Data Sheet

PTN3355
Low power DisplayPort to VGA adapter with integrated
1 : 2 VGA switch
Rev. 3 — 14 July 2014
Product data sheet
1. General description
PTN3355 is a DisplayPort to VGA adapter with an integrated 1 : 2 VGA switch optimized
primarily for motherboard applications, to convert a DisplayPort signal from the chip set to
an analog video signal that directly connects to the VGA connector. PTN3355 integrates a
DisplayPort receiver, a high-speed triple video digital-to-analog converter and 1 : 2 VGA
switch that supports a wide range of display resolutions, for example, VGA to WUXGA
(see Table 9). PTN3355 supports either one or two DisplayPort lanes operating at either
2.7 Gbit/s or 1.62 Gbit/s per lane.
PTN3355 supports I2C-bus over AUX per DisplayPort standard (Ref. 1), and bridges the
VESA DDC channel to the DisplayPort Interface.
PTN3355 is powered from a 3.3 V power supply and consumes approximately 200 mW of
power for video streaming in WUXGA resolution and 410 W of power in Low-power
mode. The VGA output is powered down when there is no valid DisplayPort source data
being transmitted. PTN3355 also aids in monitor detection by performing load sensing on
RGB lines and reporting sink connection status to the source.
2. Features and benefits
2.1 VESA-compliant DisplayPort converter
 Main Link: 1-lane and 2-lane modes supported
 HBR (High Bit Rate) at 2.7 Gbit/s per lane
 RBR (Reduced Bit Rate) at 1.62 Gbit/s per lane
 BER (Bit Error Rate) better than 109
 DisplayPort Link down-spreading supported
 1 MHz AUX channel
 Supports native AUX CH syntax
 Supports I2C-bus over AUX CH syntax
 Active HIGH Hot Plug Detect (HPD) signal to the source
2.2 VESA-compliant eDP extensions
 Supports Alternate Scrambler Seed Reset (ASSR)
 Supports Alternate Enhanced Framing mode - Enhanced Framing
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
2.3 DDC channel output
 I2C-Over-AUX feature facilitates support of MCCS, DDC/CI, and DDC protocols (see
Ref. 2)
2.4 Analog video output






VSIS 1.2 compliance (Ref. 3) for supported video output modes
Analog RGB current-source outputs
3.3 V VSYNC and HSYNC outputs
Pixel clock up to 240 MHz
Triple 8-bit Digital-to-Analog Converter (DAC)
Direct drive of double terminated 75  load with standard 700 mV (peak-to-peak)
signals
 Integrated 1 : 2 VGA switch
2.5 General features
 Supports firmware upgradability through ‘Flash-over-AUX’ scheme for Windows
 Supports firmware upgradability through I2C-bus interface
 Monitor presence detection through load detection scheme. Connection/disconnection
reported via HPD IRQ and DPCD update.
 Wide set of display resolutions are supported1:
 1920  1440, 60 Hz, 18 bpp, 234 MHz pixel clock rate
 2048  1152, 60 Hz (reduced blanking), 24 bpp, 162 MHz pixel clock rate
 2048  1536, 50 Hz (reduced blanking), 24 bpp, 167.2 MHz pixel clock rate
 WUXGA: 1920  1200, 60 Hz, 18 bpp, 193 MHz pixel clock rate
 WUXGA: 1920  1200, 60 Hz (reduced blanking), 24 bpp, 154 MHz pixel clock rate
 UXGA: 1600  1200, 60 Hz, 162 MHz pixel clock rate
 SXGA: 1280  1024, 60 Hz, 108 MHz pixel clock rate
 XGA: 1024  768, 60 Hz, 65 MHz pixel clock rate
 SVGA: 800  600, 60 Hz, 40 MHz pixel clock rate
 VGA: 640  480, 60 Hz, 25 MHz pixel clock rate
 Any resolution and refresh rates are supported from 25 MHz up to 180 MHz pixel
clock rate at 24 bpp, or up to 240 MHz pixel clock rate at 18 bpp
 Bits per color (bpc) supported1
 6, 8 bits supported
 10, 12, 16 bits supported by truncation to 8 MSBs
 All VGA colorimetry formats (RGB) supported
 Power modes (when the application design is as per Figure 4)
 Active-mode power consumption: ~200 mW at WUXGA, 1920  1200, 60 Hz
(18 bpc)
 410 W at Low-power mode
 Supports slave I2C-bus interface for host debugging and configuration
1.
Except for color depth beyond 8 bits, display resolutions and refresh rates are only limited to those which a standard 2-lane
DisplayPort configuration is able to support over 2.7 Gbit/s per lane of DP Main Link.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
2 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
 Supports flexible choice of timing reference
 On-board oscillator with external crystal, ceramic resonator
 Different frequencies supported: 25 MHz, 27 MHz, 33 MHz
 ESD protection: 7.5 kV HBM
 Single power supply (3.3 V) for easy integration in the platforms
 Commercial temperature range: 0 C to 85 C
 40-pin HVQFN, 6 mm  6 mm  0.85 mm (nominal); 0.5 mm pitch; lead-free package
3. Applications
 Notebook computers, tablets and desktop PCs
 Dongles, adapters, docking stations
4. Ordering information
Table 1.
Ordering information
Type number
Topside mark
Package
Name
Description
Version
PTN3355
HVQFN40
plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; 6  6  0.85 mm[3]
SOT618-1
PTN3355BS/FX[2] PTN3355
HVQFN40
plastic thermal enhanced very thin quad flat package;
no leads; 40 terminals; 6  6  0.85 mm[3]
SOT618-1
PTN3355BS[1]
[1]
PTN3355BS uses latest firmware version.
[2]
PTN3355BS/FX uses specific firmware version (‘X’ = 1, 2, 3, etc., and changes according to firmware version).
[3]
Maximum height is 1 mm.
4.1 Ordering options
Table 2.
Ordering options
Type number
Orderable
part number
Package
Packing method
PTN3355BS[1]
PTN3355BSMP
HVQFN40
Reel 13” Q2/T3 *standard mark 4000
SMD dry pack
Tamb = 0 C to +85 C
HVQFN40
Reel 13” Q2/T3 *standard mark 4000
SMD dry pack
Tamb = 0 C to +85 C
PTN3355BS/FX[2] PTN3355BS/FXMP
Minimum
order
quantity
Temperature
[1]
PTN3355BS uses latest firmware version.
[2]
PTN3355BS/FX uses specific firmware version (‘X’ = 1, 2, 3, etc., and changes according to firmware version).
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
3 of 37
xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
TIMING RECOVERY
DPCD
REGISTERS
H, V
sync
DAC
DAC
RED1
GRN1
BLU1
VGA
OUTPUT
WITH
1:2
VGA
SWITCH
CONTROL
NVM
MANCHESTER
CODEC
AUX_P, AUX_N
DDC2_SCL
DDC2_SDA
RX DIGITAL SUBSYSTEM
Vbias
Functional diagram
OSC_OUT
RSET
RST_N
CFG1_SCL, CFG2_SDA
002aag883
PTN3355
4 of 37
© NXP Semiconductors N.V. 2014. All rights reserved.
OSC_IN
HSYNC2
VSYNC2
DDC1_SCL
DDC1_SDA
I2C-BUS
MASTER
DRV
HPD
Fig 1.
AUX COMMAND
LEVEL MODULE
RED2
GRN2
BLU2
MCU
Vbias
RCV
HSYNC1
VSYNC1
channel 1
G[7:0]
MAIN
STREAM
B[7:0]
MONITOR
PRESENCE
DETECT
TIME
CONV.
