Data Sheet

PCA9510A
Hot swappable I2C-bus and SMBus bus buffer
Rev. 04 — 18 August 2009
Product data sheet
1. General description
The PCA9510A is a hot swappable I2C-bus and SMBus buffer that allows I/O card
insertion into a live backplane without corrupting the data and clock buses. Control
circuitry prevents the backplane from being connected to the card until a stop command or
bus idle occurs on the backplane without bus contention on the card. When the
connection is made, the PCA9510A provides bidirectional buffering, keeping the
backplane and card capacitances isolated.
The PCA9510A has no rise time accelerator circuitry to prevent interference when there
are multiple devices in the same system. The PCA9510A incorporates a digital ENABLE
input pin, which enables the device when asserted HIGH and forces the device into a Low
current mode when asserted LOW, and an open-drain READY output pin, which indicates
that the backplane and card sides are connected together (HIGH) or not (LOW).
During insertion, the PCA9510A SDAIN and SCLIN pins (inputs only) are precharged to
1 V to minimize the current required to charge the parasitic capacitance of the chip.
Remark: The dynamic offset design of the PCA9510A/11A/12A/13A/14A I/O drivers allow
them to be connected to another PCA9510A/11A/12A/13A/14A device in series or in
parallel and to the A side of the PCA9517. The PCA9510A/11A/12A/13A/14A cannot
connect to the static offset I/Os used on the PCA9515/15A/16/16A/18 or PCA9517 B side
or P82B96 Sx/y side.
2. Features
n Bidirectional buffer for SDA and SCL lines increases fan-out and prevents SDA and
SCL corruption during live board insertion and removal from multipoint backplane
systems
n Compatible with Standard-mode I2C-bus, Fast-mode I2C-bus, and SMBus standards
n Active HIGH ENABLE input
n Active HIGH READY open-drain output
n High-impedance SDAn and SCLn pins for VCC = 0 V
n 1 V precharge on SDAIN and SCLIN inputs
n Supports clock stretching and multiple master arbitration and synchronization
n Operating power supply voltage range: 2.7 V to 5.5 V
n 5 V tolerant I/Os
n 0 Hz to 400 kHz clock frequency
n ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Packages offered: SO8, TSSOP8 (MSOP8)
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
3. Applications
n cPCI, VME, AdvancedTCA cards and other multipoint backplane cards that are
required to be inserted or removed from an operating system
4. Feature selection
Table 1.
Feature selection chart
Feature
PCA9510A PCA9511A PCA9512A PCA9513A PCA9514A
Idle detect
yes
yes
yes
yes
yes
High-impedance SDA, SCL pins for VCC = 0 V
yes
yes
yes
yes
yes
Rise time accelerator circuitry on SDAn and SCLn pins
-
yes
yes
yes
yes
Rise time accelerator circuitry hardware disable pin for
lightly loaded systems
-
-
yes
-
-
Rise time accelerator threshold 0.8 V versus 0.6 V
improves noise margin
-
-
-
yes
yes
Ready open-drain output
yes
yes
-
yes
yes
Two VCC pins to support 5 V to 3.3 V level translation with improved noise margins
-
yes
-
-
1 V precharge on all SDAn and SCLn pins
in only
yes
yes
-
-
92 µA current source on SCLIN and SDAIN for PICMG
applications
-
-
-
yes
-
5. Ordering information
Table 2.
Ordering information
Tamb = −40 °C to +85 °C.
Type number Topside
mark
Package
PCA9510AD
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TSSOP8[1]
plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
PA9510A
PCA9510ADP 9510A
[1]
Name
Description
Version
Also known as MSOP8.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
2 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
6. Block diagram
PCA9510A
VCC
BACKPLANE-TO-CARD
CONNECTION
SDAIN
CONNECT
SDAOUT
CONNECT
CONNECT
ENABLE
100 kΩ
RCH1
1 VOLT
PRECHARGE
100 kΩ
RCH2
BACKPLANE-TO-CARD
CONNECTION
SCLIN
SCLOUT
CONNECT
CONNECT
0.55VCC/
0.45VCC
STOP BIT AND
BUS IDLE
0.5 µA
0.55VCC/
0.45VCC
CONNECT
20 pF
UVLO
ENABLE
100 µs
DELAY
UVLO
READY
RD
GND
QB
S
0.5 pF
CONNECT
002aab781
Fig 1.
