ISSUE NO : Rev: DATE OF ISSUE : 2012.11.19 SPECIFICATION MODEL : SPSWH1S16S2G White Side View CUSTOMER : CUSTOMER CHECKED CHECKED APPROVED SAMSUNG ELECTRONICS CO., LTD. DRAWN CHECKED APPROVED SAMSUNG ELECTRONICS CO,.LTD. SAN #24 NONGSEO-DONG, GIHEUNGGIHEUNG-GU, YONGINYONGIN-CITY, CITY,KYUNGKI-DO,KOREA,446 KYUNGKI-DO,KOREA,446-711 SAMSUNG ELECTRONICS Co.,Ltd 1/23 Contents 1. Product Outline-------------------------- 3 2. Absolute Maximum Rating---------------- 3 3. Characteristics ------------------------- 3 4. Chromaticity Diagram-------------------- 6 5. Typical Characteristic Graph------------- 7 6. Outline Drawing And Dimension -------- 9 7. Package Structure ---------------------- 10 8. Solder Conditions ----------------------- 10 9. Reliability Test Items And Conditions ---- 10 10. Taping Dimension --------------------- 12 11. Reel Packing Structure ---------------- 13 12. Label Structure ----------------------- 14 13. Aluminium Packing Bag --------------- 15 14. Precaution For use ------------------- 16 15. Hazard Substance Analysis ------------ 17 16. Revision History ----------------------- 23 SAMSUNG ELECTRONICS Co.,Ltd 2/23 1. Product Outline 1) Product Name Side View LED : WHITE Color 2) Feature 1. Mini-Mold type : 3.8 * 1.0 * t 0.8 2. Beam Angle( θ) : 120 0 3. GaN/Al2O3 Chip & Long Time Reliability 3) Applications ㎜ △ - Mobile Phone, CLP, Back-light, Indicator..... 2. Absolute Maximum Rating 1) Operation Forward Current ㎃ 100 ㎃ ······················ 45 2) Peak Pulsed Forward Current ·················· 3) Reverse Voltage ··································· 5 V ℃ ∼ 85℃ ℃ ∼ 100℃ 260±5℃, max10sec 4) Operating Temperature Range(Topr) ··········· -30 5) Storage Temperature Range(Tstg) ············· -40 6) Reflow Soldering Temperature ···················· 3. Characteristics Electrical properties Ta : 25 Item Symbol Forward Voltage VF Reverse Current IR SAMSUNG ELECTRONICS Co.,Ltd Condition IF = 20 ㎃ VR = 5V Rank Min. Max. I0 2.7 2.9 J0 2.9 3.1 50 ℃ Unit V ㎂ 3/23 Chromaticity coordinate Ta : 25 Rank TA2 TA3 TB2 TB3 TC2 TC3 TD2 TD3 TE2 TE3 TF2 TF3 X Y 0.2655 0.2689 0.2689 0.2655 0.2655 0.2689 0.2689 0.2655 0.2689 0.2723 0.2723 0.2689 0.2689 0.2723 0.2723 0.2689 0.2723 0.2757 0.2757 0.2723 0.2723 0.2757 0.2757 0.2723 0.2757 0.2791 0.2791 0.2757 0.2757 0.2791 0.2791 0.2757 0.2791 0.2825 0.2825 0.2791 0.2791 0.2825 0.2825 0.2791 0.2825 0.2859 0.2859 0.2825 0.2825 0.2859 0.2859 0.2825 0.2412 0.2474 0.2362 0.2298 0.2298 0.2362 0.2248 0.2184 0.2474 0.2536 0.2426 0.2362 0.2362 0.2426 0.2313 0.2248 0.2536 0.2598 0.2489 0.2426 0.2426 0.2489 0.2377 0.2313 0.2598 0.2661 0.2553 0.2489 0.2489 0.2553 0.2442 0.2377 0.2661 0.2723 0.2616 0.2553 0.2553 0.2616 0.2507 0.2442 0.2723 0.2785 0.2680 0.2616 0.2616 0.2680 0.2571 0.2507 SAMSUNG ELECTRONICS Co.,Ltd Rank TG2 TG3 TH2 TH3 TI2 TI3 TJ2 TJ3 TK2 TK3 TL2 TL3 X Y 0.2859 0.2893 0.2893 0.2859 0.2859 0.2893 0.2893 0.2859 0.2893 0.2927 0.2927 0.2893 0.2893 0.2927 0.2927 0.2893 0.2927 0.2961 0.2961 0.2927 0.2927 0.2961 0.2961 0.2927 0.2961 0.2995 0.2995 0.2961 0.2961 0.2995 0.2995 0.2961 0.2995 0.3029 0.3029 0.2995 0.2995 0.3029 0.3029 0.2995 0.3029 0.3063 0.3063 0.3029 0.3029 0.3063 0.3063 0.3029 0.2785 