Data Sheet

SC18IS600
SPI to I2C-bus interface
Rev. 6 — 4 May 2012
Product data sheet
1. General description
The SC18IS600 is designed to serve as an interface between the standard SPI of a host
(microcontroller, microprocessor, chip set, etc.) and the serial I2C-bus. This allows the
host to communicate directly with other I2C-bus devices. The SC18IS600 can operate as
an I2C-bus master-transmitter or master-receiver. The SC18IS600 controls all the I2C-bus
specific sequences, protocol, arbitration and timing.
2. Features and benefits















SPI slave interface
SPI Mode 3
Single master I2C-bus controller
Four General Purpose Input/Output (GPIO) pins
Two quasi-bidirectional I/O pins
5 V tolerant I/O pins
High-speed SPI: Up to 1.2 Mbit/s
High-speed I2C-bus: 400 kbit/s
96-byte transmit buffer
96-byte receive buffer
2.4 V to 3.6 V operation
Power-down mode with WAKEUP pin
Internal oscillator
Active LOW interrupt output
Available in very small TSSOP16 and HVQFN24 packages
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
SC18IS600IPW
TSSOP16
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
SC18IS600IBS
HVQFN24
plastic thermal enhanced very thin quad flat package; no leads; 24 terminals;
body 4 × 4 × 0.85 mm
SOT616-3
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
4. Block diagram
SC18IS600
MISO
MOSI
SCLK
CS
INT
CONTROL
LOGIC
SPI
INTERRUPT
CONTROL
LOGIC
INTERCONNECT BUS LINES
AND
CONTROL SIGNALS
RESET
BUFFER
I2C-BUS
CONTROLLER
GENERAL
PURPOSE
I/Os
SDA
SCL
GPIO0
GPIO1
GPIO2
GPIO3
IO5
IO4/WAKEUP
OSCILLATOR
ON-CHIP
RC
OSCILLATOR
002aab712
Fig 1.
Block diagram of SC18IS600
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
2 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
5. Pinning information
19 n.c.
20 IO5
1
18 WAKEUP/IO4
2
17 INT
VSS
3
14 INT
MISO
4
13 GPIO3
MOSI
5
15 VDD
14 SCLK
SDA
6
13 GPIO2
MISO
5
MOSI
6
11 SCLK
SDA
7
10 GPIO2
SCL
8
12 VDD
9
GPIO1
n.c. 12
4
GPIO1 11
VSS
16 GPIO3
SC18IS600IBS
n.c. 10
3
9
RESET
n.c.
15 WAKEUP/IO4
8
2
7
CS
n.c.
16 IO5
SCL
1
002aad707
Transparent top view
002aab713
Fig 2.
21 n.c.
CS
RESET
GPIO0
SC18IS600IPW
22 n.c.
terminal 1
index area
23 GPIO0
24 n.c.
5.1 Pinning
SC18IS600 pin configuration for TSSOP16
Fig 3.
SC18IS600 pin configuration for HVQFN24
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Type
Description
TSSOP16
HVQFN24
GPIO0
1
23
I/O
programmable I/O pin
CS
2
1
I
Chip select. When CS is LOW, the SC18IS600 is selected.
RESET
3
2
I
Master Reset. When active (LOW), RESET sets internal registers to the
default values, and resets the I2C-bus and SPI hardware. See Table 3.
VSS
4
3[1]
I
ground supply voltage
MISO
5
4
O
SPI slave data output
MOSI
6
5
I
SPI slave data input
SDA
7
6
I/O
I2C-bus serial data input/output
SCL
8
8
O
I2C-bus serial clock output
GPIO1
9
11
I/O
programmable I/O pin
GPIO2
10
13
I/O
programmable I/O pin
SCLK
11
14
I
SPI clock input
VDD
12
15
I
2.4 V to 3.6 V supply voltage
GPIO3
13
16
I/O
programmable I/O pin
CLKIN
-
-
I
external clock input
INT
14
17
O
Interrupt. When active (LOW), INT informs the CPU that the SC18IS600
has an interrupt to be serviced.
INT is reset (deactivated) either when the I2CStat register is read or as a
result of a master reset (RESET). This pin is an open-drain pin.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
3 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
Table 2.
Symbol
Pin description …continued
Pin
TSSOP16
Type
Description
HVQFN24
WAKEUP/IO4 15
18
I/O
Wake up the SC18IS600 from the Power-down mode. Pulled LOW by
the host to wake-up from low power state. This pin can also be used as
a quasi-bidirectional I/O when not in a power-down state.
IO5
16
20
I/O
quasi-bidirectional I/O pin
n.c.
