Product Family Data Sheet Rev. 2.0 2016.5.27 High Voltage LED Series Chip on Board - Small LES COB line-up - LCo20C Small LES COBs are well-suited for compact spot light system Features & Benefits • Suitable for luminaires with narrow beam angle such as shop lighting • Maximize Center Beam Candle Power(CBCP) • Reduce lighting system cost with smaller optical component • High reliability without wire-bonding Applications • Spotlight / Downlight • LED Retrofit Bulbs 1# 2 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Ambient / Operating Temperature Ta -40 ~ +105 ºC Storage Temperature Tstg -40 ~ +120 ºC Case Temperature Tc 105 ºC LED Junction Temperature TJ 140 ºC Forward Current IF 810 mA Minimum Current IF_min 20 mA ESD (HBM) - ±2 kV Notes: 1) Refer to 4. Outline Drawing & Dimension for Tc point. 2) Refer to the Derating curve for proper driving current that maintained below Maximum junction temperature. b) Electro-optical Characteristics (IF = 540 mA, TJ = 85 ºC) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) *1, *2 V - 31.5 34.5 37.5 5 80 - - 7 90 - - Color Rendering Index (Ra) *1, *2 Thermal Resistance (Junction to Tc point) ºC/W - 1.6 1.9 Beam Angle º - 115 - Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = 85 °C). 2) Samsung maintains measurement tolerance of: Forward Voltage = ±5 %, CRI = ±1 3 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H 2 H D N C 0 5 Y H V 3 C 1 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version 2 Form Factor HD 9 Lens Type N No lens 10 Internal Code C LC020C 11 Chip Type 0 Minor version 5 Min. 80 12 CRI & Sorting Temperature 7 Min. 90 1 2 3 4 5 6 7 8 13 14 15 Forward Voltage (V) Specification White Version COB YH 31.5~37.5 W 2700 K V 3000 K U 3500 K T 4000 K R 5000 K Q 5700 K 2 MacAdam 2-step 3 MacAdam 3-step T ANSI bin CCT (K) 16 MacAdam / ANSI : Ra min.80 17 18 2700K C3, B3, A3 3000K D3, C3, B3 3500K E3, D3, C3 4000K E3, D3, C3 5000K F3, E3, D3 5700K F3, E3, D3 2700K K2, H2, G2 3000K L2, K2, H2 3500K A3, L2, K2 4000K B3, A3, L2 Luminous Flux C1 Ra min.90 4 a) 20W Luminous Flux Characteristics CRI (Ra) Lumen Flux Min. Rank (IF = 540 mA) 1) CCT Sorting @ TJ = 85 °C (lm) Min. Max. G 3 2900 3110 F 3 2710 2900 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 B 3 2070 2220 A 3 1930 2070 L 2 1810 1930 2700K 3000K 2700K 3000K 3500K 4000K 3500K 4000K 5000K 5700K 80 K 2 1690 1810 H 2 1580 1690 G 2 1480 1580 F 2 1380 1480 CRI (Ra) Lumen Flux Min. Rank 90 1) CCT Sorting @ TJ = 85 °C (lm) Min. Max. F 3 2710 2900 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 B 3 2070 2220 A 3 1930 2070 L 2 1810 1930 K 2 1690 1810 H 2 1580 1690 G 2 1480 1580 F 2 1380 1480 Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = 85 °C). 2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1 5 b) Binning Structure CRI (Ra) Nominal Min. CCT (K) (IF = 540 mA, TJ = 85 ºC) VF Color Color Flux Flux (lm) Flux Flux Range (Φv, lm) Rank Rank Bin Rank Typ. Bin Min. Max. Product Code SPHWH2HDNC05YHW2C1 YH W2 WB C1 2140 C 3 2220 2370 B 3 2070 2220 A 3 1930 2070 C 3 2220 2370 B 3 2070 2220 A 3 1930 2070 D 3 2370 2540 C 3 2220 2370 B 3 2070 2220 D 3 2370 2540 C 3 2220 2370 B 3 2070 2220 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 E 3 2540 2710 D 3 2370 2540 C 3 2220 2370 F 3 2710 2900 E 3 2540 2710 D 3 2370 2540 F 3 2710 2900 E 3 2540 2710 D 3 2370 2540 F 3 2710 2900 E 3 2540 2710 D 3 2370 2540 2700 SPHWH2HDNC05YHW3C1 SPHWH2HDNC05YHV2C1 YH YH W3 V2 WA, WB VB C1 C1 2140 2230 3000 SPHWH2HDNC05YHV3C1 SPHWH2HDNC05YHU2C1 YH YH V3 U2 VA, VB UB C1 C1 2230 2320 3500 80 SPHWH2HDNC05YHU3C1 SPHWH2HDNC05YHT2C1 YH YH U3 T2 UA, UB TB C1 C1 2320 2380 4000 SPHWH2HDNC05YHT3C1 SPHWH2HDNC05YHR3C1 YH YH T3 R3 TA, TB RA C1 C1 2380 2520 5000 SPHWH2HDNC05YHRTC1 5700 SPHWH2HDNC05YHQTC1 YH YH RT QT RW, RX, RY, RZ QW, QX, QY, QZ C1 C1 2520 2520 6 b) Binning Structure CRI (Ra) Nominal Min. CCT (K) (IF = 540 mA, TJ = 85 ºC) VF Color Color Flux Flux (lm) Flux Flux Range (Φv, lm) Rank Rank Bin Rank Typ. Bin Min. Max. Product Code SPHWH2HDNC07YHW2C1 YH W2 WB C1 1600 K 2 1690 1810 H 2 1580 1690 G 2 1480 1580 K 2 1690 1810 H 2 1580 1690 G 2 1480 1580 L 2 1810 1930 K 2 1690 1810 H 2 1580 1690 L 2 1810 1930 K 2 1690 1810 H 2 1580 1690 A 3 1930 2070 L 2 1810 1930 K 2 1690 1810 A 3 1930 2070 L 2 1810 1930 K 2 1690 1810 B 3 2070 2220 A 3 1930 2070 L 2 1810 1930 B 3 2070 2220 A 3 1930 2070 L 2 1810 1930 2700 SPHWH2HDNC07YHW3C1 SPHWH2HDNC07YHV2C1 YH YH W3 V2 WA, WB VB C1 C1 1600 1730 3000 SPHWH2HDNC07YHV3C1 YH V3 VA, VB C1 1730 90 SPHWH2HDNC07YHU2C1 YH U2 UB C1 1850 3500 SPHWH2HDNC07YHU3C1 SPHWH2HDNC07YHT2C1 YH YH U3 T2 UA, UB TB C1 C1 1850 1950 4000 SPHWH2HDNC07YHT3C1 YH T3 TA, TB C1 1950 7 c) Chromaticity Region & Coordinates (TJ = 85 ºC) θ CIE x,y MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB) θ a b Step CIE x CIE y θ a b 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.4030 53.22 0.0056 0.0027 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y 2-step 0.4578 3-step 0.4578 MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB) Step CIE x CIE y θ a b Step CIE x CIE y θ a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (RA) Step CIE x CIE y θ a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 Note : Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 8 c) Chromaticity Region & Coordinates (TJ = 85 ºC) CIE 1931 x,y Chromaticity Diagram 0.39 0.38 5000K 0.37 RY 5700K CIE y 0.36 RW Blackbody Locus RZ QY 0.35 RX QW 0.34 QZ QX 0.33 ANSI bin 0.32 0.31 0.31 0.32 0.33 0.34 0.35 0.36 0.37 CIE x Region CIE x CIE y Region CIE x CIE y Region CIE x R rank (5000 K) 0.3376 0.3616 0.3463 0.3687 0.3451 0.3554 0.3371 0.3490 RW CIE y Region CIE x CIE y 0.3290 0.3538 Q rank (5700 K) 0.3463 0.3687 0.3207 0.3462 0.3551 0.3760 0.3533 0.3620 0.3290 0.3538 0.3376 0.3616 0.3290 0.3417 0.3371 0.3451 0.3490 0.3554 0.3215 0.3350 0.3290 0.3417 RY QW QY 0.3371 0.3490 0.3451 0.3554 0.3215 0.3350 0.3290 0.3417 0.3451 0.3554 0.3533 0.3620 0.3290 0.3417 0.3371 0.3490 RX RZ QX QZ 0.3440 0.3428 0.3515 0.3487 0.3290 0.3300 0.3366 0.3369 0.3366 0.3369 0.3440 0.3428 0.3222 0.3243 0.3290 0.3300 Note : Samsung maintains measurement tolerance of: Cx, Cy = ±0.005 9 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 540 mA, TJ = 85 ºC) CRI Ra 80+ CRI Ra 90+ 120% 120% 2700K 3000K 3500K 4000K 2700K 100% 3000K 3500K 80% 4000K Relative Intensity Relative Intensity 100% 5000K 60% 5700K 40% 80% 60% 40% 20% 20% 0% 0% 350 400 450 500 550 600 650 700 750 350 800 400 450 b) Forward Current Characteristics 550 600 650 700 750 800 (TJ = 85 ºC) Forward Voltage vs. Forward Current Relative Luminous Flux vs. Forward Current 38 1.6 37 1.4 36 1.2 Forward Voltage (V) Relative Luminous Flux (a.u.) 500 Wavelength [nm] Wavelength [nm] 1 0.8 0.6 0.4 35 34 33 32 31 30 0.2 29 0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 Forward Current (A) c) Temperature Characteristics 0.70 0.80 0.90 28 0.00 0.10 0.20 0.30 0.40 0.50 0.60 Forward Current (A) 0.70 0.80 0.90 (IF = 540 mA) Forward Voltage vs. Tj Relative Luminous Flux vs. Tj 1.15 37.5 1.10 36.5 Forward Voltage (V) Relative Luminous Flux (a.u.) 37 1.05 1.00 36 35.5 35 34.5 34 0.95 33.5 0.90 32.5 33 0 20 40 60 Tj (℃) 80 100 120 0 20 40 60 Tj (℃) 80 100 120 10 d) Color Shift Characteristics TJ = 85℃ IF = 540 mA Δ CIE x, Δ CIE y vs. Forward Current Δ CIE x, Δ CIE y vs. Tj 0.008 0.006 Δ CIE x Δ CIE y 0.004 0.002 0 -0.004 0.00 0.10 0.20 0.30 0.40 0.50 0.60 Forward Current (A) 0.70 0.80 0.90 0 Case temperature vs. Allowable Forward Current Derating curve 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 Tc (℃) f) Beam Angle Characteristics 80 100 120 (IF = 540 