Data Sheet

PCK351
1 : 10 clock distribution device with 3-state outputs
Rev. 02 — 16 December 2005
Product data sheet
1. General description
The PCK351 is a high-performance 3.3 V LVTTL clock distribution device. The PCK351
enables a single clock input to be distributed to ten outputs with minimum output skew and
pulse skew. The use of distributed VCC and GND pins in the PCK351 ensures reduced
switching noise.
The PCK351 is characterized for operation over the supply range 3.0 V to 3.6 V, and over
the industrial temperature range −40 °C to +85 °C.
2. Features
■
■
■
■
■
■
■
■
■
■
1 : 10 LVTTL clock distribution
Low output-to-output skew
Low output pulse skew
Overvoltage tolerant inputs and outputs
LVTTL-compatible inputs and outputs
Distributed VCC and ground pins reduce switching noise
Balanced high-drive outputs (−32 mA IOH, 32 mA IOL)
Reduced power dissipation due to the state-of-the-art QUBiC-LP process
Supply range of +3.0 V to +3.6 V
Package options include plastic small-outline (D) and shrink small-outline (DB)
packages
■ Industrial temperature range −40 °C to +85 °C
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPLH
LOW-to-HIGH
propagation delay
A input to Yn outputs;
CL = 50 pF; VCC = 3.3 V
3.1
3.6
4.1
ns
tPHL
HIGH-to-LOW
propagation delay
A input to Yn outputs;
CL = 50 pF; VCC = 3.3 V
3.1
3.6
4.1
ns
Ci
input capacitance
VCC = 3.3 V; VI = VCC or GND;
f = 10 MHz
-
4
-
pF
Co
output capacitance
VCC = 3.3 V; VO = VCC or GND;
f = 10 MHz
-
6
-
pF
CPD
power dissipation
capacitance [1]
CL = 50 pF; f = 1 MHz
-
48
-
pF
[1]
CPD is used to determine the dynamic power dissipation (P in µW).
P = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑ (CL × VCC2 × fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in volts.
4. Ordering information
Table 2:
Ordering information
Tamb = −40 °C to +85 °C
Type number
Package
Name
Description
Version
PCK351D
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
PCK351DB
SSOP24
plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
2 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
5. Functional diagram
OE
5
23
21
19
18
A
Y1
Y2
Y3
Y4
6
16
14
11
9
4
2
Y5
Y6
Y7
Y8
Y9
Y10
002aaa282
Fig 1. Logic diagram of PCK351
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
3 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
6. Pinning information
6.1 Pinning
GND
1
24 GND
GND
1
24 GND
Y10
2
23 Y1
Y10
2
23 Y1
VCC
3
VCC
3
Y9
4
22 VCC
21 Y2
Y9
4
22 VCC
21 Y2
OE
5
20 GND
OE
5
20 GND
A
6
19 Y3
A
6
GND
7
18 Y4
GND
7
GND
8
17 GND
GND
8
17 GND
Y8
9
16 Y5
Y8
9
16 Y5
PCK351D
VCC 10
Y7 11
GND 12
15 VCC
14 Y6
VCC 10
13 GND
GND 12
PCK351DB
18 Y4
15 VCC
14 Y6
Y7 11
13 GND
002aaa280
Fig 2. Pin configuration for SO24
19 Y3
002aaa281
Fig 3. Pin configuration for SSOP24
6.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
GND
1, 7, 8, 12, 13, 17, 20, 24
ground (0 V)
Y10
2
outputs
Y9
4
Y8
9
Y7
11
Y6
14
Y5
16
Y4
18
Y3
19
Y2
21
Y1
23
VCC
3, 10, 15, 22
supply voltage
OE
5
output enable input (active LOW)
A
6
data input
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
4 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
7. Functional description
Refer to Figure 1 “Logic diagram of PCK351”.