-
7, 9, 10, 12, 19, 21, 22,
24
[1]
not connected
HVQFN24 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must be connected to supply
ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be
soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias
need to be incorporated in the PCB in the thermal pad region.
6. Functional description
The SC18IS600 acts as a bridge between a SPI interface and an I2C-bus. It allows a SPI
master device to communicate with I2C-bus slave devices. The SPI interface supports
Mode 3 of the SPI specification and can operate up to 1.2 Mbit/s.
6.1 Internal registers
The SC18IS600 provides internal registers for monitoring and control. These registers are
shown in Table 3. Register functions are more fully described in the following paragraphs.
Table 3.
Internal registers summary
Register Register
address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R/W
Default
value
0x00
IOConfig
IO3.1
IO3.0
IO2.1
IO2.0
IO1.1
IO1.0
IO0.1
IO0.0
R/W
0x00
0x01
IOState
0
0
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
R/W
0x3F
0x02
I2CClock
CR7
CR6
CR5
CR4
CR3
CR2
CR1
CR0
R/W
0x19
0x03
I2CTO
TO6
TO5
TO4
TO3
TO2
TO1
TO0
TE
R/W
0xFE
0x04
I2CStat
1
1
1
1
I2CSTAT3 I2CSTAT2 I2CSTAT1 I2CSTAT0 R
0xF0
0x05
I2CAdr
ADR7
ADR6
ADR5
ADR4
ADR3
0x00
ADR2
ADR1
X
R/W
6.2 Register descriptions
6.2.1 Programmable IO port configuration register (IOConfig)
Pins GPIO0 to GPIO3 may be configured by software to one of four types. These are:
quasi-bidirectional, push-pull, open-drain, and input-only. Two configuration bits per pin,
located in the IOConfig register, select the IO type for each pin. Each pin has
Schmitt-triggered input that also has a glitch suppression circuit. IO4 and IO5 are
quasi-bidirectional pins and are not user-configurable.
Table 4 shows the configurations for the programmable I/O pins. IOx.1 and IOx.0
correspond to GPIOx.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
4 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
Table 4.
6.2.1.1
Pin configurations
IOx.1
IOx.0
Pin configuration
0
0
quasi-bidirectional output configuration
0
1
input-only configuration
1
0
push-pull output configuration
1
1
open-drain output configuration
Quasi-bidirectional output configuration
Quasi-bidirectional outputs can be used both as an input and output without the need to
reconfigure the pin. This is possible because when the pin outputs a logic HIGH, it is
weakly driven, allowing an external device to pull the pin LOW. When the pin is driven
LOW, it is driven strongly and able to sink a large current. There are three pull-up
transistors in the quasi-bidirectional output that serve different purposes.
One of these pull-ups, called the ‘very weak’ pull-up, is turned on whenever the pin latch
for the pin contains a logic 1. This very weak pull-up sources a very small current that will
pull the pin HIGH if it is left floating.
A second pull-up, called the ‘weak’ pull-up, is turned on when the pin latch for the pin
contains a logic 1 and the pin itself is also at a logic 1 level. This pull-up provides the
primary source current for a quasi-bidirectional pin that is outputting a 1. If this pin is
pulled LOW by an external device, the weak pull-up turns off, and only the very weak
pull-up remains on. In order to pull the pin LOW under these conditions, the external
device has to sink enough current to overpower the weak pull-up and pull the pin below its
input threshold voltage.
The third pull-up is referred to as the ‘strong’ pull-up. This pull-up is used to speed up
LOW-to-HIGH transitions on a quasi-bidirectional pin when the pin latch changes from a
logic 0 to a logic 1. When this occurs, the strong pull-up turns on for two system clock
cycles quickly pulling the pin HIGH.
The quasi-bidirectional pin configuration is shown in Figure 4.
Although the SC18IS600 is a 3 V device, most of the pins are 5 V tolerant. If 5 V is applied
to a pin configured in quasi-bidirectional mode, there will be a current flowing from the pin
to VDD causing extra power consumption. Therefore, applying 5 V to pins configured in
quasi-bidirectional mode is discouraged.
A quasi-bidirectional pin has a Schmitt-triggered input that also has a glitch suppression
circuit.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
5 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
VDD
2 SYSTEM
CLOCK
CYCLES
P
strong
P
very
weak
P
weak
GPIOn,
IOn pin
pin latch data
VSS
input data
glitch rejection
002aab882
Fig 4.
6.2.1.2
Quasi-bidirectional output configuration
Open-drain output configuration
The open-drain output configuration turns off all pull-ups and only drives the pull-down
transistor of the pin when the pin latch contains a logic 0. To be used as a logic output, a
pin configured in this manner must have an external pull-up, typically a resistor tied to
VDD. The pull-down for this mode is the same as for the quasi-bidirectional mode.
