Data Sheet LC020C Rev.2.0

Product Family Data Sheet
Rev. 2.0 2016.5.27
High Voltage LED Series
Chip on Board
- Small LES COB line-up -
LCo20C
Small LES COBs are well-suited for compact spot light system
Features & Benefits
• Suitable for luminaires with narrow beam angle such as shop lighting
• Maximize Center Beam Candle Power(CBCP)
• Reduce lighting system cost with smaller optical component
• High reliability without wire-bonding
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
1#
2
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Unit
Ambient / Operating Temperature
Ta
-40 ~ +105
ºC
Storage Temperature
Tstg
-40 ~ +120
ºC
Case Temperature
Tc
105
ºC
LED Junction Temperature
TJ
140
ºC
Forward Current
IF
810
mA
Minimum Current
IF_min
20
mA
ESD (HBM)
-
±2
kV
Notes:
1) Refer to 4. Outline Drawing & Dimension for Tc point.
2) Refer to the Derating curve for proper driving current that maintained below Maximum junction temperature.
b) Electro-optical Characteristics
(IF = 540 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF) *1, *2
V
-
31.5
34.5
37.5
5
80
-
-
7
90
-
-
Color Rendering Index (Ra) *1, *2
Thermal Resistance (Junction to Tc point)
ºC/W
-
1.6
1.9
Beam Angle
º
-
115
-
Notes:
1)
The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2)
Samsung maintains measurement tolerance of: Forward Voltage = ±5 %, CRI = ±1
3
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
2
H
D
N
C
0
5
Y
H
V
3
C
1
Digit
PKG Information
Code
Samsung Package High Power
SPH
Color
WH
Product Version
2
Form Factor
HD
9
Lens Type
N
No lens
10
Internal Code
C
LC020C
11
Chip Type
0
Minor version
5
Min. 80
12
CRI & Sorting Temperature
7
Min. 90
1 2
3
4 5
6
7 8
13
14
15
Forward Voltage (V)
Specification
White
Version
COB
YH
31.5~37.5
W
2700 K
V
3000 K
U
3500 K
T
4000 K
R
5000 K
Q
5700 K
2
MacAdam 2-step
3
MacAdam 3-step
T
ANSI bin
CCT (K)
16
MacAdam / ANSI
:
Ra min.80
17
18
2700K
C3, B3, A3
3000K
D3, C3, B3
3500K
E3, D3, C3
4000K
E3, D3, C3
5000K
F3, E3, D3
5700K
F3, E3, D3
2700K
K2, H2, G2
3000K
L2, K2, H2
3500K
A3, L2, K2
4000K
B3, A3, L2
Luminous Flux
C1
Ra min.90
4
a) 20W Luminous Flux Characteristics
CRI (Ra)
Lumen Flux
Min.
Rank
(IF = 540 mA)
1)
CCT
Sorting @ TJ = 85 °C (lm)
Min.
Max.
G
3
2900
3110
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
2700K
3000K
2700K
3000K
3500K
4000K
3500K
4000K
5000K
5700K
80
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
F
2
1380
1480
CRI (Ra)
Lumen Flux
Min.
Rank
90
1)
CCT
Sorting @ TJ = 85 °C (lm)
Min.
Max.
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
F
2
1380
1480
Notes:
1)
The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
b) Binning Structure
CRI
(Ra)
Nominal
Min.
CCT (K)
(IF = 540 mA, TJ = 85 ºC)
VF
Color
Color
Flux
Flux
(lm)
Flux
Flux Range (Φv, lm)
Rank
Rank
Bin
Rank
Typ.
Bin
Min.
Max.
Product Code
SPHWH2HDNC05YHW2C1
YH
W2
WB
C1
2140
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
C
3
2220
2370
B
3
2070
2220
A
3
1930
2070
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
D
3
2370
2540
C
3
2220
2370
B
3
2070
2220
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
E
3
2540
2710
D
3
2370
2540
C
3
2220
2370
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
F
3
2710
2900
E
3
2540
2710
D
3
2370
2540
2700
SPHWH2HDNC05YHW3C1
SPHWH2HDNC05YHV2C1
YH
YH
W3
V2
WA, WB
VB
C1
C1
2140
2230
3000
SPHWH2HDNC05YHV3C1
SPHWH2HDNC05YHU2C1
YH
YH
V3
U2
VA, VB
UB
C1
C1
2230
2320
3500
80
SPHWH2HDNC05YHU3C1
SPHWH2HDNC05YHT2C1
YH
YH
U3
T2
UA, UB
TB
C1
C1
2320
2380
4000
SPHWH2HDNC05YHT3C1
SPHWH2HDNC05YHR3C1
YH
YH
T3
R3
TA, TB
RA
C1
C1
2380
2520
5000
SPHWH2HDNC05YHRTC1
5700
SPHWH2HDNC05YHQTC1
YH
YH
RT
QT
RW, RX,
RY, RZ
QW, QX,
QY, QZ
C1
C1
2520
2520
6
b) Binning Structure
CRI
(Ra)
Nominal
Min.
