Data Sheet - SPSWH1S16S2G

ISSUE NO :
Rev:
DATE OF ISSUE : 2012.11.19
SPECIFICATION
MODEL : SPSWH1S16S2G
White Side View
CUSTOMER :
CUSTOMER
CHECKED
CHECKED
APPROVED
SAMSUNG ELECTRONICS CO., LTD.
DRAWN
CHECKED
APPROVED
SAMSUNG ELECTRONICS CO,.LTD.
SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU,
YONGINYONGIN-CITY,
CITY,KYUNGKI-DO,KOREA,446
KYUNGKI-DO,KOREA,446-711
SAMSUNG ELECTRONICS Co.,Ltd
1/23
Contents
1. Product Outline-------------------------- 3
2. Absolute Maximum Rating---------------- 3
3. Characteristics ------------------------- 3
4. Chromaticity Diagram-------------------- 6
5. Typical Characteristic Graph------------- 7
6. Outline Drawing And Dimension -------- 9
7. Package Structure ---------------------- 10
8. Solder Conditions ----------------------- 10
9. Reliability Test Items And Conditions ---- 10
10. Taping Dimension --------------------- 12
11. Reel Packing Structure ---------------- 13
12. Label Structure ----------------------- 14
13. Aluminium Packing Bag --------------- 15
14. Precaution For use ------------------- 16
15. Hazard Substance Analysis ------------ 17
16. Revision History ----------------------- 23
SAMSUNG ELECTRONICS Co.,Ltd
2/23
1. Product Outline
1) Product Name
Side View LED : WHITE Color
2) Feature
1. Mini-Mold type : 3.8 * 1.0 * t 0.8
2. Beam Angle( θ) : 120 0
3. GaN/Al2O3 Chip & Long Time Reliability
3) Applications
㎜
△
- Mobile Phone, CLP, Back-light, Indicator.....
2. Absolute Maximum Rating
1) Operation Forward Current
㎃
100 ㎃
······················
45
2) Peak Pulsed Forward Current ··················
3) Reverse Voltage ···································
5 V
℃ ∼ 85℃
℃ ∼ 100℃
260±5℃, max10sec
4) Operating Temperature Range(Topr) ··········· -30
5) Storage Temperature Range(Tstg) ············· -40
6) Reflow Soldering Temperature ····················
3. Characteristics
Electrical properties
Ta : 25
Item
Symbol
Forward Voltage
VF
Reverse Current
IR
SAMSUNG ELECTRONICS Co.,Ltd
Condition
IF = 20
㎃
VR = 5V
Rank
Min.
Max.
I0
2.7
2.9
J0
2.9
3.1
50
℃
Unit
V
㎂
3/23
Chromaticity coordinate
Ta : 25
Rank
TA2
TA3
TB2
TB3
TC2
TC3
TD2
TD3
TE2
TE3
TF2
TF3
X
Y
0.2655
0.2689
0.2689
0.2655
0.2655
0.2689
0.2689
0.2655
0.2689
0.2723
0.2723
0.2689
0.2689
0.2723
0.2723
0.2689
0.2723
0.2757
0.2757
0.2723
0.2723
0.2757
0.2757
0.2723
0.2757
0.2791
0.2791
0.2757
0.2757
0.2791
0.2791
0.2757
0.2791
0.2825
0.2825
0.2791
0.2791
0.2825
0.2825
0.2791
0.2825
0.2859
0.2859
0.2825
0.2825
0.2859
0.2859
0.2825
0.2412
0.2474
0.2362
0.2298
0.2298
0.2362
0.2248
0.2184
0.2474
0.2536
0.2426
0.2362
0.2362
0.2426
0.2313
0.2248
0.2536
0.2598
0.2489
0.2426
0.2426
0.2489
0.2377
0.2313
0.2598
0.2661
0.2553
0.2489
0.2489
0.2553
0.2442
0.2377
0.2661
0.2723
0.2616
0.2553
0.2553
0.2616
0.2507
0.2442
0.2723
0.2785
0.2680
0.2616
0.2616
0.2680
0.2571
0.2507
SAMSUNG ELECTRONICS Co.,Ltd
Rank
TG2
TG3
TH2
TH3
TI2
TI3
TJ2
TJ3
TK2
TK3
TL2
TL3
X
Y
0.2859
0.2893
0.2893
0.2859
0.2859
0.2893
0.2893
0.2859
0.2893
0.2927
0.2927
0.2893
0.2893
0.2927
0.2927
0.2893
0.2927
0.2961
0.2961
0.2927
0.2927
0.2961
0.2961
0.2927
0.2961
0.2995
0.2995
0.2961
0.2961
0.2995
0.2995
0.2961
0.2995
0.3029
0.3029
0.2995
0.2995
0.3029