The open-drain pin configuration is shown in Figure 5.
An open-drain pin has a Schmitt-triggered input that also has a glitch suppression circuit.
GPIO pin
pin latch data
VSS
input data
glitch rejection
002aab883
Fig 5.
6.2.1.3
Open-drain output configuration
Input-only configuration
The input-only pin configuration is shown in Figure 6. It is a Schmitt-triggered input that
also has a glitch suppression circuit.
input data
GPIO pin
glitch rejection
002aab884
Fig 6.
SC18IS600
Product data sheet
Input-only configuration
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
6 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.2.1.4
Push-pull output configuration
The push-pull output configuration has the same pull-down structure as both the
open-drain and the quasi-bidirectional output modes, but provides a continuous strong
pull-up when the pin latch contains a logic 1. The push-pull mode may be used when
more source current is needed from a pin output.
The push-pull pin configuration is shown in Figure 7.
A push-pull pin has a Schmitt-triggered input that also has a glitch suppression circuit.
VDD
P
strong
GPIO pin
N
pin latch data
VSS
input data
glitch rejection
002aab885
Fig 7.
Push-pull output configuration
6.2.2 I/O pins state register (IOState)
When read, this register returns the actual state of all programmable and
quasi-bidirectional I/O pins. When written, each register bit will be transferred to the
corresponding I/O pin programmed as output.
Table 5.
IOState - I/O pins state register (address 0x01) bit description
Bit
Symbol
Description
7:6
-
reserved
5
IO5
Set the logic level on the output pins.
4
IO4
Write to this register:
3
GPIO3 (SC18IS600 only)
2
GPIO2
1
GPIO1
0
GPIO0
logic 0 = set output pin to zero
logic 1 = set output pin to one
A read from this register returns states of all pins.
6.2.3 I2C-bus address register (I2CAdr)
The contents of the register represents the device’s own I2C-bus address. The most
significant bit corresponds to the first bit received from the I2C-bus after a START
condition. The least significant bit is not used, but should be programmed with a ‘0’.
I2CAdr is not needed for device operation, but should be configured so that its address
does not conflict with an I2C-bus device address used by the bus master.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
7 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.2.4 I2C-bus clock rates register (I2CClk)
This register determines the I2C-bus clock frequency. Various clock rates are shown in
Table 6 for the SC18IS600. The frequency can be determined using Equation 1:
6
7.3728 × 10
2
I C-bus clock frequency = ------------------------------- ( Hz )
4 × I2CClk
Table 6.
(1)
I2C-bus clock frequency example at 7.3728 MHz
I2CClk (decimal)
I2C-bus clock frequency
5 (minimum)
369 kHz
7
263 kHz
9
204 kHz
19
97 kHz
255 (maximum)
7.2 kHz
6.2.5 I2C-bus time-out register (I2CTO)
The time-out register is used to determine the maximum time that the I2C-bus master is
allowed to complete a transfer before setting an I2C-bus time-out interrupt.
Table 7.
I2CTO - I2C-bus time-out register (address 0x04) bit description
Bit
Symbol
Description
7:1
TO[7:1]
Time-out value
0
TE
Enable/disable time-out function
logic 0 = disable
logic 1 = enable
The least significant bit of I2CTO (TE bit) is used as a time-out enable/disable. A logic 1
will enable the time-out function.
On the SC18IS600 the time-out oscillator operates at 57.6 kHz.
This oscillator is fed into a 16-bit down counter. The down counter’s lower nine bits are
loaded with ‘1’, while the upper seven bits are loaded with the contents of I2CTO.
57.6 kHz
OSCILLATOR
16-BIT DOWN COUNTER
[I2CTO][111111111]
time-out
002aab715
Fig 8.
Time-out value
The time-out value is an approximate value.
In the case of arbitration loss, the SC18IS600 will transmit a START condition when the
bus becomes free unless the time-out condition is reached. If the time-out condition is
reached, an interrupt will be generated on the INT pin. The ‘I2C-bus time-out’ status can
be read in I2CStat.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
8 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.2.6 I2C-bus status register (I2CStat)
This register reports the results of I2C-bus transmit and receive transaction between
SC18IS600 and an I2C-bus slave device.
Table 8.
I2C-bus status
Register
value
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
I2C-bus status description
0xF0
1
1
1
1
0
0
0
0
Transmission successful. The SC18IS600 has
successfully completed an I2C-bus read or write
transaction. An interrupt is generated on INT. This
is also the default status after reset. No interrupt is
generated after reset.
0xF1
1
1
1
1
0
0
0
1
I2C-bus device address not acknowledged. No
I2C-bus slave device has acknowledged the slave
address that has been sent out in an I2C-bus read
or write transaction. An interrupt is generated on
INT.