DAC
channel 2
10b/8b
DIFF CDR,
RCV S2P
ML1_P, ML1_N
DE-SCRAM
Vbias
INTERFACE DE-SKEWING
10b/8b
R[7:0]
DE-SCRAM
ML0_P, ML0_N
VIDEO DAC SUBSYSTEM
ISOCHRONOUS LINK
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Rev. 3 — 14 July 2014
All information provided in this document is subject to legal disclaimers.
DIFF CDR,
RCV S2P
RX PHY DIGITAL
NXP Semiconductors
RX PHY
ANALOG
SUBSYSTEM
5. Functional diagram
PTN3355
Product data sheet
PTN3355
DOCK_IN,
CFG3, CFG5,
TESTMODE
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
6. Pinning information
31 RED1
32 RED2
33 OSC_IN
34 OSC_OUT
35 VDDA15_DAC
36 VDDD15
37 TESTMODE
38 PVDD33
terminal 1
index area
39 SWOUT
40 PGND
6.1 Pinning
VDDA33_DNW
1
30 RSET
DOCK_IN
2
29 GRN2
AUX_P
3
28 GRN1
AUX_N
4
27 BLU2
VDDE33_IO
5
ML0_P
6
ML0_N
7
VDDA15_DP
8
ML1_P
9
26 BLU1
PTN3355BS
25 HSYNC1
24 VSYNC1
23 DDC_SCL2
22 DDC_SDA1
GND(1)
DDC_SCL1 20
HSYNC2 19
VSYNC2 18
CFG2_SDA 17
CFG3 16
CFG5 15
CFG1_SCL 14
HPD 13
RST_N 11
21 VDDE33_IO
DDC_SDA2 12
ML1_N 10
002aag884
Transparent top view
(1) Exposed die pad.
Fig 2.
Pin configuration for HVQFN40
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Type
Description
VDDA33_DNW
1
power
3.3 V power supply
DOCK_IN
2
3.3 V digital I/O
Docked indication signal
AUX_P
3
self-biasing differential
input
DisplayPort AUX channel positive input
AUX_N
4
self-biasing differential
input
DisplayPort AUX channel negative input
VDDE33_IO
5
power
3.3 V power supply for I/O
ML0_P
6
self-biasing differential
input
DisplayPort Main Link lane 0 positive input
ML0_N
7
self-biasing differential
input
DisplayPort Main Link lane 0 negative input
VDDA15_DP
8
power
1.5 V power supply for DisplayPort PHY; power provided to this pin
from SWOUT pin
ML1_P
9
self-biasing differential
input
DisplayPort Main Link lane 1 positive input
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
ML1_N
10
self-biasing differential
input
DisplayPort Main Link lane 1 negative input
RST_N
11
3.3 V digital input
Reset input active LOW; pulled up to VDD(3V3) internally
DDC_SDA2
12
5 V open-drain I/O
DDC I2C-bus data for channel 2
HPD
13
3.3 V digital I/O
DisplayPort Hot Plug Detection output
CFG1_SCL
14
5 V open-drain I/O
General purpose configuration pin CFG1 or slave I2C clock
CFG5
15
3.3 V digital I/O
Configuration pin supporting trinary input
CFG3
16
3.3 V digital I/O
Reserved
CFG2_SDA
17
5 V open-drain I/O
General purpose configuration pin CFG2 or slave I2C data
VSYNC2
18
3.3 V 50  digital I/O
Vertical sync for channel 2
HSYNC2
19
3.3 V 50  digital I/O
Horizontal sync for channel 2
DDC_SCL1
20
5 V open-drain I/O
DDC I2C-bus clock for channel 1
VDDE33_IO
21
power
3.3 V power supply for I/O
DDC_SDA1
22
5 V open-drain I/O
DDC I2C-bus data for channel 1
DDC_SCL2
23
5 V open-drain I/O
DDC I2C-bus clock for channel 2
VSYNC1
24
3.3 V 50  digital I/O
Vertical sync for channel 1
HSYNC1
25
3.3 V 50  digital I/O
Horizontal sync for channel 1
BLU1
26
analog output
Blue DAC analog output for channel 1
BLU2
27
analog output
Blue DAC analog output for channel 2
GRN1
28
analog output
Green DAC analog output for channel 1
GRN2
29
analog output
Green DAC analog output for channel 2
RSET
30
input
Resistor for DAC output reference control
RED1
31
analog output
Red DAC analog output for channel 1
RED2
32
analog output
Red DAC analog output for channel 2
OSC_IN
33
input
Crystal oscillator input
OSC_OUT
34
output
Crystal oscillator output
VDDA15_DAC
35
power
1.5 V power supply for DAC; power provided to this pin from SWOUT
pin
VDDD15
36
power
1.5 V power supply for digital core; power provided to this pin from
SWOUT pin
TESTMODE
37
input
Test mode selection for CFG/JTAG and I2C slave address selection;
supports trinary input
PVDD33
38
power
3.3 V power supply for switching regulator
SWOUT
39
power
Switching regulator output
PGND
40
ground
Ground for switching regulator
GND[1]
-
power
central supply ground connection (exposed die pad)
[1]
HVQFN40 package die supply ground is connected to exposed center pad. Exposed center pad must be connected to supply ground for
proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad must be soldered to the board
using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias must be incorporated in
the PCB in the thermal pad region.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
6 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
7. Functional description
Referring to Figure 1 “Functional diagram”, the PTN3355 performs protocol conversion
from VESA DisplayPort specification to VESA VGA output. At the physical layer, PTN3355
implements the advanced DisplayPort Front-end technology (Auto receive equalization,
Clock Data Recovery) to support the objectives of delivering excellent Signal Integrity (SI)
performance, and consuming very low power consumption. The PTN3355 integrates a
DisplayPort receiver (according to VESA DisplayPort standard, Ref. 1) and a high-speed
triple 8-bit video digital-to-analog converter that supports a wide range of video resolutions
(see Table 9 “Display resolution and pixel clock rate[1]”), up to a pixel clock rate of
240 MHz. The PTN3355 supports one or two DisplayPort Main Link lanes operating at
either in 2.7 Gbit/s or 1.62 Gbit/s per lane. PTN3355 also integrates a 1 : 2 VGA switch
that enables driving VGA signals either to main board connector or docking connector.
This feature helps realize BOM saving due to removal of discrete VGA switch component.
PTN3355 comprises the following functional blocks:
•
•
•
•
•
•
DP Main Link
DP AUX CH (Auxiliary Channel)
DPCD (DisplayPort Configuration Data)
VGA monitor detection
Video DAC
1 : 2 VGA switch
The RGB video data with corresponding synchronization references are extracted from
the main stream video data. Main stream video attribute information is also extracted. This
information is inserted once per video frame during the vertical blanking period by the DP
source. The attributes describe the main video stream format in terms of geometry, timing,
and color format. The original video clock and video stream are derived from these main
link data.
The PTN3355 internal DPCD registers can be accessed by the DP source via the
DP AUX channel. The monitor’s DDC control bus may also be controlled via the DP AUX
channel. PTN3355 implements the standard DisplayPort I2C-over-AUX protocol
conversion to provide DP source access to the VGA plug DDC-I2C interface. The
PTN3355 passes through sink-side status change (for example, hot-plug events) to the
source side, through HPD interrupts and DPCD registers.
PTN3355 integrates a 1 : 2 VGA switch that selects between the two channels, depending
on DOCK_IN setting. Also, PTN3355 provides a slave I2C-bus interface for reading and
updating configuration registers. These registers and their settings are described in a
separate document.
7.1 DisplayPort Main Link
The DisplayPort main link consists of two AC-coupled differential pairs. The 50 
termination resistors are integrated inside PTN3355.