Block diagram of PCA9510A
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
3 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
7. Pinning information
7.1 Pinning
ENABLE
1
8
VCC
SCLOUT
2
7
SDAOUT
SCLIN
3
6
SDAIN
GND
4
5
READY
PCA9510AD
ENABLE
1
8
VCC
SCLOUT
2
7
SDAOUT
6
SDAIN
5
READY
Pin configuration for SO8
3
GND
4
002aab783
002aab782
Fig 2.
SCLIN
PCA9510ADP
Fig 3.
Pin configuration for TSSOP8
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
ENABLE
1
Chip enable. Grounding this input puts the part in a Low current (< 1 µA)
mode. It also disables the rise time accelerators, isolates SDAIN from
SDAOUT and isolates SCLIN from SCLOUT.
SCLOUT
2
serial clock output to and from the SCL bus on the card
SCLIN
3
serial clock input to and from the SCL bus on the backplane
GND
4
ground supply; connect this pin to a ground plane for best results
READY
5
open-drain output which pulls LOW when SDAIN and SCLIN are
disconnected from SDAOUT and SCLOUT, and goes HIGH when the two
sides are connected
SDAIN
6
serial data input to and from the SDA bus on the backplane
SDAOUT
7
serial data output to and from the SDA bus on the card
VCC
8
power supply
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
4 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
8. Functional description
Refer to Figure 1 “Block diagram of PCA9510A”.
8.1 Start-up
An undervoltage and initialization circuit holds the parts in a disconnected state which
presents high-impedance to all SDAn and SCLn pins during power-up. A LOW on the
ENABLE pin also forces the parts into the low current disconnected state when the ICC is
essentially zero. As the power supply is brought up and the ENABLE is HIGH or the part is
powered and the ENABLE is taken from LOW to HIGH, it enters an initialization state
where the internal references are stabilized and the precharge circuit is enabled. At the
end of the initialization state the ‘Stop Bit And Bus Idle’ detect circuit is enabled. With the
ENABLE pin HIGH long enough to complete the initialization state (ten) and remaining
HIGH when all the SDAn and SCLn pins have been HIGH for the bus idle time or when all
pins are HIGH and a STOP condition is seen on the SDAIN and SCLIN pins, SDAIN is
connected to SDAOUT and SCLIN is connected to SCLOUT. The 1 V precharge circuitry
is activated during the initialization and is deactivated when the connection is made. The
precharge circuitry pulls up the SDAIN and SCLIN input pins to 1 V through individual
100 kΩ nominal resistors. This precharges the pins to 1 V to minimize the worst case
disturbances that result from inserting a card into the backplane where the backplane and
the card are at opposite logic levels.
8.2 Connect circuitry
Once the connection circuitry is activated, the behavior of SDAIN and SDAOUT as well as
SCLIN and SCLOUT become identical with each acting as a bidirectional buffer that
isolates the input capacitance from the output bus capacitance while communicating the
logic levels. A LOW forced on either SDAIN or SDAOUT will cause the other pin to be
driven to a LOW by the part. The same is also true for the SCLn pins. Noise between
0.7VCC and VCC is generally ignored because a falling edge is only recognized when it
falls below 0.7VCC with a slew rate of at least 1.25 V/µs. When a falling edge is seen on
one pin, the other pin in the pair turns on a pull-down driver that is referenced to a small
voltage above the falling pin. The driver will pull the pin down at a slew rate determined by
the driver and the load initially, because it does not start until the first falling pin is below
0.7VCC. The first falling pin may have a fast or slow slew rate, if it is faster than the
pull-down slew rate then the initial pull-down rate will continue. If the first falling pin has a
slow slew rate then the second pin will be pulled down at its initial slew rate only until it is
just above the first pin voltage then they will both continue down at the slew rate of the
first.
