Rev: 0.0 ISSUE NO : DATE OF ISSUE : Feb. 27 2012 SPECIFICATION MODEL : SPFCW14311BD High Power Flash LED CUSTOMER : CUSTOMER : CHECKED CHECKED APPROVED SAMSUNG LED DRAWN CHECKED APPROVED SAMSUNG LED CO,.LTD. Nongseo-dong, Giheung-gu, Yongin-si, Gyeonggi-do, 446-711 KOREA Http://www.samsungled.com 1 / 23 Contents 1. Revision Sheet ------------------------- 3 2. Product Outline ------------------------- 4 3. Absolute Maximum Rating ------------------------- 4 4. Characteristics ------------------------- 4 5. Typical Characteristics Graph ------------------------- 6 6. Outline Drawing & Dimension ------------------------- 8 7. Solder Conditions -------------------------- 9 8. Taping Dimension -------------------------- 10 9. Label Structure -------------------------- 11 10. Lot Number -------------------------------- 11 11. Reel Packing Structure -------------------------- 12 12. Aluminium Packing Bag ------------------------- 14 13. Precaution For Use ------------------------- 15 14. QC Flow Chart -------------------------- 16 15. Hazard Substance Analysis(SGS) 16. Reliability Test Items and Conditions Http://www.samsungled.com ------------------------- 17 ---------------- 23 2 / 23 1. Revision Sheet Revision History (Model: SPFCW14311BD) Writer rev 0 Date Revision History Feb.27 2012 New Version Http://www.samsungled.com page Drawn Approved C.W.Kim J.H.KIM 3 / 23 2. Product Outline 1) Features . Low profile lens-integrated LED ( 4.0 x 3.9 x t 1.9mm ) △ . Wide Beam Angle ( θ : 620x480 ) for uniform illuminance . InGaN/GaN MQW LED with long-time reliability . Lead (Pd) free product - RoHS compliant 2) Applications . Flashlight for cameraphones & digital still cameras . Torchlight . Amusement equipment . Other applications 3. Absolute Maximum Rating ℃ 1) Torch Mode Operation Forward Current (Ta = 25 ) .......... 300 mA 2) Flash Mode Peak Pulsed Forward Current ........................ 1300 mA ≤ ℃ (Pulse width t 300msec, Duty ratio=0.06, Ta=25 ) 3) Reverse Current ........................................................................ 85 mA 4) Thermal Resistance ( Rth,j-s ) ..................................................... 9 K/W 5) LED Junction Temperature ( TJ ) .............................................. 125 ℃ 6) Operating Temperature Range ( T ) ........................ -40℃ ∼ 85℃ 7) Storage Temperature Range ( T ) ......................... -40℃ ∼ 100℃ opr stg 4. Characteristics ℃) 1) Specifications ( Ta : 25 Item Unit Condition Min Typ Max Illuminance lux IF = 1000 mA 230 245 300 Forward Voltage (VF) V IF = 1000 mA 2.8 3.6 4.0 Chromaticity Coordinates x,y IF = 1000 mA Reverse Voltage (VR) V IR =10 mA 0.6 - 1.2 Low Current Voltage (VF) V IF = 1 µA 1.7 - 2.7 Size mm - Refer to the CIE chromaticity coordinates in page 7 4.0 x 3.9 x 1.9 Notes * Samsung LED uses the above specifications table as the final product test criteria. * Samsung LED maintains a tester tolerance of ±10% on flux measurements. * Samsung LED maintains a tolerance of ±0.15V on forward voltage measurements. * Samsung LED maintains a tester tolerance of ±0.01 on CCx, CCy measurements. * Samsung LED maintains a tester tolerance of ±10% on low current voltage measurements. * Samsung LED maintains a tolerance of ±0.1 mm on device dimensions. Http://www.samsungled.com 4 / 