Data Sheet

PCA9535; PCA9535C
16-bit I2C-bus and SMBus, low power I/O port with interrupt
Rev. 05 — 15 September 2008
Product data sheet
1. General description
The PCA9535 and PCA9535C are 24-pin CMOS devices that provide 16 bits of General
Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was
developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The
improvements include higher drive capability, 5 V I/O tolerance, lower supply current,
individual I/O configuration, and smaller packaging. I/O expanders provide a simple
solution when additional I/O is needed for ACPI power switches, sensors, push buttons,
LEDs, fans, etc.
The PCA9535 and PCA9535C consist of two 8-bit Configuration (Input or Output
selection), Input, Output and Polarity Inversion (active HIGH or active LOW operation)
registers. The system master can enable the I/Os as either inputs or outputs by writing to
the I/O configuration bits. The data for each input or output is kept in the corresponding
Input or Output register. The polarity of the read register can be inverted with the Polarity
Inversion register. All registers can be read by the system master. Although pin-to-pin and
I2C-bus address compatible with the PCF8575, software changes are required due to the
enhancements and are discussed in Application Note AN469.
The PCA9535 is identical to the PCA9555 except for the removal of the internal I/O pull-up
resistor which greatly reduces power consumption when the I/Os are held LOW.
The PCA9535C is identical to the PCA9535 except that all the I/O pins are
high-impedance open-drain outputs.
The PCA9535 and PCA9535C open-drain interrupt output is activated when any input
state differs from its corresponding Input Port register state and is used to indicate to the
system master that an input state has changed. The power-on reset sets the registers to
their default values and initializes the device state machine.
Three hardware pins (A0, A1, A2) vary the fixed I2C-bus address and allow up to eight
devices to share the same I2C-bus/SMBus. The fixed I2C-bus address of the PCA9535
and PCA9535C are the same as the PCA9555 allowing up to eight of these devices in any
combination to share the same I2C-bus/SMBus.
2. Features
n
n
n
n
n
n
Operating power supply voltage range of 2.3 V to 5.5 V
5 V tolerant I/Os
Polarity Inversion register
Active LOW interrupt output
Low standby current
Noise filter on SCL/SDA inputs
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
n
n
n
n
n
No glitch on power-up
Internal power-on reset
16 I/O pins which default to 16 inputs
0 Hz to 400 kHz clock frequency
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Offered in four different packages: SO24, TSSOP24, HVQFN24 and HWQFN24
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9535D
SO24
plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
PCA9535PW
TSSOP24
plastic thin shrink small outline package; 24 leads; body SOT355-1
width 4.4 mm
PCA9535BS
HVQFN24
plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 × 4 × 0.85 mm
PCA9535HF
HWQFN24 plastic thermal enhanced very very thin quad flat
SOT994-1
package; no leads; 24 terminals; body 4 × 4 × 0.75 mm
PCA9535CD
SO24
PCA9535CPW TSSOP24
PCA9535CHF
plastic small outline package; 24 leads;
body width 7.5 mm
SOT616-1
SOT137-1
plastic thin shrink small outline package; 24 leads; body SOT355-1
width 4.4 mm
HWQFN24 plastic thermal enhanced very very thin quad flat
SOT994-1
package; no leads; 24 terminals; body 4 × 4 × 0.75 mm
3.1 Ordering options
Table 2.
Ordering options
Type number
Topside mark
Temperature range
PCA9535D
PCA9535D
Tamb = −40 °C to +85 °C
PCA9535PW
PCA9535PW
Tamb = −40 °C to +85 °C
PCA9535BS
9535
Tamb = −40 °C to +85 °C
PCA9535HF
P35H
Tamb = −40 °C to +85 °C
PCA9535CD
PCA9535CD
Tamb = −40 °C to +85 °C
PCA9535CPW
PCA9535C
Tamb = −40 °C to +85 °C
PCA9535CHF
P35C
Tamb = −40 °C to +85 °C
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
2 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
4. Block diagram
PCA9535
PCA9535C
IO1_0
IO1_1
8-bit
A0
A1
A2
write pulse
IO1_2
INPUT/
OUTPUT
PORTS
IO1_3
IO1_4
IO1_5
IO1_6
read pulse
IO1_7
I2C-BUS/SMBus
CONTROL
SCL
SDA
IO0_0
INPUT
FILTER
IO0_1
8-bit
write pulse
VDD
IO0_2
INPUT/
OUTPUT
PORTS
IO0_3
IO0_4
IO0_5
IO0_6
read pulse
IO0_7
POWER-ON
RESET
VSS
VDD
INT
002aac217
Remark: All I/Os are set to inputs at reset.
Fig 1.
Block diagram of PCA9535; PCA9535C
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
3 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
5. Pinning information
5.1 Pinning
INT
1
24 VDD
INT
1
A1
2
23 SDA
A1
2
24 VDD
23 SDA
A2
3
22 SCL
A2
3
22 SCL
IO0_0
4
21 A0
IO0_0
4
21 A0
IO0_1
5
20 IO1_7
IO0_1
5
20 IO1_7
IO0_2
6
19 IO1_6
IO0_2
6
IO0_3
7
18 IO1_5
IO0_3
7
IO0_4
8
17 IO1_4
IO0_4
8
17 IO1_4
IO0_5
9
16 IO1_3
IO0_5
9
16 IO1_3
IO0_6 10
15 IO1_2
IO0_6 10
15 IO1_2
IO0_7 11
14 IO1_1
IO0_7 11
14 IO1_1
VSS 12
13 IO1_0
VSS 12
13 IO1_0
PCA9535D
PCA9535CD
002aac214
Pin configuration for SO24
Fig 3.
Pin configuration for TSSOP24
19 SCL
14 IO1_4
5
14 IO1_4
13 IO1_3
IO0_5
6
13 IO1_3
002aac216
Pin configuration for HVQFN24
IO1_2 12
15 IO1_5
IO0_4
IO1_1 11
15 IO1_5
4
IO1_0 10
16 IO1_6
IO0_3
9
16 IO1_6
3
VSS
17 IO1_7
IO0_2
002aac880
Transparent top view
Fig 5.
PCA9535_PCA9535C_5
Product data sheet
24 A2
17 IO1_7
8
18 A0
2
7
1
IO0_1
IO0_7
IO0_0
IO0_6
IO1_2 12
IO1_1 11
IO1_0 10
18 A0
Transparent top view
Fig 4.
21 VDD
20 SDA
19 SCL
20 SDA
21 VDD
22 INT
23 A1
24 A2
6
9
IO0_5
5
VSS
IO0_4
4
8
IO0_3
3
7
IO0_2
2
IO0_7
IO0_1
1
IO0_6
IO0_0
terminal 1
index area
22 INT
PCA9535HF
PCA9535CHF
PCA9535BS
terminal 1
index area
18 IO1_5
002aac215
23 A1
Fig 2.
19 IO1_6
PCA9535PW
PCA9535CPW
Pin configuration for HWQFN24
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
4 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
5.2 Pin description
Table 3.
Symbol
Pin description
Pin
Description
SO24, TSSOP24
HVQFN24,
HWQFN24
INT
1
22
interrupt output (open-drain)
A1
2
23
address input 1
A2
3
24
address input 2
IO0_0
4
1
port 0 input/output[2]
IO0_1
5
2
IO0_2
6
3
IO0_3
7
4
IO0_4
8
5
IO0_5
9
6
IO0_6
10
7
IO0_7
11
8
VSS
12
9[1]
supply ground
IO1_0
13
10
port 1 input/output[2]
IO1_1
14
11
IO1_2
15
12
IO1_3
16
13
IO1_4
17
14
IO1_5
18
15
IO1_6
19
16
IO1_7
20
17
A0
21
18
address input 0
SCL
22
19
serial clock line
SDA
23
20
serial data line
VDD
24
21
supply voltage
[1]
HVQFN24 and HWQFN24 package die supply ground is connected to both the VSS pin and the exposed
center pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced
thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using
a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
[2]
PCA9535 I/Os are totem pole, whereas the I/Os on PCA9535C are open-drain.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
5 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
6. Functional description
Refer to Figure 1 “Block diagram of PCA9535; PCA9535C”.
6.1 Device address
slave address
0
1
0
0
fixed
A2
A1
A0 R/W
programmable
002aac219
Fig 6.
PCA9535; PCA9535C device address
6.2 Registers
6.2.1 Command byte
The command byte is the first byte to follow the address byte during a write transmission.
It is used as a pointer to determine which of the following registers will be written or read.
Table 4.
