Data Sheet - LM362A CRI 90

Rev: 002
ISSUE NO :
Product Family Data Sheet
LM362A
- CRI 90
Introduction
Features
 Beam Angle: 120˚
 Precondition : JEDEC Level 2a
 Dimension : 3.6 x 2.3 x 0.6 mm
 ESD withstand Voltage : up to ±5KV [HBM]
 Reliability Test : Refer to page 25
SAMSUNG ELECTRONICS
95, Samsung2-Ro, Giheung-Gu,
Yongin-City, Gyeonggi-Do 446-711, KOREA
Copyright © 2009-2011 SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to
change without notice. SAMSUNG,
http://www.samsungled.com
is a registered trademark of SAMSUNG ELECTRONICS.
1 / 47
Contents
1. Product Code Information
-----------------------
3
2. Luminous Flux Characteristics
-----------------------
7
3. Characteristics
-----------------------
9
4. Typical Characteristics Graph
----------------------- 10
5. Outline Drawing & Dimension
----------------------- 15
6. Reliability Test Items & Conditions
----------------------- 16
7. Solder Conditions
----------------------- 17
8. Tape & Reel
----------------------- 18
9. Label Structure
----------------------- 19
10. Packing Structure
----------------------- 20
11. Precaution For Use
----------------------- 22
12. Hazard Substance Analysis Report
----------------------- 25
13. Revision History
----------------------- 47
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2 / 47
1. Product Code Information
1) Luminous Flux Bins (Ts = 25℃)
Sorting Condition lm @100mA
Nominal
CCT
Product Code
Flux Rank
Flux Bin
Intensity Range (cd)
Flux Range (Φv, lm)
2700K
3000K
3500K
4000K
SPMWHT325AD7YBW0S0
SPMWHT325AD7YBV0S0
SPMWHT325AD7YBU0S0
SPMWHT325AD7YBT0S0
S0
S0
S0
S0
S1
48.00 ~ 53.00
S2
53.00 ~ 58.00
S3
58.00 ~ 63.00
S1
50.00 ~ 55.00
S2
55.00 ~ 60.00
S3
60.00 ~ 65.00
S1
52.00 ~ 57.00
S2
57.00 ~ 62.00
S3
62.00 ~ 67.00
S1
54.00 ~ 59.00
S2
59.00 ~ 64.00
S3
64.00 ~ 69.00
Notes:
1) Luminous Intensity(Iv, cd) values are for representative reference only
2) SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurement
2) Color Bins (Ts = 25℃)
1) Color Binning
Nominal
Product Code
Color Rank
2700K
SPMWHT325AD7YBW0S0
W0 (Whole Bin)
3000K
SPMWHT325AD7YBV0S0
V0 (Whole Bin)
3500K
SPMWHT325AD7YBU0S0
U0 (Whole Bin)
4000K
SPMWHT325AD7YBT0S0
T0 (Whole Bin)
CCT
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Chromaticity Bins
W1,W2,W3,W4,W5,W6,W7,W8,
W9,WA,WB,WC,WD,WE,WF,WG
V1,V2,V3,V4,V5,V6,V7,V8,
V9,VA,VB,VC,VD,VE,VF,VG
U1,U2,U3,U4,U5,U6,U7,U8,
U9,UA,UB,UC,UD,UE,UF,UG
T1,T2,T3,T4,T5,T6,T7,T8,
T9,TA,TB,TC,TD,TE,TF,TG
3 / 47
2) Chromaticity Region & Coordinates
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4 / 47
2) Chromaticity Region & Coordinates (Continued)
Region CIE X CIE Y Region CIE X CIE Y
Region CIE X CIE Y Region CIE X CIE Y
W rank (2700K)
V rank (3000K)
0.4373 0.3893
W1
W2
W3