Once both sides are LOW they will remain LOW until all the external drivers have stopped
driving LOWs. If both sides are being driven LOW to the same value for instance, 10 mV
by external drivers, which is the case for clock stretching and is typically the case for
acknowledge, and one side external driver stops driving that pin will rise until the internal
driver pulls it down to the offset voltage. When the last external driver stops driving a
LOW, that pin will rise up and settle out just above the other pin as both rise together with
a slew rate determined by the internal slew rate control and the RC time constant. As long
as the slew rate is at least 1.25 V/µs, when the pin voltage exceeds 0.6 V for the
PCA9510A, the pull-down driver is turned off.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
5 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
8.3 Maximum number of devices in series
Each buffer adds about 0.1 V dynamic level offset at 25 °C with the offset larger at higher
temperatures. Maximum offset (Voffset) is 0.150 V with a 10 kΩ pull-up resistor. The LOW
level at the signal origination end (master) is dependent upon the load and the only
specification point is the I2C-bus specification of 3 mA will produce VOL < 0.4 V, although if
lightly loaded the VOL may be ~0.1 V. Assuming VOL = 0.1 V and Voffset = 0.1 V, the level
after four buffers would be 0.5 V, which is only about 0.1 V below the threshold of the
rising edge accelerator (about 0.6 V). With great care a system with four buffers may
work, but as the VOL moves up from 0.1 V, noise or bounces on the line will result in firing
the rising edge accelerator thus introducing false clock edges. Generally it is
recommended to limit the number of buffers in series to two, and to keep the load light to
minimize the offset.
The PCA9510A (rise time accelerator is permanently disabled) and the PCA9512A (rise
time accelerator can be turned off) are a little different with the rise time accelerator turned
off because the rise time accelerator will not pull the node up, but the same logic that turns
on the accelerator turns the pull-down off. If the VIL is above ~0.6 V and a rising edge is
detected, the pull-down will turn off and will not turn back on until a falling edge is
detected.
buffer A
MASTER
buffer B
SLAVE B
common
node
buffer C
SLAVE C
002aab581
Fig 4.
System with 3 buffers connected to common node
Consider a system with three buffers connected to a common node and communication
between the Master and Slave B that are connected at either end of buffer A and buffer B
in series as shown in Figure 4. Consider if the VOL at the input of buffer A is 0.3 V and the
VOL of Slave B (when acknowledging) is 0.4 V with the direction changing from Master to
Slave B and then from Slave B to Master. Before the direction change you would observe
VIL at the input of buffer A of 0.3 V and its output, the common node, is ~0.4 V. The output
of buffer B and buffer C would be ~0.5 V, but Slave B is driving 0.4 V, so the voltage at
Slave B is 0.4 V. The output of buffer C is ~0.5 V. When the Master pull-down turns off, the
input of buffer A rises and so does its output, the common node, because it is the only part
driving the node. The common node will rise to 0.5 V before buffer B’s output turns on, if
the pull-up is strong the node may bounce. If the bounce goes above the threshold for the
rising edge accelerator ~0.6 V the accelerators on both buffer A and buffer C will fire
contending with the output of buffer B. The node on the input of buffer A will go HIGH as
will the input node of buffer C. After the common node voltage is stable for a while the
rising edge accelerators will turn off and the common node will return to ~0.5 V because
the buffer B is still on. The voltage at both the Master and Slave C nodes would then fall to
~0.6 V until Slave B turned off. This would not cause a failure on the data line as long as
the return to 0.5 V on the common node (~0.6 V at the Master and Slave C) occurred
before the data set-up time. If this were the SCL line, the parts on buffer A and buffer C
would see a false clock rather than a stretched clock, which would cause a system error.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
6 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
8.4 Propagation delays
The delay for a rising edge is determined by the combined pull-up current from the bus
resistors and the rise time accelerator current source and the effective capacitance on the
lines. If the pull-up currents are the same, any difference in rise time is directly
proportional to the difference in capacitance between the two sides. The tPLH may be
negative if the output capacitance is less than the input capacitance and would be positive
if the output capacitance is larger than the input capacitance, when the currents are the
same.
