Data Sheet - SPFCW14311BD

Rev: 0.0
ISSUE NO :
DATE OF ISSUE : Feb. 27 2012
SPECIFICATION
MODEL : SPFCW14311BD
High Power Flash LED
CUSTOMER :
CUSTOMER :
CHECKED
CHECKED
APPROVED
SAMSUNG LED
DRAWN
CHECKED
APPROVED
SAMSUNG LED CO,.LTD.
Nongseo-dong, Giheung-gu,
Yongin-si, Gyeonggi-do, 446-711 KOREA
Http://www.samsungled.com
1 / 23
Contents
1. Revision Sheet
-------------------------
3
2. Product Outline
-------------------------
4
3. Absolute Maximum Rating
-------------------------
4
4. Characteristics
-------------------------
4
5. Typical Characteristics Graph
-------------------------
6
6. Outline Drawing & Dimension
-------------------------
8
7. Solder Conditions
--------------------------
9
8. Taping Dimension
-------------------------- 10
9. Label Structure
-------------------------- 11
10. Lot Number
-------------------------------- 11
11. Reel Packing Structure
-------------------------- 12
12. Aluminium Packing Bag
------------------------- 14
13. Precaution For Use
------------------------- 15
14. QC Flow Chart
-------------------------- 16
15. Hazard Substance Analysis(SGS)
16. Reliability Test Items and Conditions
Http://www.samsungled.com
------------------------- 17
---------------- 23
2 / 23
1. Revision Sheet
Revision History
(Model: SPFCW14311BD)
Writer
rev
0
Date
Revision History
Feb.27 2012 New Version
Http://www.samsungled.com
page
Drawn
Approved
C.W.Kim
J.H.KIM
3 / 23
2. Product Outline
1) Features
. Low profile lens-integrated LED ( 4.0 x 3.9 x t 1.9mm )
△
. Wide Beam Angle ( θ : 620x480 ) for uniform illuminance
. InGaN/GaN MQW LED with long-time reliability
. Lead (Pd) free product - RoHS compliant
2) Applications
. Flashlight for cameraphones & digital still cameras
. Torchlight
. Amusement equipment
. Other applications
3. Absolute Maximum Rating
℃
1) Torch Mode Operation Forward Current (Ta = 25 ) .......... 300 mA
2) Flash Mode Peak Pulsed Forward Current ........................ 1300 mA
≤
℃
(Pulse width t 300msec, Duty ratio=0.06, Ta=25 )
3) Reverse Current ........................................................................ 85 mA
4) Thermal Resistance ( Rth,j-s ) ..................................................... 9 K/W
5) LED Junction Temperature ( TJ ) .............................................. 125
℃
6) Operating Temperature Range ( T ) ........................ -40℃ ∼ 85℃
7) Storage Temperature Range ( T ) ......................... -40℃ ∼ 100℃
opr
stg
4. Characteristics
℃)
1) Specifications
( Ta : 25
Item
Unit
Condition
Min
Typ
Max
Illuminance
lux
IF = 1000 mA
230
245
300
Forward Voltage (VF)
V
IF = 1000 mA
2.8
3.6
4.0
Chromaticity Coordinates
x,y
IF = 1000 mA
Reverse Voltage (VR)
V
IR =10 mA
0.6
-
1.2
Low Current Voltage (VF)
V
IF = 1 µA
1.7
-
2.7
Size
mm
-
Refer to the CIE chromaticity
coordinates in page 7
4.0 x 3.9 x 1.9
Notes
* Samsung LED uses the above specifications table as the final product test criteria.
* Samsung LED maintains a tester tolerance of ±10% on flux measurements.
* Samsung LED maintains a tolerance of ±0.15V on forward voltage measurements.
* Samsung LED maintains a tester tolerance of ±0.01 on CCx, CCy measurements.
* Samsung LED maintains a tester tolerance of ±10% on low current voltage measurements.
* Samsung LED maintains a tolerance of ±0.1 mm on device dimensions.