Command byte
Command
Register
0
Input port 0
1
Input port 1
2
Output port 0
3
Output port 1
4
Polarity Inversion port 0
5
Polarity Inversion port 1
6
Configuration port 0
7
Configuration port 1
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
6 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
6.2.2 Registers 0 and 1: Input port registers
This register is an input-only port. It reflects the incoming logic levels of the pins,
regardless of whether the pin is defined as an input or an output by Register 3. Writes to
this register have no effect.
The default value ‘X’ is determined by the externally applied logic level.
Table 5.
Bit
Input port 0 Register
7
6
5
4
3
2
1
0
Symbol
I0.7
I0.6
I0.5
I0.4
I0.3
I0.2
I0.1
I0.0
Default
X
X
X
X
X
X
X
X
Table 6.
Bit
Input port 1 register
7
6
5
4
3
2
1
0
Symbol
I1.7
I1.6
I1.5
I1.4
I1.3
I1.2
I1.1
I1.0
Default
X
X
X
X
X
X
X
X
6.2.3 Registers 2 and 3: Output port registers
This register is an output-only port. It reflects the outgoing logic levels of the pins defined
as outputs by Registers 6 and 7. Bit values in this register have no effect on pins defined
as inputs. In turn, reads from this register reflect the value that is in the flip-flop controlling
the output selection, not the actual pin value.
Table 7.
Bit
Output port 0 register
7
6
5
4
3
2
1
0
Symbol
O0.7
O0.6
O0.5
O0.4
O0.3
O0.2
O0.1
O0.0
Default
1
1
1
1
1
1
1
1
Table 8.
Bit
Output port 1 register
7
6
5
4
3
2
1
0
Symbol
O1.7
O1.6
O1.5
O1.4
O1.3
O1.2
O1.1
O1.0
Default
1
1
1
1
1
1
1
1
6.2.4 Registers 4 and 5: Polarity Inversion registers
This register allows the user to invert the polarity of the Input port register data. If a bit in
this register is set (written with ‘1’), the Input port data polarity is inverted. If a bit in this
register is cleared (written with a ‘0’), the Input port data polarity is retained.
Table 9.
Bit
Polarity Inversion port 0 register
7
6
5
4
3
2
1
0
Symbol
N0.7
N0.6
N0.5
N0.4
N0.3
N0.2
N0.1
N0.0
Default
0
0
0
0
0
0
0
0
Table 10.
Bit
Polarity Inversion port 1 register
7
6
5
4
3
2
1
0
Symbol
N1.7
N1.6
N1.5
N1.4
N1.3
N1.2
N1.1
N1.0
Default
0
0
0
0
0
0
0
0
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
7 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
6.2.5 Registers 6 and 7: Configuration registers
This register configures the directions of the I/O pins. If a bit in this register is set (written
with ‘1’), the corresponding port pin is enabled as an input with high-impedance output
driver. If a bit in this register is cleared (written with ‘0’), the corresponding port pin is
enabled as an output. At reset, the device's ports are inputs.
Table 11.
Bit
Configuration port 0 register
7
6
5
4
3
2
1
0
Symbol
C0.7
C0.6
C0.5
C0.4
C0.3
C0.2
C0.1
C0.0
Default
1
1
1
1
1
1
1
1
Table 12.
Bit
Configuration port 1 register
7
6
5
4
3
2
1
0
Symbol
C1.7
C1.6
C1.5
C1.4
C1.3
C1.2
C1.1
C1.0
Default
1
1
1
1
1
1
1
1
6.3 Power-on reset
When power is applied to VDD, an internal power-on reset holds the PCA9535/PCA9535C
in a reset condition until VDD has reached VPOR. At that point, the reset condition is
released and the PCA9535/PCA9535C registers and SMBus state machine will initialize
to their default states. Thereafter, VDD must be lowered below 0.2 V to reset the device.
For a power reset cycle, VDD must be lowered below 0.2 V and then restored to the
operating voltage.
6.4 I/O port
When an I/O is configured as an input on PCA9535, FETs Q1 and Q2 are off, creating a
high impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V.
In the case of PCA9535C, FET Q1 has been removed and the open-drain FET Q2 will
function the same as PCA9535.