W4
W5
W6
W7
W8
0.4418 0.3981
0.4475 0.3994
0.4465 0.4071
W9
0.4513 0.4164
0.4573 0.4178
0.4147 0.3814
V1
0.4183 0.3898
0.4242 0.3919
0.4221 0.3984
V9
0.4259 0.4073
0.4322 0.4096
0.4428 0.3906
0.4523 0.4085
0.4203 0.3833
0.4281 0.4006
0.4428 0.3906
0.4523 0.4085
0.4203 0.3833
0.4281 0.4006
0.4475 0.3994
0.4532 0.4008
WA
0.4573 0.4178
0.4634 0.4193
V2
0.4242 0.3919
0.4300 0.3939
VA
0.4322 0.4096
0.4385 0.4119
0.4483 0.3919
0.4582 0.4099
0.4259 0.3853
0.4342 0.4028
0.4483 0.3919
0.4582 0.4099
0.4259 0.3853
0.4342 0.4028
0.4532 0.4008
0.4589 0.4021
WB
0.4634 0.4193
0.4695 0.4207
V3
0.4300 0.3939
0.4359 0.3960
VB
0.4385 0.4119
0.4449 0.4141
0.4538 0.3931
0.4641 0.4112
0.4316 0.3873
0.4403 0.4049
0.4538 0.3931
0.4641 0.4112
0.4316 0.3873
0.4403 0.4049
0.4589 0.4021
0.4646 0.4034
WC
0.4695 0.4207
0.4756 0.4221
V4
0.4359 0.3960
0.4418 0.3981
VC
0.4449 0.4141
0.4513 0.4164
0.4593 0.3944
0.4700 0.4126
0.4373 0.3893
0.4465 0.4071
0.4418 0.3981
0.4513 0.4164
0.4183 0.3898
0.4259 0.4073
0.4465 0.4071
0.4523 0.4085
WD
0.4562 0.4260
0.4624 0.4274
V5
0.4221 0.3984
0.4281 0.4006
VD
0.4299 0.4165
0.4364 0.4188
0.4475 0.3994
0.4573 0.4178
0.4242 0.3919
0.4322 0.4096
0.4475 0.3994
0.4573 0.4178
0.4242 0.3919
0.4322 0.4096
0.4523 0.4085
0.4582 0.4099
WE
0.4624 0.4274
0.4687 0.4289
V6
0.4281 0.4006
0.4342 0.4028
VE
0.4364 0.4188
0.4430 0.4212
0.4532 0.4008
0.4634 0.4193
0.4300 0.3939
0.4385 0.4119
0.4532 0.4008
0.4634 0.4193
0.4300 0.3939
0.4385 0.4119
0.4582 0.4099
0.4641 0.4112
WF
0.4687 0.4289
0.4750 0.4304
V7
0.4342 0.4028
0.4403 0.4049
VF
0.4430 0.4212
0.4496 0.4236
0.4589 0.4021
0.4695 0.4207
0.4359 0.3960
0.4449 0.4141
0.4589 0.4021
0.4695 0.4207
0.4359 0.3960
0.4449 0.4141
0.4641 0.4112
0.4700 0.4126
0.4646 0.4034
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WG
0.4750 0.4304
0.4813 0.4319
0.4756 0.4221
V8
0.4403 0.4049
0.4465 0.4071
0.4418 0.3981
VG
0.4496 0.4236
0.4562 0.4260
0.4513 0.4164
5 / 47
2) Chromaticity Region & Coordinates (Continued)
Region CIE X CIE Y Region CIE X CIE Y
Region CIE X CIE Y Region CIE X CIE Y
U rank (3500K)
T rank (4000K)
0.3889 0.3690
U1
U2
0.3953 0.3720
0.3981 0.3800
U4
U5
U6
U7
U8
U9
0.4010 0.3882
0.4040 0.3966
0.3670 0.3578
T1
0.3726 0.3612
0.3744 0.3685
0.3702 0.3722
T9
0.3763 0.3760
0.3782 0.3837
0.3915 0.3768
0.3968 0.3930
0.3686 0.3649
0.3719 0.3797
0.3953 0.3720
0.4010 0.3882
0.3726 0.3612
0.3763 0.3760
0.4017 0.3751
0.4048 0.3832
0.3981
U3
0.3941 0.3848
UA
0.4080 0.3916
0.4113 0.4001
T2
0.3783 0.3646
0.3804 0.3721
TA
0.3825 0.3798
0.3847 0.3877
0.380
0.4040 0.3966
0.3744 0.3685
0.3782 0.3837
0.4017 0.3751
0.4080 0.3916
0.3783 0.3646
0.3825 0.3798
0.4082 0.3782
0.4116 0.3865
UB
0.4150 0.3950
0.4186 0.4037
T3
0.3840 0.3681
0.3863 0.3758
TB
0.3887 0.3836