23 ℃) 2) General characteristics ( Ta : 25 Item Unit Condition Illuminance (at 1 meter) lux IF = 700 mAⓐ Min IF = 300 mA cd Luminous Flux lm Forward Voltage (VF) V CCT °K Max 63 67 82 158 168 206 230 245 300 IF = 700 mAⓐ IF = 1000 mAⓑ 63 67 82 158 168 206 230 245 300 IF = 300 mA IF = 1000 mAⓑ IF = 300 mA Luminous Intensity Typ IF = 700 mAⓐ IF = 1000 mAⓑ 67 71 88 168 179 220 245 261 320 IF = 300 mA 2.42 3.03 3.46 IF = 700 mAⓐ IF = 1000 mAⓑ 2.70 3.38 3.86 2.80 3.50 4.00 IF = 300 mA 5564 6027 6491 5760 6240 6720 6000 6500 7000 0.6 - 1.2 IF = 700 mAⓐ IF = 1000 mAⓑ Reverse Voltage (VR) V IR = 10 mA Size mm - 4.0 x 3.9 x 1.9 Notes: * The above data table is for design reference only. ⓐ Pulse mode operation: Pulse width ≤ 600ms, Duty ratio 0.12 for I = 700mA ⓑ Pulse mode operation: Pulse width ≤ 500ms, Duty ratio 0.1 for I = 1000mA F F 3) Chromaticity Diagram Condition IF=1000mA x 0.342 0.312 y 0.302 0.342 0.320 0.288 0.385 0.320 * CIE coordinate at outgoing inspection can deviate within the range of tester tolerance of ± 0.01 Http://www.samsungled.com 5 / 23 5. Typical Characteristics Graph * These graphs show typical values. Luminous Flux vs. Forward Current Illuminance vs. Forward Current 1.2 1.2 ec 1 na ni 0.8 m ull 0.6 I ev it 0.4 lae R0.2 xu 1 lF su0.8 on i m uL0.6 ev it 0.4 al e 0.2 R 0 0 0.2 0.4 0.6 0.8 Current(mA) 1 1.2 0 Forward Current vs. Forward Voltage 3.8 0 0.2 0.4 0.6 0.8 Current(mA) 1 1.2 Relative Spectral Emission 1.2 3.6 1.0 yti sn0.8 et In de0.6 zil a m ro0.4 N ) 3.4 V (e 3.2 g al o 3 V d ra 2.8 w ro 2.6 F 2.4 0.2 2.2 0.0 2 0 0.2 0.4 0.6 0.8 Current(mA) 1 1.2 450 550 650 Wavelength(nm) 750 Intensity Drop vs. Time at Pulse Operation Radiation Pattern (I = 300mA) 350 1.2 F vertical IF = 1,200 mA horizontal 1.0 IF = 1,000 mA IF = 800 mA 0.8 IF = 600 mA 0.6 IF = 400 mA 0.4 IF = 200 mA 0.2 0.0 -60 -40 -20 0 20 40 60 * LED under test is SMT-soldered on a Samsung LED standard FR4 PCB Http://www.samsungled.com 6 / 23 * These graphs show typical values. Chromaticity vs. Forward Current x Coordinate ℃ 0.32 ℃ (Ta = 25 ) 0.32 0.315 0.315 )x (e ta 0.31 ind ro 0.305 o C 0.3 EI C )y (e 0.31 ta ind ro0.305 o C 0.3 EI C 0.295 0.29 y Coordinate (Ta = 25 ) 0.295 0 0.2 0.4 0.6 0.8 Current(mA) 1 1.2 0.29 0 0.2 Max. Pulse Rating 1 1.2 80 100 Max. DC Rating 350 1400 )A1200 m t(n1000 er ru 800 C es 600 lu P 400 xa M 200 0 -40 0.4 0.6 0.8 Current(mA) )A300 m (t 250 ne rr 200 uC CD150 xa100 M 50 -20 0 20 40 60 Ambient Temperature(℃) 80 100 0 -40 -20 0 20 40 60 Ambient Temperature(℃) Uniformity Map 90%-100% 80%-90% 70%-80% 60%-70% 50%-60% 40%-50% 30%-40% 20%-30% 10%-20% 0%-10% Http://www.samsungled.com 7 / 23 6. Outline Drawing & Dimension Unit : mm Tolerance : width, length ± 0.05 height : ± 0.07 Circuit Solder Pattern for Surface Mount Cathode Anode * 2D, 3D CAD data are available upon request. Http://www.samsungled.com 8 / 23 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 3 times max. 2) For Manual Soldering ℃ Not more than 5 seconds @MAX300 , under soldering iron.