The tPHL can never be negative because the output does not start to fall until the input is
below 0.7VCC, and the output turn on has a non-zero delay, and the output has a limited
maximum slew rate, and even if the input slew rate is slow enough that the output catches
up it will still lag the falling voltage of the input by the offset voltage. The maximum tPHL
occurs when the input is driven LOW with zero delay and the output is still limited by its
turn-on delay and the falling edge slew rate. The output falling edge slew rate is a function
of the internal maximum slew rate which is a function of temperature, VCC and process, as
well as the load current and the load capacitance.
8.5 READY digital output
This pin provides a digital flag which is LOW when either ENABLE is LOW or the start-up
sequence described earlier in this section has not been completed. READY goes HIGH
when ENABLE is HIGH and start-up is complete. The pin is driven by an open-drain
pull-down capable of sinking 3 mA while holding 0.4 V on the pin. Connect a resistor of
10 kΩ to VCC to provide the pull-up.
8.6 ENABLE low current disable
Grounding the ENABLE pin disconnects the backplane side from the card side, disables
the rise time accelerators, drives READY LOW, disables the bus precharge circuitry, and
puts the part in a low current state. When the pin voltage is driven all the way to VCC, the
part waits for data transactions on both the backplane and card sides to be complete
before reconnecting the two sides.
8.7 Resistor pull-up value selection
The system pull-up resistors must be strong enough to provide a positive slew rate of
1.25 V/µs on the SDAn and SCLn pins, in order to activate the boost pull-up currents
during rising edges. Choose maximum resistor value using Equation 1:
3 V CC ( min ) – 0.6
R PU ≤ 800 × 10  -----------------------------------


C
(1)
where RPU is the pull-up resistor value in ohms, VCC(min) is the minimum VCC voltage in
volts, and C is the equivalent bus capacitance in picofarads.
In addition, regardless of the bus capacitance, always choose RPU ≤ 65.7 kΩ for
VCC = 5.5 V maximum, RPU ≤ 45 kΩ for VCC = 3.6 V maximum. The start-up circuitry
requires logic HIGH voltages on SDAOUT and SCLOUT to connect the backplane to the
card, and these pull-up values are needed to overcome the precharge voltage. See the
curves in Figure 5 and Figure 6 for guidance in resistor pull-up selection.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
7 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
002aae778
50
RPU
(kΩ)
Rmax = 45 kΩ
40
rise time = 20 ns
30
rise time = 300 ns
rise time = 1000 ns
20
(1)
10
Rmin = 1 kΩ
0
0
100
200
300
400
Cb (pF)
(1) Unshaded area indicates recommended pull-up.
Fig 5.
Bus requirements for 3.3 V systems
002aae779
70
RPU
(kΩ)
Rmax = 65.7 kΩ
60
50
rise time = 20 ns
40
rise time = 300 ns
30
rise time = 1000 ns
20
Rmin = 1.7 kΩ
(1)
10
0
0
100
200
300
400
Cb (pF)
(1) Unshaded area indicates recommended pull-up.
Fig 6.
Bus requirements for 5 V systems
8.8 Hot swapping and capacitance buffering application
Figure 7 through Figure 10 illustrate the usage of the PCA9510A in applications that take
advantage of both its hot swapping and capacitance buffering features. In all of these
applications, note that if the I/O cards were plugged directly into the backplane, all of the
backplane and card capacitances would add directly together, making rise time and
fall time requirements difficult to meet. Placing a bus buffer on the edge of each card,
however, isolates the card capacitance from the backplane. For a given I/O card, the
PCA9510A drives the capacitance of everything on the card and the backplane must drive
only the capacitance of the bus buffer, which is less than 10 pF, the connector, trace, and
all additional cards on the backplane.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
8 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
See Application Note AN10160, ‘Hot Swap Bus Buffer’ for more information on
applications and technical assistance.