0.3912 0.3917
0.4048 0.3832
0.4113 0.4001
0.3804 0.3721
0.3847 0.3877
0.4082 0.3782
0.4150 0.3950
0.3840 0.3681
0.3887 0.3837
0.4147 0.3814
0.4183 0.3898
UC
0.4221 0.3984
0.4259 0.4073
T4
0.3898 0.3716
0.3924 0.3794
TC
0.3950 0.3875
0.3978 0.3958
0.4116 0.3865
0.4186 0.4037
0.3863 0.3758
0.3912 0.3917
0.3915 0.3768
0.3968 0.3930
0.3686 0.3649
0.3719 0.3797
0.3981 0.3800
0.4010 0.3882
UD
0.4040 0.3966
0.4071 0.4052
T5
0.3744 0.3685
0.3763 0.3760
TD
0.3782 0.3837
0.3802 0.3916
0.3941 0.3848
0.3996 0.4015
0.3702 0.3722
0.3736 0.3874
0.3981 0.3800
0.4040 0.3966
0.3744 0.3685
0.3782 0.3837
0.4048 0.3832
0.4080 0.3916
UE
0.4113 0.4001
0.4146 0.4089
T6
0.3804 0.3721
0.3825 0.3798
TE
0.3847 0.3877
0.3869 0.3958
0.4011 0.3882
0.4071 0.4052
0.3763 0.3760
0.3802 0.3916
0.4048 0.3832
0.4113 0.4001
0.3804 0.3721
0.3847 0.3877
0.4116 0.3865
0.4150 0.3950
UF
0.4186 0.4037
0.4222 0.4127
T7
0.3863 0.3758
0.3887 0.3836
TF
0.3912 0.3917
0.3937 0.4001
0.4080 0.3916
0.4146 0.4089
0.3825 0.3798
0.3869 0.3958
0.4116 0.3865
0.4186 0.4037
0.3863 0.3758
0.3912 0.3917
0.4183 0.3898
0.4221 0.3984
0.4150 0.3950
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UG
0.4259 0.4073
0.4299 0.4165
0.4222 0.4127
T8
0.3924 0.3794
0.3950 0.3875
0.3887 0.3836
TG
0.3978 0.3958
0.4006 0.4044
0.3937 0.4001
6 / 47
2. Luminous Flux Characteristics (Ts = 25℃)
Nominal
Minimum
CCT
CRI1)
2700K
3000K
If(mA)
Vf(V)
Power(W)
Flux(lm)
lm/W
50
5.71
0.29
32
109
100
5.96
0.60
58
96
110
5.99
0.66
62
94
120
6.03
0.72
67
93
130
6.06
0.79
71
90
140
6.09
0.85
75
86
150
6.11
0.92
79
85
160
6.14
0.98
83
83
170
6.17
1.05
87
81
180
6.20
1.12
91
80
190
6.23
1.18
94
80
200
6.27
1.25
98
78
50
5.71
0.29
33
112
100
5.96
0.60
59
99
110
5.99
0.66
64
97
120
6.03
0.72
69
95
130
6.06
0.79
73
93
140
6.09
0.85
77
91
150
6.11
0.92
81
88
160
6.14
0.98
86
87
170
6.17
1.05
90
85
180
6.20
1.12
94
84
190
6.23
1.18
97
82
200
6.27
1.25
101
80
90
90
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7 / 47
2. Luminous Flux Characteristics (Ts = 25℃)
Nominal
Minimum
CCT
CRI1)
3500K
4000K
If(mA)
Vf(V)
Power(W)
Flux(lm)
lm/W
50
5.71
0.29
34
116
100
5.96
0.60
61
102
110
5.99
0.66
66
100
120
6.03
0.72
71
98
130
6.06
0.79
75
95
140
6.09
0.85
80
94
150
6.11
0.92
84
91
160
6.14
0.98
88
90
170
6.17
1.05
92
88
180
6.20
1.12
96
86
190
6.23
1.18
100
85
200
6.27
1.25
104
83
50
5.71
0.29
35
119
100
5.96
0.60
63
105
110
5.99
0.66
68
103
120
6.03
0.72
73
101
130
6.06
0.79
78
98
140
6.09
0.85
72
97
150
6.11
0.92
76
94
160
6.14
0.98
91
93
170
6.17
1.05
95
91
180
6.20
1.12
99
89
190
6.23
1.18
103
87
200
6.27
1.25
107
85
90
90
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3. Characteristics
1) Absolute Maximum Rating
Item
Operating temperature range
Storage temperature range
LED junction temperature