7.1 Function table
Table 4:
Function table
H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state
Inputs
Outputs
A
OE
Yn
L
H
Z
H
H
Z
L
L
L
H
L
H
7.2 Logic symbol
OE
A
5
EN
6
23
21
19
18
16
14
11
9
4
2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
002aaa283
Fig 4. Logic symbol
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
5 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
8. Limiting values
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]
Symbol
Parameter
VCC
Conditions
Min
Max
Unit
supply voltage
−0.5
+4.6
V
VI
input voltage
−0.5 [2]
+7.0
V
VO
output voltage
−0.5 [2]
+3.6
V
IIK
input clamping current
VI < 0 V
-
−18
mA
IOK
output clamping current
VI < 0 V
-
−50
mA
IO(sink)
output sink current
-
64
mA
ICC
quiescent supply current
-
±75
mA
IGND
ground current
-
±75
mA
Tstg
storage temperature
−65
+150
°C
P
power dissipation
SO package
-
0.65
W
SSOP package
-
1.7
W
Tamb = +55 °C
[1]
The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 150 °C.
[2]
The input and output negative voltage ratings may be exceeded if the input and output clamping currents
are observed.
9. Recommended operating conditions
Table 6:
Recommended operating conditions
Unused pins (input or I/O) must be held HIGH or LOW.
Symbol Parameter
Conditions
Max
Unit
VCC
supply voltage
3.0
3.6
V
VIH
HIGH-state input voltage
2.0
5.5
V
VI
input voltage
0
0.8
V
Tamb
ambient temperature
see Table 7 and Table 8
per device
−40
+85
°C
tr
rise time
input; VCC = 3.3 ± 0.3 V
-
100
ns/V
tf
fall time
input; VCC = 3.3 ± 0.3 V
-
100
ns/V
PCK351_2
Product data sheet
Min
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
6 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
10. Characteristics
Table 7:
Static characteristics
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = 25 °C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIK
input clamping voltage
VCC = 3.0 V; II = −18 mA
-
-
−1.2
V
VOH
HIGH-state output voltage
VCC = 3.0 V; IOH = −32 mA
2.0
-
-
V
VOL
LOW-state output voltage
VCC = 3.0 V; IOL = 32 mA
-
-
0.5
V
ILI
input leakage current
VCC = 3.6 V; VI = GND or 5.5 V
-
-
±1.0
µA
ILO
output leakage current
VCC = 3.6 V; VO = 2.5 V
−15
-
−150
mA
-
-
±10
µA
outputs HIGH
-
-
0.3
mA
outputs LOW
-
-
25
mA
outputs disabled
IOZ
OFF-state output current
3-state; VCC = 3.6 V; VO = 3 V
ICC
quiescent supply current
VCC = 3.6 V; VI = VCC or GND; IO = 0 A
[1]
-
-
0.3
mA
Ci
input capacitance
VCC = 3.3 V; VI = VCC or GND;
f = 10 MHz
-
4
-
pF
Co
output capacitance
VCC = 3.3 V; VO = VCC or GND;
f = 10 MHz
-
6
-
pF
[1]
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
7 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
Table 8:
Dynamic characteristics
GND = 0 V; tr = tf ≤ 2.5 ns.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC = 3.3 V; Tamb = 25 °C; CL = 50 pF
tPLH
LOW-to-HIGH propagation delay
A to Yn; see Figure 5 and Figure 8
3.1
3.8
4.1
ns
tPHL
HIGH-to-LOW propagation delay
A to Yn; see Figure 5 and Figure 8
3.1
3.8
4.1
ns
tPZH
OFF-state to HIGH propagation delay OE to Yn; see Figure 6 and Figure 8
1.8
3.8
5.5
ns
tPZL
OFF-state to LOW propagation delay OE to Yn; see Figure 6 and Figure 8
1.8
3.8
5.5
ns
tPHZ
HIGH to OFF-state propagation delay OE to Yn; see Figure 6 and Figure 8
1.8
3.8
5.9
ns
tPLZ
LOW to OFF-state propagation delay OE to Yn; see Figure 6 and Figure 8
1.8
3.8
5.9
ns
tsk(o)
