Data Sheet - SPFCW02101BN

ISSUE NO :
Rev:
DATE OF ISSUE : 07/28/2011
SPECIFICATION
MODEL : SPFCW02101BN
Approved Rank : VF() CIE(), IV()
High Power Flash LED
CUSTOMER :
CUSTOMER :
DRAWN
CHECKED
APPROVED
SAMSUNG LED
DRAWN
CHECKED
APPROVED
SAMSUNG LED CO,.LTD.
314. MAETAN3-DONG, YEONGTONG-KU,
SUWON-SI,GYUNGKI-DO,KOREA,442-743
SAMSUNG LED
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Contents
1. Revision Sheet
-------------------------
2. Product Outline
3. Absolute Maximum Rating
3
4
----------------
4
-------------------------
4
5. Typical Characteristics Graph
-------------------
6
6. Outline Drawing & Dimension
---------------
5
7. Solder Conditions
-------------------------
6
8. Taping Dimension
-------------------------
7
-----------------------
8
-----------------------
9
4. Characteristics
9. Label Structure
10. Lot Number
11. Reel Packing Structure
12. Aluminium Packing Bag
13. Precaution For Use
SAMSUNG LED
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1. Revision Sheet
Revision History
(Model:SPFCW02101BN)
Date
Revision History
2014.02.10
New Version
SAMSUNG LED
Page
Writer
Drawn
Approved
S.M.CHO
M.Y PARK
3/20
2. Product Outline
1) Feature
. Package & Lens Type LED Package ( 2.0 * 1.6 * t 0.75mm )
. Beam Angle ( △θ : 120 0 )
. GaN/Al2O3 Chip & Long Time Reliability
. Lead (Pd) free product - RoHS compliant
2) Applications
. Flashlight for mobile cameraphones & digital still camera
. Torchlight
. Amusement Equipment
. Other Applications
3. Absolute Maximum Rating
1) Torch Mode Operation Forward Current(Ta = 25℃) ..........
2) Flash Mode Peak Pulsed Forward Current ......................
300 ㎃
1200 ㎃
(Pulse width t≤300msec, Duty ratio=0.06, Ta=25℃)
3) Reverse Current ........................................................................ 85 ㎃
4) Thermal Resistance .................................................................. 7K/W
5) LED Junction Temperature ( TJ ) .............................................. 125℃
6) Operating Temperature Range ( Topr ) ........................ -40℃ ∼ 85℃
7) Storage Temperature Range ( Tstg ) ............................ -40℃ ∼100℃
4. Characteristics
1) Specifications
( Ta : 25OC
)
Item
Unit
Condition
Min
Typ
Max
Luminous Flux
lm
IF= 1000mA
180
220
280
Forward Voltage
V
IF= 1000mA
2.8
3.5
4.2
CCT
°K
IF= 1000mA
5100
6100
Notes
* Samsung LED uses the above specifications table as the final product test criteria.
* Samsung LED maintains a tester tolerance of ±10% on flux measurements.
* Samsung LED maintains a tolerance of ±0.15V on forward voltage measurements.
* Samsung LED maintains a tester tolerance of ±0.02 on CCx, CCy measurements.
* Samsung LED maintains a tester tolerance of ±10% on low current voltage measurements.
* Samsung LED maintains a tolerance of ±0.1 mm on device dimensions.
SAMSUNG LED
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2) General characteristics
Item
Unit
Luminous Flux
lm
Condition
Min
Typ
Max
IF = 300 mA
-
-
-
IF = 500 mAⓐ
-
-
-
180
220
280
IF = 300 mA
-
-
-
IF = 800 mAⓐ
-
-
-
2.8
3.5
4.2
-
-
-
mAⓑ
IF = 1000
Forward Voltage (VF)
V
mAⓑ
IF = 1000
IF = 300 mA
CCT
°K
IF = 800
mAⓐ
-
-
-
IF = 1000
mAⓑ
5100
5600
6100
0.6
-
1.2
Reverse Voltage (VR)
V
IR = 10 mA
Size
mm
-
2.0 x 1.6 x .075
Notes:
* The above data table is for design reference only.
ⓐ Pulse mode operation: Pulse width ≤ 2000ms, Duty ratio 0.4 for IF = 500mA
ⓑ Pulse mode operation: Pulse width ≤ 500ms, Duty ratio 0.1 for IF = 1000mA
3) Chromaticity Diagram (TBD)
Rank
-
X
Y
0.341
0.3174
0.3216
0.2968
0.3161
0.3533
0.3464
0.3833
* CIE Tolerance x, y : ±0.02
SAMSUNG LED
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5. Typical Characteristics Graph
* These graphs show typical values.
( Ta : 25OC )
Forward Current vs. Forward Voltage
Forward Current vs Luminous Flux.