(one time only) Http://www.samsungled.com 9 / 23 8. Taping Dimension 0.3±0.05 2±0.05 Φ1.5+0.10 4±0.10 1.75±0.10 Φ150Min 5.5±0.05 12±0.30 4.35±0.10 8±0.10 4.15±0.10 Start End Mounted with Flash LED More than 40 ㎜ Unloaded tape More than (100~200)㎜ Leading part more than Unloaded tape (200~400)㎜ (1) Quantity : The quantity/reel to be 3,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 ㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at 10° angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package. (5) Cover Tape Sealing Type : Thermal Compression Carrier Tape Cover Tape Surface Resistance 107Ω 108Ω Material PS Anti-Static 0.00kV 0.00kV E/S @23 ℃, 50%RH Http://www.samsungled.com Reel Al Bag BOX 109Ω 1010Ω PS Al Paper 0.00kV 0.00kV 0.00kV 107Ω 이하 10 / 23 9. Label Structure LED-00039-001 Rank Code IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 S1R1T0 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II S1 : Forward Voltage (VF) Rank SLAT94001 / I001 / 3,000pcs Rank Code IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III R1 : Chromaticity Coordinate Rank T0 : Luminous Intensity (IV) Rank N.B) Denoted rank is the only example. LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 Customer Part Number Bar Code Supplier Part Number SPFCW14311BDS1R1T0 : Supplier Part 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III LED-00039-001 : Customer Part Number Number Quantity 10. Lot Number The Lot number is composed of the following characters LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III ●◎◇◆□■△△△ / I▲▲▲ / 3,000PCS ● : Production Site (S:SAMSUNG LED Suwon, G:Gosin China) ◎ : L (LED) ◇ : Product State (A:Normality, B: Bulk, C:First Production, R:reproduction, S:Sample) ◆ : Year (S:2008, T:2009, U:2010, V:2011...) □ : Month (1 ~ 9, A~C) ■ : Day (1 ~ 9, A, B ~ V) △ : SAMSUNG LED Product number (1 ~ 999) ▲ : Reel Number (1 ~ 999) Http://www.samsungled.com 11 / 23 11. Reel Packing Structure Reel LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III LEV EL 2a ↓ Aluminum Bag LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III ↓ Inner Box Material : Paper(SW3B(B)) TYPE 13inch ㎜ SIZE( ) L W H 335 45 335 LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 H IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III HP LED [ Box Label] W L Http://www.samsungled.com 12 / 23 Carton Box ↓ Material : Paper(SW3B(B)) TYPE 13inch SIZE(mm) L W H 350 350 350 ① SIDE ① LED-00039-001 H IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II 01 HP LED W SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III [ Box Label] Http://www.samsungled.com L 13 / 23 12. Aluminum Packing Bag LED-00039-001 IIIIIIIIIIIIIIIIIIIIIIIII SPFCW14311BDS1R1T0 S1R1T0 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIIIII III IIIIIIIII II SLAT94001 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIII III IIIIIIIIIIIIIIIII III Silica gel & Humidity Indicator Card in Aluminum Bag Http://www.samsungled.com 14 / 23 13. Precaution for use 1) For overcurrent-protection, customers are recommended to apply resistors connected in series with the LEDs to mitigate sudden change of the forward current caused by shift of the forward voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as cleaning agent. Solvent-based cleaning agent such as Zestron(R) may damage the silicone resins used in the device. 