Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
PCA16xx series
32 kHz watch circuits with
EEPROM
Product specification
Supersedes data of 1997 Apr 21
File under Integrated Circuits, IC16
1997 Dec 12
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
FEATURES
• Stop function for accurate timing
• 32 kHz oscillator, amplitude regulated with excellent
frequency stability
• Power-on reset for fast testing
• High immunity of the oscillator to leakage currents
• Various test modes for testing the mechanical parts of
the watch and the IC.
• Time calibration electrically programmable and
reprogrammable (via EEPROM)
GENERAL DESCRIPTION
• A quartz crystal is the only external component required
The PCA16xx series devices are CMOS integrated circuits
specially suited for battery-operated,
quartz-crystal-controlled wrist-watches, with bipolar
stepping motors.
• Very low current consumption; typically 170 nA
• Detector for silver-oxide or lithium battery voltage levels
• Indication for battery end-of-life
ORDERING INFORMATION
TYPE
NUMBER
PCA1601U/10
PCA1602T
PACKAGE(1)
NAME
−
PMFP8
DESCRIPTION
VERSION
−
chip on foil
plastic micro flat package; 8 leads (straight)
SOT144-1
PCA1603U/7
−
chip with bumps on tape
−
PCA1604U
−
chip in tray
−
PCA1604U/10
−
chip on foil
−
PCA1605U/7
−
chip with bumps on tape
−
PCA1606U/10
−
chip on foil
−
PCA1607U
−
chip in tray
−
PCA1608U
−
chip in tray
−
PCA1611U
−
chip in tray
−
PCA1621U/7
−
chip with bumps on tape
−
PCA1621U/10
−
chip on foil
−
PCA1622U
−
chip in tray
−
PCA1623U/7
−
chip with bumps on tape
−
PCA1624U
−
chip in tray
−
PCA1625U/7
−
chip with bumps on tape
−
PCA1626U
−
chip in tray
−
PCA1627U/7
−
chip with bumps on tape
−
PCA1628U
−
chip in tray
−
PCA1629U/7
−
chip with bumps on tape
−
Note
1. Figure 1 and Chapter “Package outline” show details of standard package, available for specified devices and for
large orders only.
Chapter “Chip dimensions and bonding pad locations” shows exact pad locations for other delivery formats.
1997 Dec 12
2
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
PINNING
SYMBOL
PIN
DESCRIPTION
VSS
1
ground (0 V)
TEST
2
test output
OSC IN
3
oscillator input
OSC OUT
4
oscillator output
VDD
5
positive supply voltage
M1
6
motor 1 output
M2
7
motor 2 output
RESET
8
reset input
VSS
1
TEST
2
8
RESET
7
M2
PCA16xxT
OSC IN
3
6
M1
OSC OUT
4
5
V DD
MSA973
Fig.1 Pin configuration, PCA16xxT, (PMFP8).
FUNCTIONAL DESCRIPTION AND TESTING
Customer testing
Motor pulse
An output frequency of 32 Hz is provided at RESET (pin 8)
to be used for exact frequency measurement. Every
minute a jitter occurs as a result of time calibration, which
occurs 90 to 150 ms after disconnecting the RESET from
VDD.
The motor pulse width (tP) and the cycle times (tT) are
given in Chapter “Available types”.
Voltage level detector
Connecting the RESET to VDD stops the motor pulses
leaving them in a HIGH impedance 3-state condition and a
32 Hz signal without jitter is produced at the TEST pin.
A debounce circuit protects accidental stoppages due to
mechanical shock to the watch (tDEB = 14.7 to 123.2 ms).
The supply voltage is compared with the internal voltage
reference VLIT and VEOL every minute. The first voltage
level detection is carried out 30 ms after a RESET.
Lithium mode
Connecting RESET to VSS activates Tests 1 and 2 and
disables the time calibration.
If a lithium voltage is detected (VDD ≥ VLIT), the circuit will
operate in the lithium mode. The motor pulse will be
produced with a 75% duty factor.
Test 1, VDD > VEOL. Normal function takes place except
the voltage detection cycle (tV) is 125 ms and the cycle
time tT1 is 31.25 ms. At pin TEST a minute signal is
available at 8192 times its normal frequency.