0.3029
0.2995
0.3029
0.3063
0.3063
0.3029
0.3029
0.3063
0.3063
0.3029
0.2785
0.2847
0.2743
0.2680
0.2680
0.2743
0.2636
0.2571
0.2847
0.2909
0.2807
0.2743
0.2743
0.2807
0.2700
0.2636
0.2909
0.2972
0.2870
0.2807
0.2807
0.2870
0.2765
0.2700
0.2972
0.3034
0.2934
0.2870
0.2870
0.2934
0.2830
0.2765
0.3034
0.3096
0.2997
0.2934
0.2934
0.2997
0.2894
0.2830
0.3096
0.3158
0.3061
0.2997
0.2997
0.3061
0.2959
0.2894
℃
4/23
Luminous Intensity
Rank
Ta : 25
Symbol
Condition
Luminous Intensity
LA
2,600
2,650
LB
2,650
2,700
MA
2,700
2,750
MB
2,750
2,800
NA
2,800
2,850
NB
2,850
2,900
2,900
2,950
2,950
3,000
Fa
3,000
3,050
Fb
3,050
3,100
Ga
3,100
3,150
Gb
3,150
3,200
Ha
3,200
3,250
Hb
3,250
3,300
℃
Unit
AL
AM
AN
OA
AO
IV
IF = 20
OB
㎃
mcd
BF
BG
BH
* Tolerance: VF:±0.05V, IV: ±5 %, X,Y:±0.005
* Luminous intensity measuring equipment : CAS140B
SAMSUNG ELECTRONICS Co.,Ltd
5/23
4. Chromaticity Diagram
SAMSUNG ELECTRONICS Co.,Ltd
6/23
5. Typical Characteristic Graph
SAMSUNG ELECTRONICS Co.,Ltd
7/23
SAMSUNG ELECTRONICS Co.,Ltd
8/23
6. Outline Drawing and Dimension
Cathode
Anode
unit:mm
Tolerance : ±0.1
SAMSUNG ELECTRONICS Co.,Ltd
9/23
7. Package Structure
④
⑤
③
①
②
No
①
②
③
④
⑤
Item
Material
FRAME
Copper Frame(Silver plated)
PACKAGE
Heat-resistant Polymer
LED CHIP
GaN/Al2O3
WIRE
Gold Wire
RESIN
+Phosphor
Resin
8. Solder Conditions
1) Reflow Conditions ( Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5 seconds @MAX300℃, under Soldering iron.
SAMSUNG ELECTRONICS Co.,Ltd
10/23
9. Reliability Test Items and Conditions
1) Test Items and Results
Test Items
Test Conditions
Room Temperature
Life Test
25
High Temperature
humidity Life Test
60
High Temperature
Life Test
Low Temperature
Life Test
Temperature
Humidity Cycle
℃±3℃, 95%±2%RH, DC 25 ㎃
85℃±3℃, DC 8.5 ㎃
-30℃±3℃, DC 20 ㎃
25℃ ~ 65℃ ~ -10℃
30mA, 95%RH, 24hrs/1cycle
℃ ℃
㎃
-45℃ ~ 125℃
85 ±3 , 85%±2%RH,
DC 30 , On/2sec, Off/5sec
On/Off test
Thermal Shock
30min ~ 30min
℃ ℃
High Temperature
Humidity Storage
High Temperature
Storage
Low Temperature
Storage
Reflow
Ink Test
℃±3℃, DC45 ㎃
60 ±3 , 95%±2%RH
℃ ℃
Ta=-40℃±3℃
Peak 260±5℃ for 10sec
Reflow(260℃) → Keep into ink solution 24h
Ta=100 ±3
Test
Hours/Cycles
Sample
No
500 h
0/50
500 h
0/50
500 h
0/50
1000 h
0/50
10 cycles
0/50
100k cycles
0/50
100 cycles
0/50
1000 h
0/50
1000 h
0/50
1000 h
0/50
3 times
0/50
24h
0/50
3 times
ESD(HBM)
0/50
㏁
㏀
- R1:10 , R2:1.5 , C:100
(±2kV)
㎊
2) Criteria for Judging the Damage
Item
Symbol
Test Condition
Forward Voltage
VF
IF = 20
Luminous Intensity
Iv
IF
㎃
= 20 ㎃
Limit
Min
-
IVL
×0.7
Max
×1.2
IVL.
IVL : Initial Value Level
SAMSUNG ELECTRONICS Co.,Ltd
11/23
10. Taping Dimension
Polarity
Start
End
More than 40mm
Mounted with
More than 100~200mm
Leading part more than
Unloaded tape
Side View LED
Unloaded tape
200~400mm
1) Quantity : The quantity/Reel is to be 3000pcs.
㎜
2) Cumulative Tolerance : Cumulative tolerance/10 pitches is less than ±0.2
3) Adhesion Strength of Cover Tape : Adhesion strength is to be 0.1-0.7N when the
cover tape is taken off from the carrier tape at 10° angle of the carrier tape.
4) Packaging : P/N, manufacturing data code No. and quantity are indicated on a
damp proof package.