Http://www.samsungled.com
4 / 23
℃)
2) General characteristics
( Ta : 25
Item
Unit
Condition
Illuminance
(at 1 meter)
lux
IF = 700 mAⓐ
Min
IF = 300 mA
cd
Luminous Flux
lm
Forward Voltage (VF)
V
CCT
°K
Max
63
67
82
158
168
206
230
245
300
IF = 700 mAⓐ
IF = 1000 mAⓑ
63
67
82
158
168
206
230
245
300
IF = 300 mA
IF = 1000 mAⓑ
IF = 300 mA
Luminous Intensity
Typ
IF = 700 mAⓐ
IF = 1000 mAⓑ
67
71
88
168
179
220
245
261
320
IF = 300 mA
2.42
3.03
3.46
IF = 700 mAⓐ
IF = 1000 mAⓑ
2.70
3.38
3.86
2.80
3.50
4.00
IF = 300 mA
5564
6027
6491
5760
6240
6720
6000
6500
7000
0.6
-
1.2
IF = 700 mAⓐ
IF = 1000 mAⓑ
Reverse Voltage (VR)
V
IR = 10 mA
Size
mm
-
4.0 x 3.9 x 1.9
Notes:
* The above data table is for design reference only.
ⓐ Pulse mode operation: Pulse width ≤ 600ms, Duty ratio 0.12 for I = 700mA
ⓑ Pulse mode operation: Pulse width ≤ 500ms, Duty ratio 0.1 for I = 1000mA
F
F
3) Chromaticity Diagram
Condition
IF=1000mA
x
0.342
0.312
y
0.302
0.342
0.320
0.288
0.385
0.320
* CIE coordinate at outgoing inspection can deviate within the range of tester tolerance of ± 0.01
Http://www.samsungled.com
5 / 23
5. Typical Characteristics Graph
* These graphs show typical values.
Luminous Flux vs. Forward Current
Illuminance vs. Forward Current
1.2
1.2
ec 1
na
ni 0.8
m
ull 0.6
I
ev
it 0.4
lae
R0.2
xu 1
lF
su0.8
on
i
m
uL0.6
ev
it 0.4
al
e 0.2
R
0
0
0.2
0.4
0.6
0.8
Current(mA)
1
1.2
0
Forward Current vs. Forward Voltage
3.8
0
0.2
0.4
0.6
0.8
Current(mA)
1
1.2
Relative Spectral Emission
1.2
3.6
1.0
yti
sn0.8
et
In
de0.6
zil
a
m
ro0.4
N
) 3.4
V
(e
3.2
g
al
o 3
V
d
ra 2.8
w
ro 2.6
F 2.4
0.2
2.2
0.0
2
0
0.2
0.4
0.6
0.8
Current(mA)
1
1.2
450
550
650
Wavelength(nm)
750
Intensity Drop vs. Time
at Pulse Operation
Radiation Pattern
(I = 300mA)
350
1.2
F
vertical
IF = 1,200 mA
horizontal
1.0
IF = 1,000 mA
IF = 800 mA
0.8
IF = 600 mA
0.6
IF = 400 mA
0.4
IF = 200 mA
0.2
0.0
-60
-40
-20
0
20
40
60
* LED under test is SMT-soldered on
a Samsung LED standard FR4 PCB
Http://www.samsungled.com
6 / 23
* These graphs show typical values.
Chromaticity vs. Forward Current
x Coordinate
℃
0.32
℃
(Ta = 25 )
0.32
0.315
0.315
)x
(e
ta 0.31
ind
ro 0.305
o
C 0.3
EI
C
)y
(e 0.31
ta
ind
ro0.305
o
C 0.3
EI
C
0.295
0.29
y Coordinate
(Ta = 25 )
0.295
0
0.2
0.4
0.6
0.8
Current(mA)
1
1.2
0.29
0
0.2
Max. Pulse Rating
1
1.2
80
100
Max. DC Rating
350
1400
)A1200
m
t(n1000
er
ru 800
C
es 600
lu
P 400
xa
M 200
0
-40
0.4
0.6
0.8
Current(mA)
)A300
m
(t 250
ne
rr 200
uC
CD150
xa100
M
50
-20
0
20
40
60
Ambient Temperature(℃)
80
100
0
-40
-20
0
20
40
60
Ambient Temperature(℃)
Uniformity Map
90%-100%
80%-90%
70%-80%
60%-70%
50%-60%
40%-50%
30%-40%
20%-30%
10%-20%
0%-10%
Http://www.samsungled.com
7 / 23
6. Outline Drawing & Dimension
Unit : mm
Tolerance :
width, length ± 0.05
height : ± 0.07
Circuit
Solder Pattern for Surface Mount
Cathode
Anode
* 2D, 3D CAD data are available upon request.
Http://www.samsungled.com
8 / 23
7. Solder Conditions
1) Reflow Conditions ( Pb Free )
Reflow Frequency : 3 times max.