0xF2
1
1
1
1
0
0
1
0
I2C-bus device address not acknowledged. An
I2C-bus slave has not acknowledged the byte that
has just been transmitted by the SC18IS600. An
interrupt is generated on INT.
0xF3
1
1
1
1
0
0
1
1
I2C-bus busy. The SC18IS600 is busy performing
an I2C-bus transaction, no new transaction should
be initiated by the host. No interrupt is generated.
0xF8
1
1
1
1
1
0
0
0
I2C-bus time-out (see Section 6.2.5 “I2C-bus
time-out register (I2CTO)”). The SC18IS600 has
started an I2C-bus transaction that has taken
longer than the time programmed in I2CTO
register. This could happen after a period of
unsuccessful arbitration or when an I2C-bus slave
is (continuously) pulling the SCL clock LOW. An
interrupt is generated on INT.)
0xF9
1
1
1
1
1
0
0
1
I2C-bus invalid data count. The number of bytes
specified in a read or write command to the
SC18IS600. An interrupt is generated on INT.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
9 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.3 I2C-bus serial interface
I2C-bus uses two wires (SDA and SCL) to transfer information between devices
connected to the bus, and it has the following features:
• Bidirectional data transfer between masters and slaves
• Multi-master bus (no central master)
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer
• The I2C-bus may be used for test and diagnostic purposes.
A typical I2C-bus configuration is shown in Figure 9. The SC18IS600 device provides a
byte-oriented I2C-bus interface that supports data transfers up to 400 kHz. (Refer to
UM10204, “I2C-bus specification and user manual”.)
VDD
RPU
RPU
SDA
SCL
I2C-bus
SC18IS600
I2C-BUS
DEVICE
I2C-BUS
DEVICE
002aab716
Fig 9.
I2C-bus configuration
6.4 Serial Peripheral Interface (SPI)
The host communicates with the SC18IS600 via the SPI interface. The SC18IS600
operates in Slave mode up to 3 Mbit/s.
The SPI interface has four pins: SCLK, MOSI, MISO, and CS.
• SCLK, MOSI and MISO are typically tied together between two or more SPI devices.
Data flows from the master to the SC18IS600 on the MOSI (Master Out Slave In) pin
and flows from SC18IS600 to the master on the MISO (Master In Slave Out) pin. The
SCLK signal is an input to the SC18IS600.
• CS is the slave select pin. In a typical configuration, an SPI master selects one SPI
device as the current slave. An SPI slave device uses its CS pin to determine whether
it is selected. The CS pin may be tied LOW if it is the only device on the bus.
Typical connections are shown in Figure 10.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
10 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
master
slave
SC18IS600
MISO
MOSI
SCLK
SPICLK
CS
PORT
slave
OTHER SPI
DEVICE
SCLK
CS
PORT
002aab717
Fig 10. SPI single master multiple slaves configuration
6.5 SPI message format
6.5.1 Write N bytes to I2C-bus slave device
SPI host sends
0x00
COMMAND
NUMBER
OF BYTES
SLAVE ADDRESS
+W
DATA
BYTE 1
DATA
BYTE N
CS
SCLK
MOSI
command 0x00
number of bytes D[7:0]
slave address A[7:1] 0
data byte 1
data byte N
002aab718
Fig 11. Write N bytes to I2C-bus slave device
The SPI host issues the write command by sending a 0x00 command followed by the total
number of bytes (maximum 96 bytes excluding the address) to send and an I2C-bus slave
device address followed by I2C-bus data bytes, beginning with the first byte (data byte 1)
and ending with the last byte (data byte N). Once the SPI host issues this command, the
SC18IS600 will access the I2C-bus slave device and start sending the I2C-bus data bytes.
When the I2C-bus write transaction has successfully finished, and interrupt is generated
on the INT pin, and the ‘transaction completed’ status can be read in I2CStat.
Note that the third byte sent by the host is the device I2C-bus slave address. The
SC18IS600 will ignore the least significant bit so a write will always be performed even if
the least significant bit is a ‘1’.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
11 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.5.2 Read N bytes from I2C-bus slave device
SPI host sends
0x01
COMMAND
NUMBER
OF BYTES
SLAVE ADDRESS
+R
CS
SCLK
MOSI
command 0x01
number of bytes D[7:0]
slave address A[7:1] 1
002aab719
Fig 12. Read N bytes from I2C-bus slave device
Once the host issues this command, the SC18IS600 will start an I2C-bus read transaction
on the I2C-bus to the specified slave address. Once the data is received, the SC18IS600
will place this data in the receiver buffer, and will generate an interrupt on the INT pin. The
‘transaction completed’ status can be read in the I2CStat. Note that the data is not
returned until a Read Buffer command is performed (see Section 6.5.4 “Read buffer”).