0.2847 0.2743 0.2680 0.2680 0.2743 0.2636 0.2571 0.2847 0.2909 0.2807 0.2743 0.2743 0.2807 0.2700 0.2636 0.2909 0.2972 0.2870 0.2807 0.2807 0.2870 0.2765 0.2700 0.2972 0.3034 0.2934 0.2870 0.2870 0.2934 0.2830 0.2765 0.3034 0.3096 0.2997 0.2934 0.2934 0.2997 0.2894 0.2830 0.3096 0.3158 0.3061 0.2997 0.2997 0.3061 0.2959 0.2894 ℃ 4/23 Luminous Intensity Rank Ta : 25 Symbol Condition Luminous Intensity LA 2,600 2,650 LB 2,650 2,700 MA 2,700 2,750 MB 2,750 2,800 NA 2,800 2,850 NB 2,850 2,900 2,900 2,950 2,950 3,000 Fa 3,000 3,050 Fb 3,050 3,100 Ga 3,100 3,150 Gb 3,150 3,200 Ha 3,200 3,250 Hb 3,250 3,300 ℃ Unit AL AM AN OA AO IV IF = 20 OB ㎃ mcd BF BG BH * Tolerance: VF:±0.05V, IV: ±5 %, X,Y:±0.005 * Luminous intensity measuring equipment : CAS140B SAMSUNG ELECTRONICS Co.,Ltd 5/23 4. Chromaticity Diagram SAMSUNG ELECTRONICS Co.,Ltd 6/23 5. Typical Characteristic Graph SAMSUNG ELECTRONICS Co.,Ltd 7/23 SAMSUNG ELECTRONICS Co.,Ltd 8/23 6. Outline Drawing and Dimension Cathode Anode unit:mm Tolerance : ±0.1 SAMSUNG ELECTRONICS Co.,Ltd 9/23 7. Package Structure ④ ⑤ ③ ① ② No ① ② ③ ④ ⑤ Item Material FRAME Copper Frame(Silver plated) PACKAGE Heat-resistant Polymer LED CHIP GaN/Al2O3 WIRE Gold Wire RESIN ＋Phosphor Resin 8. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 seconds @MAX300℃, under Soldering iron. SAMSUNG ELECTRONICS Co.,Ltd 10/23 9. Reliability Test Items and Conditions 1) Test Items and Results Test Items Test Conditions Room Temperature Life Test 25 High Temperature humidity Life Test 60 High Temperature Life Test Low Temperature Life Test Temperature Humidity Cycle ℃±3℃, 95%±2%RH, DC 25 ㎃ 85℃±3℃, DC 8.5 ㎃ -30℃±3℃, DC 20 ㎃ 25℃ ~ 65℃ ~ -10℃ 30mA, 95%RH, 24hrs/1cycle ℃ ℃ ㎃ -45℃ ~ 125℃ 85 ±3 , 85%±2%RH, DC 30 , On/2sec, Off/5sec On/Off test Thermal Shock 30min ~ 30min ℃ ℃ High Temperature Humidity Storage High Temperature Storage Low Temperature Storage Reflow Ink Test ℃±3℃, DC45 ㎃ 60 ±3 , 95%±2%RH ℃ ℃ Ta=-40℃±3℃ Peak 260±5℃ for 10sec Reflow(260℃) → Keep into ink solution 24h Ta=100 ±3 Test Hours/Cycles Sample No 500 h 0/50 500 h 0/50 500 h 0/50 1000 h 0/50 10 cycles 0/50 100k cycles 0/50 100 cycles 0/50 1000 h 0/50 1000 h 0/50 1000 h 0/50 3 times 0/50 24h 0/50 3 times ESD(HBM) 0/50 ㏁ ㏀ - R1:10 , R2:1.5 , C:100 (±2kV) ㎊ 2) Criteria for Judging the Damage Item Symbol Test Condition Forward Voltage VF IF = 20 Luminous Intensity Iv IF ㎃ = 20 ㎃ Limit Min - IVL ×0.7 Max ×1.2 IVL. IVL : Initial Value Level SAMSUNG ELECTRONICS Co.,Ltd 11/23 10. Taping Dimension Polarity Start End More than 40mm Mounted with More than 100~200mm Leading part more than Unloaded tape Side View LED Unloaded tape 200~400mm 1) Quantity : The quantity/Reel is to be 3000pcs. ㎜ 2) Cumulative Tolerance : Cumulative tolerance/10 pitches is less than ±0.2 3) Adhesion Strength of Cover Tape : Adhesion strength is to be 0.1-0.7N when the cover tape is taken off from the carrier tape at 10° angle of the carrier tape. 4) Packaging : P/N, manufacturing data code No. and quantity are indicated on a damp proof package. SAMSUNG ELECTRONICS Co.,Ltd 12/23 11. Label Structure ⓐⓐⓑⓑⓑⓒⓒ Rank Code I0TA2LA SPSWH1S16S2G I0 T A2 LA 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIII III IIIIIIII II IIIIIIII II IIIIIIIIIII III GLAU14003 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIII III ⓐ : V Rank (refer to page. 3) ⓑ : Chromaticity Coordinate Rank (refer to page. 4,5,6) ⓒ : I Rank (refer to page. 7) F V ※ Lot Number The Lot number is composed of the following characters ● ◎ ◇ ◆ □ ■ △△△ / I▲▲▲ / 3000PCS ● : Production site (S:SAMSUNG ELECTRONICS, G:Gosin(TIANJIN) China) ◎ : L (LED) ◇ : Product state (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) ◆ : Year (V:2011, W:2012...) □ : Month (1 ~ 9, A, B) ■ : Day (1 ~ 9, A, B ~ V) △ : SAMSUNG ELECTRONICS Product number (1 ~ 999) ▲ : Reel number (1 ~ 999) SAMSUNG ELECTRONICS Co.,Ltd 13/23 12. Reel Packing Structure Reel I0TA2LA SPSWH1S16S2G I0TA 2LA 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIII III IIIIIIII II IIIIIIII II IIIIIIIIIII III GLAU14003 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIII III Aluminum Bag I0TA2LA SPSWH1S16S2G I 0TA2LA 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIII III IIIIIIII II IIIIIIII II IIIIIIIIIII III GLAU14003 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIII III Outer Box Structure Material : Paper(SW3B(B)) SIZE(mm) TYPE 7inch L W H 250 225 190 ① SIDE I0TA2LA SPSWH1S16S2G I0TA 2LA 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIII III IIIIIIII II IIIIIIII II IIIIIIIIIII III H S ID ① E L ED GLAU14003 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIII III [Box Label] L SAMSUNG ELECTRONICS Co.,Ltd W 14/23 13. Aluminium Packing Bag I0TA2LA SPSWH1S16S2G I0TA 2LA 01 IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIII III IIIIIIII II IIIIIIII II IIIIIIIIIII III GLAU14003 / I001 / 3,000pcs IIIIIIIIIIIIIIIIII IIIIIIII IIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIII III SAMSUNG ELECTRONICS Co.,Ltd 15/23 14. Precaution for Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from SEC(LED), they should be packed by a sealed container with nitrogen gas injected. ℃ (Shelf life of sealed bags : 12 months, temp. 0~40 , 20~70%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 168 hours (7 days) at an assembly line with a condition of no ℃ more than 30 /60%RH, b. Stored at <10% RH. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. ℃ 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5 . ℃ 8) Devices must be baked for 24hours at 65±5 , if baking is required. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 10) Reflow soldering should not be done more than two times. a. Repairing should not be done after the LEDs have been soldered. ℃ When repairing is unavoidable, it should do repairing less than 10 seconds within 250 for one times. b. Reflow soldering should not be done more than two times. c. When soldering, do not put stress on the LEDs during heating. SAMSUNG ELECTRONICS Co.,Ltd 16/23 15. Hazard Substance Analysis SAMSUNG ELECTRONICS Co.,Ltd 17/23 SAMSUNG ELECTRONICS Co.,Ltd 18/23 SAMSUNG ELECTRONICS Co.,Ltd 19/23 SAMSUNG ELECTRONICS Co.,Ltd 20/23 SAMSUNG ELECTRONICS Co.,Ltd 21/23 SAMSUNG ELECTRONICS Co.,Ltd 22/23 Revision History (Model: SPSWH1S16S2G) Date 2012.11.19 SAMSUNG ELECTRONICS Co.,Ltd Revision History Writer Drawn Approved S.Y.AN H.Y. SONG 23/23