If the I/O is configured as an output, then on PCA9535 either Q1 or Q2 is on, depending
on the state of the Output Port register. Care should be exercised if an external voltage is
applied to an I/O configured as an output because of the low-impedance path that exists
between the pin and either VDD or VSS.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
8 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
data from
shift register
output port
register data
configuration
register
data from
shift register
D
(1)
VDD
Q1
Q
FF
write
configuration
pulse
CK
Q
D
Q
FF
write pulse
I/O pin
Q2
CK
output port
register
input port
register
D
Q
FF
read pulse
VSS
input port
register data
CK
to INT
polarity inversion
register
data from
shift register
D
Q
FF
write polarity
pulse
polarity
inversion
register data
CK
002aac218
At power-on reset, all registers return to default values.
(1) PCA9535C I/Os are open-drain only. The portion of the PCA9535 schematic marked inside the
dotted line box is not in PCA9535C.
Fig 7.
Simplified schematic of I/Os
6.5 Bus transactions
6.5.1 Writing to the port registers
Data is transmitted to the PCA9535/PCA9535C by sending the device address and
setting the least significant bit to a logic 0 (see Figure 6 “PCA9535; PCA9535C device
address”). The command byte is sent after the address and determines which register will
receive the data following the command byte.
The eight registers within the PCA9535/PCA9535C are configured to operate as four
register pairs. The four pairs are Input Ports, Output Ports, Polarity Inversion Ports, and
Configuration Ports. After sending data to one register, the next data byte will be sent to
the other register in the pair (see Figure 8 and Figure 9). For example, if the first byte is
sent to Output Port 1 (register 3), then the next byte will be stored in Output Port 0
(register 2). There is no limitation on the number of data bytes sent in one write
transmission. In this way, each 8-bit register may be updated independently of the other
registers.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
9 of 31
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1
2
3
4
5
6
7
8
9
slave address
SDA S
0
1
0
data to port 0
command byte
0 A2 A1 A0 0
START condition
NXP Semiconductors
PCA9535_PCA9535C_5
Product data sheet
SCL
R/W
A
0
0
0
0
0
0
1
0
acknowledge
from slave
A 0.7
data to port 1
0.0 A 1.7
DATA 0
acknowledge
from slave
1.0 A
DATA 1
acknowledge
from slave
P
STOP
condition
write to port
tv(Q)
data out
from port 0
Rev. 05 — 15 September 2008
tv(Q)
data out
from port 1
DATA VALID
Fig 8.
Write to Output Port registers
1
2
3
4
5
6
7
8
9
data to register
slave address
SDA S
0
1
0
command byte
0 A2 A1 A0 0
10 of 31
© NXP B.V. 2008. All rights reserved.
START condition
R/W
A
0
0
0
acknowledge
from slave
0
0
1
MSB
1
0
A
acknowledge
from slave
data to register
MSB
LSB
DATA 0
A
acknowledge
from slave
LSB
DATA 1
A
P
STOP
condition
002aac221
Fig 9.
Write to Configuration registers
PCA9535; PCA9535C
SCL
16-bit I2C-bus and SMBus, low power I/O port with interrupt
002aac220
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
6.5.2 Reading the port registers
In order to read data from the PCA9535/PCA9535C, the bus master must first send the
PCA9535/PCA9535C address with the least significant bit set to a logic 0 (see Figure 6
“PCA9535; PCA9535C device address”). The command byte is sent after the address and
determines which register will be accessed. After a restart, the device address is sent
again, but this time the least significant bit is set to a logic 1. Data from the register
defined by the command byte will then be sent by the PCA9535/PCA9535C (see
Figure 10, Figure 11 and Figure 12). Data is clocked into the register on the falling edge of
the acknowledge clock pulse. After the first byte is read, additional bytes may be read but
the data will now reflect the information in the other register in the pair. For example, if you
read Input Port 1, then the next byte read would be Input Port 0. There is no limitation on
the number of data bytes received in one read transmission but the final byte received, the
bus master must not acknowledge the data.
slave address
SDA S
0
1
0
0 A2 A1 A0 0
START condition
A
data from lower or
upper byte of register
slave address
0
1
0
MSB
0 A2 A1 A0 1
(repeated)
START condition
(cont.)
acknowledge
from slave
R/W
acknowledge
from slave
(cont.) S
A
COMMAND BYTE
A
data from upper or
lower byte of register
LSB
DATA (first byte)
R/W
acknowledge
from slave
MSB
A
acknowledge
from master
LSB
DATA (last byte)
NA P
no acknowledge
from master
at this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
STOP
condition
002aac222
Remark: Transfer can be stopped at any time by a STOP condition.