Forward Current vs Luminous Flux
300
Luminous Flux(lm)
250
200
150
100
50
0
0
200
400
600
800
Forward Current(mA)
1000
1200
Relative Spectral Emission
Radiation Pattern
Radiation Pattern
S p c e tru m D i stri b u ti o n
1.2
Minor Axis
Major Axis
1 .0 0
Relative Intensity
Normalized Intensity
1
(IF = 300mA)
0.8
0.6
0.4
0.2
0 .8 0
0 .6 0
0 .4 0
0 .2 0
0 .0 0
400
0
-90
-60
-30
0
30
60
450
90
500
550
600
650
700
W a v e l e n g th (n m )
Angle(Degree)
Chromaticity vs. Forward Current
X coordinate
Y coordinate
0.32
0.32
CIE Coordinate(Y)
CIE Coordinate(X)
0.315
0.31
0.305
0.315
0.31
0.305
0.3
0
200
400
600
Current(mA)
SAMSUNG LED
800
1000
1200
0
200
400
600
800
1000
1200
Current(mA)
6/20
* These graphs show typical values.
(Ta = 25℃)
Max. DC Rating
CCT vs. Forward Current
△ CCT vs Current
350
400
300
△ CCT
200
100
0
-100 0
200
400
600
-200
-300
-400
1000
1200
300
250
200
150
100
50
0
-40
-500
Current(mA)
SAMSUNG LED
800
Max DC Current(mA)
500
-20
0
20
40
60
80
100
Ambient Temperature(℃)
7/20
6. LED Package Outline Dimensions
unit:mm
SIDE VIEW
TOP VIEW
BOTTOM VIEW
Recommended Solder Pattern
CIRCUIT
NUMBER
Description
Material
①
Ceramic Substrate
Aluminium Nitride or Aluminium Oxide
②
Resin Mold
Silicone/Filler/Phospor
③
LED Die
InGaN
④
Zener Diode
Silicon
SAMSUNG LED
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7. Solder Conditions
1) Reflow Conditions ( Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5 seconds @MAX300℃, under soldering iron.(one time only)
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8. Taping Dimension
;13䦴316
4133.3158
03133
5159䦴3138
4133䦴3138
7133䦴314
41<8䦴3138
Start
End
More than 40 ㎜
Mounted with
More than (100~200)㎜
Unloaded tape
Flash LED
Unloaded tape
Leading part more than
(200~400)㎜
15.4±1.
0
Ø180
2.0±0.2
13.0±0.
+0
-3
3
Ø13±0.2
30°
Ø60
+1
-0
Ø10
Ø22
Label
(1) Quantity : The quantity/reel to be 3000pcs.
Tolerance
±0.2 , Unit:mm
(2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 ㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape.
(4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof package.
SAMSUNG LED
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9. Label Structure
ⓐ ⓑ ⓒ
XXXXXX
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
N.B) Denoted rank is the only example.
Rank Code
ⓐ : Forward Voltage (VF) Rank
ⓑ : Chromaticity Coordinate Rank
ⓒ : Luminous Flux (ΦV) Rank
10. Lot Number
The Lot number is composed of the following characters
ⓐ ⓑ ⓒ
XXXXXX
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Rank Code
●◎◇◆□■△△△ / I▲▲▲ / 3,000PCS
● : Production Site (S:SAMSUNG LED Suwon, G:Gosin China)
◎ : L (LED)
◇ : Product State (A:Normality, B: Bulk, C:First Production, R:reproduction, S:Sample)
◆ : Year (S:2008, T:2009, U:2010, V:2011...)
□ : Month (1 ~ 9, A~C)
■ : Day (1 ~ 9, A, B ~ V)
△ : SAMSUNG LED Product number (1 ~ 999)
▲ : Reel Number (1 ~ 999)
SAMSUNG LED
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11. Reel Packing Structure
Reel
XXXXXX
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
LEVEL
2a
Aluminum Bag
↓
XXXXXX
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
↓
Outer Box Structure
TYPE
Dimensions(mm)
L×W×H
Ree/box
Material
S
250×225×126
5Reel Max.
Paper
(DW)
L
250×225×190
10Reel
Max.
Paper
(SW3B)
S1WOTO
H
S ID
①
E L
ED
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
[Box Label]
L
SAMSUNG LED
W
12/20
12. Aluminum Vinyl Bag
xxxxxx
SPFCW02101BNSIWOTO S1W0T0 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag
SAMSUNG LED
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13. Precaution for use
1) For overcurrent-protection, customers are recommended to apply resistors
connected in series with the LEDs to mitigate sudden change of the forward current
caused by shift of the forward voltage.
2) This device should not be used in any type of fluid such as water, oil, organic
solvent, etc. When cleaning is required, IPA is recommended as cleaning agent.
Solvent-based cleaning agent such as Zestron(R) may damage the silicone resins used in
the device.
3) When the device is in operation, the forward current should be carefully determined
considering the maximum ambient temperature and the corresponding junction
temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3
months or more after being shipped from Samsung LED, they should be packed with a
nitrogen-filled container.
(Shelf life of sealed bags: 12 months, temp. 0~40℃, 20~70%RH)
5) After storage bag is open, device subject to soldering, solder reflow, or other
high temperature processes must be:
a. Mounted within 168 hours (7 days) at an assembly line with a condition of no
more than 30℃/60%RH.
b. Stored at <10% RH.
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in a dry place.
7) Devices require baking before mounting, if humidity card reading reaches 60%
at 23±5℃. 8) Devices must be baked for 24hours at 65±5℃, if baking is required.
9) The LEDs are sensitive to the static electricity and surge current. It is recommended to
use a wrist band or anti-electrostatic glove when handling the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leakage
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
SAMSUNG LED
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