output skew time
A to Yn; output-to-output;
see Figure 7 and Figure 8
-
0.3
0.5
ns
tsk(p)
pulse skew time
A to Yn; see Figure 7 and Figure 8
-
0.2
0.8
ns
tsk(pr)
process skew time
A to Yn; part-to-part;
see Figure 7 and Figure 8
-
-
1
ns
tr
rise time
A to Yn; see Figure 5 and Figure 8
0.3
-
2.0
ns
tf
fall time
A to Yn; see Figure 5 and Figure 8
0.3
-
2.0
ns
2.5
3.3
5.9
ns
VCC = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; CL = 50 pF
tPLH
LOW-to-HIGH propagation delay
A to Yn; see Figure 5 and Figure 8
tPHL
HIGH-to-LOW propagation delay
A to Yn; see Figure 5 and Figure 8
2.5
3.3
5.9
ns
tPZH
OFF-state to HIGH propagation delay OE to Yn; see Figure 6 and Figure 8
1.3
-
5.9
ns
tPZL
OFF-state to LOW propagation delay OE to Yn; see Figure 6 and Figure 8
1.3
-
5.9
ns
tPHZ
HIGH to OFF-state propagation delay OE to Yn; see Figure 6 and Figure 8
1.7
-
6.3
ns
tPLZ
LOW to OFF-state propagation delay OE to Yn; see Figure 6 and Figure 8
1.7
-
6.3
ns
tsk(o)
output skew time
A to Yn; output-to-output;
see Figure 7 and Figure 8
-
-
0.5
ns
tsk(p)
pulse skew time
A to Yn; see Figure 7 and Figure 8
-
-
0.8
ns
tsk(pr)
process skew time
A to Yn; part-to-part;
see Figure 7 and Figure 8
-
-
1
ns
tr
rise time
A to Yn; see Figure 5 and Figure 8
0.3
-
2.0
ns
tf
fall time
A to Yn; see Figure 5 and Figure 8
0.3
-
2.0
ns
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
8 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
Table 9:
Switching characteristics
Temperature and VCC coefficients over recommended operating free-air temperature and VCC range. [1]
Symbol
Parameter
Conditions
Min
Max
Unit
-
65
ps/10 °C
∆tPLH(T)
temperature coefficient of LOW-to-HIGH propagation delay
A to Yn (average value)
[2]
∆tPHL(T)
temperature coefficient of HIGH-to-LOW propagation delay
A to Yn (average value)
[2]
-
45
ps/10 °C
∆tPLH(V)
VCC coefficient of LOW-to-HIGH propagation delay A to Yn
(average value)
[3]
-
−140
ps/100 mV
∆tPHL(V)
VCC coefficient of HIGH-to-LOW propagation delay A to Yn
(average value)
[3]
-
−120
ps/100 mV
[1]
These data were extracted from characterization material and are not tested at the factory.
[2]
∆tPLH(T) and ∆tPHL(T) are virtually independent of VCC.
[3]
∆tPLH(V) and ∆tPHL(V) are virtually independent of temperature.
10.1 AC waveforms
3.0 V
A input
1.5 V
0V
tPHL
tPLH
VOH
2V
Yn output
1.5 V
0.8 V
VOL
tr
tf
002aaa289
Fig 5. The input (A) to outputs (Yn) propagation delays and rise and fall times
3V
OE input
1.5 V
0V
tPZL
tPLZ
VCC
output
LOW-to-OFF
OFF-to-LOW
1.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
VOH
VOH − 0.3 V
output
HIGH-to-OFF
OFF-to-HIGH
1.5 V
GND
outputs
disabled
outputs
disabled
outputs
disabled
002aaa290
Fig 6. 3-state enable and disable times
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
9 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
A input
Y1 output
tPHL(A-Y1)
tPLH(A-Y1)
tPHL(A-Y2)
tPLH(A-Y2)
tPHL(A-Y3)
tPLH(A-Y3)
tPHL(A-Y4)
tPLH(A-Y4)
tPHL(A-Y5)
tPLH(A-Y5)
tPHL(A-Y6)
tPLH(A-Y6)
tPHL(A-Y7)
tPLH(A-Y7)
tPHL(A-Y8)
tPLH(A-Y8)
tPHL(A-Y9)
tPLH(A-Y9)
tPHL(A-Y10)
tPLH(A-Y10)
Y2 output
Y3 output
Y4 output
Y5 output
Y6 output
Y7 output
Y8 output
Y9 output
Y10 output
002aaa286
Output-to-output skew is the highest values of positive and negative edge skew:
tsk(o) = tPLH(A-Yn)(max) − tPLH(A-Yn)(min) and tsk(o) = tPHL(A-Yn)(max) − tPHL(A-Yn)(min).
