading word B
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
13 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
7.9 Frequency tuning of assembled watch
Figure 9 shows the test set-up for frequency tuning the assembled watch.
N+]
0
3&)[
)5(48(1&<
&2817(5
PRWRU
352*5$00$%/(
'&32:(56833/<
EDWWHU\
3&,17(5)$&(
3&
DDD
Fig 9.
Frequency tuning the assembled watch
7.10 Measurement of oscillator frequency and inhibition time
The output of the two measuring states can either be monitored directly at pad RESET or
as a modulation of the supply voltage (a modulating resistor of 30 k is connected
between VDD and VSS when the signal at pad RESET is at HIGH-level).
The supply voltage modulation must be followed as shown in Figure 10 in order to
guarantee the correct start-up of the circuit during production and testing.
9''
WSVWRS
93SURJVWRS
WGVWDUW!PV
9''QRP
966
DDF
VDD(nom): nominal supply voltage.
Fig 10. Supply voltage at start-up during production and testing
Measuring states:
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
14 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
• State 1: quartz crystal oscillator frequency divided by 1024; state 1 starts with a pulse
to VP and ends with a second pulse to VP
• State 2: inhibition time has a value of n  0.122 ms. A signal with periodicity of
31.25 ms + n  0.122 ms appears at pad RESET and as current modulation at
pad VDD (see Figure 11 and Figure 12)
PVLQKLELWLRQWLPH
9''
92GLI
966
PJZ
Fig 11. Output waveform at pad RESET for instruction state 2
9''
W SVWRS
W SVWDUW
93SURJVWRS
93SURJVWDUW
W
W
93PRG
9''QRP
966
PJX
VDD(nom): nominal supply voltage.
Fig 12. Supply voltage modulation for starting and stopping of instruction state 2
7.11 Customer testing
Connecting pad RESET to VSS activates the test mode. In this test mode, the motor
output frequency is 8 Hz; the duty cycle reduction and battery check occurs every second,
instead of every 4 minutes.
8. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Semiconductors are light sensitive. Exposure to light sources can cause the IC to
malfunction. The IC must be protected against light. The protection must be applied to all
sides of the IC.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
15 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
9. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
1.8
+7.0
V
VDD
supply voltage
VI
input voltage
on all supply pins
0.5
+7.5
V
tsc
short circuit duration time
output
-
indefinite
s
Tamb
ambient temperature
VESD
electrostatic discharge
voltage
VSS = 0 V
[1][2]
10
+60
C
HBM
[3]
-
2000
V
MM
[4]
-
200
V
Ilu
latch-up current
[5]
-
100
mA
Tstg
storage temperature
[6]
30
+100
C
[1]
When writing to the OTP cells, the supply voltage (VDD) can be raised to a maximum of 12 V for a time period of 1 s.
[2]
Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows, which rapidly
discharges the battery.
[3]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[4]
Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”.
[5]
Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[6]
According to the store and transport requirements (see Ref. 10 “UM10569”) the devices have to be stored at a temperature of +8 C to
+45 C and a humidity of 25 % to 75 %.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
16 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
10. Characteristics
Table 11. Characteristics
VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 C; quartz crystal: RS = 40 k, C1 = 2 fF to 3 fF, CL = 8.2 pF; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD
supply voltage
normal operating mode;
Tamb = 10 C to +60 C
1.1
1.55
3.60
V
VDD
supply voltage variation V/t = 1 V/s
-
-
0.25
V
IDD
supply current
between motor pulses
-
90
120
nA
between motor pulses
at VDD = 3.5 V
-
120
180
nA
Tamb = 10 C to +60 C
-
-
200
nA
stop mode;
pad RESET connected to
VDD
-
100
135
nA
-
150
200
mV
-
200
300

1.1
-
-
V
5
10
-
S
-
0.3
0.9
s
-
0.05
0.20
ppm
4.3
5.2
6.3
pF
20
-
-
M
Supply
Motor output
Vsat
saturation voltage
Rmotor = 2 k;
Tamb = 10 C to +60 C
Zo(sc)
output impedance
(short circuit)
between motor pulses;
Imotor < 1 mA
[1]
Oscillator
Vstart
start voltage
gm
transconductance
tstartup
start-up time
f/f
frequency stability
CL(itg)
integrated load
capacitance
Rpar
parasitic resistance
Vi(osc)  50 mV (p-p)
VDD = 100 mV
allowed resistance between
adjacent pads
Pad RESET
fo
output frequency
-
32
-
Hz
1.4
-
-
V
VO(dif)
differential output
voltage
RL = 1 M; CL = 10 pF
[2]
tr
rise time
RL = 1 M; CL = 10 pF
[2]
-
1
-
s
[2]
-
1
-
s
-
10
20
nA
tf
fall time
RL = 1 M; CL = 10 pF
Ii(AV)
average input current
pad RESET connected to
VDD or VSS
[1]
P1 + ... + P4 + N1 + N2 (see Section 7.2).