The PTN3355 supports HBR at 2.7 Gbit/s and RBR at 1.62 Gbit/s per lane.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
7 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
7.2 DisplayPort auxiliary channel (AUX CH)
The AUX CH is a half-duplex, bidirectional channel between DisplayPort source and sink.
It consists of one differential pair transporting self-clocked data at 1 Mbit/s. The PTN3355
integrates the AUX CH replier (or slave), and responds to transactions initiated by the
DisplayPort source AUX CH requester (or master).
The AUX CH uses the Manchester-II code for the self-clocked transmission of signals;
every ‘zero’ is represented by LOW-to-HIGH transition, and ‘one’ represented by
HIGH-to-LOW transition, in the middle of the bit time.
7.3 DPCD registers
DPCD registers that are part of the VESA DisplayPort standard are described in detail in
Ref. 1. The following describes the specific implementation by PTN3355 only.
PTN3355 DisplayPort receiver capability and status information about the link are
reported by DisplayPort Configuration Data (DPCD) registers, when a DP source issues a
read command on the AUX CH. The DP source device can also write to the link
configuration field of DPCD to configure and initialize the link. The DPCD is DisplayPort
v1.2a compliant.
PTN3355 specific capabilities are made available to DP source in the relevant DPCD
read/write registers. In line with the DisplayPort standard (Ref. 1), the specific Link
controls are also made available to initialize and maintain the DisplayPort Link.
It is the responsibility of the DP source to issue commands only within the capability of the
PTN3355 as defined in the ‘Receiver Capability Field’ in order to prevent undefined
behavior. PTN3355 specific DPCD registers are listed in Table 4.
7.3.1 PTN3355 specific DPCD register settings
Table 4.
PTN3355 specific DPCD registers
DPCD
Description
register [1]
Power-on
Reset
value
Read/write
over
AUX CH
Receiver Capability Field
0000Ch
I2C-bus speed control capabilities bit map. Speed control is 00h
not supported through DPCD register. Default speed of
50 kbit/s is supported.
read only
0000Dh
eDP_CONFIGURATION_CAP.
read only
03h
Bit 0 = ALTERNATE_SCRAMBLER_RESET_CAPABLE.
A setting of 1 indicates that this is an eDP device that
can use the eDP alternate scrambler reset value of
FFFFh.
Bit 1 = FRAMING_CHANGE_CAPABLE. A setting of 1
indicates that this is an eDP device that uses only
Enhanced Framing independently of the setting by the
source of ENHANCED_FRAME_EN.
Bit 2 = reserved for eDP. Read 0.
Bit 3 = DPCD_DISPLAY_CONTROL_CAPABLE. A
setting of 1 indicates that display control registers
starting at address 00700h are enabled.
Bits 7:4 = reserved for eDP. Read all zeros.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
8 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Table 4.
PTN3355 specific DPCD registers …continued
DPCD
Description
register [1]
Power-on
Reset
value
Read/write
over
AUX CH
Link Configuration Field
00109h
I2C-bus speed control capabilities bit map. Speed control is 00h
not supported and the default speed of 50 kbit/s is
supported. Writes are ignored and reads would get zeros.
read/write
0010Ah
Bit 0 = ALTERNATE_SCRAMBLER_RESET_ENABLE.
Source sets to 1 to select the alternate scrambler reset.
Writes ignored if
ALTERNATE_SCRAMBLER_RESET_CAPABLE = 0.
Power-on default value = 0.
00h
read/write
00h
read only
60h
read only
37h
read only
33h
read only
00504h
33h
read only
00505h
55h
read only
00506h
55h
read only
00507h
4Eh
read only
00508h
32h
read only
Bit 1 = FRAMING_CHANGE_ENABLE. Source sets to 1 to
select the framing change. Writes ignored if
FRAMING_CHANGE_CAPABLE = 0. Power-on default
value = 0.
Bits 6:2 = reserved. Read all zeros.
Bit 7 = PANEL_SELF_TEST_ENABLE (not supported in
PTN3355).
Branch device specific field
00500h
BRANCH_IEEE_OUI 7:0
Branch vendor 24-bit IEEE OUI.
NXP OUI = 00
00501h
BRANCH_IEEE_OUI 15:8
NXP OUI = 60
00502h
BRANCH_IEEE_OUI 23:16
NXP OUI = 37
00503h
ID string = 3355N2
00509h
Hardware revision level v1.1
10h
read only
0050Ah
Firmware/software major revision level
01h[2]
read only
Firmware/software minor revision level
00h[2]
read only
0050Bh
0050Ch to RESERVED
005FFh
read only
[1]
Byte fields that are not explicitly listed are by definition reserved (‘RES’) and their default value is 0h.
[2]
Example only. Firmware number changes as firmware updated.
Remark: If necessary, the DDC bus speed control can be done via I2C-bus interface.
For any requirement to change DDC bus speed, contact NXP.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
9 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
7.4 VGA monitor detection
The PTN3355 implements a robust scheme for VGA monitor detection. It senses
presence or absence of VGA monitor load termination (75 ) by pulsing the RGB lines.
The load sensing operation is performed periodically to determine the latest VGA
connectivity status. If the VGA monitor is disconnected, then the detection logic informs
the host platform via IRQ_HPD signal.
7.5 EDID handling
Figure 3 shows a DisplayPort-to-analog video converter between the DisplayPort source
and a VGA monitor. The PTN3355 implements a DP I2C-Over-AUX protocol, providing for
DP source access to the monitor’s DDC bus. With this, the monitor’s EDID data is made
available to DP source for access at any time.
It is the responsibility of the source to choose only video modes which are declared in the
EDID and to adjust the DisplayPort link capabilities (link rate and lane count) to provide
the necessary video bandwidth. The PTN3355 does not cache or modify the EDID to
match the capabilities of the DisplayPort link data.
If the DisplayPort source drives display modes that are not specified in the EDID mode
list, the PTN3355 does not detect such conditions, and it depends entirely on the VGA
display on what is being displayed.
sink device
DisplayPort to VGA adapter IC
source device
DP Tx
embedded
DisplayPort
DP Rx
with DPCD
VIDEO DAC
box-to-box
legacy
VGA DISPLAY
WITH EDID
002aaf640
Fig 3.
DisplayPort to VGA adapter IC sits between the DisplayPort source and a VGA
monitor with EDID
7.6 Triple 8-bit video DACs and VGA outputs
The triple 8-bit video DACs output a 700 mV (peak-to-peak) analog video output signal
into 37.5  load, as is the case of a doubly terminated 75  cable. The DAC is capable of
supporting the maximum pixel rate supported by a two-lane DP link (240 MHz).
7.6.1 DAC reference resistor
An external reference resistor must be connected between pin RSET and ground. This
resistor sets the reference current which determines the analog output level, and is
specified as 1.2 k with a 1 % tolerance. This value allows a 0.7 V (peak-to-peak) output
into a 37.5  load (for example, double-terminated 75  coaxial cable).
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
10 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
8. Power-up and reset
PTN3355 has built-in power-on reset circuitry which automatically sequences the part
through reset and initialization. In addition, there is a dedicated pin (RST_N) to
control/effect reset operation externally. This provides flexibility at the platform level for
debug or application purpose.
Before link is established, the PTN3355 holds VSYNC and HSYNC signals LOW and
blanks the RGB signals.
While the PTN3355 performs power-on initialization,
• The HPD signal is driven LOW, to indicate to the DisplayPort source that the
PTN3355 is not ready for AUX channel communication. Once the device is initialized,
the HPD level is produced based on CFG1_SCL/CFG2_SDA setting
• The RGB outputs are disabled
• The VSYNC and HSYNC outputs are maintained LOW as long as there is no active
video streaming from the DisplayPort source.
