457-04

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE F
DATE 14 MAY 2013
SCALE 4:1
F
0.08 (0.003)
C
−A−
J
M
T B
S
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
S
S
DIM
A
B
C
D
F
H
J
K
L
R
S
PIN 1
−B−
K
PIN 2
R
L
J
D
H
0.08 (0.003)
−T−
STYLE 1:
PIN 1. CATHODE
2. ANODE
STYLE 2:
PIN 1. ANODE OR CATHODE
2. CATHODE OR ANODE
(BI−DIRECTIONAL)
M
T B
S
C
0.635
0.025
2 1
M
XXXG
2
STYLE 2
M
XXXG
2
STYLE 3
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
1.27
0.050
SCALE 10:1
M
XXXG
1
0.762
0.030
2.54
0.100
1
STYLE 1
SOLDERING FOOTPRINT*
2.67
0.105
GENERIC
MARKING DIAGRAMS*
S
STYLE 3:
PIN 1. ANODE
2. CATHODE
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98ASB14853C
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
POWERMITE
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ASB14853C
PAGE 2 OF 2
ISSUE
REVISION
DATE
E
ADDED SOLDERING FOOTPRINT AND MARKING DIAGRAMS, STYLES 1, 2 & 3.
REQ. BY D. TRUHITTE.
26 NOV 2008
F
MODIFED NOTE 3 FROM ‘DIMENSION A’ TO ‘DIMENSIONS A AND B’. REQ. BY
D. TRUHITTE.
14 MAY 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. F
Case Outline Number:
457
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