2) For Manual Soldering
℃
Not more than 5 seconds @MAX300 , under soldering iron.(one time only)
Http://www.samsungled.com
9 / 23
8. Taping Dimension
0.3±0.05
2±0.05
Φ1.5+0.10
4±0.10
1.75±0.10
Φ150Min
5.5±0.05
12±0.30
4.35±0.10
8±0.10
4.15±0.10
Start
End
Mounted with
Flash LED
More than 40 ㎜
Unloaded tape
More than (100~200)㎜ Leading part more than
Unloaded tape
(200~400)㎜
(1) Quantity : The quantity/reel to be 3,000 pcs.
(2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2
㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10° angle to be the carrier tape.
(4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof package.
(5) Cover Tape Sealing Type : Thermal Compression
Carrier Tape
Cover Tape
Surface Resistance
107Ω
108Ω
Material
PS
Anti-Static
0.00kV
0.00kV
E/S @23
℃, 50%RH
Http://www.samsungled.com
Reel
Al Bag
BOX
109Ω
1010Ω
PS
Al
Paper
0.00kV
0.00kV
0.00kV
107Ω
이하
10 / 23
9. Label Structure
LED-00039-001
Rank Code
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
S1R1T0
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
S1 : Forward Voltage (VF) Rank
SLAT94001 / I001 / 3,000pcs
Rank Code
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
R1 : Chromaticity Coordinate Rank
T0 : Luminous Intensity (IV) Rank
N.B) Denoted rank is the only example.
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
Customer
Part Number
Bar Code
Supplier
Part Number
SPFCW14311BDS1R1T0 : Supplier Part
01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
LED-00039-001 : Customer Part Number
Number
Quantity
10. Lot Number
The Lot number is composed of the following characters
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
●◎◇◆□■△△△ / I▲▲▲ / 3,000PCS
● : Production Site (S:SAMSUNG LED Suwon, G:Gosin China)
◎ : L (LED)
◇ : Product State (A:Normality, B: Bulk, C:First Production, R:reproduction, S:Sample)
◆ : Year (S:2008, T:2009, U:2010, V:2011...)
□ : Month (1 ~ 9, A~C)
■ : Day (1 ~ 9, A, B ~ V)
△ : SAMSUNG LED Product number (1 ~ 999)
▲ : Reel Number (1 ~ 999)
Http://www.samsungled.com
11 / 23
11. Reel Packing Structure
Reel
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
LEV EL
2a
↓
Aluminum Bag
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
↓
Inner Box
Material : Paper(SW3B(B))
TYPE
13inch
㎜
SIZE( )
L
W
H
335
45
335
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
H
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
HP LED
[ Box Label]
W
L
Http://www.samsungled.com
12 / 23
Carton Box
↓
Material : Paper(SW3B(B))
TYPE
13inch
SIZE(mm)
L
W
H
350
350
350
① SIDE
①
LED-00039-001
H
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
01
HP LED
W
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
[ Box Label]
Http://www.samsungled.com
L
13 / 23
12. Aluminum Packing Bag
LED-00039-001
IIIIIIIIIIIIIIIIIIIIIIIII
SPFCW14311BDS1R1T0
S1R1T0
01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIIIII
III IIIIIIIII
II
SLAT94001 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
Silica gel & Humidity Indicator Card in Aluminum Bag
Http://www.samsungled.com
14 / 23
13. Precaution for use
1) For overcurrent-protection, customers are recommended to apply resistors
connected in series with the LEDs to mitigate sudden change of the forward current
caused by shift of the forward voltage.
2) This device should not be used in any type of fluid such as water, oil, organic
solvent, etc. When cleaning is required, IPA is recommended as cleaning agent.
Solvent-based cleaning agent such as Zestron(R) may damage the silicone resins used in
the device.
3) When the device is in operation, the forward current should be carefully determined
considering the maximum ambient temperature and the corresponding junction
temperature.
4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3
months or more after being shipped from Samsung LED, they should be packed with a
nitrogen-filled container.
(Shelf life of sealed bags: 12 months, temp. 0~40 , 20~70%RH)
℃
5) After storage bag is open, device subject to soldering, solder reflow, or other
high temperature processes must be:
a. Mounted within 168 hours (7 days) at an assembly line with a condition of no
℃
more than 30 /60%RH.
b. Stored at <10% RH.
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in a dry place.