9. Configurability and programmability
The PTN3355 delivers flexibility for application usage by providing configurability via two
options:
• Configuration pins CFG1_SCL, CFG2_SDA, CFG5, DOCK_IN and TESTMODE
• DP-AUX vendor-specific configuration registers
The pins provide limited application board level configurability, whereas vendor-specific
configuration registers deliver ultimate flexibility. The configuration pin changes (static,
dynamic) are reflected in the IC behavior.
The configuration pin definitions are as follows:
• CFG1_SCL, CFG2_SDA are used for either host I2C communication or as dedicated
configuration pins with binary leveled I/O. PTN3355 is flexible to accept either. The
use of these configuration pins is defined in Table 8.
• Configuration pin CFG5 selects OSC_IN clock frequency setting. Table 5 captures the
pin definition.
Table 5.
CFG5 pin definition
Configuration input
OSC_IN clock frequency setting
LOW
25 MHz
HIGH
33 MHz
open
27 MHz
Table 6 captures DOCK_IN pin definition.
Table 6.
PTN3355
Product data sheet
DOCK_IN pin definitions
Configuration input
VGA active output
LOW
channel 1
HIGH
channel 2
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
The TESTMODE pin is used to indicate selection of JTAG or Configuration/I2C mode for
CFG1_SCL, CFG2_SDA and CFG5. Table 7 defines the possible combinations of
TESTMODE pin.
Table 7.
TESTMODE pin definition
Pin value
Mode selection
LOW
Configuration pin functionality is selected; I2C address for
CFG1_SCL, CFG2_SDA is 40h.
open
Configuration pin functionality is selected; I2C address for
CFG1_SCL, CFG2_SDA is C0h.
HIGH
JTAG functionality is selected.
CFG1_SCL, CFG2_SDA can be used in I2C mode or configuration pin mode. PTN3355
automatically detects the mode in which these pins are used. If they are used as
Configuration pins, Table 8 determines the possible and allowed combinations for these
pin settings. If they are used as I2C Clock/Data pins, PTN3355 detects toggling of the pins
during I2C data transport and receives data properly.
Table 8.
CFG1_SCL/CFG2_SDA pin definitions
Pin value
System behavior
00
Compliant HPD behavior
01
Most interoperable (non-compliant) HPD behavior
10
Most interoperable (non-compliant) HPD behavior
11
(Default) Compliant behavior (but configurable via I2C-bus)
More configuration options are available through internal configuration registers. These
registers can be accessed by GPU/CPU software driver via DP AUX channel or I2C-bus.
NXP can deliver Windows and DOS based utilities, on explicit request, to upgrade the
firmware or configuration registers only for laboratory evaluation and debugging purposes
at customer premises.
10. Application design-in information
With its maximum integration features, the PTN3355 has low BOM requirement at the
platform application level. Figure 4 illustrates the PTN3355 usage in a system application
context. On the DP side, it is connected to DP source and the VGA side, it is connected to
VGA connector. The PTN3355 system application requires the following components
additionally: supply decoupling capacitors, DC blocking capacitors, pull-up/down resistors,
(optional) inductor for DC-to-DC converter, crystal oscillator. For more details on reference
design information, contact NXP team.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
12 of 37
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
VDD_5V
VBUCK_1V5
VDD_3V3
NXP Semiconductors
PTN3355
VDD_CONN_5V
BAT54
0.1 μF
ML1_P
ML1_N
Place 100 nF capacitor as close
as possible to pin 38 and pin 40
without vias at same side as PTN3355.
AUX_P
AUX_N
HPD
MS_SCL_CFG1
Assume SM_BUS has
pull-up on system side.
VDD_3V3
VDD_3V3
0.1 μF
VBUCK_1V5
VDDA33_DNW
10 kΩ
DOCK_IN
AUX_P
AUX_P
AUX_N
AUX_N
VDDE33_IO
ML0_P
ML0_P
ML0_N
ML0_N
VDDA15_DP
ML1_P
ML1_P
ML1_N
ML1_N
1
2
3
4
5
6
7
8
9
10
PTN3355
RST_N
DDC_SDA2
HPD
CFG1_SCL
CFG5
CFG3
CFG2_SDA
VSYNC2
HSYNC2
DDC_SCL1
1 μF
(optional)
Option design:
Install to support 5 V H/V for
legacy projector and CRTs.
HPD
MS_SCL_CFG1
VDD_5V
RED
DDC_SCL
0.1 μF
DDC_SCL
GND3 16
GND4 17
2 kΩ
MS_SDA_CFG2
74LVC2T45GN
10 kΩ
VDD_3V3
Option design
1
2
3
4
MS_I2C
Header 4 (no load)
I2C BIRD PIN OUT
BAT54
DDC1_PU
CFG5 open: 27 MHz XTAL is used
CFG1, CFG2:
11, default
00, if MS bus is not used
10 kΩ
10 kΩ
MS_SCL_CFG1
Option design:
ESD protection circuitry
VDD_5V
PI filter design is
customer specific
RED
FB
GRN
22 Ω; 300 mA
BLU
75 Ω
75 Ω
75 Ω
3.3 pF
3.3 pF
DNL
RED_VGA
FB
GRN_VGA
22 Ω; 300 mA
FB
3.3 pF
3.3 pF
DNL
22 Ω; 300 mA
3.3 pF
3.3 pF
DNL
BLU_VGA
002aah568
Parts shown with shading are extra components required in DC-to-DC converter mode to achieve low power performance.
Fig 4.
Application with DC-to-DC converter mode
PTN3355
13 of 37
© NXP Semiconductors N.V. 2014. All rights reserved.
HS_5V
VS_5V
VGA_CONN
2 kΩ
CFG3 CFG3 open: not used
CFG5_XTAL
MS_SDA_CFG2
0.1 μF
1 VCCA VCCB 8
HSYNC_VGA 2
1A
1B 7
VSYNC_VGA 3
2A
2B 6
4 GND
DIR 5
VSYNC_VGA
1.2 kΩ ± 1 %
RSET
30
GRN2
29
GRN1
GRN
28
BLU2
27
BLU1
BLU
26
36 Ω
HSYNC1
HSYNC_VGA
25
VSYNC1
VSYNC_VGA
24
DDC_SCL2 36 Ω
23
DDC_SDA1
DDC_SDA
22
VDDE33_IO
21
VDD_3V3
11
12
13
14
15
16
17
18
19
20
0.01 μF
0.1 μF
HSYNC_VGA
BLU_VGA
0.1 μF
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Rev. 3 — 14 July 2014
All information provided in this document is subject to legal disclaimers.
0.1 μF
VDD_3V3
DDC_SDA
GRN_VGA
Resonator (with
built-in capacitors)
40
39
38
37
36
35
34
33
32
31
100 kΩ
(optional)
MS_SDA_CFG2
RED_VGA
27 MHz
10 pF
0.1 μF
4.7 μF
RED_RTN
NC1
RED
GREEN_RTN
SDA
GREEN
BLU_RTN
HS
BLUE
+5V
VS
NC2
GND1
SCL
GND2
6
11
1
7
12
2
8
13
3
9
14
4
10
15
5
0.1 μF
0.1 μF
10 pF
CPU/GPU
ML0_N
2.2 μF
PESD5V0U2BT
(optional)
0.1 μF
FB
PESD5V0U2BT
(optional)
0.1 μF
ML0_P
PESD5V0U2BT
(optional)
0.1 μF
DIE PAD
0.1 μF
PGND
4.7 μH
SWOUT
PVDD33
VDD_3V3
TESTMODE
open: I2C address = C0h
VDDD15
VDDA15_DAC
OSC_OUT
OSC_IN
RED2
RED1
Product data sheet
+3.3 V
VDD_5V +3.3 V
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PTN3355
VDD_3V3
0.1 μF
C60
0.1 μF
C61
0.1 μF
C10
0.1 μF
C11
0.1 μF
CPU/GPU
2.2 μF
ML0_N
ML1_N
VDDD15
AUX_P
VDD_3V3
AUX_N
0.1 μF
U1
0.1 μF
VDDA33_DNW
DOCK_IN
AUX_P
AUX_P
AUX_N
AUX_N
VDDE33_IO
ML0_P
ML0_P
ML0_N
ML0_N
VDDA15_DP
ML1_P
ML1_P
ML1_N
ML1_N
1
2
3
4
5
6
7
8
9
10
Application with LDO mode
30
29
28
27
26
25
24
23
22
21
GND3 16
GND4 17
RSET 1.2 kΩ ± 1 %
GRN2
GRN1
GRN
BLU2
BLU1
BLU
36 Ω
HSYNC1
HSYNC_VGA
VSYNC1
VSYNC_VGA
DDC_SCL2
36 Ω
DDC_SDA1
DDC_SDA
VDDE33_IO
VDD_3V3
MS_SDA_CFG2
MS_SCL_CFG1
HPD
0.1 μF
DDC_SCL
CFG5_XTAL
CFG3
CFG1, CFG2:
11, default
00, if MS bus is not used
Fig 5.