mA, Ta = 25 ºC) Radiation diagram 1.2 1 0.8 0.6 0.4 0.2 0 -90 -60 -30 0 Angle (°) 30 -0.004 0 20 40 60 Tj (℃) e) Derating Characteristics Allowable forward current (A) 0.002 -0.002 -0.002 Relative luminous intensity (a.u.) Δ CIE x Δ CIE y 0.004 Δ CIE x, Δ CIE y Δ CIE x, Δ CIE y 0.006 60 90 80 100 120 11 4. Outline Drawing & Dimension 1. Unit: mm 2. Tolerance: ± 0.20 mm 1. Unit: mm 2. Tolerance: ± 0.2 mm Note : Tc point : The Center of the back side of substrate. Item Dimension Tolerance Unit Length 15.00 ±0.20 mm Width 12.00 ±0.20 mm Height 1.50 ±0.20 mm Light Emitting Surface (LES) Diameter 8 ±0.15 mm 12 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 ºC, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 ºC, DC Derating, IF 1000 h Low Temperature Life Test -40 ºC, DC 810 mA 1000 h Pulsed Operating Life Test 55 ℃, Pulse width 100 ㎲, duty cycle 3 % 1000 h High Temperature Storage 120 ºC 1000 h Low Temperature Storage -40 ºC 1000 h Temperature Humidity Storage 60 ºC, 90% RH 1000h Thermal Cycle -45 ºC / 15 min ↔ 125 ºC / 15 min temperature change in 5 min 800 cycles Temperature Cycle On/Off Test -40 ºC / 85 ºC each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 MΩ R2: 1.5 kΩ C: 100 pF ESD (HBM) V: 3 times ±2 kV R1: 10 MΩ R2: 0 kΩ ESD (MM) 3 times C: 200 pF V: ±0.2 kV Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency ↔ max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Sulfur Resistance 25 °C, 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 ºC) Forward Voltage VF Luminous Flux Φv Limit Min. Max. IF = 540 m A L.S.L. * 0.9 U.S.L. * 1.1 IF = 540 m A L.S.L * 0.7 U.S.L * 1.3 13 6. Label Structure a) Label Structure Aluminum Bag & Inner Box YHV3C1 SPHWH2HDNC05YHV3C4 Note: YHV3C1 Outer Box YHV3C1 SPHWH2HDNC05YHV3C4 YHV3C1 Denoted rank code and product code above is only an example (see description on page 6) Rank Code: ⓐⓑ: Forward Voltage rank (refer to page 3) ⓒⓓ: Chromaticity bin ⓔⓕ: Luminous Flux bin (refer to page 5-6) (refer to page 4) 14 b) Lot Number The lot number is composed of the following characters: ●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS ● : Production site ◎ : L (LED) ◇ : Product state ◆ : Year □ : Month ■ : Day (1~9, A, B~V) △△△ : Product serial number (001 ~ 009) ▲▲▲ : Tray number (S: Giheung, Korea, G: Tianjin, China) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Y: 2014, Z: 2015 , A: 2016, …) (1~9, A, B, C) (001 ~ 999) 15 7. Packing Structure Packing material Max. quantity in pcs of COB Tray Dimension (mm) Length Width Height Tolerance 78 322.6 135.9 11 0.25 Aluminum Bag 624 (8 trays) 450 230 - 10 PE Foam Pad - 280 130 10 2 Inner Box 624 (1 aluminum bag) 338 148 55 2 Outer Box 2,496 (4 inner boxes) 351 308 120 5 Pallet 139,776 (56 outer boxes) 1000 1000 970 10 a) Packing Structure for 8 trays inside Aluminum Bag 1BAG = 78pcs / tray, 8(9)tray / 624pcs/BAG 1 BOX = 4 BAG (2,496 pcs) 16 b) Packing Structure for <8 trays inside Aluminum Bag 1BAG = 78pcs / tray PE foam pad is used as buffer for < 8 trays inside an aluminum bag c) Tray 17 d) Aluminum Vinyl Packing Bag e) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag 18 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 ºC, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC. 6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction temperature should not exceed the absolute maximum rating while operation of LED lighting system. For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’. 9) In case of driving the LC020C around the minimum current level (If_min), chips might exhibit different brightness due to the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. For more information, please refer to Application Note ‘LED Handling Guide’. Resin Area Handling Area Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com