BACKPLANE
CONNECTOR
BACKPLANE
STAGGERED CONNECTOR
BD_SEL
SDA
SCL
R2
10 kΩ
STAGGERED CONNECTOR
R1
10 kΩ
I/O PERIPHERAL CARD 1
POWER SUPPLY
HOT SWAP
POWER SUPPLY
HOT SWAP
STAGGERED CONNECTOR
VCC
POWER SUPPLY
HOT SWAP
C1
0.01 µF
R3
10 kΩ
ENABLE
SDAIN
SCLIN
VCC
GND
R4
10 kΩ
R5
10 kΩ
SDAOUT
SCLOUT
READY
R6
10 kΩ
CARD1_SDA
CARD1_SCL
I/O PERIPHERAL CARD 2
C3
0.01 µF
R7
10 kΩ
ENABLE
SDAIN
SCLIN
VCC
GND
R8
10 kΩ
R9
10 kΩ
SDAOUT
SCLOUT
READY
R10
10 kΩ
CARD2_SDA
CARD2_SCL
I/O PERIPHERAL CARD N
C5
0.01 µF
R11
10 kΩ
ENABLE
SDAIN
SCLIN
VCC
GND
SDAOUT
SCLOUT
READY
R12
10 kΩ
R13
10 kΩ
R14
10 kΩ
CARDN_SDA
CARDN_SCL
002aab584
Remark: The PCA9510A can be used in any combination depending on the number of rise time accelerators that are needed
by the system. Normally only one PCA9510A would be required per bus.
Fig 7.
Hot swapping multiple I/O cards into a backplane using the PCA9510A in a cPCI, VME, and AdvancedTCA
system
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
9 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
BACKPLANE
CONNECTOR
BACKPLANE
R1
10 kΩ
R2
10 kΩ
SDA
SCL
STAGGERED CONNECTOR
I/O PERIPHERAL CARD 1
VCC
C1
0.01 µF
C2
0.01 µF
ENABLE
SDAIN
SCLIN
VCC
GND
R4
10 kΩ
R5
10 kΩ
SDAOUT
SCLOUT
READY
R6
10 kΩ
CARD1_SDA
CARD1_SCL
STAGGERED CONNECTOR
I/O PERIPHERAL CARD 2
C3
0.01 µF
C4
0.01 µF
ENABLE
SDAIN
SCLIN
VCC
GND
R8
10 kΩ
R9
10 kΩ
SDAOUT
SCLOUT
READY
R10
10 kΩ
CARD2_SDA
CARD2_SCL
002aab585
Fig 8.
Hot swapping multiple I/O cards into a backplane using the PCA9510A in a PCI system
I2C-bus System 1
I2C-bus System 2
VCC = 5 V
R1
10 kΩ
to other
System 1
devices
SDA1
SCL1
VCC
R4
10 kΩ
C1
0.01 µF
VCC
ENABLE
SDAOUT
SDAIN
SCLOUT
SCLIN
READY
GND
R5
10 kΩ
R2
10 kΩ
R3
10 kΩ
R6
10 kΩ
long
distance
bus
C2
0.01 µF
VCC
SDAOUT
ENABLE
SCLOUT
SDAIN
READY
SCLIN
GND
R7
10 kΩ
R8
10 kΩ
SDA1
SCL1
to other
System 2
devices
002aab586
Remark: See Application Note AN255, ‘I2C repeaters, hubs, and expanders’ for more information on other devices better
optimized for long distance transmission of the I2C-bus or SMBus.
Fig 9.