Silver-oxide mode
If the voltage level detected is between VLIT and VEOL, the
circuit will operate in silver-oxide mode.
Test 2(2), VDD < VEOL. The voltage detection cycle (tV) is
31.25 ms and the motor pulse period (tT2) = 31.25 ms.
Battery end-of-life(1)
Test and reset mode are terminated by disconnecting the
RESET pin.
If the battery end-of-life is detected (VDD ≤ VEOL), the
motor pulse will be produced without chopping. To indicate
this condition, bursts of 4 pulses are produced every 4 s.
Test 3, VDD > 5.1 V. Motor pulses with a time period of
tT3 = 31.25 ms and n × 122 µs are produced to check the
contents of the EEPROM. At pin TEST the motor pulse
period signal (tT) is available at 1024 times its normal
frequency. The circuit returns to normal operation when
VDD < 2.5 V between two motor pulses.
Power-on reset
For correct operation of the Power-on reset the rise time of
VDD from 0 V to 2.1 V should be less than 0.1 ms.
All resettable flip-flops are reset. Additionally the polarity of
the first motor pulse is positive: VM1 − VM2 ≥ 0 V.
(2) Only applicable for types with the battery end-of-life detector.
(1) Only available for types with a 1 s motor pulse.
1997 Dec 12
3
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
3. VDD is decreased to 2.5 V during a motor pulse to
initialize a storing sequence.
Time calibration
Taking a normal quartz crystal with frequency 32768kHz,
frequency deviation (∆f/f) of ±15 × 10−6 and CL = 8.2 pF;
the oscillator frequency is offset (by using non-symmetrical
internal oscillator input and output capacitances of 10 pF
and 15 pF) such that the frequency deviation is
positive-only. This positive deviation can then be
compensated for to maintain time-keeping accuracy.
4. The first VDD pulse to 5.1 V erases the contents of
EEPROM.
5. When the EEPROM is erased a logic 1 is at the TEST
pin.
6. VDD is increased to 5.1 V to read the data by pulsing
VDD n times to 4.5 V. After the n edge, VDD is
decreased to 2.5 V.
Once the positive frequency deviation is measured, a
corresponding number ‘n’ (see Table 1) is programmed
into the device’s EEPROM. This causes n pulses of
frequency 8192 Hz to be inhibited every minute of
operation, which achieves the required calibration.
7. VDD is increased to 5.1 V to store n bits in the
EEPROM.
8. VDD is decreased to 2.5 V to terminate the storing
sequence and to return to operating mode.
The programming circuit is shown in Fig.2. The required
number n is programmed into EEPROM by varying VDD
according to the steps shown in Fig.3, which are
explained below:
9. VDD is increased to 5.1 V to check writing from the
motor pulse period tT3.
10. VDD is decreased to the operation voltage between
two motor pulses to return to operating mode.
(Decreasing VDD during the motor pulse would restart
the programming mode).
1. The positive quartz frequency deviation (∆f/f) is
measured, and the corresponding values of n are
found according to Table 1.
The time calibration can be reprogrammed up to 100
times.
2. VDD is increased to 5.1 V allowing the contents of the
EEPROM to be checked from the motor pulse period
tT3 at nominal frequency.
Table 1
Quartz crystal frequency deviation, n and tT3
FREQUENCY
DEVIATION
∆f/f
(× 10−6)
NUMBER OF
PULSES
(n)
tT3
(ms)
0(1)
0
31.250(2)
+2.03
1
31.372
+4.06
2
31.494
.
.
.
SIGNAL GENERATOR
V SS
.
.
.
.
.
.
+127.89
63
38.936
TEST
OSC IN
1
8
2
7
PCA16xx
SERIES
M2
M
3
6
4
5
32 kHz
OSC OUT
RESET
M1
VDD
MSA975
Notes
1. Increments of 2.03 × 10−6/step.
Fig.2 Circuit for programming the time calibration.
2. Increments of 122 µs/step.
1997 Dec 12
4
1997 Dec 12
5.1
4.5
5
1
(1)
2
9
10
3
t E = 5 ms
4
ERASURE
5
∆ V DDP
2
3
6
n
(1)
Fig.3 VDD for programming.