[2]
RL and CL are a load resistor and load capacitor, externally connected to pad RESET.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
17 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
11. OTP programming characteristics
Table 12. Specifications for OTP programming
See Figure 7, Figure 8 and Figure 12.
Symbol
Parameter[1]
Conditions
Min
Typ
Max
Unit
VDD
supply voltage
during programming procedure
1.5
-
3.0
V
VP(prog)(start)
programming supply voltage (start)
6.6
-
6.8
V
VP(prog)(stop)
programming supply voltage (stop)
6.2
-
6.4
V
VP(mod)
supply voltage modulation
320
350
380
mV
Vprestore
prestore voltage
for prestore pulse
6.2
-
6.4
V
Vstore
store voltage
for writing to the OTP cells
9.9
10.0
10.1
V
Istore
store current
for writing to the OTP cells
-
-
10
mA
tp(start)
start pulse width
8
10
12
ms
tp(stop)
pulse width of stop pulse
0.05
-
0.5
ms
tmod
modulation pulse width
25
30
40
s
tw(prestore)
prestore pulse width
0.05
-
0.5
ms
tw(store)
store pulse width
for writing to the OTP cells
95
100
110
ms
for entering instructions, referred
to VDD
t0
time 0
waiting time after start pulse
20
-
30
ms
t1
time 1
pulse distance for incrementing
the state counter
0.6
0.7
0.8
ms
t2
time 2
pulse distance for clocking the
data register with data = logic 0
1.6
1.7
1.8
ms
t3
time 3
pulse distance for clocking the
data register with data = logic 1
2.6
2.7
2.8
ms
t4
time 4
waiting time for writing to OTP
cells
0.1
0.2
0.3
ms
SR
slew rate
for modulation of the supply
voltage
0.5
-
5.0
V/s
Rmod
modulation resistance
supply current modulation
read-out resistor
18
30
45
k
[1]
Program each word once only.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
12. Bare die outline
:/&63ZDIHUOHYHOFKLSVL]HSDFNDJHEXPSV
3&)'86
'
E
\
[
(
$
$
$
1RWH
0DUNLQJFRGH
2XWOLQH
YHUVLRQ
)LJXUHQRWGUDZQWRVFDOH
ZOFVSBSFIGXVBGR
5HIHUHQFHV
,(&
-('(&
(XURSHDQ
SURMHFWLRQ
-(,7$
,VVXHGDWH
3&)'86
Fig 13. Bare die outline of PCF2003DUS (for dimensions see Table 13, for pin location see Table 14)
Table 13. Dimension of PCF2003US
Original dimensions are in mm.
PCF2003
Product data sheet
Unit (mm)
A
A1
A2
b
D
E
max
-
-
-
-
1.19
0.89
nom
0.53
0.15
0.38
0.20
1.16
0.86
min
-
-
-
-
1.13
0.83
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
19 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
Table 14.
Symbol
Bonding pad description
Pin
X[1]
Y[1]
Type
Description
280
supply
ground
1
430
i.c.[3]
2
0
280
-
internally connected
OSCIN
3
225
0
input
oscillator input
OSCOUT
4
430
280
output
oscillator output
VDD
5
430
280
supply
supply voltage
VSS
[2]
MOT1
6
0
280
output
motor 1 output
MOT2
7
225
0
output
motor 2 output
RESET
8
430
280
input
reset input
[1]
All coordinates are referenced, in m, to the center of the die (see Figure 13).
[2]
The substrate (rear side of the chip) is connected to VSS. Therefore the die pad must be either floating or
connected to VSS.
[3]
Pad i.c. is used for factory tests; in normal operation it should be left open-circuit, and it has an internal
pull-down resistance to VSS.
13. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
20 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
14. Packing information
14.1 Tape and reel information
7239,(:
‘'
3
:
7
%
3
$
;
.
GLUHFWLRQRIIHHG
SLQ
/
7KHGLHKDVDFWLYHVLGHIDFLQJGRZQ
SLQWRZDUGVWKHVSURFNHWKROHVZLWK³/´PDUNRQWRSVLGH
GHWDLO;
2ULJLQDOGLPHQVLRQVDUHLQPP
)LJXUHQRWGUDZQWRVFDOH
DDD
Fig 14. Tape and reel details for PCF2003DUS
Table 15. Carrier tape dimensions of PCF2003DUS
Nominal values with production tolerances.