Fig 10. Read from register
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
11 of 31
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NXP Semiconductors
PCA9535_PCA9535C_5
Product data sheet
data into port 0
data into port 1
INT
SCL
1
2
3
4
trst(INT_N)
5
6
slave address
SDA S
0
1
0
7
8
R/W
0 A2 A1 A0 1
START condition
9
I0.x
A
7
6
5
acknowledge
from slave
4
3
I1.x
2
1
0
A
acknowledge
from master
7
6
5
4
3
I0.x
2
1
0
A
acknowledge
from master
7
6
5
4
3
STOP condition
I1.x
2
1
0
A
acknowledge
from master
7
6
5
4
3
2
1
0
1
P
non acknowledge
from master
read from port 1
002aac223
12 of 31
© NXP B.V. 2008. All rights reserved.
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It
is assumed that the command byte has previously been set to ‘00’ (read Input Port register).
Fig 11. Read Input Port register, scenario 1
PCA9535; PCA9535C
read from port 0
16-bit I2C-bus and SMBus, low power I/O port with interrupt
Rev. 05 — 15 September 2008
tv(INT_N)
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DATA 00
DATA 01
DATA 02
DATA 03
tsu(D)
th(D)
data into port 1
NXP Semiconductors
PCA9535_PCA9535C_5
Product data sheet
data into port 0
DATA 10
DATA 11
DATA 12
th(D)
tsu(D)
INT
SCL
1
2
3
4
trst(INT_N)
5
6
slave address
SDA S
0
1
0
7
8
R/W
0 A2 A1 A0 1
START condition
9
I0.x
A
acknowledge
from slave
DATA 00
I1.x
A
acknowledge
from master
DATA 10
I0.x
A
acknowledge
from master
DATA 03
I1.x
A
acknowledge
from master
DATA 12
STOP condition
1
P
non acknowledge
from master
read from port 1
002aac224
13 of 31
© NXP B.V. 2008. All rights reserved.
Remark: Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). It
is assumed that the command byte has previously been set to ‘00’ (read Input Port register).
Fig 12. Read Input Port register, scenario 2
PCA9535; PCA9535C
read from port 0
16-bit I2C-bus and SMBus, low power I/O port with interrupt
Rev. 05 — 15 September 2008
tv(INT_N)
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
6.5.3 Interrupt output
The open-drain interrupt output is activated when one of the port pins change state and
the pin is configured as an input. The interrupt is deactivated when the input returns to its
previous state or the Input Port register is read (see Figure 11). A pin configured as an
output cannot cause an interrupt. Since each 8-bit port is read independently, the interrupt
caused by Port 0 will not be cleared by a read of Port 1 or the other way around.
Remark: Changing an I/O from an output to an input may cause a false interrupt to occur
if the state of the pin does not match the contents of the Input Port register.
7. Characteristics of the I2C-bus
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be
connected to a positive supply via a pull-up resistor when connected to the output stages
of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
will be interpreted as control signals (see Figure 13).
SDA
SCL
data line
stable;
data valid
change
of data
allowed
mba607
Fig 13. Bit transfer
7.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW
transition of the data line while the clock is HIGH is defined as the START condition (S). A
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP
condition (P) (see Figure 14).
SDA
SDA
SCL
SCL
S
P
START condition
STOP condition
mba608
Fig 14. Definition of START and STOP conditions
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
14 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
7.2 System configuration
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The
device that controls the message is the ‘master’ and the devices which are controlled by
the master are the ‘slaves’ (see Figure 15).
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
I2C-BUS
MULTIPLEXER
SLAVE
002aaa966
Fig 15. System configuration
7.3 Acknowledge
The number of data bytes transferred between the START and the STOP conditions from
transmitter to receiver is not limited. Each byte of eight bits is followed by one
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,
whereas the master generates an extra acknowledge related clock pulse.