Output pulse skew is the highest value of: tsk(p) = |tPLH(A-Yn) − tPHL(A-Yn)|.
Part-to-part skew tsk(pr) represents the positive and negative edge skew between outputs of
several devices operating under identical conditions.
Fig 7. Calculation of tsk(o), tsk(p), and tsk(pr)
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
10 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
11. Test information
S1
VCC
PULSE
GENERATOR
VI
RL
500 Ω
VO
6V
open
GND
DUT
CL
50 pF
RT
RL
500 Ω
002aaa285
Test data are given in Table 10.
CL = load capacitance includes jig and probe capacitance.
RL = load resistance.
RT = termination resistance.
Fig 8. Load circuitry for switching times
Table 10:
Test
Test data
Load
Switch
CL
RL
tPLH, tPHL
50 pF
500 Ω
open
tPLZ, tPZL
50 pF
500 Ω
6V
tPHZ, tPZH
50 pF
500 Ω
GND
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
11 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
12. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT137-1 (SO24)
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
12 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
o
0
o
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
REFERENCES
IEC
JEDEC
JEITA
MO-150
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT340-1 (SSOP24)
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
13 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
14 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
13.5 Package related soldering information
Table 11:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
LQFP, QFP, TQFP
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
PCK351_2
Product data sheet
not suitable
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
15 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Revision history
Table 12:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PCK351_2
20051216
Product data sheet
-
-
PCK351-01
Modifications:
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
•
Section 2 “Features”: deleted (old) 12th bullet
•
Table 2 “Ordering information”: changed “Temperature range = −65 °C to +150 °C” to
“Tamb = −40 °C to +85 °C”
Table 5 “Limiting values”:
– removed (old) Table note [1]; this is now presented in the Definitions section
– symbol “IO” changed to “IO(sink)”
– row “ICC, IGND” split to 2 rows, and parameter for each revised
•
Table 6 “Recommended operating conditions”:
– moved (old) Table note [1] to description below table title
– split row “tr, tf”
•
Table 7 “Static characteristics”: changed parameter description of VIK from “input diode voltage”
to “input clamping voltage”
•
Table 8 “Dynamic characteristics”:
– in descriptive line below table title: changed “tr = tf = ≤ 3.0 ns” to “tr = tf = ≤ 2.5 ns”
– (VCC = 3.3 V) typical value for tPLH and tPHL (A to Yn) changed from 3.6 ns to 3.8 ns
– (VCC = 3.3 V) typical value for tPHZ and tPZH (OE to Yn) changed from 4.0 ns to 3.8 ns
– (VCC = 3.3 V) tr and tf minimum values changed from “-” to “0.3 ns”; maximum values
changed from “-” to “2.0 ns”
– subheading “VCC = 3.3 to 3.6 V; Tamb = 0 °C to +70 °C” changed to
“VCC = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C”
– (VCC = 3.0 V to 3.6 V) values for tPLH and tPHL (A to Yn) changed from “-” to “2.5 ns” (min),
“3.3 ns” (typ), “5.9 ns” (max)
– (VCC = 3.0 V to 3.6 V) tr and tf minimum values changed from “-” to “0.3 ns”; maximum values
changed from “-” to “2.0 ns”
PCK351-01
20020514
Product data
853-2344 28198
PCK351_2
Product data sheet
9397 750 09791
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
16 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
15. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
18. Trademarks
17. Disclaimers
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
PCK351_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 16 December 2005
17 of 18
PCK351
Philips Semiconductors
1 : 10 clock distribution device with 3-state outputs
20. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
8
9
10
10.1
11
12
13
13.1
13.2
13.3
13.4
13.5
14
15
16
17
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Logic symbol. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
Package related soldering information . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information . . . . . . . . . . . . . . . . . . . . 17
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 16 December 2005
Document number: PCK351_2
Published in The Netherlands
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