Forward Current
Peak Pulsed Forward Current
Thermal resistance
Assembly Process Temperature
ESD
Symbol
Rating
Top
Tstg
TJ
IF
IFP
Rth, j-s
-
-40℃ ~ +85℃
-40℃ ~ +100℃
125℃
200 mA
400 mA
15℃/W
260℃, < 10sec
5kV
Condition
Duty 1/10 pulse width 10ms
Junction to solder point
HBM
2) Electro-optical Characteristics - Voltage and CRI
Item
Unit
Forward Voltage (@100 mA, Tj = 25℃)
V
Reverse Voltage (@5 mA, Tj = 25℃)
Color Rendering Index
Special CRI4) (R9)
V
Ra
-
Rank
A1
A2
YB
A3
A4
A5
7
-
Min
Typ
Max
5.6
5.8
6.0
6.2
6.4
0.7
90
50
-
5.8
6.0
6.2
6.4
6.6
1.2
-
Notes:
1)~2) SAMSUNG ELECTRONICS maintains a tolerance of VF:±0.1 V, Ra :±3.0 on measurements
3) Electro-optical Characteristics - Luminous Intensity and Flux
Item
Luminous Flux
(@100 mA, Ts = 25℃)
Unit
CCT
Rank
2700K
S0
3000K
S0
3500K
S0
4000K
S0
lm
S1
S2
S3
S1
S2
S3
S1
S2
S3
S1
S2
S3
Min
Typ
Max
48.0
53.0
58.0
50.0
55.0
60.0
52.0
57.0
62.0
54.0
59.0
64.0
-
53.0
58.0
63.0
55.0
60.0
65.0
57.0
62.0
67.0
59.0
64.0
69.0
Notes:
Luminous Intensity(Iv, cd) values are for representative reference only
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9 / 47
4. Typical Characteristics Graph
1) Spectrum Distribution
(Ts = 25℃)
2700K & 3000K
3500K & 4000K
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10 / 47
2) Forward Current Characteristics
(Ts = 25℃)
Relative Flux vs. Forward Current
Forward Current vs. Forward Voltage
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3) Temperature Characteristics
Relative Flux vs. Ts(solder temp.) @ 100mA
Forward Voltage vs. Ts(solder temp.) @ 100mA
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12 / 47
4) Color shift Characteristics
Color x,y vs. Forward Current
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5) Derating Curve
(Ta = 25℃)
Rj-a = 30℃/W
Rj-a = 21℃/W
Rj-a = 12℃/W
6) Viewing Angle Characteristics
Viewing Angle
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5. Outline Drawing and Dimension
1. Tolerance is ±0.1 mm
2. The maximum compressing force is 15N on the silicone ⓐ
3. Do not place pressure on the encapsulation resin ⓑ
Recommended Land Pattern
Notes:
1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
2) Ts point & measurement method
① Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of
PCB to reach Ts point.
② Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be
damaged.
3) Precautions
① The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating.
② Re-soldering should not be done after the LEDs have been soldered. If re-soldering is
unavoidable, LED`s characteristics should be carefully checked before and after such repair.
③ Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two
PCB assembled with LED might cause catastrophic failure of the LEDs.
