Data Sheet

INTEGRATED CIRCUITS
PCK2002P
533 MHz PCI-X clock buffer
Product data
Supersedes data of 2001 May 09
Philips
Semiconductors
2002 Dec 13
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
PIN CONFIGURATION
• General purpose and PCI-X 1:4 clock buffer
• 8-pin TSSOP package
• See PCK2001 for 48-pin 1:18 buffer part
• See PCK2001M for 28-pin 1:10 buffer part
• See PCK2001R for 16-pin 1:6 buffer part
• Operating frequency: 0 - 533 MHz
• Part-to-part skew < 500 ps
• Low output skew: <200 ps
• 3.3 V operation
• ESD classification testing is done to JEDEC Standard JESD22.
BUF_IN
1
OE
2
BUF_OUT0
3
VSS
4
PCK2002P
FEATURES
8
BUF_OUT3
7
BUF_OUT2
6
VDD
5
BUF_OUT1
TOP VIEW
SA00552
PIN DESCRIPTION
Protection exceeds 2000 V to HBM per method A114.
DESCRIPTION
PIN
NUMBER
I/O
TYPE
SYMBOL
1
Input
BUF_IN
3, 5, 7, 8
Output
BUF_OUT
(0-3)
6
Input
VDD
3.3 V supply
2
Input
OE
Output Enable
4
Input
VSS
Ground
The PCK2002PL is a 1- 4 fanout buffer used as a high-performance,
low skew, general purpose and PCI-X clock buffer. It distributes one
input clock (BUF_IN) signal to four output clocks (BUF_OUTn).
FUNCTION
Buffered clock input
Buffered clock outputs
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
tPLH
tPHL
Propagation delay
BUF_IN to BUF_OUTn
VCC = 3.3 V, CL = 25 pF
2.9
2.8
ns
tr
Rise time
VCC = 3.3 V, CL = 25 pF, 0.2VDD to 0.6VDD
800
ps
tf
Fall time
VCC = 3.3 V, CL = 25 pF, 0.6VDD to 0.2VDD
600
ps
Total supply current
VCC = 3.6 V
50
µA
ICC
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DRAWING NUMBER
8-Pin Plastic TSSOP
-40 to +85 °C
PCK2002PDP
SOT505-1
8-Pin Plastic SO
-40 to +85 °C
PCK2002PD
SOT96-1
2002 Dec 13
2
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
FUNCTION TABLE
OE
BUF_IN
BUF_OUTn
L
X
L
H
L
L
H
H
H
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to VSS (VSS = 0 V).
LIMITS
SYMBOL
VDD
PARAMETER
CONDITION
DC 3.3 V supply voltage
UNIT
MIN
MAX
-0.5
+4.3
V
IIK
DC input diode current
VI < 0
—
-50
mA
VI
DC input voltage
Note 2
-0.5
VDD + 0.5
V
IOK
DC output diode current
VO
DC output voltage
IO
DC output source or sink current
Tstg
Storage temperature range
Ptot
Power dissipation per package
plastic medium-shrink SO (SSOP)
VO > VDD or VO < 0
—
±50
mA
Note 2
-0.5
VDD + 0.5
V
VO ≥ 0 to VDD
For temperature range: 0 to +70 °C
above +55 °C derate linearly with 11.3 mW/K
—
±50
mA
-65
+150
°C
—
850
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
UNIT
MIN
MAX
DC 3.3V supply voltage
3.0
3.6
V
CL
Capacitive load
20
30
pF
VI
DC input voltage range
0
VDD
V
VO
DC output voltage range
0
VDD
V
-40
+85
°C
VDD
Tamb
2002 Dec 13
Operating ambient temperature range in free air
3
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
DC CHARACTERISTICS
LIMITS
TEST CONDITIONS
SYMBOL
Tamb = -40 to +85 °C
PARAMETER
VDD
(V)
OTHER
MIN
MAX
UNIT
VIH
HIGH level input voltage
3.0 to 3.6
—
—
2.0
VDD + 0.3
V
VIL
LOW level input voltage
3.0 to 3.6
—
—
VSS - 0.3
0.8
V
3.0 to 3.6
IOH = -1 mA
—