A slave receiver which is addressed must generate an acknowledge after the reception of
each byte. Also a master must generate an acknowledge after the reception of each byte
that has been clocked out of the slave transmitter. The device that acknowledges has to
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable
LOW during the HIGH period of the acknowledge related clock pulse; set-up time and hold
time must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
data output
by transmitter
not acknowledge
data output
by receiver
acknowledge
SCL from master
1
S
START
condition
2
8
9
clock pulse for
acknowledgement
002aaa987
Fig 16. Acknowledgement on the I2C-bus
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
15 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
8. Application design-in information
VDD
(5 V)
10 kΩ
10 kΩ
10 kΩ
2 kΩ
VDD
VDD
SUB-SYSTEM 1
(e.g., temp sensor)
100 kΩ
(×3)
INT
MASTER
CONTROLLER
SCL
SCL
IO0_0
SDA
SDA
IO0_1
PCA9535
INT
SUB-SYSTEM 2
(e.g., counter)
IO0_2
INT
RESET
IO0_3
GND
A
IO0_4
controlled
switch
(e.g., CBT device)
ENABLE
IO0_5
B
IO0_6
IO0_7
IO1_0
IO1_1
IO1_2
IO1_3
IO1_4
IO1_5
IO1_6
IO1_7
A2
A1
A0
SUB-SYSTEM 3
(e.g., alarm system)
10 DIGIT
NUMERIC
KEYPAD
ALARM
VDD
VSS
002aac225
Device address configured as 1110 100Xb for this example.
IO0_0, IO0_2, IO0_3 configured as outputs.
IO0_1, IO0_4, IO0_5 configured as inputs.
IO0_6, IO0_7, and IO1_0 to IO1_7 configured as inputs.
Fig 17. Typical application
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
16 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
8.1 Minimizing IDD when the I/Os are used to control LEDs
When the PCA9535 I/Os are used to control LEDs, they are normally connected to VDD
through a resistor as shown in Figure 17. Since the LED acts as a diode, when the LED is
off the I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI
becomes lower than VDD.
Designs needing to minimize current consumption, such as battery power applications,
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.
Figure 18 shows a high value resistor in parallel with the LED. Figure 19 shows VDD less
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at
or above VDD and prevents additional supply current consumption when the LED is off.
This concern does not occur in the case of PCA9535C because the I/O pins are
open-drain.
3.3 V
VDD
VDD
VDD
100 kΩ
LED
5V
LEDn
LED
LEDn
002aac189
002aac190
Fig 18. High value resistor in parallel with
the LED
Fig 19. Device supplied by a lower voltage
9. Limiting values
Table 13. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDD
Conditions
Min
Max
Unit
supply voltage
−0.5
+6.0
V
VI/O
voltage on an input/output pin
VSS − 0.5
6
V
IO
output current
-
±50
mA
II
input current
-
±20
mA
IDD
supply current
-
160
mA
ISS
ground supply current
-
200
mA
Ptot
total power dissipation
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
on an I/O pin
operating
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
17 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
10. Static characteristics
Table 14. Static characteristics
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
2.3
-
5.5
V
IDD
supply current
Operating mode; VDD = 5.5 V;
no load; fSCL = 100 kHz; I/O = inputs
-
135
200
µA
Istb
standby current
Standby mode; VDD = 5.5 V; no load;
VI = VSS; fSCL = 0 kHz; I/O = inputs
-
0.25
1
µA
Standby mode; VDD = 5.5 V; no load;
VI = VDD; fSCL = 0 kHz; I/O = inputs
-
0.25
1
µA
no load; VI = VDD or VSS
-
1.5
1.65
V
VPOR
power-on reset voltage[1]
Input SCL; input/output SDA
VIL
LOW-level input voltage
−0.5
-
+0.3VDD V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
IOL
LOW-level output current
VOL = 0.4 V
3
-
-
mA
IL
leakage current
VI = VDD = VSS
−1
-
+1
µA
Ci
input capacitance
VI = VSS
-
6
10
pF
−0.5
-
+0.3VDD V
I/Os
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
IOL
LOW-level output current
VOH
HIGH-level output voltage
0.7VDD
-
5.5
V
VDD = 2.3 V to 5.5 V; VOL = 0.5 V
[2]
8
10
-
mA
VDD = 2.3 V to 5.5 V; VOL = 0.7 V
[2]
10
14
-
mA
IOH = −8 mA; VDD = 2.3 V
[3]
1.8
-
-
V
IOH = −10 mA; VDD = 2.3 V
[3]
1.7
-
-
V
IOH = −8 mA; VDD = 3.0 V
[3]
2.6
-
-
V
IOH = −10 mA; VDD = 3.0 V
[3]
2.5
-
-
V
IOH = −8 mA; VDD = 4.75 V
[3]
4.1
-
-
V
IOH = −10 mA; VDD = 4.75 V
[3]
4.0
-
-
V
PCA9535 only
ILIH
HIGH-level input leakage current VDD = 5.5 V; VI = VDD
-
-
1
µA
ILIL
LOW-level input leakage current VDD = 5.5 V; VI = VSS
-
-
−1
µA
Ci
input capacitance
-
3.7
5
pF
Co
output capacitance
-
3.7
5
pF
3
-
-
mA
Interrupt INT
IOL
LOW-level output current
VOL = 0.4 V
Select inputs A0, A1, A2
VIL
LOW-level input voltage
−0.5
-
+0.3VDD V
VIH
HIGH-level input voltage
0.7VDD
-
5.5
V
ILI
input leakage current
−1
-
+1
µA
[1]
VDD must be lowered to 0.2 V for at least 5 µs in order to reset part.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
18 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
[2]
Each I/O must be externally limited to a maximum of 25 mA and each octal (IO0_0 to IO0_7 and IO1_0 to IO1_7) must be limited to a
maximum current of 100 mA for a device total of 200 mA.