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6. Reliability Test Items and Conditions
1) Test Items and Results
Test Item
Test Conditions
Test
Hours/Cycles
Sample No
MSL Test
125 ℃ 24hrs drying → 60 ℃, 60 %RH 120hrs
→ 260 ℃ 10sec 3 cycles
1 cycle
11
Room Temperature
life test
25 ℃±3 ℃, DC200㎃
1,000 hrs
22
High Temperature
life test
85 ℃±3 ℃, DC200 ㎃
1,000 hrs
22
High Temperature
humidity life test
85℃±3 ℃, 85 %±2 %RH, DC200 ㎃
1,000 hrs
22
Low Temperature
life test
-40 ℃±3 ℃, DC200 ㎃
1,000 hrs
22
Power Temperature
Cycle
-40 ℃/20 min ↔ 85 ℃/20 min,
Temp. change within 100min, on/off 5 min
100 cycles
50
Thermal Shock
-45 ℃/15 min ↔ 125 ℃/15 min,
Temp. change within 5min
→ Hot plate 180 ℃
200 cycles
100
High Temperature
Storage
Ta=120 ℃±3 ℃
1000 hrs
11
Low Temperature
Storage
Ta=-40 ℃±3 ℃
1000 hrs
11
ESD(HBM)
R1:10 ㏁, R2:1.5 ㏀,
C:100 ㎊, V = ±5 kV
5 times
10
ESD(MM)
R1:10 ㏁, R2:0,
C:200 ㎊, V = ±0.5 kV
5 times
10
Vibration Test
100~2000~100 Hz, 200 m/s2,
Sweep 4 min,
X, Y, Z 3 direction, each 1 cycle
4 cycles
11
Mechanical Shock Test
1500G, 0.5 ms,
5 cycles
11
2) Criteria for Judging the Damage
Item
Symbol
Limit
Test Condition
Min
Max
Forward Voltage
VF
IF = 100 ㎃
Init. Value*0.9
Init. Value*1.1
Luminous Flux
Im
IF = 100 ㎃
Init. Value*0.8
Init. Value*1.2
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7. Solder Conditions
1) Reflow Conditions ( Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5 seconds @Max. 300℃, under soldering iron.
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8. Tape And Reel
Start
End
More than 40 ㎜
Mounted with
More than (100~200)㎜
Leading part more than
Unloaded tape
Flash LED
Unloaded tape
(200~400)㎜
(1) Quantity : The quantity/reel to be 4,000 pcs.
(2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 ㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10° angle to be the carrier tape.
(4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof package.
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18 / 47
9. Label Structure
1) Label Structure
ⓐⓑⓒⓓⓔⓕ
A1W1S1
SPMWHT325AD7YBW0S0 A1W1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / I001 / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
Rank Code
ⓐⓑ
: Forward Voltage Rank
ⓒⓓ
: Chromaticity Coordinate Rank
ⓔⓕ
: Luminous Intensity Rank
2) LOT Number
The Lot number is composed of the following characters
A1W1S1
SPMWHT325AD7YBW0S0 A1W1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨ / Iⓐⓑⓒ / 4,000 PCS
①
: Production Site (S:SAMSUNG LED, G:GOSIN CHINA)
②
: L (LED)
③
: Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
④
: Year (V:2011, W:2012, X:2013...)
⑤
: Month (1 ~ 9, A, B)
⑥
: Day (1 ~ 9, A, B ~ V)
⑦⑧⑨
: SAMSUNG Electronics LED Product number (1 ~ 999)
ⓐⓑⓒ
: Reel Number (1 ~ 999)
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19 / 47
10. Packing Structure
1) Packing Process
Reel
A1W1S1
SPMWHT325AD7YBW0S0 A1W1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAV94001 / 1001 / 4,000 pcs
LEVEL
2a
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Aluminum Vinyl Bag
A1W1S1
SPMWHT325AD7YBW0S0 A1W1S1 01
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GLAV94001 / 1001 / 4,000 pcs
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Material : Paper(SW3B(B))
TYPE
7inch
SIZE(mm)
Reels/ box
ⓐ
ⓑ
ⓒ
245
220
182
Up to 10 Reels
245
220
86
Up to 5 Reels
① SIDE
A1W1S1
①
SPMWHT325AD7YBW0S0 A1W1S1 01
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GLAV94001 / 1001 / 40,000 pcs
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H
CHIP LED
[Box Label]
W
L
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2) Aluminum Packing Bag
A1W1S1
SPMWHT325AD7YBW0S0 A1W1S1 01
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GLAW94001 / I001 / 4,000 pcs
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Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag
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11. Precaution for use
1) For over-current-proof function, customers are recommended to apply resistors to
prevent sudden change of the current caused by slight shift of the voltage.
과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기
위해 저항 등의 설치를 권장함.
2) This device should not be used in any type of fluid such as water, oil, organic
solvent, etc. When washing is required, IPA is recommended to use.
제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며,
세정이 필요할 시에는 IPA 사용을 권장함.
3) When the LEDs illuminate, operating current should be decided after considering the
ambient maximum temperature.