3) When the device is in operation, the forward current should be carefully determined considering the maximum ambient temperature and the corresponding junction temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung LED, they should be packed with a nitrogen-filled container. (Shelf life of sealed bags: 12 months, temp. 0~40 , 20~70%RH) ℃ 5) After storage bag is open, device subject to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 168 hours (7 days) at an assembly line with a condition of no ℃ more than 30 /60%RH. b. Stored at <10% RH. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 7) Devices require baking before mounting, if humidity card reading reaches 60% at 23±5 . ℃ ℃ 8) Devices must be baked for 24hours at 65±5 , if baking is required. 9) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) The LEDs package must be handled with care, especially top surface of the lens must not be stressed on handling. Pick the sidewall of package mold and do not touch the lens area when manual movement of each LEDs. 11) When processing by automated pick and place machine for SMT, the pressure applied to lens directly should be controlled less than 1Kg. Pickup tool should be designed according to lens shape. Pickup tool without cavity for lens area consideration can cause serious damage to package. Http://www.samsungled.com 15 / 23 14. QC Flow Chart P r o c e s s F lo w C h a r t f o r F la s h L E D P r o c e s s I n p u t P r o c e s s & Q . C m o n i t o r I n s p e c t i o n & Q . A 1 0 0 % G a t e I n s p e c t i o n D e v i c e F l a s h n a m e L E D D i a g r a m P . K . G 4 1 3 9 ( 4 . 1 * 3 . 9 * 1 . 9 ) T y p e 4039(4.0*3.9*1.9) Nokia R I M C u s t o m e r A r e a D i a g r a m I.Q .C P r o c e s s L e a d M a t e r i a l E q u i p m e n t I n s p e c i t o n I t e m L F L e a d F r a m e Diagram In s p e c t i o n Process D ie I n s p e c t i o n I n s p e c t i o n R e f . E x t e r a n l V i su a l M ic ro sc o p e C o n t a m in a t io n Area Q . C & Q . A F r a m e In c o m in g F r o n t -E n d P r o d . Material A g e t c . In s p e c t i o n Prod. Q.C&Q.A Inspection Inspection Ref. Equipment Inspeciton Item P a st e D ie Bo n d i n g P a st e M a c h in e P a st e C o v e r a g e V i su a l A t t a c h A g & S c o p e In sp e c t io n In s p e c t i o n I.Q.C Incoming O v e n C u r e N 2 QC Lead Frame, Lens, MicroscopeD i e s h e a r Contamination etc. O v e n etc. P la sm a Visual S h e a r Te s t e r Inspection P la sm a A r Front-End LF Exteranl C le a n in g Die Attach P a r a m e t e r Ag Paste Die Bonding Paste Coverage Machine & Scope Inspection P u l l Te s t c l e a n e r Ag Paste Visual Inspection W ir e S c o p e W ir e B o n d Reflow W ir e N2 W i n gG o l d B a ll Cleaning B a c k -E n d B o n d i n g Plasma Ar cleaner S il ic o n e D isp e n sin g Shear Tester P u l l Te s t e r S h e a r Te s t e r P a r a m e n t e r ) Parameter M o l d V isu a l P a r a m e t e r M o n it o r N 2 Wire BondingGold Wire O v e n Bonding Machine L e n s V i su a l Back-End C u r e N Dispensing O v e n 2 Silicone Ball PShear Test a r a m e t e r Inspection In s p e c t i o n V i s u a l Parameter) M o n it o r V i s u a l monitor, Shear Tester M o l d A t t ac h e r P a r a m e t e r Dispenser Scope V i su a l Wire Bonding(Visual Pull Tester L e n s O v e n Phosphor In s p e c t i o n Te m p . L e n s A t t a c h in g M o n it o r Wire Pull Test Wire C u r e In s p e c t i o n g ( V isu a l m o n i t o r , D isp en se r P h o sp h o r