Repeater and bus extender application using the PCA9510A
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
10 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
Rdrop
VCC_LOW
VCC
R1
10 kΩ
C2
0.01 µF
R4
10 kΩ
R2
10 kΩ
R3
10 kΩ
R5
10 kΩ
VCC
ENABLE
SDAOUT
SDAIN
SCLOUT
SCLIN
READY
GND
SDA
SCL
SDA2
SCL2
002aab587
VCC > VCC_LOW
Rdrop is the line loss of VCC in the backplane.
Fig 10. System with disparate VCC voltages
9. Application design-in information
VCC
(2.7 V to 5.5 V)
R1
10 kΩ
R2
10 kΩ
SCLIN
SDAIN
8
R5
10 kΩ
3
2
6
7
1
ENABLE
C1
0.01 µF
ENABLE
READY
R3
10 kΩ
R4
10 kΩ
SCLOUT
SDAOUT
5
GND
4
002aab780
Fig 11. Typical application
10. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Min
Max
Unit
supply voltage
[1]
−0.5
+7
V
Vn
voltage on any other pin
[1]
−0.5
+7
V
VCC
Parameter
Conditions
Toper
operating temperature
−40
+85
°C
Tstg
storage temperature
−65
+150
°C
Tsp
solder point temperature
-
300
°C
Tj(max)
maximum junction temperature
-
125
°C
[1]
Voltages with respect to pin GND.
PCA9510A_4
Product data sheet
10 s maximum
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
11 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
11. Characteristics
Table 5.
Characteristics
VCC = 2.7 V to 5.5 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Power supply
[1]
2.7
-
5.5
V
[1]
-
3.5
6
mA
-
16
-
µA
0.8
1.1
1.2
V
VIH(ENABLE) HIGH-level input voltage
on pin ENABLE
-
0.5 × VCC 0.7 × VCC V
VIL(ENABLE) LOW-level input voltage
on pin ENABLE
0.3 × VCC
0.5 × VCC -
V
-
±0.1
±1
µA
VCC
supply voltage
ICC
supply current
VCC = 5.5 V;
VSDAIN = VSCLIN = 0 V
ICC(sd)
Shut-down mode supply
current
VENABLE = 0 V; all other pins at
VCC or GND
Start-up circuitry
Vpch
precharge voltage
SDA, SCL floating; input only
[1]
II(ENABLE)
input current on pin
ENABLE
ten
enable time
[2]
-
110
-
µs
tidle(READY)
bus idle time to READY
active
[1]
50
105
200
µs
tdis(EN-RDY)
disable time (ENABLE to
READY)
-
30
-
ns
tstp(READY)
SDAIN to READY delay
after STOP
[3]
-
1.2
-
µs
tREADY
SCLOUT/SDAOUT to
READY delay
[3]
-
0.8
-
µs
ILZ(READY)
off-state leakage current
on pin READY
VENABLE = VCC
-
±0.3
-
µA
Ci(ENABLE)
input capacitance on pin
ENABLE
VI = VCC or GND
[4]
-
1.9
4.0
pF
Co(READY)
output capacitance on pin VI = VCC or GND
READY
[4]
-
2.5
4.0
pF
[1]
-
-
0.4
V
VOL(READY) LOW-level output voltage
on pin READY
VENABLE = 0 V to VCC
Ipu = 3 mA; VENABLE = VCC
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
12 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
Table 5.