0.1 ms
min.
t edge = 1 µs
1
DATA INPUT
t S = 5 ms
7
STORING
8
(1)
(1)
9
t T3
CHECKING
10
MSA948
32 kHz watch circuits with EEPROM
(1) Rise and fall time should be greater than 400 µs/V for immediately correct checking.
0 (VSS)
1.5
2.5
VDD (V)
I DD
CONTENT CHECKING
Philips Semiconductors
Product specification
PCA16xx series
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
AVAILABLE TYPES
Refer to Fig.4 and to Chapters “Ordering information” and “Functional description and testing”.
SPECIFICATIONS
SHORT
TYPE
NUMBER
DELIVERY
FORMAT(1)
PERIOD
tT
(s)
1601
U/10
PULSE
WIDTH tP
(ms)
DRIVE
(%)
EEPROM
BATTERY
EOL
DETECTION
1
7.8
100
yes
no
REMARKS
1602
T
1
7.8
75
yes
no
1603
U/7
20
7.8
100
yes
no
1604
U/10
5
7.8
75
yes
no
1605
U/7
5
4.8
75
yes
no
1606
U/10
10
6.8
100
yes
no
1607
U
5
5.8
100
75
yes
no
1.5 V and
2.1 V Lithium
1608
U
5
7.8
100
75
yes
no
1.5 V and
2.1 V Lithium
1611
U
1
6.8
75
yes
no
1621
U/7
20
4.8
100
yes
no
1622
U
1
4.8
100
yes
yes
1623
U
20
4.8
75
yes
no
1624
U
12
3.9
75
56
yes
no
1625
U/7
5
5.8
75
yes
no
1626
U
20
5.8
100
yes
no
1627
U/7
20
5.8
100
75
yes
no
1628
U
20
5.8
75
yes
no
1629
U/7
5
6.8
75
yes
no
Note
1. U = Chip in trays; U/7 = chip with bumps on tape; U/10 = chip on foil.
T = SOT144-1.
V M1 - M2
tT
2t T
tP
MSA977
Fig.4 Motor output waveform (normal operation).
1997 Dec 12
6
1.5 V and
2.1 V Lithium
1.5 V and
2.1 V Lithium
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
PARAMETER
VDD
supply voltage
VI
all input voltages
CONDITIONS
VSS = 0 V; note 1
MIN.
MAX.
UNIT
−1.8
+6
V
VSS
VDD
V
output short-circuit duration
indefinite
Tamb
operating ambient temperature
−10
+60
°C
Tstg
storage temperature
−30
+100
°C
Note
1. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows,
which will rapidly discharge the battery.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
advisable to take handling precautions appropriate to handling MOS devices. Advice can be found in
“Data Handbook IC16, General, Handling MOS Devices”.
CHARACTERISTICS
VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; crystal: RS = 20 kΩ; C1 = 2 to 3 fF; CL = 8 to 10 pF;
C0 = 1 to 3 pF; unless otherwise specified.
Immunity against parasitic impedance = 20 MΩ from one pin to an adjacent pin.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VDD
supply voltage
Tamb = −10 to +60 °C
1.2
1.5
2.5
V
∆VDD
supply voltage variation
transient; VDD = 1.2 to 2.5 V
−
−
0.25
V
VDDP
supply voltage pulse
programming
5.0
5.1
5.2
V
∆VDDP
supply voltage pulse variation
programming
0.55
0.6
0.65
V
IDD1
supply current
between motor pulses
−
170
260
nA
IDD2
supply current
between motor pulses;
VDD = 2.1 V
−
190
300
nA
IDD3
supply current
stop mode; pin 8 connected to
VDD
−
180
280
nA
IDD4
supply current
stop mode; pin 8 connected to
VDD; VDD = 2.1 V
−
220
360
nA
IDD5
supply current
VDD = 2.1 V;
Tamb = −10 to +60 °C
−
−
600
nA
1997 Dec 12
7
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
SYMBOL
PCA16xx series
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Motor output
Vsat
saturation voltage Σ (P + N)
RL = 2 kΩ; Tamb = −10 to +60 °C
−
150
200
mV
Rsc
short-circuit resistance Σ (P + N)
Itransistor < 1 mA
−
200
300
Ω
tT
cycle time
note 1
tP
pulse width
note 2
Oscillator
VOSC ST
starting voltage
Vi(p-p) ≤ 50 mV
1.2
−
−
V
6
15
−
µS
−
1
−
s
−
0.05 × 0.3 ×
10−6
10−6
gm
transconductance
tosc
start-up time
∆f/f