CCT (K)
(IF = 540 mA, TJ = 85 ºC)
VF
Color
Color
Flux
Flux
(lm)
Flux
Flux Range (Φv, lm)
Rank
Rank
Bin
Rank
Typ.
Bin
Min.
Max.
Product Code
SPHWH2HDNC07YHW2C1
YH
W2
WB
C1
1600
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
K
2
1690
1810
H
2
1580
1690
G
2
1480
1580
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
L
2
1810
1930
K
2
1690
1810
H
2
1580
1690
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
A
3
1930
2070
L
2
1810
1930
K
2
1690
1810
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
B
3
2070
2220
A
3
1930
2070
L
2
1810
1930
2700
SPHWH2HDNC07YHW3C1
SPHWH2HDNC07YHV2C1
YH
YH
W3
V2
WA, WB
VB
C1
C1
1600
1730
3000
SPHWH2HDNC07YHV3C1
YH
V3
VA, VB
C1
1730
90
SPHWH2HDNC07YHU2C1
YH
U2
UB
C1
1850
3500
SPHWH2HDNC07YHU3C1
SPHWH2HDNC07YHT2C1
YH
YH
U3
T2
UA, UB
TB
C1
C1
1850
1950
4000
SPHWH2HDNC07YHT3C1
YH
T3
TA, TB
C1
1950
7
c) Chromaticity Region & Coordinates
(TJ = 85 ºC)
θ
CIE x,y
MacAdam Ellipse (WA, WB)
MacAdam Ellipse (VA, VB)
θ
a
b
Step
CIE x
CIE y
θ
a
b
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.4030
53.22
0.0056
0.0027
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
Step
CIE x
CIE y
2-step
0.4578
3-step
0.4578
MacAdam Ellipse (UA, UB)
MacAdam Ellipse (TA, TB)
Step
CIE x
CIE y
θ
a
b
Step
CIE x
CIE y
θ
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (RA)
Step
CIE x
CIE y
θ
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
Note : Samsung maintains measurement tolerance of:
Cx, Cy = ±0.005
8
c) Chromaticity Region & Coordinates
(TJ = 85 ºC)
CIE 1931 x,y Chromaticity Diagram
0.39
0.38
5000K
0.37
RY
5700K
CIE y
0.36
RW
Blackbody
Locus
RZ
QY
0.35
RX
QW
0.34
QZ
QX
0.33
ANSI bin
0.32
0.31
0.31
0.32
0.33
0.34
0.35
0.36
0.37
CIE x
Region
CIE x
CIE y
Region
CIE x
CIE y
Region
CIE x
R rank (5000 K)
0.3376
0.3616
0.3463
0.3687
0.3451
0.3554
0.3371
0.3490
RW
CIE y
Region
CIE x
CIE y
0.3290
0.3538
Q rank (5700 K)
0.3463
0.3687
0.3207
0.3462
0.3551
0.3760
0.3533
0.3620
0.3290
0.3538
0.3376
0.3616
0.3290
0.3417
0.3371
0.3451
0.3490
0.3554
0.3215
0.3350
0.3290
0.3417
RY
QW
QY
0.3371
0.3490
0.3451
0.3554
0.3215
0.3350
0.3290
0.3417
0.3451
0.3554
0.3533
0.3620
0.3290
0.3417
0.3371
0.3490
RX
RZ
QX
QZ
0.3440
0.3428
0.3515
0.3487
0.3290
0.3300
0.3366
0.3369
0.3366
0.3369
0.3440
0.3428
0.3222
0.3243
0.3290
0.3300
Note : Samsung maintains measurement tolerance of:
Cx, Cy = ±0.005
9
3. Typical Characteristics Graphs
a) Spectrum Distribution
(IF = 540 mA, TJ = 85 ºC)
CRI Ra 80+
CRI Ra 90+
120%
120%
2700K
3000K
3500K
4000K
2700K
100%
3000K
3500K
80%
4000K
Relative Intensity
Relative Intensity
100%
5000K
60%
5700K
40%
80%
60%
40%
20%
20%
0%
0%
350
400
450
500
550
600
650
700
750
350
800
400
450
b) Forward Current Characteristics
550
600
650
700
750
800
(TJ = 85 ºC)
Forward Voltage vs. Forward Current
Relative Luminous Flux vs. Forward Current
38
1.6
37
1.4
36
1.2
Forward Voltage (V)
Relative Luminous Flux (a.u.)
500
Wavelength [nm]
Wavelength [nm]
1
0.8
0.6
0.4
35
34
33
32
31
30
0.2
29
0
0.00
0.10
0.20
0.30 0.40 0.50 0.60
Forward Current (A)
c) Temperature Characteristics
0.70
0.80
0.90
28
0.00
0.10
0.20
0.30 0.40 0.50 0.60
Forward Current (A)
0.70
0.80
0.90
(IF = 540 mA)
Forward Voltage vs. Tj
Relative Luminous Flux vs. Tj
1.15
37.5
1.10
36.5
Forward Voltage (V)
Relative Luminous Flux (a.u.)