Characteristics …continued
VCC = 2.7 V to 5.5 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
0
110
175
mV
Input-output connection
Voffset
offset voltage
10 kΩ to VCC on SDA, SCL;
VCC = 3.3 V
[1][5]
[6]
tPLH
LOW to HIGH
propagation delay
SCLn to SCLn and
SDAn to SDAn; 10 kΩ to VCC;
CL = 100 pF each side
-
800
-
ns
tPHL
HIGH to LOW
propagation delay
SCLn to SCLn and
SDAn to SDAn; 10 kΩ to VCC;
CL = 100 pF each side
-
80
-
ns
[4]
-
5
7
pF
[1]
0
0.3
0.4
V
−1
-
+1
µA
Ci(SCL/SDA) SCL and SDA input
capacitance
VOL
LOW-level output voltage
VI = 0 V; SDAn, SCLn pins;
Isink = 3 mA; VCC = 2.7 V
ILI
input leakage current
SDAn, SCLn pins; VCC = 5.5 V
System characteristics
SCL clock frequency
[4]
0
-
400
kHz
tBUF
bus free time between a
STOP and START
condition
[4]
1.3
-
-
µs
tHD;STA
hold time (repeated)
START condition
[4]
0.6
-
-
µs
tSU;STA
set-up time for a repeated
START condition
[4]
0.6
-
-
µs
tSU;STO
set-up time for STOP
condition
[4]
0.6
-
-
µs
tHD;DAT
data hold time
[4]
300
-
-
ns
tSU;DAT
data set-up time
[4]
100
-
-
ns
tLOW
LOW period of the SCL
clock
[4]
1.3
-
-
µs
tHIGH
HIGH period of the SCL
clock
[4]
0.6
-
-
µs
tf
fall time of both SDA and
SCL signals
[4][7]
20 + 0.1 × Cb -
300
ns
tr
rise time of both SDA and
SCL signals
[4][7]
20 + 0.1 × Cb -
300
ns
fSCL
[1]
This specification applies over the full operating temperature range.
[2]
The enable time can slow considerably for some parts when temperature is < −20 °C.
[3]
Delays that can occur after ENABLE and/or idle times have passed.
[4]
Guaranteed by design, not production tested.
[5]
The connection circuitry always regulates its output to a higher voltage than its input. The magnitude of this offset voltage as a function
of the pull-up resistor and VCC voltage is shown in Section 11.1 “Typical performance characteristics”.
[6]
Force VSDAIN = VSCLIN = 0.1 V, tie SDAOUT and SCLOUT through 10 kΩ resistor to VCC and measure the SDAOUT and SCLOUT
output.
[7]
Cb = total capacitance of one bus line in pF.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
13 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
11.1 Typical performance characteristics
002aab588
3.7
002aab589
90
VCC = 5.5 V
ICC
(mA)
VCC = 5.5 V
tPHL
(ns)
3.3 V
3.3
80
2.7 V
2.7 V
2.9
2.5
−40
3.3 V
70
+25
60
−40
+90
+25
Tamb (°C)
+90
Tamb (°C)
Ci = Co > 100 pF; RPU(in) = RPU(out) = 10 kΩ
Fig 12. ICC versus temperature
Fig 13. Input/output tPHL versus temperature
002aab591
350
VO − VI
(mV)
250
150
VCC = 5 V
3.3 V
50
0
10
20
30
40
RPU (kΩ)
Fig 14. Connection circuitry VO − VI
PCA9510A_4
Product data sheet
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Rev. 04 — 18 August 2009
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PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
11.2 Timing diagrams
SDAn/SCLn
ten
ENABLE
tdis
tidle(READY)
READY
002aab592
Fig 15. Timing for ten, tidle(READY), and tdis
SDAIN
SCLIN
SCLOUT
SDAOUT
ten
ENABLE
tstp(READY)
READY
002aab593
tstp(READY) is only applicable after the ten delay
Fig 16. tstp(READY) that can occur after ten
SCLIN, SDAIN,
SCLOUT, SDAOUT
ten
tidle(READY)
ENABLE
tstp(READY)
READY
002aab594
tstp(READY) is only applicable after the ten delay
Fig 17. tstp(READY) delay that can occur after ten and tidle(READY)
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
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PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
12. Test information
VCC
VCC
PULSE
GENERATOR
VI
VO
RL
10 kΩ
DUT
RT
CL
100 pF
002aab595
RL = load resistor
CL = load capacitance includes jig and probe capacitance
RT = termination resistance should be equal to the output impedance Zo of the pulse generator
Fig 18. Test circuitry for switching times
PCA9510A_4
Product data sheet
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Rev. 04 — 18 August 2009
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PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
HE
v M A
Z
5
8
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
inches
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100
0.014 0.0075
0.20
0.19
0.16
0.15
0.05
0.01
0.01
0.004
0.028
0.012
0.244
0.039 0.028
0.041
0.228
0.016 0.024
θ
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT96-1
076E03
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 19. Package outline SOT96-1 (SO8)
PCA9510A_4
Product data sheet
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Rev. 04 — 18 August 2009
17 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
D
E
SOT505-1
A
X
c
y
HE
v M A
Z
5
8
A2
pin 1 index
(A3)
A1
A
θ
Lp
L
1
4
detail X
e
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.94
0.7
0.4
0.1
0.1
0.1
0.70
0.35
6°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-04-09
03-02-18
SOT505-1
Fig 20. Package outline SOT505-1 (TSSOP8)
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
18 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
PCA9510A_4
Product data sheet
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Rev. 04 — 18 August 2009
19 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 21) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Table 6.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 21.