O v e n Te s t W iD r e o n d in Reflow Oven ieBshear ir e M a c h in e Plasma S h e a r M o n it o r In s p e c t i o n V Mold Visual Monitor Te m p . P a r a m e t e r Parameter Monitor Visual i su a l Inspection In s p e c t i o n (100%) P a c k a g e F in a l P a c k a g e In Oven Cure sp e c t i o n Tr Lens im N2 Oven S c o pe In S c o p e Parameter sp e c t io n S c o p e In s p e c t i o n Lens Attaching Tr Lens i m M a c h in e V Attacher V Mold Visual Monitor isu a l In sp e c t io n Parameter Monitor E le c t r ic a l N2 L Oven E D Te s t e r Te s t Lens shear ( IV , V F , IR ) O p t ic a l Trim Ta p i n g & Inspection (100%) Te s t Oven Cure Te s t H a n d l e r Visual i su a l In s p e c t i o n Shear Tester Te s t ( L m ) Scope Trim MachineDimension Inspection C a r r e i r / C o v e r V i su a l R e e l Test Ta p e & R e e l Ta p e Ta p i n g C o n d u c t iv e A l LED Tester P a c k in g S il ic a l Taping& G e l In s p e c t i o n In sp e c t io n C a r d Carreir/ Cover ( 100% ) Tape & Reel Tape B o x P a c k i n g V i su a l L a b e l K L P M P a c k i n g H u m id it y Reel In s p e c t i o n (IV, VF, IR) Optical Test(Lm) B a g S h i e l d i n g B a g In sp e c t io n Electrical Test W h e e l Test Handler P a c k i n g M a c h i nV ei s u a l Taping Machine Visual Inspection P a c k in g Ta p e Conductive Wheel Visual V i su a l Inspection L a b e l B o x In s p e c t i o n In sp e c t io n ( 100% ) Packing Q . C NO Shielding Bag Packing Q . C G a t e Al Bag Silical Gel Humidity Card KLPM L E D Te s t e r Packing Label S c o p e In s p e c t i o n Inspection ( M o n it o r ) Visual & R Ta p e e e l Inspection In s p e c t i o n → I o0 n0 i %) z e r (1 D r y B o x Packing Label Box Packing Box Tape Y E S Inspection W a r e H o u se Q.C W a r e C u s t o m e r H o u si n g NO Final S p e c . N u m b e r Inspection Q.C Gate S pe c . Ti t l e LED Tester Visual Inspection (100%) Electrical, Optical Tape & Reel Test R e v . Inspection Scope Inspection → Ionizer Dry (Monitor) Box P A G E YES Warehouse Stocking Http://www.samsungled.com 16 / 23 15. Hazard Substance Analysis(SGS) Http://www.samsungled.com 17 / 23 Http://www.samsungled.com 18 / 23 Http://www.samsungled.com 19 / 23 Http://www.samsungled.com 20 / 23 Http://www.samsungled.com 21 / 23 Http://www.samsungled.com 22 / 23 16. Reliability Test Items and Conditions Test Item Test Conditions Test Hours/Cycles No. of Samples s Sample RTOL 25℃±3℃, DC 300 mA 168 h 0/22 WHTOL 85℃±3℃, 85%±2% RH, DC 300mA 168 h 0/60 HTOL 85℃±3℃, DC 300mA 168 h 0/22 LTOL -40℃±3℃, DC 300mA 168 h 0/22 HTS Ta = 100℃±3℃ 168 h 0/11 LTS Ta = -40℃±3℃ 168 h 0/11 Thermal Shock -45℃↔125℃, each 15 min, 5 min Transfer 100 cycles 0/22 Series 85 ℃,85 %RH, 24 h → Peak 260±5 ℃, 220 ℃ over time 60 s, 3times → -40 ℃ / 85 ℃, each 1 h, 30 cycles 30 cycles 0/22 25℃ ~ 65℃ ~ -10℃ 24hrs/1cycle, 95%RH, DC 300 ㎃ 5 cycles 0/60 25℃ ~ 65℃ ~ -10℃ 24hrs/1cycle, 95%RH 5 cycles 0/60 On/Off Test 25℃±3℃, IF = 1000mA, On 0.5sec, Off 4.5sec 50k cycles 0/60 Vibration (sinewave) Test 100~2000~100 ㎐, 20G, Sweep 1 min, X.Y.Z 3 direction 4 cycles 0/11 Drop Test Random drop to steel, 120cm 12 times, 150cm 20times 20 times 0/11 5 times (± 5㎸) 0/5 Temperature humidity Cycle ESD[HBM] R1:10MΩ , R2:1.5KΩ , C:100pF Http://www.samsungled.com 23 / 23