DDC_SCL
2.2 kΩ
VGA_CONN
BLU
GRN
RED
75 Ω
75 Ω
75 Ω
VDD_5V
2.2 kΩ
aaa-010214
PTN3355
14 of 37
© NXP Semiconductors N.V. 2014. All rights reserved.
TESTMODE open: I2C address = C0h
CFG5 open: 27 MHz XTAL is used
CFG3 open: not used
RED
PTN3355
0.1 μF
CFG5_XTAL
TESTMODE
DOCK_IN
MS_SCL_CFG1
MS_SDA_CFG2
CFG3
VSYNC_VGA
11
12
13
14
15
16
17
18
19
20
VDD_3V3
HSYNC_VGA
BLU
PI filter
design is
customer
specific
RED_RTN
NC1
RED
GREEN_RTN
SDA
GREEN
BLU_RTN
HS
BLUE
+5V
VS
NC2
GND1
SCL
GND2
40
39
38
37
36
35
34
33
32
31
VDD_3V3
DDC_SDA
GRN
6
11
1
7
12
2
8
13
3
9
14
4
10
15
5
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Rev. 3 — 14 July 2014
All information provided in this document is subject to legal disclaimers.
HPD
MS_SCL_CFG1
MS_SDA_CFG2
Assume SMBus has pull-up on system side.
0.1 μF
RED
27 MHz
resonator (with
built-in capacitors)
ML1_P
DIE PAD
C21
VDD_5V
ML0_P
0.1 μF
0.1 μF
PGND
SWOUT
PVDD33
TESTMODE
VDDD15
VDDA15_DAC
OSC_OUT
OSC_IN
RED2
RED1
C59
RST_N
DDC_SDA2
HPD
CFG1_SCL
CFG5
CFG3
CFG2_SDA
VSYNC2
HSYNC2
DDC_SCL1
Product data sheet
VDD_5V VDD_3V3
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
10.1 Display resolution
Table 9 lists some example display resolutions and clock rates that PTN3355 supports.
(Refer to Footnote 1 on page 2.)
Table 9.
Display resolution and pixel clock rate[1]
Display
type
Active video
Total frame
VGA
640
480
800
525
24
59.94
25.175
0.76
Industry standard
SVGA
800
600
1056
628
24
60.317
40.000
1.20
VESA guidelines
XGA
1024
768
1344
806
24
60.004
65.000
1.95
VESA guidelines
XGA+
1152
864
1600
900
24
75
108.000
3.24
VESA standard
HD
1360
768
1792
795
24
60.015
85.500
2.56
VESA standard
HD/WXGA
1366
768
1792
798
24
59.79
85.501
2.57
VESA standard
HD/WXGA
1280
720
1650
750
24
60
74.250
2.23
CEA standard
WXGA
1280
800
1680
831
24
59.81
83.500
2.50
CVT
Horizontal Vertical Horizontal Vertical
total (pixel) total (line)
Bits
per
pixel
Vertical
Pixel
frequency clock
(Hz)
(MHz)
Data
Standard type
rate
(Gbit/s)
WXGA
1280
800
1696
838
24
74.934
106.500
3.19
CVT
WXGA
1280
800
1712
843
24
84.88
122.500
3.68
CVT
SXGA
1280
960
1800
1000
24
60
108.000
3.24
VESA standard
SXGA
1280
1024
1688
1066
24
60.02
108.000
3.24
VESA standard
SXGA
1280
1024
1688
1066
24
75.025
135.001
4.05
VESA standard
SXGA
1280
1024
1728
1072
24
85.024
157.500
4.72
VESA standard
SXGA+
1400
1050
1864
1089
24
59.978
121.749
3.65
CVT
WXGA+
1440
900
1904
934
24
59.887
106.499
3.19
CVT
HD+
1600
900
1800
1000
24
60 (RB)
108.000
3.24
VESA standard
UXGA
1600
1200
2160
1250
24
60
162.000
4.86
VESA standard
UXGA
1600
1200
2160
1250
24
65
175.500
5.27
VESA standard
WSXGA+
1680
1050
2240
1089
24
59.954
146.249
4.39
CVT
FHD
1920
1080
2200
1125
24
60
148.500
4.46
CEA standard
WUXGA
1920
1200
2592
1245
18
59.885
193.251
4.35
CVT
WUXGA
1920
1200
2080
1235
24
59.95 (RB) 154.000
4.62
CVT RB
2.76M3
1920
1440
2600
1500
18
60
234.000
5.27
VESA standard
QWXGA
2048
1152
2250
1200
24
60 (RB)
162.000
4.86
CVT RB
QXGA
2048
1536
2128
1573
24
49.95 (RB) 167.20
5.02
CVT RB
[1]
Contact NXP team for other monitor timings not listed in this table.
The available bandwidth over a 2-lane HBR DisplayPort v1.2a link limits pixel clock rate
support to:
• 240 MHz at 6 bpc
• 180 MHz at 8 bpc
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
15 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
10.2 Power supply filter
Sufficient decoupling capacitance to ground should be connected from each VDD pin
directly to ground to filter supply noise.
10.3 DAC terminations
Typically, the VGA RGB outputs are (doubly) terminated. Figure 6 shows an example
VGA application. A 75  termination is used to terminate inside the motherboard, and
another 75  termination is typically used inside the RGB monitor. The load sensing
mechanism assumes this double termination. Figure 7 is another example of VGA
application with 50  PCB trace impedance with 150  terminations.
In general, it is left to the system integrator to decide on their specific implementation.
close to
VGA connector
37.5 Ω
PCB traces
75 Ω
PCB traces
PCB
EMI
filter
RED, GRN, BLU
DAC
GND
75 Ω
cable
75 Ω
75 Ω
MOTHERBOARD
MONITOR
002aah582
Fig 6.
PTN3355 DAC termination example 1
close to
PTN3355
37.5 Ω
PCB traces
close to
VGA connector
50 Ω
PCB traces
75 Ω
PCB traces
PCB
EMI
filter
RED, GRN, BLU
DAC
GND
150 Ω
150 Ω
MOTHERBOARD
75 Ω
cable
75 Ω
MONITOR
aaa-010215
Fig 7.
PTN3355
Product data sheet
PTN3355 DAC termination example 2
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
16 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
10.4 Timing reference
PTN3355 requires a crystal or ceramic resonator for a stable VGA clock timing reference.
Resonators have a higher frequency tolerance than crystals, but have the advantage of
integrated capacitors and therefore a small PCB area and potentially lower cost.
Table 10.