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
20 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 21. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
Table 8.
Abbreviations
Acronym
Description
AdvancedTCA
Advanced Telecommunications Computing Architecture
CDM
Charged Device Model
cPCI
compact Peripheral Component Interface
DUT
Device Under Test
ESD
Electrostatic Discharge
HBM
Human Body Model
I2C-bus
Inter IC bus
MM
Machine Model
PCI
Peripheral Component Interface
PICMG
PCI Industrial Computer Manufacturers Group
RC
Resistor-Capacitor network
SMBus
System Management Bus
VME
VERSAModule Eurocard
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
21 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
16. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9510A_4
20090818
Product data sheet
-
PCA9510A_3
Modifications:
•
Section 8.7 “Resistor pull-up value selection”,
paragraph,
sentence changed from
“... always choose RPU ≤ 16 kΩ for VCC = 5.5 V maximum, RPU ≤ 24 kΩ for VCC = 3.6 V
maximum.” to “always choose RPU ≤ 65.7 kΩ for VCC = 5.5 V maximum, RPU ≤ 45 kΩ for
VCC = 3.6 V maximum.”
•
Updated Figure 5 “Bus requirements for 3.3 V systems”:
2nd
1st
– changed from “rise time < 20 ns” to “rise time = 20 ns”
– changed from “rise time > 300 ns” to “rise time = 300 ns”
– changed from “rise time > 1000 ns” to “rise time = 1000 ns”
•
Updated Figure 6 “Bus requirements for 5 V systems”:
– changed from “rise time < 20 ns” to “rise time = 20 ns”
– changed from “rise time > 300 ns” to “rise time = 300 ns”
– changed from “rise time > 1000 ns” to “rise time = 1000 ns”
PCA9510A_3
20090721
Product data sheet
-
PCA9510A_2
PCA9510A_2
20080520
Product data sheet
-
PCA9510A_1
PCA9510A_1
20050908
Product data sheet
-
-
PCA9510A_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 18 August 2009
22 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9510A_4
Product data sheet
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Rev. 04 — 18 August 2009
23 of 24
PCA9510A
NXP Semiconductors
Hot swappable I2C-bus and SMBus bus buffer
19. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
9
10
11
11.1
11.2
12
13
14
14.1
14.2
14.3
14.4
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Feature selection . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connect circuitry. . . . . . . . . . . . . . . . . . . . . . . . 5
Maximum number of devices in series . . . . . . . 6
Propagation delays . . . . . . . . . . . . . . . . . . . . . . 7
READY digital output . . . . . . . . . . . . . . . . . . . . 7
ENABLE low current disable. . . . . . . . . . . . . . . 7
Resistor pull-up value selection . . . . . . . . . . . . 7
Hot swapping and capacitance buffering
application. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Application design-in information . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Typical performance characteristics . . . . . . . . 14
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Soldering of SMD packages . . . . . . . . . . . . . . 19
Introduction to soldering . . . . . . . . . . . . . . . . . 19
Wave and reflow soldering . . . . . . . . . . . . . . . 19
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 23
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 August 2009
Document identifier: PCA9510A_4
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