7) Devices require baking before mounting, if humidity card reading reaches 60%
at 23±5 .
℃ ℃
8) Devices must be baked for 24hours at 65±5 , if baking is required.
9) The LEDs are sensitive to the static electricity and surge current. It is recommended to
use a wrist band or anti-electrostatic glove when handling the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leakage
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
10) The LEDs package must be handled with care, especially top surface of the lens must
not be stressed on handling. Pick the sidewall of package mold and do not touch the
lens area when manual movement of each LEDs.
11) When processing by automated pick and place machine for SMT, the pressure applied
to lens directly should be controlled less than 1Kg.
Pickup tool should be designed according to lens shape. Pickup tool without cavity for
lens area consideration can cause serious damage to package.
Http://www.samsungled.com
15 / 23
14. QC Flow Chart
P r o c e s s F lo w C h a r t f o r F la s h L E D
P r o c e s s
I n p u t
P r o c e s s
&
Q . C
m o n i t o r
I n s p e c t i o n
&
Q . A
1 0 0 %
G a t e
I n s p e c t i o n
D e v i c e
F l a s h
n a m e
L E D
D i a g r a m
P . K . G
4 1 3 9 ( 4 . 1 * 3 . 9 * 1 . 9 )
T y p e
4039(4.0*3.9*1.9)
Nokia
R I M
C u s t o m e r
A r e a
D i a g r a m
I.Q .C
P r o c e s s
L e a d
M a t e r i a l
E q u i p m e n t
I n s p e c i t o n
I t e m
L F
L e a d
F r a m e
Diagram
In s p e c t i o n
Process
D ie
I n s p e c t i o n
I n s p e c t i o n
R e f .
E x t e r a n l
V i su a l
M ic ro sc o p e
C o n t a m in a t io n
Area
Q . C & Q . A
F r a m e
In c o m in g
F r o n t -E n d
P r o d .
Material
A g
e t c .
In s p e c t i o n
Prod.
Q.C&Q.A
Inspection Inspection Ref.
Equipment Inspeciton Item
P a st e
D ie
Bo n d i n g
P a st e
M a c h in e
P a st e
C o v e r a g e
V i su a l
A t t a c h
A g
&
S c o p e
In sp e c t io n
In s p e c t i o n
I.Q.C
Incoming
O v e n
C u r e
N 2
QC
Lead Frame, Lens,
MicroscopeD i e s h e a r
Contamination etc.
O v e n
etc.
P la sm a
Visual
S h e a r
Te s t e r
Inspection
P la sm a
A r
Front-End
LF Exteranl
C le a n in g
Die Attach
P a r a m e t e r
Ag Paste
Die Bonding
Paste Coverage
Machine
& Scope
Inspection
P u l l Te s t
c l e a n e r
Ag Paste
Visual
Inspection
W ir e
S c o p e
W ir e
B o n d
Reflow
W ir e
N2 W
i n gG o l d
B a ll
Cleaning
B a c k -E n d
B o n d i n g
Plasma
Ar
cleaner
S il ic o n e
D isp e n sin g
Shear Tester
P u l l
Te s t e r
S h e a r
Te s t e r
P a r a m e n t e r )
Parameter
M o l d
V isu a l
P a r a m e t e r
M o n it o r
N 2
Wire BondingGold Wire
O v e n
Bonding
Machine
L e n s
V i su a l
Back-End
C u r e
N
Dispensing
O v e n
2
Silicone
Ball PShear
Test
a r a m e t e r
Inspection
In s p e c t i o n
V i s u a l Parameter)
M o n it o r
V i s
u a l
monitor,
Shear
Tester
M o l d
A t t ac h e r
P a r a m e t e r
Dispenser
Scope
V i su a l
Wire Bonding(Visual Pull Tester
L e n s
O v e n
Phosphor
In s p e c t i o n
Te m p .
L e n s
A t t a c h in g
M o n it o r
Wire Pull Test
Wire
C u r e
In s p e c t i o n
g ( V isu a l
m o n i t o r ,
D isp en se r
P h o sp h o r
O v e n
Te s t
W iD
r e
o n d in
Reflow Oven
ieBshear
ir e
M a c h in e
Plasma
S h e a r
M o n it o r
In s p e c t i o n
V
Mold Visual Monitor
Te m p .