Required crystal specifications (SMD components)
Crystal parameters
PTN3355
Product data sheet
Specifications
Frequency
25 MHz, 27 MHz or 33 MHz
Operation mode
Fundamental
Frequency tolerance
1 % maximum
Frequency stability over temperature
0.4 % maximum
Load capacitance (CL)
18 pF
Shunt capacitance
< 2 pF
Equivalent Series Resistance (ESR)
< 150 
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
17 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
11. Limiting values
Table 11. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD(3V3)
supply voltage (3.3 V)
VI
input voltage
Tstg
storage temperature
VESD
Conditions
Min
Max
Unit
0.3
+4.6
V
0.3
VDD(3V3) + 0.5
V
65
+150
C
HBM
[1]
-
7500
V
CDM
[2]
-
1000
V
3.3 V CMOS inputs
electrostatic discharge voltage
[1]
Human Body Model: ANSI/ESDA/JEDEC JDS-001-2012 (Revision of ANSI/ESDA/JEDEC JS-001-2011), ESDA/JEDEC Joint standard
for ESD sensitivity testing, Human Body Model - Component level; Electrostatic Discharge Association, Rome, NY, USA; JEDEC Solid
State Technology Association, Arlington, VA, USA.
[2]
Charged Device Model: JESD22-C101E December 2009 (Revision of JESD22-C101D, October 2008), standard for ESD sensitivity
testing, Charged Device Model - Component level; JEDEC Solid State Technology Association, Arlington, VA, USA.
12. Recommended operating conditions
Table 12.
Operating conditions
Symbol
Parameter
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
tr
rise time
supply voltage
3.3
3.6
V
-
10
ms
VI
input voltage
0
3.3
3.6
V
SDA and SCL inputs with respect
to ground
0
5
5.5
V
Rext(RSET)
external resistance on pin RSET between RSET (pin 21) and GND
-
1.20  1 %
-
k
Tamb
ambient temperature
0
-
85
C
PTN3355
Product data sheet
Conditions
Min
Typ
2.8
-
3.3 V CMOS inputs
commercial grade
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
18 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13. Characteristics
13.1 Current consumption, power dissipation and thermal characteristics
Table 13. Current consumption, power dissipation and thermal characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDD
supply current
normal operation, WUXGA / 193 MHz pixel
clock; VDD(3V3) = 3.3 V
-
60
-
mA
Low power D3 mode; VDD(3V3) = 3.3 V
-
124
-
A
Buck converter mode;
PTN3355 being used as per Figure 4
-
200
-
mW
LDO mode;
PTN3355 being used as per Figure 5
-
405
-
mW
-
45
-
K/W
P
power dissipation
Rth(j-a)
normal operation, WUXGA / 193 MHz pixel clock
(reduced blanking)
thermal resistance from
junction to ambient
in free air for SOT618-1
Table 14. Device characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tstartup
start-up time
device start-up time from power-on to HPD = HIGH;
VGA monitor remains connected at power-on[1];
RST_N = HIGH; supply voltage within operating range to
specified operating characteristics
-
-
100
ms
tw(rst)
reset pulse width
device is supplied with valid supply voltage
10
-
-
s
td(rst)
reset delay time
device reset delay time from RST_N toggling (LOW to
HIGH) until HPD goes HIGH;
VGA monitor remains connected at power-on[1];
supply voltage within operating range to specified
operating characteristics
-
-
100
ms
[1]
VGA monitor remains connected at power-on — this condition is applicable only when PTN3355 is used in most interoperable
(non-compliant) HPD mode (that is, CFG1_SCL/CFG2_SDA is ‘01’ or ‘10’).
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
19 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13.2 DisplayPort receiver main link
Table 15. DisplayPort receiver main link characteristics[1]
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
UI
unit interval
for high bit rate
(2.7 Gbit/s per lane)
-
370
-
ps
for low bit rate
(1.62 Gbit/s per lane)
-
617
-
ps
[2]
0.0
-
0.5
%
for high bit rate
[3]
120
-
-
mV
for reduced bit rate
[3]
40
-
-
mV
RX DC common mode voltage
[4]
0
-
2.0
V
IRX_SHORT
RX short-circuit current limit
[5]
CRX
AC coupling capacitor
fRX_TRACK_BW_HBR
jitter closed loop tracking bandwidth
(High Bit Rate)
fRX_TRACK_BW_RBR
jitter closed loop tracking bandwidth
(Reduced Bit Rate)
fDOWN_SPREAD
link clock down spreading
VRX_DIFFp-p
differential input peak-to-peak
voltage
VRX_DC_CM
at RX package pins
-
-
50
mA
75
-
200
nF
[6]
10
-
20
MHz
[6]
5.4
-
20
MHz
on DP Main Link and
AUX inputs
[1]
Ref. 1 supersedes in case of any mismatch of specification items.
[2]
Up to 0.5 % down spread is supported. Modulation frequency range of 30 kHz to 33 kHz must be supported.
[3]
Informative; refer to Figure 8 for definition of differential voltage.
[4]
Common mode voltage is equal to Vbias_RX voltage.
[5]
Total drive current of the input bias circuit when it is shorted to its ground.
[6]
The measurements are always taken with PRBS7 test signal. Minimum CDR closed loop tracking bandwidth at the receiver when the
input is a PRBS7 pattern.
VD+
VDIFF_PRE
VCM
VDIFF
VD−
002aaf363
pre-emphasis = 20Log(VDIFF_PRE / VDIFF)
Fig 8.
PTN3355
Product data sheet
Definitions of pre-emphasis and differential voltage
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
20 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13.3 DisplayPort receiver AUX CH
Table 16. DisplayPort receiver AUX CH characteristics[1]
Over operating free-air temperature range, unless otherwise noted.
Symbol
UI
Parameter
Conditions
unit interval
tjit(cc)
VAUX_DIFFp-p
cycle-to-cycle jitter time
AUX differential peak-to-peak
voltage
Min
Typ
Max
Unit
AUX
[2]
0.4
0.5
0.6
s
transmitting device
[3]
-
-
0.04
UI
receiving device
[4]
-
-
0.05
UI
transmitting device
[5]
0.39
-
1.38
V
receiving device
[5]
0.32
-
1.36
V
RAUX_TERM(DC)
AUX CH termination DC resistance informative
-
100
-

VAUX_DC_CM
AUX DC common-mode voltage
[6]
0
-
2.0
V
VAUX_TURN_CM
AUX turnaround common-mode
voltage
[7]
-
-
0.3
V
IAUX_SHORT
AUX short-circuit current limit
[8]
-
-
90
mA
CAUX
AUX AC coupling capacitor
[9]
75
-
200
nF
[1]
Ref. 1 supersedes in case of any mismatch of specification items.
[2]
Results in the bit rate of 1 Mbit/s including the overhead of Manchester II coding.
[3]
Maximum allowable UI variation within a single transaction at connector pins of a transmitting device. Equal to 24 ns maximum. The
transmitting device is a source device for a request transaction and a sink device for a reply transaction.
[4]
Maximum allowable UI variation within a single transaction at connector pins of a receiving device. Equal to 30 ns maximum. The
transmitting device is a source device for a request transaction and a sink device for a reply transaction.
[5]
VAUX_DIFFp-p = 2  VAUX+  VAUX.
[6]
Common-mode voltage is equal to Vbias_TX (or Vbias_RX) voltage.
[7]
Steady-state common-mode voltage shift between transmit and receive modes of operation.
[8]
Total drive current of the transmitter when it is shorted to its ground.