Note that the third byte sent by the host is the device slave address. The SC18IS600 will
ignore the least significant bit so a read will always be performed even if the least
significant bit is a ‘0’. The maximum number of bytes to be read is 96.
6.5.3 I2C-bus read after write
SPI host sends
NUMBER OF NUMBER OF
0x02
WRITE
READ
COMMAND
BYTES
BYTES
SLAVE
ADDRESS
+W
DATA
WRITE
BYTE 0
DATA
WRITE
BYTE N
SLAVE
ADDRESS
+R
002aab720
Fig 13. I2C-bus read after write
Once the host issues this command, the SC18IS600 will start a write transaction on the
I2C-bus to the specified slave address. Once the data is written, the SC18IS600 will read
data from the specified slave, place the data in the Receiver Buffer and generate an
interrupt on the INT pin. The ‘transaction completed’ status can be read in I2CStat. Note
that the data is not returned until a ‘Read Buffer’ command is performed.
6.5.4 Read buffer
SPI host sends
0x06
COMMAND
DATA
BYTE 1
DATA
BYTE N
002aab868
Fig 14. Read buffer
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
12 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
When the host issues a Read Buffer command, the SC18IS600 will return the data in the
Read Buffer on the MISO pin. Note that the Read Buffer will be overwritten if an additional
‘Read N bytes’ or a ‘Read after write’ command is executed before the Read Buffer
command.
6.5.5 I2C-bus write after write
SPI host sends
0x03
NUMBER OF NUMBER OF
COMMAND
BYTES 1
BYTES 2
SLAVE 1
ADDRESS + W
DATA
BYTE 1
DATA
BYTE N
SLAVE 2
ADDRESS + W
DATA
BYTE 1
DATA
BYTE M
002aab721
Fig 15. Write after write
When the host issues this command, the SC18IS600 will first write N data bytes to the
I2C-bus slave 1 device followed by a write of M data bytes to the I2C-bus slave 2 device.
6.5.6 SPI configuration
SPI host sends
0x18
COMMAND
SPI
CONFIGURATION
CS
SCLK
MOSI
character 0x18
SPI configuration data
002aab722
Fig 16. SPI configuration
Table 9.
SPI configuration
SPI configuration
Data order
0x81
LSB first
0x42
MSB first (default)
The SPI configuration command can be used to change the order in which the bits of SPI
data byte are sent on the SPI bus. In the LSB first configuration (SPI configuration data is
0x81), bit 0 is the first bit sent of any SPI byte. In MSB first (SPI configuration data is
0x42), bit 7 is the first bit sent. Table 9 shows the two possible configurations that can be
programmed.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
13 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.5.7 Write to SC18IS600 internal registers
SPI host sends
0x20
COMMAND
REGISTER
X
DATA
BYTE
CS
SCLK
MOSI
character 0x20
register X
data byte
002aab723
Fig 17. Write to SC18IS600 internal registers
A Write Register function is initiated by sending a 0x20 command followed by an internal
register address to be written (see Section 6.1). The register data byte follows the register
address. Only one register can be accessed in a single transaction. There is no
auto-incrementing of the register address.
6.5.8 Read from SC18IS600 internal register
SPI host sends
0x21
COMMAND
REGISTER
X
REGISTER
DATA
CS
SCLK
MOSI
character 0x21
register X
MISO
dummy byte
data byte
002aab724
Fig 18. Read from SC18IS600 internal register
A Read Register function is initiated by sending a 0x21 command followed by an internal
register address to be read (see Section 6.1) and a dummy byte. The data byte of the
read register is returned by the SC18IS600 on the MISO pin. Only one register can be
accessed in a single transaction. There is no auto-incrementing of the register address.
Note that write and read from internal registers are processed immediately as soon as the
SC18IS600 determines the intended register.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
14 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
6.5.9 Power-down mode
SPI host sends
0x30
COMMAND
0x5A
0xA5
CS
SCLK
MOSI
character 0x30
character 0x5A
character 0xA5
002aab725
Fig 19. Power-down mode
The SC18IS600 can be placed in a low-power mode where the internal oscillator is
stopped and it will no longer respond to SPI messages. Enter the Power-down mode by
sending the power-down command (0x30) followed by the two defined bytes, which are
0x5A followed by 0xA5. If the exact message is not received, the device will not enter the
power-down state.
Before entering the power-down state, WAKEUP/IO4 should be placed in a HIGH state.
To exit the power-down state, the WAKEUP/IO4 should be brought LOW. After leaving the
power-down state, the WAKEUP/IO4 can once again be used as a general-purpose IO
pin.
7. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1][2]
Symbol
Parameter
Conditions
Min
Max
Unit
Tamb(bias)
bias ambient temperature
operating
−55
+125
°C
Tstg
storage temperature
−65
+150
°C
Vn
voltage on any other pin
−0.5
+5.5
V
referenced to VSS
IOH(I/O)
HIGH-level output current per input/output pin
-
8
mA
IOL(I/O)
LOW-level output current per input/output pin
-
20
mA
II/O(tot)(max)
maximum total I/O current
-
120
mA
-
1.5
W
Ptot/pack
[3]
total power dissipation per package
[1]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
[2]
Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[3]
Based on package heat transfer, not device power consumption.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
15 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
8. Static characteristics
Table 11. Static characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IDD(oper)
operating supply current
VDD = 3.6 V; f = 12 MHz
-
7
13
mA
VDD = 3.6 V; f = 18 MHz
-
11
16
mA
IDD(idle)
Idle mode supply current
VDD = 3.6 V; f = 12 MHz
-
3.6
4.8
mA
VDD = 3.6 V; f = 18 MHz
-
4
6
mA
VDD = 3.6 V; industrial
-
< 0.1
5
μA
IDD(tpd)
total Power-down mode supply
current
VDD = 3.6 V; extended
-
-
50
μA
Vth(HL)
HIGH-LOW threshold voltage
Schmitt trigger input
0.22VDD
0.4VDD
-
V
Vth(LH)
LOW-HIGH threshold voltage
Schmitt trigger input
-
0.6VDD
0.7VDD
V
Vhys
hysteresis voltage
-
0.2VDD
-
V
VOL
LOW-level output voltage
all pins; IOL = 20 mA
-
0.6
1.0
V
all pins; IOL = 10 mA
-
0.3
0.5
V
all pins; IOL = 3.2 mA
-
0.2
0.3
V
all pins; IOH = −8 mA;
push-pull mode
VDD − 1
-
-
V
all pins; IOH = −3.2 mA;
push-pull mode
VDD − 0.7 VDD − 0.4 -
V
all pins; IOH = −20 μA;
quasi-bidirectional mode
VDD − 0.3 VDD − 0.2 -
V
VOH
Cig
IIL
HIGH-level output voltage
input capacitance at gate
[2]
-
-
15
pF
LOW-level input current
logical 0; VI = 0.4 V
[3]
-
-
−80
μA
all ports; VI = VIL or VIH
[4]
-
-
±10
μA
−30
-
−450
μA
10
-
30
kΩ
input leakage current
ILI
ITHL
HIGH-LOW transition current
RRESET_N(int)
internal pull-up resistance on pin
RESET
all ports; logical 1-to-0;
VI = 2.0 V at VDD = 3.6 V
[5][6]
[1]
Typical ratings are not guaranteed. The values listed are at room temperature, 3 V.
[2]
Pin capacitance is characterized but not tested.
[3]
Measured with pins in quasi-bidirectional mode.
[4]
Measured with pins in high-impedance mode.
[5]
Pins in quasi-bidirectional mode with weak pull-up (applies to all pins with pull-ups).
[6]
Pins source a transition current when used in quasi-bidirectional mode and externally driven from logic 1 to logic 0. This current is
highest when VI is approximately 2 V.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
16 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
9. Dynamic characteristics
Table 12. Dynamic characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1]
Symbol
fosc(RC)
Parameter
internal RC oscillator
frequency
Conditions
Variable clock
SC18IS600; nominal f = 7.3728 MHz;
trimmed to ±1 % at Tamb = 25 °C
fosc = 12 MHz Unit
Min
Max
Min
Max
7.189
7.557
7.189
7.557
-
50
-
50
MHz
Glitch filter
tgr
glitch rejection time
signal acceptance time
tsa
RESET pin
[2]
any pin except RESET
[2]
ns
-
15
-
15
ns
RESET pin
125
-
125
-
ns
any pin except RESET
50
-
50
-
ns
SPI slave interface
fSPI
SPI operating frequency
2.0 MHz
0
fosc⁄
6
0
2.0
TSPICYC
SPI cycle time
2.0 MHz
6⁄
fosc
-
500
-
ns
tSPILEAD
SPI enable lead time
2.0 MHz
4
-
4
-
μs
tSPILAG
SPI enable lag time
MHz
4
-
4
-
μs
tSCLKH
SCLK HIGH time
3⁄
fosc
-
190
-
ns
tSCLKL
SCLK LOW time
3⁄
fosc
-
190
-
ns
tSPIDSU
SPI data set-up time
100
-
100
-
ns
tSPIDH
SPI data hold time
100
-
100
-
ns
tSPIA
SPI access time
0
120
0
120
ns
tSPIDIS
SPI disable time
2.0 MHz
0
240
-
240
ns
tSPIDV
SPI enable to output
data valid time
2.0 MHz
0
240
-
240
ns
3.0 MHz
0
167
-
167
ns
tSPIOH
SPI output data hold time
tSPIR
SPI rise time
tSPIF
SPI fall time
0
-
0
-
ns
SPI outputs (SCLK, MOSI, MISO)
-
100
-
100
ns
SPI inputs (SCLK, MOSI, MISO, CS)
-
2000
-
2000
ns
SPI outputs (SCLK, MOSI, MISO)
-
100
-
100
ns
SPI inputs (SCLK, MOSI, MISO, CS)
-
2000
-
2000
ns
[1]
Parameters are valid over operating temperature range unless otherwise specified. Parts are tested to 2 MHz, but are guaranteed to
operate down to 0 Hz.