P a r a m e t e r
Parameter Monitor
Visual
i su a l
Inspection
In s p e c t i o n
(100%)
P a c k a g e
F in a l
P a c k a g e
In
Oven Cure
sp e c t i o n
Tr
Lens
im
N2
Oven
S c o pe
In
S c o p e
Parameter
sp e c t io n
S c o p e
In s p e c t i o n
Lens
Attaching
Tr
Lens
i m M a
c h in e V
Attacher
V
Mold Visual Monitor
isu a l In sp e c t io n
Parameter Monitor
E le c t r ic a l
N2
L
Oven
E D Te s t e r
Te s t
Lens shear
( IV , V F , IR )
O p t ic a l
Trim
Ta p i n g &
Inspection
(100%)
Te s t
Oven Cure
Te s t H a n d l e r
Visual
i su a l
In s p e c t i o n
Shear Tester
Te s t ( L m )
Scope
Trim MachineDimension
Inspection
C a r r e i r / C o v e r
V i su a l
R e e l
Test
Ta p e
&
R e e l
Ta p e
Ta p i n g
C o n d u c t iv e
A l
LED Tester
P a c k in g
S il ic a l
Taping&
G e l
In s p e c t i o n
In sp e c t io n
C a r d
Carreir/
Cover
( 100% )
Tape & Reel Tape
B o x
P a c k i n g
V i su a l
L a b e l
K L P M
P a c k i n g
H u m id it y
Reel
In s p e c t i o n
(IV, VF, IR)
Optical Test(Lm)
B a g
S h i e l d i n g
B a g
In sp e c t io n
Electrical Test
W h e e l
Test Handler
P a c k i n g
M a c h i nV ei s u a l
Taping Machine
Visual Inspection
P a c k in g
Ta p e
Conductive
Wheel
Visual
V i su a l
Inspection
L a b e l
B o x
In s p e c t i o n
In sp e c t io n
( 100% )
Packing
Q . C
NO
Shielding
Bag Packing
Q . C
G a t e
Al Bag
Silical Gel
Humidity Card
KLPM
L E D
Te s t e r
Packing Label
S c o p e
In s p e c t i o n
Inspection
( M o n it o r )
Visual
& R
Ta p e
e e l
Inspection
In s p e c t i o n
→
I o0
n0
i %)
z e r
(1
D r y
B o x
Packing Label
Box Packing Box Tape
Y E S
Inspection
W a r e
H o u se
Q.C
W a r e
C u s t o m e r
H o u si n g
NO
Final
S p e c .
N u m b e r
Inspection
Q.C Gate
S pe c .
Ti t l e
LED Tester
Visual
Inspection
(100%)
Electrical, Optical
Tape & Reel
Test
R e v .
Inspection
Scope Inspection
→ Ionizer Dry
(Monitor)
Box
P A G E
YES
Warehouse
Stocking
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15. Hazard Substance Analysis(SGS)
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16. Reliability Test Items and Conditions
Test Item
Test Conditions
Test
Hours/Cycles
No. of
Samples
s
Sample
RTOL
25℃±3℃, DC 300 mA
168 h
0/22
WHTOL
85℃±3℃, 85%±2% RH, DC 300mA
168 h
0/60
HTOL
85℃±3℃, DC 300mA
168 h
0/22
LTOL
-40℃±3℃, DC 300mA
168 h
0/22
HTS
Ta = 100℃±3℃
168 h
0/11
LTS
Ta = -40℃±3℃
168 h
0/11
Thermal Shock
-45℃↔125℃, each 15 min, 5 min Transfer
100 cycles
0/22
Series
85 ℃,85 %RH, 24 h → Peak 260±5 ℃, 220 ℃ over time
60 s, 3times → -40 ℃ / 85 ℃, each 1 h, 30 cycles
30 cycles
0/22
25℃ ~ 65℃ ~ -10℃
24hrs/1cycle, 95%RH, DC 300 ㎃
5 cycles
0/60
25℃ ~ 65℃ ~ -10℃
24hrs/1cycle, 95%RH
5 cycles
0/60
On/Off Test
25℃±3℃,
IF = 1000mA, On 0.5sec, Off 4.5sec
50k cycles
0/60
Vibration
(sinewave) Test
100~2000~100 ㎐, 20G, Sweep 1 min, X.Y.Z 3 direction
4 cycles
0/11
Drop Test
Random drop to steel, 120cm 12 times, 150cm 20times
20 times
0/11
5 times
(± 5㎸)
0/5
Temperature
humidity Cycle
ESD[HBM]
R1:10MΩ , R2:1.5KΩ , C:100pF
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