[9]
The AUX CH AC coupling capacitor placed both on the DisplayPort source and sink devices.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
21 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13.4 HPD characteristics
Table 17. HPD characteristics[1]
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Output characteristics
VOH
HIGH-level output voltage
IOH = 2 mA
2.4
-
-
V
VOL
LOW-level output voltage
IOL = 2 mA
-
-
0.4
V
IOSH
HIGH-level short-circuit
output current
drive HIGH; cell connected to ground
-
-
16
mA
IOSL
LOW-level short-circuit
output current
drive LOW; cell connected to VDD
-
-
15
mA
[1]
Ref. 1 supersedes in case of any mismatch of specification items.
13.5 DDC/I2C characteristics
Table 18. DDC/I2C characteristics
VCC = 4.5 V to 5.5 V[1]. Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input characteristics
VIH
HIGH-level input voltage
0.7  VDD(3V3)
-
5.5
V
VIL
LOW-level input voltage
0.5
-
+0.3  VDD(3V3)
V
VI(hys)
hysteresis of input voltage
0.1  VDD(3V3)
-
-
V
ILI
input leakage current
VI = 5 V
-
-
10
A
Output characteristics
IOL
LOW-level output current
VOL = 0.4 V
3.0
-
-
mA
IO(sc)
short-circuit output current
drive LOW;
cell connected to VDD(3V3)
-
-
40.0
mA
Cio
input/output capacitance
VI = 3 V or 0 V
VDD(3V3) = 3.3 V
-
6
7
pF
VDD(3V3) = 0 V
-
6
7
pF
[1]
VCC is the pull-up voltage for DDC/I2C.
[2]
Table 18 applies to CFG1_SCL and CFG2_SDA pins as they operate as I2C-bus I/O.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
22 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13.6 DAC
Table 19. DAC characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Nres(DAC)
DAC resolution
-
-
8
bit
fclk
clock frequency
Io(DAC)
DAC output current variation
-
-
240
MHz
-
-
4
%
INL
integral non-linearity
1
0.25
+1
LSB
DNL
differential non-linearity
0.5
0.1
+0.5
LSB
Vo(DAC)max
maximum DAC output voltage
665
700
770
mV
Co(DAC)
DAC output capacitance
-
3.5
-
pF
DAC noise injection ratio
1.5
-
+1.5
%
DAC-to-DAC
13.7 HSYNC, VSYNC characteristics
Table 20. HSYNC and VSYNC characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
2.4
-
-
V
Output characteristics
VOH
HIGH-level output voltage
IOH = 8 mA;
VDD(3V3) = 3.3 V  10 %
VOL
LOW-level output voltage
IOL = 8 mA
IOSH
HIGH-level short-circuit output current
drive HIGH;
cell connected to ground
[1]
IOSL
LOW-level short-circuit output current
drive LOW;
cell connected to VDD
[1]
[1]
-
-
0.5
V
-
-
100
mA
-
-
100
mA
The parameter values specified are simulated and absolute values.
13.8 Configuration pins CFG5, DOCK_IN, TESTMODE
Table 21. Configuration pins characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
V
Input characteristics
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
0.7  VDD(3V3) -
0.3  VDD(3V3) V
Weak pull-down characteristics
Ipd
pull-down current
VI = VDD(3V3)
15
30
70
A
Ipu
pull-up current
VI = 0 V
25
55
90
A
Rext
external resistance
external resistor used on
configuration pins
-
-
10
k
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
23 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
13.9 RST_N
Table 22. RST_N characteristics
Over operating free-air temperature range, unless otherwise noted.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
Input characteristics
VIH
HIGH-level input voltage
0.7  VDD(3V3) -
-
VIL
LOW-level input voltage
-
-
0.3  VDD(3V3) V
25
55
90
Ipu(RST_N) pull-up current on
pin RST_N
PTN3355
Product data sheet
VI = 0 V
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
A
© NXP Semiconductors N.V. 2014. All rights reserved.
24 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
14. Package outline
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm
A
B
D
SOT618-1
terminal 1
index area
A
A1
E
c
detail X
e1
e
C
v
w
1/2 e b
11
20
C A B
C
y
y1 C
L
21
10
e
Eh
e2
1/2 e
1
30
terminal 1
index area
40
31
X
Dh
0
2.5
Dimensions (mm are the original dimensions)
Unit
mm
A(1)
A1
b
max 1.00 0.05 0.30
nom 0.85 0.02 0.21
min 0.80 0.00 0.18
5 mm
scale
c
D(1)
Dh
E(1)
Eh
e
e1
e2
L
v
0.2
6.1
6.0
5.9
4.25
4.10
3.95
6.1
6.0
5.9
4.25
4.10
3.95
0.5
4.5
4.5
0.5
0.4
0.3
0.1
w
y
0.05 0.05
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
SOT618-1
Fig 9.
References
IEC
JEDEC
JEITA
sot618-1_po
European
projection
Issue date
02-10-22
13-11-05
MO-220
Package outline SOT618-1 (HVQFN40)
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
25 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
15. Packing information
SOT618-1
HVQFN40; Reel dry pack, SMD, 13”; Q2/T3 turn product orientation
Orderable part number ending ,528 or MP; Ordering code (12NC) ending 528
15.1 Packing method
Barcode label
Dry-agent
Bag
ESD print
Relative humidity
indicator
Moisture caution
print
ESD embossed
Tape
Reel assembly
Barcode label
Guard band
Printed plano box
Cover tape
Carrier tape
Space for additional
label
Preprinted ESD
warning
Barcode label
Drypack ID sticker
Preprinted Hyatt patent
Printed plano box
QA seal
aaa-005677
Fig 10. Dry reel pack for SMD
Table 23.
Reel dimensions
d  w (mm) [1]
SPQ/PQ (pcs)
Reels per box
Outer box dimensions
l  w  h (mm)
330  16
4000
1
339  335  43
[1]
PTN3355
Product data sheet
Dimensions and quantities
d = reel diameter; w = tape width.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
26 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
15.2 Product orientation
pin 1
aaa-006538
Pin 1 is in quadrant 2.
Fig 11. Product orientation in carrier tape
15.3 Carrier tape dimensions
4 mm
W
K0
A0
B0
P1
T
direction of feed
001aao148
Fig 12. Carrier tape dimensions
Table 24. Carrier tape dimensions
In accordance with IEC 60286-3.
PTN3355
Product data sheet
A0 (mm)
B0 (mm)
K0 (mm)
T (mm)
P1 (mm)
W (mm)
6.3
6.3
1.1
-
12
16
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
27 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
15.4 Reel dimensions
A
Z
W2
B
ØC
ØD
detail Z
001aao149
Fig 13. Schematic view of reel
Table 25. Reel dimensions
In accordance with IEC 60286-3.
PTN3355
Product data sheet
A [nom]
(mm)
W2 [max]
(mm)
B [min]
(mm)
C [min]
(mm)
D [min]
(mm)
330
18.4
1.5
12.8
20.2
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
28 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
15.5 Barcode label
Fixed text
Country of origin
i.e. "Made in....." or
"Diffused in EU [+]
Assembled in......
Packing unit (PQ) identification
2nd traceability lot number*
2nd (youngest) date code*
2nd Quantity*
Traceability lot number
Date code
With linear barcode
Quantity
With linear barcode
Type number
NXP 12NC
With linear barcode
NXP SEMICONDUCTORS
MADE IN >COUNTRY<
[PRODUCT INFO]
(Q) QTY
Optional product information*
Re-approval date code*
Origin code
Product Manufacturing Code
MSL at the Peak Body solder
temperature with tin/lead*
MSL at the higher lead-free
Peak Body Temperature*
2D matrix with all data
(including the data identifiers)
HALOGEN FREE
(30P) TYPE
RoHS compliant
(1P) CODENO
Additional info if halogen
free product
Additional info on RoHS
(33T) PUID: B.0987654321
(30T) LOT2
(31D) REDATE
(30D) DATE2 (32T) ORIG
(30Q) QTY2
(31T) PMC
(31P) MSL/PBT
(1T) LOT
MSL/PBT
(9D) DATE
Lead-free symbol
001aak714
Fig 14. Box and reel information barcode
Table 26.