37
1.05
1.00
36
35.5
35
34.5
34
0.95
33.5
0.90
32.5
33
0
20
40
60
Tj (℃)
80
100
120
0
20
40
60
Tj (℃)
80
100
120
10
d) Color Shift Characteristics
TJ = 85℃
IF = 540 mA
Δ CIE x, Δ CIE y vs. Forward Current
Δ CIE x, Δ CIE y vs. Tj
0.008
0.006
Δ CIE x
Δ CIE y
0.004
0.002
0
-0.004
0.00
0.10
0.20
0.30 0.40 0.50 0.60
Forward Current (A)
0.70
0.80
0.90
0
Case temperature vs. Allowable Forward Current
Derating curve
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
20
40
60
Tc (℃)
f) Beam Angle Characteristics
80
100
120
(IF = 540 mA, Ta = 25 ºC)
Radiation diagram
1.2
1
0.8
0.6
0.4
0.2
0
-90
-60
-30
0
Angle (°)
30
-0.004
0
20
40
60
Tj (℃)
e) Derating Characteristics
Allowable forward current (A)
0.002
-0.002
-0.002
Relative luminous intensity (a.u.)
Δ CIE x
Δ CIE y
0.004
Δ CIE x, Δ CIE y
Δ CIE x, Δ CIE y
0.006
60
90
80
100
120
11
4. Outline Drawing & Dimension
1. Unit:
mm
2. Tolerance: ± 0.20 mm
1. Unit:
mm
2. Tolerance: ± 0.2 mm
Note : Tc point : The Center of the back side of substrate.
Item
Dimension
Tolerance
Unit
Length
15.00
±0.20
mm
Width
12.00
±0.20
mm
Height
1.50
±0.20
mm
Light Emitting Surface (LES) Diameter
8
±0.15
mm
12
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC 810 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Thermal Cycle
-45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min
800 cycles
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
ESD (HBM)
V:
3 times
±2 kV
R1: 10 MΩ
R2: 0 kΩ
ESD (MM)
3 times
C: 200 pF
V: ±0.2 kV
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C,
75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Forward Voltage
VF
Luminous Flux
Φv
Limit
Min.
Max.
IF = 540 m A
L.S.L. * 0.9
U.S.L. * 1.1
IF = 540 m A
L.S.L * 0.7
U.S.L * 1.3
13
6. Label Structure
a) Label Structure
Aluminum Bag & Inner Box
YHV3C1
SPHWH2HDNC05YHV3C4
Note:
YHV3C1
Outer Box
YHV3C1
SPHWH2HDNC05YHV3C4
YHV3C1
Denoted rank code and product code above is only an example (see description on page 6)
Rank Code:
ⓐⓑ:
Forward Voltage rank (refer to page 3)
ⓒⓓ:
Chromaticity bin
ⓔⓕ:
Luminous Flux bin
(refer to page 5-6)
(refer to page 4)
14
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
●
:
Production site
◎
:
L (LED)
◇
:
Product state
◆
:
Year
□
:
Month
■
:
Day (1~9, A, B~V)
△△△
:
Product serial number (001 ~ 009)
▲▲▲
:
Tray number
(S: Giheung, Korea,
G: Tianjin, China)
(A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
(Y: 2014, Z: 2015 , A: 2016, …)
(1~9, A, B, C)
(001 ~ 999)
15
7. Packing Structure
Packing material
Max. quantity
in pcs of COB
Tray
Dimension (mm)
Length
Width
Height
Tolerance
78
322.6
135.9
11
0.25
Aluminum Bag
624 (8 trays)
450
230
-
10
PE Foam Pad
-
280
130
10
2
Inner Box
624 (1 aluminum bag)
338
148
55
2
Outer Box
2,496 (4 inner boxes)
351
308
120
5
Pallet
139,776 (56 outer boxes)
1000
1000
970
10
a) Packing Structure for 8 trays inside Aluminum Bag
1BAG = 78pcs / tray, 8(9)tray / 624pcs/BAG
1 BOX = 4 BAG (2,496 pcs)
16
b) Packing Structure for <8 trays inside Aluminum Bag
1BAG = 78pcs / tray
PE foam pad is used as buffer for
< 8 trays inside an aluminum bag
c) Tray
17
d) Aluminum Vinyl Packing Bag
e) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag
18
8.
Precautions in Handling & Use
1)
This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2)
LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3)
After storage bag is opened, device subjected to soldering or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4)
Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5)
Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6)
Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7)
The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8)
The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9)
In case of driving the LC020C around the minimum current level (If_min), chips might exhibit different brightness due to
the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
For more information, please refer to Application Note ‘LED Handling Guide’.
Resin
Area
Handling
Area
Legal and additional information.
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