[3]
The total current sourced by all I/Os must be limited to 160 mA. PCA9535C does not source current and does not have the VOH
specification.
11. Dynamic characteristics
Table 15.
Dynamic characteristics
Symbol
Parameter
fSCL
SCL clock frequency
tBUF
bus free time between a STOP and
START condition
tHD;STA
hold time (repeated) START condition
4.0
-
tSU;STA
set-up time for a repeated START
condition
4.7
-
tSU;STO
set-up time for STOP condition
4.0
-
0.3
0
tVD;ACK
data valid acknowledge time
tHD;DAT
data hold time
Conditions
Standard-mode
I2C-bus
[1]
[2]
Fast-mode I2C-bus
Unit
Min
Max
Min
Max
0
100
0
400
4.7
-
1.3
-
µs
0.6
-
µs
0.6
-
µs
0.6
-
µs
3.45
0.1
0.9
µs
-
0
-
ns
300
-
50
-
ns
kHz
tVD;DAT
data valid time
tSU;DAT
data set-up time
250
-
100
-
ns
tLOW
LOW period of the SCL clock
4.7
-
1.3
-
µs
tHIGH
HIGH period of the SCL clock
4.0
-
0.6
-
µs
20 +
0.1Cb[3]
300
ns
20 +
0.1Cb[3]
300
ns
fall time of both SDA and SCL signals
tf
-
300
tr
rise time of both SDA and SCL signals
-
1000
tSP
pulse width of spikes that must be
suppressed by the input filter
-
50
-
50
ns
-
200
-
200
ns
150
-
150
-
ns
1
-
1
-
µs
Port timing
tv(Q)
data output valid time
tsu(D)
data input set-up time
th(D)
data input hold time
[4]
Interrupt timing
tv(INT_N)
valid time on pin INT
-
4
-
4
µs
trst(INT_N)
reset time on pin INT
-
4
-
4
µs
[1]
tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW.
[2]
tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.
[3]
Cb = total capacitance of one bus line in pF.
[4]
tv(Q) measured from 0.7VDD on SCL to 50 % I/O output (PCA9535). For PCA9535C, use load circuit shown in Figure 24 and measure
from 0.7VDD on SCL to 30 % I/O output.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
19 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
SDA
tr
tBUF
tf
tHD;STA
tSP
tLOW
SCL
tHD;STA
P
tSU;STA
tHD;DAT
S
tHIGH
tSU;DAT
tSU;STO
Sr
P
002aaa986
Fig 20. Definition of timing on the I2C-bus
protocol
START
condition
(S)
tSU;STA
bit 7
MSB
(A7)
tLOW
bit 6
(A6)
tHIGH
bit 0
(R/W)
acknowledge
(A)
STOP
condition
(P)
1/f
SCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
002aab175
Rise and fall times refer to VIL and VIH.
Fig 21. I2C-bus timing diagram
SCL
SCL
tv(Q)
tv(Q)
IOn
IOn
002aad327
Fig 22. tv(Q) timing
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
20 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
12. Test information
VDD
PULSE
GENERATOR
VI
RL
500 Ω
VO
VDD
open
GND
DUT
CL
50 pF
RT
002aab284
RL = load resistor.
CL = load capacitance includes jig and probe capacitance.
RT = termination resistance should be equal to the output impedance of Zo of the pulse generators.