VDD - 0.2
—
V
3.0
IOH = -24 mA
—
2.0
—
V
3.0
IOH = -12 mA
—
2.4
—
V
3.0 to 3.6
IOL= 1 mA
—
—
0.2
V
3.0
IOL= 24 mA
—
—
0.8
V
3.0
IOL= 12 mA
—
—
0.55
V
3.0
VOUT = 1 V
—
-50
—
mA
3.3
VOUT = 1.65 V
—
—
-150
mA
3.0
VOUT = 2.0 V
—
60
—
mA
3.3
VOUT = 1.65 V
—
—
150
mA
VOH
VOL
Output HIGH voltage
Output LOW voltage
IOH
Output HIGH current
IOL
Output LOW current
±II
Input leakage current
3.6
VI = VDD or GND
—
—
±5
µA
ICC
Quiescent supply current
3.6
VI = VDD or GND
IO = 0
—
100
µA
2002 Dec 13
4
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
AC CHARACTERISTICS
LIMITS
Tamb = -40 to +85 °C
TEST CONDITIONS
SYMBOL
PARAMETER
UNIT
NOTES
MIN
TYP6
MAX
2
6.0
—
—
ns
3
6.0
—
—
ns
2
2.9
—
—
ns
3
3.0
—
—
ns
tH
CLK HIGH time
tL
CLK LOW time
tH
CLK HIGH time
tL
CLK LOW time
tR
Output rise slew rate
4
1.4
1.7
4.0
V/ns
tF
66 MHz
140 MHz
Output fall slew rate
4
1.5
2.2
4.0
V/ns
tPLH
Buffer LH propagation delay
5
1.8
2.9
3.4
ns
tPHL
Buffer HL propagation delay
5
1.8
2.8
3.4
ns
tSKW
Bus CLK skew
1
—
—
200
ps
Device to device skew
1
—
—
500
ps
tDDSKW
NOTES:
1. CLK skew is only valid for equal loading of all outputs.
2. tH is measured at 0.5 VDD as shown in Figure 2.
3. tL is measured at 0.35 VDD as shown in Figure 2.
4. tR and tF are measured as a transition through the threshold region 0.2 VDD to 0.6 VDD and 0.6 VDD to 0.2 VDD.
5. Input edge rate for these tests must be faster than 1 V/ns.
6. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
AC WAVEFORMS
TEST CIRCUIT
VM = 50% VDD
CL = 25 pF
VOL and VOH are the typical output voltage drop that occur with the
output load.
VDD
VDD
BUF_IN
INPUT
VM
tPLH
0.6 VDD
140 Ω
VM
0.2 VDD
0.2 VDD
SW00813
TR
TF
Figure 3. Load circuitry for switching times
SW00811
Figure 1. Load circuitry for switching times.
tp
th
0.5 VDD
0.4 VDD
0.35 VDD
tl
SW00812
Figure 2. Buffer Output clock
2002 Dec 13
CL
0.6 VDD
VM
BUF_OUT
D.U.T.
RT
tPHL
140 Ω
VO
VI
PULSE
GENERATOR
VM
VDD
5
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
2002 Dec 13
6
SOT505-1
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
SO8: plastic small outline package; 8 leads; body width 3.9 mm
2002 Dec 13
7
SOT96-1
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
REVISION HISTORY
Rev
Date
PCK2002P
Description
_3
20021213
Product data (9397 750 10863); ECN 853-2254 29225 of 22 November 2002
Modifications:
• Increase Fmax to 533 MHz.
_2
20010509
Product data (9397 750 08348); ECN 853-2254 26252 of 09 May 2001.
2002 Dec 13
8
Philips Semiconductors
Product data
533 MHz PCI-X clock buffer
PCK2002P
Data sheet status
Level
Data sheet status[1]
Product
status[2] [3]
Definitions
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
 Koninklijke Philips Electronics N.V. 2002
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 12-02
For sales offices addresses send e-mail to:
[email protected]
Document order number:
Philips
Semiconductors
2002 Dec 13
9
9397 750 10863
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