SAMSUNG ELECTRONICS Co.,Ltd
12/23
11. Label Structure
ⓐⓐⓑⓑⓑⓒⓒ
Rank Code
I0TA2LA
SPSWH1S16S2G
I0 T A2 LA 01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIII
III IIIIIIII
II IIIIIIII
II IIIIIIIIIII
III
GLAU14003 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
ⓐ : V Rank (refer to page. 3)
ⓑ : Chromaticity Coordinate Rank (refer to page. 4,5,6)
ⓒ : I Rank (refer to page. 7)
F
V
※ Lot Number
The Lot number is composed of the following characters
● ◎ ◇ ◆ □ ■ △△△ / I▲▲▲ / 3000PCS
● : Production site (S:SAMSUNG ELECTRONICS, G:Gosin(TIANJIN) China)
◎ : L (LED)
◇ : Product state (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
◆ : Year (V:2011, W:2012...)
□ : Month (1 ~ 9, A, B)
■ : Day (1 ~ 9, A, B ~ V)
△ : SAMSUNG ELECTRONICS Product number (1 ~ 999)
▲ : Reel number (1 ~ 999)
SAMSUNG ELECTRONICS Co.,Ltd
13/23
12. Reel Packing Structure
Reel
I0TA2LA
SPSWH1S16S2G
I0TA 2LA 01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIII
III IIIIIIII
II IIIIIIII
II IIIIIIIIIII
III
GLAU14003 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
Aluminum Bag
I0TA2LA
SPSWH1S16S2G
I 0TA2LA 01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIII
III IIIIIIII
II IIIIIIII
II IIIIIIIIIII
III
GLAU14003 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
Outer Box Structure
Material : Paper(SW3B(B))
SIZE(mm)
TYPE
7inch
L
W
H
250
225
190
① SIDE
I0TA2LA
SPSWH1S16S2G
I0TA 2LA 01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIII
III IIIIIIII
II IIIIIIII
II IIIIIIIIIII
III
H
S ID
①
E L
ED
GLAU14003 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
[Box Label]
L
SAMSUNG ELECTRONICS Co.,Ltd
W
14/23
13. Aluminium Packing Bag
I0TA2LA
SPSWH1S16S2G
I0TA 2LA 01
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIII
III IIIIIIII
II IIIIIIII
II IIIIIIIIIII
III
GLAU14003 / I001 / 3,000pcs
IIIIIIIIIIIIIIIIII
IIIIIIII
IIIIIIIIIIIIIIII
III IIIIIIIIIIIIIIIII
III
SAMSUNG ELECTRONICS Co.,Ltd
15/23
14. Precaution for Use
1) For over-current-proof function, customers are recommended to apply resistors to prevent
sudden change of the current caused by slight shift of the voltage.
2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc.
When washing is required, IPA is recommended to use.
3) When the LEDs illuminate, operating current should be decided after considering the
ambient maximum temperature.
4) LEDs must be stored in a clean environment.
If the LEDs are to be stored for 3 months or more after being shipped from SEC(LED),
they should be packed by a sealed container with nitrogen gas injected.
℃
(Shelf life of sealed bags : 12 months, temp. 0~40 , 20~70%RH)
5) After storage bag is open, device subjected to soldering, solder reflow, or other high
temperature processes must be:
a. Mounted within 168 hours (7 days) at an assembly line with a condition of no
℃
more than 30 /60%RH,
b. Stored at <10% RH.
6) Repack unused Products with anti-moisture packing, fold to close any opening and then
store in a dry place.
℃ 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5 .
℃
8) Devices must be baked for 24hours at 65±5 , if baking is required.
9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a
wrist band or anti-electrostatic glove when handling the LEDs.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
Damaged LEDs may show some unusual characteristics such as increase in leak current,
lowered turn-on voltage, or abnormal lighting of LEDs at low current.
10) Reflow soldering should not be done more than two times.
a. Repairing should not be done after the LEDs have been soldered.
℃
When repairing is unavoidable, it should do repairing less than 10 seconds within 250
for one times.
b. Reflow soldering should not be done more than two times.
c. When soldering, do not put stress on the LEDs during heating.
SAMSUNG ELECTRONICS Co.,Ltd
16/23
15. Hazard Substance Analysis
SAMSUNG ELECTRONICS Co.,Ltd
17/23
SAMSUNG ELECTRONICS Co.,Ltd
18/23
SAMSUNG ELECTRONICS Co.,Ltd
19/23
SAMSUNG ELECTRONICS Co.,Ltd
20/23
SAMSUNG ELECTRONICS Co.,Ltd
21/23
SAMSUNG ELECTRONICS Co.,Ltd
22/23
Revision History
(Model: SPSWH1S16S2G)
Date
2012.11.19
SAMSUNG ELECTRONICS Co.,Ltd
Revision History
Writer
Drawn
Approved
S.Y.AN
H.Y. SONG
23/23
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