[2]
SCL and SDA do not have glitch suppression circuits.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
17 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
Table 13. Dynamic characteristics
VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C (industrial); unless otherwise specified.[1]
Symbol
Parameter
Conditions
fosc(RC)
internal RC oscillator
frequency
SC18IS600;
nominal f = 7.3728 MHz;
trimmed to ±1 % at
Tamb = 25 °C
Variable clock
fosc = 18 MHz
Min
Max
Min
Max
7.189
7.557
7.189
7.557
Unit
MHz
Glitch filter
tgr
glitch rejection time
signal acceptance time
tsa
RESET pin
[2]
-
50
-
50
ns
any pin except RESET
[2]
-
15
-
15
ns
RESET pin
125
-
125
-
ns
any pin except RESET
50
-
50
-
ns
3.0 MHz
0
fosc⁄
6
0
3
MHz
SPI slave interface
SPI operating frequency
fSPI
TSPICYC
SPI cycle time
3.0 MHz
6⁄
fosc
-
333
-
ns
tSPILEAD
SPI enable lead time
3.0 MHz
4
-
4
-
μs
tSPILAG
SPI enable lag time
3.0 MHz
4
-
4
-
μs
SCLK HIGH time
3⁄
fosc
-
167
-
ns
tSCLKL
SCLK LOW time
3⁄
fosc
-
167
-
ns
tSPIDSU
SPI data set-up time
100
-
100
-
ns
tSPIDH
SPI data hold time
100
-
100
-
ns
tSPIA
SPI access time
0
80
0
80
ns
tSCLKH
tSPIDIS
SPI disable time
3.0 MHz
0
160
-
160
ns
tSPIDV
SPI enable to output data
valid time
3.0 MHz
0
160
-
160
ns
tSPIOH
SPI output data hold time
0
-
0
-
ns
tSPIR
SPI rise time
SPI outputs
(SCLK, MOSI, MISO)
-
100
-
100
ns
SPI inputs
(SCLK, MOSI, MISO, CS)
-
2000
-
2000
ns
SPI outputs
(SCLK, MOSI, MISO)
-
100
-
100
ns
SPI inputs
(SCLK, MOSI, MISO, CS)
-
2000
-
2000
ns
tSPIF
SPI fall time
[1]
Parameters are valid over operating temperature range unless otherwise specified. Parts are tested to 2 MHz, but are guaranteed to
operate down to 0 Hz.
[2]
SCL and SDA do not have glitch suppression circuits.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
18 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
CS
tSPIF
TCLCL
tSPILEAD
tSPIF
tSPIR
tSCLKL
tSPILAG
tSPIR
tSCLKH
SCLK
(input)
tSPIOH
tSPIDV
tSPIOH
tSPIDV
tSPIOH
tSPIDV
tSPIDIS
tSPIA
MISO
(output)
slave LSB/MSB out
slave MSB/LSB out
not defined
MOSI
(input)
tSPIDSU
tSPIDH
tSPIDSU
MSB/LSB in
tSPIDSU
tSPIDH
LSB/MSB in
002aab797
Fig 20. SPI slave timing (Mode 3)
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
19 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
Table 14.