Barcode dimensions
Box barcode label
l  w (mm)
Reel barcode label
l  w (mm)
100  75
100  75
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
29 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 15) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27 and 28
Table 27.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
PTN3355
Product data sheet
< 350
 350
< 2.5
235
220
 2.5
220
220
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
30 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Table 28.
Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 15.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 15. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
31 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
17. Soldering: PCB footprints
Footprint information for reflow soldering of HVQFN40 package
SOT618-1
Hx
Gx
D
P
0.025
0.025
C
(0.105)
SPx
nSPx
Hy
SPy tot
SPy
Gy
SLy
nSPy
By
Ay
SPx tot
SLx
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
nSPx
nSPy
3
3
Dimensions in mm
P
Ax
Ay
Bx
By
C
D
SLx
SLy
SPx tot
SPy tot
SPx
SPy
Gx
Gy
Hx
Hy
0.500
7.000
7.000
5.200
5.200
0.900
0.290
4.100
4.100
2.400
2.400
0.600
0.600
6.300
6.300
7.250
7.250
Issue date
07-05-07
09-06-11
sot618-1_fr
Fig 16. PCB footprint for SOT618-1 (HVQFN40); reflow soldering
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
32 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
18. Abbreviations
Table 29.
PTN3355
Product data sheet
Abbreviations
Acronym
Description
AUX CH
Auxiliary Channel
BER
Bit Error Rate
bpc
bits per color
bpp
bits per pixel
BoM
Bill of Materials
CDM
Charged-Device Model
CEA
Consumer Electronic Association
CMOS
Complementary Metal-Oxide Semiconductor
CVT
Coordinated Video Timings
CVT RB
CVT Reduced Blanking
DAC
Digital-to-Analog Converter
DDC
Display Data Channel
DJ
Deterministic Jitter
DP
DisplayPort (VESA)
DPCD
DisplayPort Configuration Data
ECC
Error Correction Code
EDID
Extended Display Identification Data
eDP
embedded DisplayPort
ESD
ElectroStatic Discharge
HBM
Human Body Model
HBR
High Bit Rate
HDCP
High-bandwidth Digital Content Protection
HPD
Hot Plug Detect
I2C-bus
Inter-Integrated Circuit bus
IEC
International Electrotechnical Commission
I/O
Input/Output
LSB
Least Significant Bit
MCCS
Monitor Control Command Set (VESA)
MSB
Most Significant Bit
NVM
Non Volatile Memory
QXGA
Quad eXtended Graphics Array
RB
Reduced Blanking
RBR
Reduced Bit Rate
RGB
Red/Green/Blue
SSC
Spread Spectrum Clocking
SVGA
Super Video Graphics Array
SXGA
Super eXtended Graphics Array
TJ
Total Jitter
UI
Unit Interval
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
33 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Table 29.
Abbreviations …continued
Acronym
Description
UXGA
Ultra eXtended Graphics Array
VESA
Video Electronics Standards Association
VGA
Video Graphics Array
VSIS
Video Signal Interface Standard
WUXGA
Wide Ultra eXtended Graphics Array
XGA
eXtended Graphics Array
19. References
[1]
VESA DisplayPort Standard — Version 1, Revision 2a; March 2012
[2]
Display Data Channel Command Interface Standard — Version 1.1;
October 29, 2004
[3]
Video Signal Standard (VSIS) — Version 1, Rev. 2; December 12, 2002
[4]
IEC 61000-4-2, Electromagnetic compatibility (EMC) - Part 4-2: Testing and
measurement techniques — ElectroStatic Discharge (ESD) immunity test,
edition 2.0, 2008-12
20. Revision history
Table 30.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PTN3355 v.3
20140714
Product data sheet
-
PTN3355 v.2
Modifications:
•
Updated Figure 4
PTN3355 v.2
20140703
Product data sheet
-
PTN3355 v.1
PTN3355 v.1
20140310
Product data sheet
-
-
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
34 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
21. Legal information
21.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
21.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PTN3355
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
35 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
21.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
22. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PTN3355
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 July 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
36 of 37
PTN3355
NXP Semiconductors
Low power DP to VGA adapter with integrated 1 : 2 VGA switch
23. Contents
1
2
2.1
2.2
2.3
2.4
2.5
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.4
7.5
7.6
7.6.1
8
9
10
10.1
10.2
10.3
10.4
11
12
13
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
14
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
VESA-compliant DisplayPort converter . . . . . . 1
VESA-compliant eDP extensions . . . . . . . . . . . 1
DDC channel output . . . . . . . . . . . . . . . . . . . . . 2
Analog video output . . . . . . . . . . . . . . . . . . . . . 2
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
DisplayPort Main Link . . . . . . . . . . . . . . . . . . . . 7
DisplayPort auxiliary channel (AUX CH). . . . . . 8
DPCD registers. . . . . . . . . . . . . . . . . . . . . . . . . 8
PTN3355 specific DPCD register settings . . . . 8
VGA monitor detection . . . . . . . . . . . . . . . . . . 10
EDID handling . . . . . . . . . . . . . . . . . . . . . . . . 10
Triple 8-bit video DACs and VGA outputs . . . 10
DAC reference resistor . . . . . . . . . . . . . . . . . . 10
Power-up and reset . . . . . . . . . . . . . . . . . . . . . 11
Configurability and programmability . . . . . . . 11
Application design-in information . . . . . . . . . 12
Display resolution . . . . . . . . . . . . . . . . . . . . . . 15
Power supply filter . . . . . . . . . . . . . . . . . . . . . 16
DAC terminations . . . . . . . . . . . . . . . . . . . . . . 16
Timing reference. . . . . . . . . . . . . . . . . . . . . . . 17
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18
Recommended operating conditions. . . . . . . 18
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19
Current consumption, power dissipation and
thermal characteristics . . . . . . . . . . . . . . . . . . 19
DisplayPort receiver main link . . . . . . . . . . . . 20
DisplayPort receiver AUX CH . . . . . . . . . . . . . 21
HPD characteristics . . . . . . . . . . . . . . . . . . . . 22
DDC/I2C characteristics . . . . . . . . . . . . . . . . . 22
DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
HSYNC, VSYNC characteristics. . . . . . . . . . . 23
Configuration pins CFG5, DOCK_IN,
TESTMODE . . . . . . . . . . . . . . . . . . . . . . . . . . 23
RST_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25
15
15.1
15.2
15.3
15.4
15.5
16
16.1
16.2
16.3
16.4
17
18
19
20
21
21.1
21.2
21.3
21.4
22
23
Packing information . . . . . . . . . . . . . . . . . . . .
Packing method . . . . . . . . . . . . . . . . . . . . . . .
Product orientation . . . . . . . . . . . . . . . . . . . . .
Carrier tape dimensions . . . . . . . . . . . . . . . . .
Reel dimensions . . . . . . . . . . . . . . . . . . . . . .
Barcode label . . . . . . . . . . . . . . . . . . . . . . . . .
Soldering of SMD packages . . . . . . . . . . . . . .
Introduction to soldering. . . . . . . . . . . . . . . . .
Wave and reflow soldering. . . . . . . . . . . . . . .
Wave soldering . . . . . . . . . . . . . . . . . . . . . . .
Reflow soldering . . . . . . . . . . . . . . . . . . . . . .
Soldering: PCB footprints . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
References. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
26
27
27
28
29
29
29
29
30
30
32
33
34
34
35
35
35
35
36
36
37
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 July 2014
Document identifier: PTN3355
Similar pages