Symbol
Description
Value
Unit
A0
pocket width in x direction
1.00  0.05
mm
B0
pocket width in y direction
1.30  0.05
mm
K0
pocket depth
0.62  0.05
mm
Compartments
Overall dimensions
PCF2003
Product data sheet
W
tape width
8
mm
T
tape thickness
0.2  0.02
mm
D0
sprocket hole diameter
1.5
mm
P0
sprocket hole pitch
4  0.1
mm
P1
pocket pitch
4  0.1
mm
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
21 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
15.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 15) than a SnPb process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 16.
Table 16.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 15.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
22 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 15. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
15.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
15.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
15.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
23 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reflow soldering.
16. Abbreviations
Table 17.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
HBM
Human Body Model
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
OTP
One Time Programmable
17. References
[1]
AN10365 — Surface mount reflow soldering description
[2]
AN10439 — Wafer Level Chip Size Package
[3]
AN10706 — Handling bare die
[4]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[5]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[6]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7]
JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[8]
JESD78 — IC Latch-Up Test
[9]
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[10] UM10569 — Store and transport requirements
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
24 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
18. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF2003 v.1
20151020
Product data sheet
-
-
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
25 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF2003
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
26 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
27 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
21. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Ordering information . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3
Time calibration . . . . . . . . . . . . . . . . . . . . . . . . .7
Words and bits . . . . . . . . . . . . . . . . . . . . . . . . . .8
Description of word A bits . . . . . . . . . . . . . . . . .8
Description of word B bits . . . . . . . . . . . . . . . . .9
Description of word C bits . . . . . . . . . . . . . . . .10
Description of word D bits . . . . . . . . . . . . . . . .10
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .16
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .17
Specifications for OTP programming . . . . . . . .18
Dimension of PCF2003US . . . . . . . . . . . . . . .19
Bonding pad description . . . . . . . . . . . . . . . . . .20
Carrier tape dimensions of PCF2003DUS . . . .21
Lead-free process (from J-STD-020D) . . . . . .22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .24
Revision history . . . . . . . . . . . . . . . . . . . . . . . .25
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
28 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
22. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Block diagram of PCF2003 . . . . . . . . . . . . . . . . . .2
Pin configuration of PCF2003DUS . . . . . . . . . . . .3
Correction sequence after failed motor step . . . . .4
Possible modulations for a 3.9 ms motor pulse . . .5
Simplified diagram of motor driving and step
detection circuit . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Step detection sequence and corresponding
sampling voltage . . . . . . . . . . . . . . . . . . . . . . . . . .7
Supply voltage modulation for programming . . . .12
Supply voltage modulation and corresponding
supply current variation for reading word B . . . . .13
Frequency tuning the assembled watch . . . . . . .14
Supply voltage at start-up during production
and testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Output waveform at pad RESET for instruction
state 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Supply voltage modulation for starting
and stopping of instruction state 2 . . . . . . . . . . . .15
Bare die outline of PCF2003DUS (for dimensions
see Table 13, for pin location see Table 14) . . . .19
Tape and reel details for PCF2003DUS. . . . . . . .21
Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
PCF2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 October 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
29 of 30
PCF2003
NXP Semiconductors
32 kHz watch circuit with programmable adaptive motor pulse
23. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Motor pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Step detection. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Time calibration . . . . . . . . . . . . . . . . . . . . . . . . 7
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Programming possibilities. . . . . . . . . . . . . . . . . 8
Programming procedure . . . . . . . . . . . . . . . . . 11
Programming the memory cells . . . . . . . . . . . 11
Checking memory content . . . . . . . . . . . . . . . 12
Frequency tuning of assembled watch . . . . . . 14
Measurement of oscillator frequency and
inhibition time . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.11
Customer testing . . . . . . . . . . . . . . . . . . . . . . 15
8
Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17
11
OTP programming characteristics . . . . . . . . . 18
12
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 19
13
Handling information. . . . . . . . . . . . . . . . . . . . 20
14
Packing information . . . . . . . . . . . . . . . . . . . . 21
14.1
Tape and reel information . . . . . . . . . . . . . . . . 21
15
Soldering of WLCSP packages. . . . . . . . . . . . 22
15.1
Introduction to soldering WLCSP packages . . 22
15.2
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
15.3
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
15.3.1
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
15.3.2
Quality of solder joint . . . . . . . . . . . . . . . . . . . 23
15.3.3
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
15.3.4
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
17
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
19.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
19.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19.3
19.4
20
21
22
23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
27
27
28
29
30
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 October 2015
Document identifier: PCF2003
Similar pages