Additional SPI AC characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tSPICLKW
SPICLK HIGH time
between two SPI bytes
8
-
-
μs
tCSW
CS HIGH time
between two SPI transactions
refer to Figure 22
μs
tSPILAG1
SPI enable lag time 1
in a SPI to I2C-bus transaction
refer to Figure 23
μs
refer to Figure 24
μs
delay time
td
from last SCLK pulse to SDA LOW in a SPI to
transaction
I2C-bus
tSPICLKW
SCLK
tSPILAG1
tSPILEAD
CS
tCSW
td
SDA
002aab927
Fig 21. SPI to I2C-bus timing diagram
002aab929
8
002aab930
5
tSPILAG1
(μs)
4
tCSW
(μs)
6
3
4
2
2
1
0
0
1.843
3.687
7.373
12.00
18.00
CLKIN frequency (MHz)
Fig 22. tCSW as a function of CLKIN frequency
1.843
3.687
7.373
12.00
18.00
CLKIN frequency (MHz)
Fig 23. tSPILAG1 as a function of CLKIN frequency
002aab931
160
td
(μs)
120
80
40
0
1.843
3.687
7.373
12.00
18.00
CLKIN frequency (MHz)
Fig 24. td as a function of CLKIN frequency
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
20 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
10. Package outline
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
D
A
X
c
y
HE
v M A
Z
9
16
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
8
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.40
0.06
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT403-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 25. Package outline SOT403-1 (TSSOP16)
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
21 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-3
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2
e
e
12
y
y1 C
v M C A B
w M C
b
7
L
13
6
e
e2
Eh
1/2
e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.75
2.45
4.1
3.9
2.75
2.45
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT616-3
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
04-11-19
05-03-10
Fig 26. Package outline SOT616-3 (HVQFN24)
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
22 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
11. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
11.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
11.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
11.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
23 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
11.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 27) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 15 and 16
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 27.
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
24 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 27. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
12. Abbreviations
Table 17.
SC18IS600
Product data sheet
Abbreviations
Acronym
Description
ASCII
American Standard Code for Information Interchange
CPU
Central Processing Unit
GPIO
General Purpose Input/Output
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MSB
Most Significant Bit
PCB
Printed-Circuit Board
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
25 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
13. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SC18IS600 v.6
20120504
Product data sheet
-
SC18IS600_601 v.5
Modifications:
•
•
Deleted SC18IS601 from this data sheet
Section 2 “Features and benefits”, third bullet item: changed from “Master I2C-bus controller” to
“Single master I2C-bus controller”
SC18IS600_601 v.5
20080728
Product data sheet
-
SC18IS600_601 v.4
SC18IS600_601 v.4
20080320
Product data sheet
-
SC18IS600_601 v.3
SC18IS600_601 v.3
20061213
Product data sheet
-
SC18IS600_601 v.2
SC18IS600_601 v.2
20060811
Product data sheet
-
SC18IS600_601 v.1
SC18IS600_601 v.1
20060224
Product data sheet
-
-
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
26 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SC18IS600
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
27 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
SC18IS600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 4 May 2012
© NXP B.V. 2012. All rights reserved.
28 of 29
SC18IS600
NXP Semiconductors
SPI to I2C-bus interface
16. Contents
1
2
3
4
5
5.1
5.2
6
6.1
6.2
6.2.1
6.2.1.1
6.2.1.2
6.2.1.3
6.2.1.4
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.3
6.4
6.5
6.5.1
6.5.2
6.5.3
6.5.4
6.5.5
6.5.6
6.5.7
6.5.8
6.5.9
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
14
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Internal registers . . . . . . . . . . . . . . . . . . . . . . . . 4
Register descriptions . . . . . . . . . . . . . . . . . . . . 4
Programmable IO port configuration register
(IOConfig) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Quasi-bidirectional output configuration . . . . . . 5
Open-drain output configuration . . . . . . . . . . . . 6
Input-only configuration . . . . . . . . . . . . . . . . . . 6
Push-pull output configuration . . . . . . . . . . . . . 7
I/O pins state register (IOState) . . . . . . . . . . . . 7
I2C-bus address register (I2CAdr) . . . . . . . . . . 7
I2C-bus clock rates register (I2CClk) . . . . . . . . 8
I2C-bus time-out register (I2CTO). . . . . . . . . . . 8
I2C-bus status register (I2CStat) . . . . . . . . . . . . 9
I2C-bus serial interface . . . . . . . . . . . . . . . . . . 10
Serial Peripheral Interface (SPI) . . . . . . . . . . . 10
SPI message format . . . . . . . . . . . . . . . . . . . . 11
Write N bytes to I2C-bus slave device . . . . . . 11
Read N bytes from I2C-bus slave device . . . . 12
I2C-bus read after write. . . . . . . . . . . . . . . . . . 12
Read buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C-bus write after write . . . . . . . . . . . . . . . . . 13
SPI configuration . . . . . . . . . . . . . . . . . . . . . . 13
Write to SC18IS600 internal registers . . . . . . 14
Read from SC18IS600 internal register . . . . . 14
Power-down mode . . . . . . . . . . . . . . . . . . . . . 15
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 16
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering of SMD packages . . . . . . . . . . . . . . 23
Introduction to soldering . . . . . . . . . . . . . . . . . 23
Wave and reflow soldering . . . . . . . . . . . . . . . 23
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
14.1
14.2
14.3
14.4
15
16
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
27
27
27
28
28
29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 May 2012
Document identifier: SC18IS600
Similar pages