Fig 23. Test circuitry for switching times
RL
from output under test
500 Ω
CL
50 pF
S1
2VDD
open
GND
RL
500 Ω
002aac226
Fig 24. Load circuit
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
21 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
13. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 25. Package outline SOT137-1 (SO24)
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
22 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
D
SOT355-1
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.5
0.2
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT355-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 26. Package outline SOT355-1 (TSSOP24)
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
23 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
B
D
SOT616-1
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
e
12
y
y1 C
v M C A B
w M C
b
7
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT616-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-08-08
02-10-22
Fig 27. Package outline SOT616-1 (HVQFN24)
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
24 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
HWQFN24: plastic thermal enhanced very very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.75 mm
B
D
SOT994-1
A
terminal 1
index area
E
A
A1
c
detail X
e1
1/2 e
∅v
∅w
b
e
7
12
M
M
C
C A B
C
y1 C
y
L
13
6
e
e2
Eh
1/2 e
1
18
terminal 1
index area
24
19
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
b
c
D(1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
0.8
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.25
1.95
4.1
3.9
2.25
1.95
0.5
2.5
2.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT994-1
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
07-02-07
07-03-03
Fig 28. Package outline SOT994-1 (HWQFN24)
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
25 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
14. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
26 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 29) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 29.
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
27 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 29. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
16. Abbreviations
Table 18.
Abbreviations
Acronym
Description
ACPI
Advanced Configuration and Power Interface
CBT
Cross Bar Technology
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
FET
Field-Effect Transistor
GPIO
General Purpose Input/Output
HBM
Human Body Model
I/O
Input/Output
I2C-bus
Inter-Integrated Circuit bus
IC
Integrated Circuit
LED
Light Emitting Diode
MM
Machine Model
PCB
Printed-Circuit Board
SMBus
System Management Bus
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
28 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
17. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCA9535_PCA9535C_5
20080915
Product data sheet
-
PCA9535_PCA9535C_4
Modifications:
•
Table 3 “Pin description”: Table note [2] re-written; added its reference at port 1 input/output
PCA9535_PCA9535C_4
20080731
Product data sheet
-
PCA9535_PCA9535C_3
PCA9535_PCA9535C_3
20071004
Product data sheet
-
PCA9535_2
PCA9535_2
(9397 750 12896)
20040930
Product data sheet
-
PCA9535_1
PCA9535_1
(9397 750 11681)
20030627
Product data
853-2430 30019 of 11 June 2003
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
29 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCA9535_PCA9535C_5
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 05 — 15 September 2008
30 of 31
PCA9535; PCA9535C
NXP Semiconductors
16-bit I2C-bus and SMBus, low power I/O port with interrupt
20. Contents
1
2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.3
6.4
6.5
6.5.1
6.5.2
6.5.3
7
7.1
7.1.1
7.2
7.3
8
8.1
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Device address . . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Command byte . . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers 0 and 1: Input port registers . . . . . . . 7
Registers 2 and 3: Output port registers. . . . . . 7
Registers 4 and 5: Polarity Inversion registers . 7
Registers 6 and 7: Configuration registers . . . . 8
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8
I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . . 9
Writing to the port registers . . . . . . . . . . . . . . . 9
Reading the port registers . . . . . . . . . . . . . . . 11
Interrupt output . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics of the I2C-bus. . . . . . . . . . . . . 14
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
START and STOP conditions . . . . . . . . . . . . . 14
System configuration . . . . . . . . . . . . . . . . . . . 15
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application design-in information . . . . . . . . . 16
Minimizing IDD when the I/Os are used to
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17
Static characteristics. . . . . . . . . . . . . . . . . . . . 18
Dynamic characteristics . . . . . . . . . . . . . . . . . 19
Test information . . . . . . . . . . . . . . . . . . . . . . . . 21
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22
Handling information. . . . . . . . . . . . . . . . . . . . 26
Soldering of SMD packages . . . . . . . . . . . . . . 26
Introduction to soldering . . . . . . . . . . . . . . . . . 26
Wave and reflow soldering . . . . . . . . . . . . . . . 26
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29
Legal information. . . . . . . . . . . . . . . . . . . . . . . 30
18.1
18.2
18.3
18.4
19
20
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
30
30
30
30
30
31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 September 2008
Document identifier: PCA9535_PCA9535C_5
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