LED의 발광 시, 동작 전류는 주변 최고온도를 고려하여 결정되어야 함.
4) LEDs must be stored in a clean environment.
If the LEDs are to be stored for 3 months or more after being shipped from
Samsung Electronics, they should be packed by a sealed container with nitrogen gas
injected.(Shelf life of sealed bags: 12 months, temp. ~40℃, ~90%RH)
LED의 보관은 청정한 환경에서 보존되어져야 하며, 만약 삼성전자로부터 공급받는 후
3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함.
(보존 bag의 수명 : 12 개월, 보존 온도 ~40℃, 습도 ~90%RH)
5) After storage bag is open, device subjected to soldering, solder reflow, or other
high temperature processes must be:
보존 Bag이 개봉된 후에, 납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의
사항에 부합되어야 함.
a. Mounted within 672 hours(28 days) at an assembly line with a condition of no
more than 30℃/60%RH,
a. 제품은 30℃/60%RH보다 같거나 낮은 조립조건에서 672시간(28일)이내에 조립해야 함.
b. Stored at <10%RH.
b. 10% 이하의 상대습도에서 보관되어야 함.
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in a dry place.
사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후,
건조한 장소에서 보관할 것을 권장함.
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7) Devices require baking before mounting, if humidity card reading is >60% at 23±5℃.
만약 습도표시카드의 수치가 23±5℃에서 60% 이상이라면, 제품 실장 전 baking해야 함.
8) Devices must be baked for 1 hour at 60±5℃, if baking is required.
만약 baking이 필요하다면, 제품은 60±5℃에서 1시간 정도 baking 되어야 함.
9) The LEDs are sensitive to the static electricity and surge. It is recommended to
use a wrist band or anti-electrostatic glove when handling the LEDs.
LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기
방지장갑이나 손목밴드를 사용하기를 권장함.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
만약 절대 허용치를 초과하는 전압이 LED에 가해지면, LED 소자는 파괴되거나
손상될 수 있음.
Damaged LEDs may show some unusual characteristics such as increase in leak
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
손상된 제품은 누설전류의 증가, Turn on 전압의 저하, 저 전류에서의 점등불량 등의
이상 거동을 보일 수 있음.
10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener
or organic additives used in luminaires (fixtures).
Transparent LED silicone encapsulant is permeable to those chemicals and
they may lead a discoloration of encapsualnt when they expose to heat or light.
VOCs(휘발성 유기 화합물)는 등기구에 사용되는 접착제, Flux, 경화제,
유기물 첨가제에서 발생하여 LED 실리콘 봉지제를 투과하고,
빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음.
This phenomenon can cause a significant loss of light emitted(output) from the
luminaires(fixtures).
이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음.
In order to prevent these problems, we recommend you to know the physical
properties of the materials used in luminaires, They must be selected carefully.
이러한 문제 발생 방지를 위해서, 등기구에 사용되는 자재에 대한 물성을 알고
주의하여 선택 되어야함.
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11) Risk of Sulfurization (or Tarnishing)
The LED from Samsung Electronics uses a silver-plated lead frame and
its surface color may change to black(or dark colored) when it is exposed to sulfur(S),
chlorine (Cl) or other halogen compound.
삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이
황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로
바뀔 수 있음.
Sulfurization of lead frame may cause intensity degradation, change of
chromaticity coordinates and, in extreme cases, open circuit. It requires caution.
리드 프레임의 황화(Sulfurization)는 광량 저하, 색좌표 변화 및
심한 경우 LED 무등(Open) 불량을 일으킬 수도 있으니 주의가 필요함.
Due to possible sulfurization of lead frame, LED should not be used and
stored together with oxidizing substances made of materials in a following list,
: Rubber, plain paper, lead solder cream and so on.
리드 프레임 황화(Sulfurization)의 근원이 될 수 있으니 LED는 아래의 목록으로
만들어진 산화성 물질들과 함께 저장, 사용이 불가함 : 고무, 일반 종이, 납땜 크림 등
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12. Hazard Substance Analysis Report
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Revision History
Date
No.
Revision History
2014.02.05
001
2014.03.03
002
http://www.samsungled.com
Writer
Drawn
Approved
New version
N.R.KIM
S.B.YUN
Out box 추가
N.R.KIM
S.B.YUN
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