frequency stability
Ci
input capacitance
8
10
12
pF
Co
output capacitance
12
15
18
pF
∆VDD = 100 mV
Voltage level detector
VLIT
threshold voltage
lithium mode
1.65
1.80
1.95
V
VEOL
threshold voltage
battery end-of-life
1.27
1.38
1.46
V
∆VVLD
hysteresis of threshold
−
10
−
mV
TCVLD
temperature coefficient
−
−1
−
mV/K
tV
voltage detection cycle
−
60
−
s
fo
output frequency
−
32
−
Hz
∆Vo
output voltage swing
R = 1 MΩ; C = 10 pF
1.4
−
−
V
tedge
edge time
R = 1 MΩ; C = 10 pF
−
1
−
µs
Iim
peak input current
note 3
−
320
−
nA
Ii(av)
average input current
−
10
−
nA
Reset input
Test mode
cycle time for motor pulses in:
tT1
test 1
−
125
−
ms
tT2
test 2
−
31.25
−
ms
tT3
test 3
tDEB
debounce time
see Chapter “Available types”
RESET = VDD
14.7
−
123.2
ms
−
4
−
s
−
tP
−
ms
−
31.25
−
ms
Battery end-of-life
tEOL
end-of-life sequence
tE1
motor pulse width
tE2
time between pulses
see “Available types”
Notes
1. Cycle time can be changed to one of the following values: 1, 5, 10, 12 or 20 s (see Chapter “Available types”).
2. Pulse width can be varied from 2 ms to 15.7 ms in steps of 1 ms (see Chapter “Available types”).
3. Duty factor is 1 : 32 and RESET = VDD or VSS.
1997 Dec 12
8
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
y
OSC OUT
OSC IN
TEST
V SS
PCA16xxU
SERIES
1.44 mm
0
0
x
VDD
M1
M2
RESET
2.02 mm
MSA976
Chip area: 2.91 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 200 ±25 µm, with bumps: 270 ±25 µm.
Fig.5 Bonding pad locations, PCA16xxU series, 8 terminals.
Table 2 Bonding pad locations (dimensions in µm)
All x/y coordinates are referenced to the centre of pad (VDD), see Fig.5.
PAD
x
y
1290
1100
TEST
940
1100
OSC IN
481
1100
OSC OUT
−102
1100
VDD
0
0
M1
578
0
M2
930
0
VSS
RESET
chip corner (max. value)
1997 Dec 12
1290
0
−497.5
−170
9
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
APPLICATION INFORMATION
1.55 V
V SS
TEST
1
8
2
7
PCA16xx
SERIES
(1)
OSC IN
OSC OUT
RESET
M2
M
3
6
4
5
M1
VDD
MSA974
(1) Quartz crystal case should be connected to VDD. Stray capacitance and leakage resistance from RESET, M1 or M2 to OSC IN should be less than
0.5 pF or larger than 20 MΩ.
Fig.6 Typical application circuit diagram.
1997 Dec 12
10
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
PACKAGE OUTLINE
PMFP8: plastic micro flat package; 8 leads (straight)
SOT144-1
E
D
X
c
m
t
n
HE
8
5
Q2
A2
Q1
pin 1 index
L
detail X
1
4
e
w M
b
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
b
c
D (1)
E (1)
e
HE
L
m
max.
n
max.
Q1
Q2
t
w
mm
0.90
0.70
0.40
0.25
0.19
0.12
3.1
2.9
3.1
2.9
0.80
4.6
4.4
0.75
0.26
0.3
0.40
0.30
0.40
0.30
0.95
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
94-01-25
95-01-24
SOT144-1
1997 Dec 12
EUROPEAN
PROJECTION
11
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1997 Dec 12
12
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Dec 12
13
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
NOTES
1997 Dec 12
14
Philips Semiconductors
Product specification
32 kHz watch circuits with EEPROM
PCA16xx series
NOTES
1997 Dec 12
15
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Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
© Philips Electronics N.V. 1997
SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417087/1200/03/pp16
Date of release: 1997 Dec 12
Document order number:
9397 750 03142
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